CN103737092A - Miniature PVD coat miller cutter for PCB, and making method thereof - Google Patents
Miniature PVD coat miller cutter for PCB, and making method thereof Download PDFInfo
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- CN103737092A CN103737092A CN201310574249.9A CN201310574249A CN103737092A CN 103737092 A CN103737092 A CN 103737092A CN 201310574249 A CN201310574249 A CN 201310574249A CN 103737092 A CN103737092 A CN 103737092A
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Abstract
The invention discloses a miniature PVD coat miller cutter for PCB, and a making method thereof. The miniature PVD coat miller cutter for PCB comprises a substrate and one or more layers of a hard and wear-resistant coat deposited on the substrate through a physical vapor deposition process; the hard and wear-resistant coat is an MeCxNyOz coat, Me is one or more of Al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu, and x+y+z is 1; and the total thickness of the one or more layers of the coat on the substrate is 0.1-10mum. The substrate is made by using a cemented carbide material, a ceramet material, a ceramic material, a cubic boron nitride based material or a high-speed steel material. By improving the structure of the PVD coat in the invention, a processing problem that printed circuit boards are difficult to process is overcome, and a problem that the service life of a common miniature milling cutter is short is prolonged.
Description
Technical field
The present invention relates to use in printed circuit board mini milling cutter and coatings art thereof, particularly relate to a kind of PVD composite coating mini milling cutter being mainly used in printed circuit board (PCB) and preparation method thereof.
Background technology
Printed circuit board (PCB) is called for short PCB(Printed Circuit Board) be a kind of circuit product with printing or image transfer fabrication techniques.In the various product of modern society, arrive greatly computer, TV, little of mobile phone, IC-card, as long as have circuit in product, just there is the existence of printed circuit board (PCB).The instruction of be accompanied by that the RoHS(of European Union is electric, some harmful substance being used in restriction in electronic equipment) enforcement there is great variety in environment-friendly type PCB version under the requirement of RoHS.The PCB industry in the whole world has entered lead-free compatible and halogen-free environmental protection epoch, but in order to guarantee the stability of size, in printed circuit board (PCB), often add the oxide fillers such as aluminium, barium, silicon, magnesium, increased the difficulty of processing of printed circuit board (PCB), this has just proposed new higher requirement to PCB mini milling cutter.
Milling machine operation factory in modernization and automation mechanized operation, dealer wishes under machine conditions, to increase overall production capacity not increasing, therefore have higher cutting ability, more high rigidity, more wear-resisting, more long-life mini milling cutter be circuit board industry institute in the urgent need to, therefore industry wishes to plate better coating on mini milling cutter, make the better coating mini milling cutter of