CN103746009A - 一种太阳能电池的钝化层及其制备工艺 - Google Patents
一种太阳能电池的钝化层及其制备工艺 Download PDFInfo
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Abstract
本发明公开了一种太阳能电池的钝化层及其制备工艺,其特征是钝化层是由稀土氮化物构成。钝化层的制备工艺为当P型晶体硅完成沉积减反射膜工序后,先采用有机化学气相沉积方法(MOCVD)在P型晶体硅衬底的P型一侧沉积稀土氮化物钝化层,然后在同一腔室内,在稀土氮化物钝化层上沉积铝保护膜,完成钝化层的制备。本发明因采用稀土氮化物制作晶硅电池的钝化层,晶格匹配良好,且具有场效应钝化和化学钝化的双重作用,所以钝化效果良好。稀土氮化物钝化层由MOCVD方法制备,获得的钝化层晶体结构完整,缺陷密度低,与晶硅衬底晶格匹配性好,保证了电池的钝化效果。
Description
技术领域
本发明属于半导体领域,尤其涉及光电类材料的应用领域,具体涉及一种太阳能电池的钝化层及其制备工艺。
背景技术
目前的太阳能技术中,降低晶体硅成本是日益竞争的光伏产业追求的目标之一,为降低硅原料成本,最普遍采用的方法是降低硅片的厚度,不断的降低硅片厚度,使得光生载流子很容易扩散到表面而复合,表面的复合速率对太阳能电池的性能影响很大,而通过制备钝化层可以极大的降低表面复合速率,从而提高太阳能电池的性能。
发明内容
本发明的目的在于提供一种太阳能电池的钝化层,该钝化层采用新的钝化材料,用于取代传统的Al2O3钝化材料,能有效提高钝化层与硅的晶格匹配度,从而提高钝化效果。本发明同时提供该钝化层的制备工艺。
为实现本发明的上述目的所采用的技术方案是:一种太阳能电池的钝化层,其特征是该钝化层是由稀土氮化物(REN)构成,所述的稀土氮化物为氮化镧(LnN)、氮化鐠(PrN)、氮化铷(NdN)、氮化钷(PmN)、氮化钐(SmN)、氮化铕(EuN)、氮化铽(TbN)、氮化镝(DyN)、氮化鈥(HoN)、氮化铥(TmN)、氮化镱(YbN)、氮化镥(LuN)、氮化钪(ScN)、氮化钇(YN)、氮化钆(GdN)、氮化铈(CeN2)、氮化铒(ErN)) 中的一种。
本发明的钝化层可应用于单晶硅、多晶硅太阳能电池的钝化工艺中。
上述太阳能电池的稀土氮化物钝化层的制备工艺为:当P型晶体硅完成沉积减反射膜工序后,先采用有机化学气相沉积方法(MOCVD)在P型晶体硅衬底的P型一侧沉积稀土氮化物钝化层,然后在同一腔室内,在稀土氮化物钝化层上沉积铝保护膜,完成钝化层的制备。
所沉积的稀土氮化物钝化层的最佳厚度为1~10nm。
在稀土氮化物的MOCVD沉积方法中,稀土元素的前驱体为该稀土元素的有机金属化合物,氮的提供者为氮气,腔室的反应温度为500~900℃,压力为1~5mbar,蒸发温度为100~140℃,沉积时间为10~60s。在铝保护膜的沉积过程中,铝的前驱体为(三甲基铝)TMAl,载气为H2 ,沉积温度为400~600℃,蒸发温度为80~120℃,厚度为10~100nm。
本发明的上述技术方案中,在P型晶体硅的制作过程中,当P型晶体硅完成衬底清洗、制绒、扩散磷、边缘刻蚀、HF酸清洗、沉积减反射膜工序后,采用有机化学气相沉积(MOCVD)方法在晶体硅片背部(背光面)沉积稀土氮化物钝化层和铝保护膜,最后制备栅线电极和铝背场,完成晶体硅电池的制备。
稀土氮化物(REN)常温下与Si一样,都呈立方相结构,与传统的钝化材料Al2O3相比,与Si的晶格匹配常数更为接近(a(Al2O3)=7.91; a(REN)≈5A;a(Si)=5.4A),晶格失配率很低,可以在Si上生长出高质量的薄膜,是制备钝化层的理想材料。本发明将稀土氮化物做为制备太阳能电池钝化层的钝化材料,在太阳能电池的制作中,在P型晶体硅的背面沉积稀土氮化物钝化层和铝保护膜,因采用稀土氮化物制作晶硅电池的钝化层,晶格匹配良好,且具有场效应钝化和化学钝化的双重作用,所以钝化效果良好。稀土氮化物钝化层由MOCVD方法制备,获得的钝化层晶体结构完整,缺陷密度低,与晶硅衬底晶格匹配性好,保证了电池的钝化效果。
附图说明
图1为含有稀土氮化物钝化层的晶体硅太阳能电池的结构示意图;
图2为含有稀土氮化物钝化层的晶体硅太阳能电池制备流程图。
具体实施方式
下面结合附图和具体实施的例子对本发明做进一步详细的描述,然而所述的实施例不应以限制的方式解释。
本发明的太阳能电池的钝化层及其制备工艺,在P型晶体硅的制作中,当P型晶体硅完成沉积减反射膜工序后,先采用有机化学气相沉积方法(MOCVD)在P型晶体硅衬底的P型一侧沉积稀土氮化物钝化层,然后在同一腔室内沉积铝保护膜,在稀土氮化物的MOCVD沉积方法中,稀土元素的前驱体为该稀土元素的有机金属化合物,氮的提供者为氮气,腔室的反应温度为500~900℃,压力为1~5mbar,蒸发温度为100~140℃,沉积时间为10~60s。在铝保护膜的沉积过程中,铝的前驱体为TMAl,载气为H2,沉积温度为400~600℃,蒸发温度为80~120℃,厚度为10~100nm,完成钝化层的制备。
具体实施例1(以氮化钇钝化层为例来详细说明):
从图2给出的含有稀土氮化物钝化层的P型晶体硅太阳能电池制备流程图中可以看出,本发明的钝化层,应用于太阳能电池中,其制备P型晶体硅太阳能电池的流程如下:
a、使用HF和HC1对P型晶体硅衬底进行清洗制绒,以便去除机械损伤层、油污以及金属杂质,同时在表面形成起伏不平的绒面,以便增加表面积进而增加光吸收;然后将P型晶硅衬底放入扩散室内,通入磷源,使磷元素扩散进入P型晶硅表面,形成N层,即形成PN结;然后使用HNO3和HF的混合液体进行周边刻蚀,去掉边缘沉积的N层以便使电池片与外界绝缘;然后用HF进行洗涤,即用HF洗掉扩散过程中形成的二氧化硅等物质;使用PECVD方法在其表面沉积一层SiN减反射层(以增加电池片对光线的吸收),形成P型晶硅电池片。以上为太阳能电池制备过程中的常规工艺,在此不做赘述。
b、通N2清洗MOCVD腔室,将完成上述步骤的P型晶硅电池片迅速放入MOCVD反应腔室中,在其衬底背面的P型一侧(PN结的P型一侧)沉积氮化钇钝化层,其厚度控制在1~10nm范围内,然后在同一腔室内在氮化钇钝化层上沉积铝保护膜。在氮化钇的MOCVD沉积方法中,钇的前驱体为钇的有机金属化合物Y(iPr-Et2N-GUAN)3,氮的提供者为氮气,腔室的反应温度为500~900℃,压力为1~5mbar,蒸发温度为100~140℃,沉积时间为10~60s。在铝保护膜的沉积过程中,铝的前驱体为TMAl,载气为H2,沉积温度为400~600℃,蒸发温度为80~120℃, 厚度为10~100nm。
c、制备背电极和铝背场以及前电极,经过烘干、烧结工序后,制成完整的带有稀土氮化物钝化层的晶体硅太阳电池。
从图1所示的带有稀土氮化物钝化层的P型晶体硅太阳能电池的结构示意图中可以看出,在P型晶硅衬底1上扩散磷,形成N扩散层2,在N扩散层2上采用PECVD方法在其表面沉积了一层SiNx(氮化硅)减反射层3,P型晶硅衬底1背面(背光面)的P型一侧用MOCVD方法沉积有稀土氮化物钝化层5,在同一腔室内,在稀土氮化物钝化层5上沉积有铝保护膜4,然后在铝保护膜4上印刷金属栅线背电极7和铝背场6,在减反射层3上丝网印刷金属栅线前电极8。
具体实施例2(其它稀土氮化物做钝化层):
其它稀土氮化物做钝化层的制备工艺与实施例1基本相同,不同之处在于所用的稀土元素前驱体不同,如氮化镧(LnN)钝化层的前驱体为镧的有机金属化合物Ln (iPr-Et2N-GUAN)3、氮化鐠(PrN)钝化层的前驱体为鐠的有机金属化合物Pr (iPr-Et2N-GUAN)3、氮化铷(NdN)钝化层的前驱体为铷的有机金属化合物Nd (iPr-Et2N-GUAN)3、氮化钷(PmN)钝化层的前驱体为钷的有机金属化合物Pm (iPr-Et2N-GUAN)3、氮化钐(SmN)钝化层的前驱体为钐的有机金属化合物Sm (iPr-Et2N-GUAN)3、氮化铕(EuN)钝化层的前驱体为铕的有机金属化合物Eu (iPr-Et2N-GUAN)3、氮化铽(TbN)钝化层的前驱体为铽的有机金属化合物Tb (iPr-Et2N-GUAN)3、氮化镝(DyN)钝化层的前驱体为镝的有机金属化合物Dy (iPr-Et2N-GUAN)3、氮化鈥(HoN)钝化层的前驱体为鈥的有机金属化合物Ho (iPr-Et2N-GUAN)3、氮化铥(TmN)钝化层的前驱体为铥的有机金属化合物Tm (iPr-Et2N-GUAN)3、氮化镱(YbN)钝化层的前驱体为镱的有机金属化合物Yb (iPr-Et2N-GUAN)3、氮化镥(LuN)钝化层的前驱体为镥的有机金属化合物Lu (iPr-Et2N-GUAN)3、氮化钪(LuN)钝化层的前驱体为钪的有机金属化合物Lu (iPr-Et2N-GUAN)3、氮化钇(YN)钝化层的前驱体为钇的有机金属化合物Y (iPr-Et2N-GUAN)3、氮化钆(GdN)钝化层的前驱体为钆的有机金属化合物Gd (iPr-Et2N-GUAN)3、氮化铈(CeN2)钝化层的前驱体为铈的有机金属化合物Ce (iPr-Et2N-GUAN)3、氮化铒(ErN)钝化层的前驱体为铒的有机金属化合物Er (iPr-Et2N-GUAN)3)。
所述的有机化学气相沉积方法(MOCVD)为本领域内普通专业技术人员所共知的常识,不再详述。
以上是对本发明的说明而非限定,基于本发明思想的其他实施方式,均在本发明的保护范围之内。
Claims (7)
1.一种太阳能电池的钝化层,其特征是该钝化层是由稀土氮化物构成。
2.按照权利要求1所述的稀土氮化物,其特征是所述的稀土氮化物为氮化镧(LnN)、氮化鐠(PrN)、氮化铷(NdN)、氮化钷(PmN)、氮化钐(SmN)、氮化铕(EuN)、氮化铽(TbN)、氮化镝(DyN)、氮化鈥(HoN)、氮化铥(TmN)、氮化镱(YbN)、氮化镥(LuN)、氮化钪(ScN)、氮化钇(YN)、氮化钆(GdN)、氮化铈(CeN2)、氮化铒(ErN))中的一种 。
3.按照权利要求1所述的太阳能电池的钝化层,其特征为所述的钝化层钝化于P型晶体硅电池背光面的P型一侧。
4.一种制备权利要求1、2、3所述的太阳能电池的钝化层的工艺,其特征是:在P型晶体硅的制作中,当P型晶体硅完成沉积减反射膜工序后,采用MOCVD沉积方法在P型晶体硅衬底的P型一侧沉积稀土氮化物钝化层,并在稀土氮化物钝化层上沉积铝保护膜,完成钝化层的制备。
5.按照权利要求4所述的制备太阳能电池的钝化层的工艺,其特征是:所沉积的稀土氮化物钝化层的厚度为1~10nm。
6.按照权利要求4所述的制备太阳能电池的钝化层的工艺,其特征是:在稀土氮化物的MOCVD沉积方法中,稀土元素的前驱体为稀土元素的有机金属化合物,氮的提供者为氮气,腔室的反应温度为500~900℃,压力为1~5mbar,蒸发温度为100~140℃,沉积时间为10~60s。
7.按照权利要求4所述的制备太阳能电池的钝化层的工艺,其特征是:在完成稀土氮化物钝化层的沉积后,在同一腔室内立即进行铝保护膜的沉积,铝的前驱体为三甲基铝TMAl,载气为H2,沉积温度为400~600℃,蒸发温度为80~120℃,厚度为10~100nm。
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CN110073477A (zh) * | 2016-12-07 | 2019-07-30 | 维多利亚联科有限公司 | 用于除去钝化盖帽层的稀土氮化物结构、器件和方法 |
CN112993100A (zh) * | 2021-03-16 | 2021-06-18 | 华灿光电(浙江)有限公司 | 发光二极管外延片制备方法 |
CN113130670A (zh) * | 2021-04-20 | 2021-07-16 | 浙江师范大学 | 氧化铕/铂钝化接触晶体硅太阳能电池及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102834930A (zh) * | 2010-03-30 | 2012-12-19 | 应用材料公司 | 在扩散p型区域上方形成负电荷钝化层的方法 |
WO2013130179A2 (en) * | 2012-01-03 | 2013-09-06 | Applied Materials, Inc. | Buffer layer for improving the performance and stability of surface passivation of si solar cells |
US20130247972A1 (en) * | 2012-02-17 | 2013-09-26 | Applied Materials, Inc. | Passivation film stack for silicon-based solar cells |
-
2014
- 2014-01-23 CN CN201410031420.6A patent/CN103746009A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102834930A (zh) * | 2010-03-30 | 2012-12-19 | 应用材料公司 | 在扩散p型区域上方形成负电荷钝化层的方法 |
WO2013130179A2 (en) * | 2012-01-03 | 2013-09-06 | Applied Materials, Inc. | Buffer layer for improving the performance and stability of surface passivation of si solar cells |
US20130247972A1 (en) * | 2012-02-17 | 2013-09-26 | Applied Materials, Inc. | Passivation film stack for silicon-based solar cells |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110073477A (zh) * | 2016-12-07 | 2019-07-30 | 维多利亚联科有限公司 | 用于除去钝化盖帽层的稀土氮化物结构、器件和方法 |
CN112993100A (zh) * | 2021-03-16 | 2021-06-18 | 华灿光电(浙江)有限公司 | 发光二极管外延片制备方法 |
CN112993100B (zh) * | 2021-03-16 | 2022-01-14 | 华灿光电(浙江)有限公司 | 发光二极管外延片制备方法 |
CN113130670A (zh) * | 2021-04-20 | 2021-07-16 | 浙江师范大学 | 氧化铕/铂钝化接触晶体硅太阳能电池及其制备方法 |
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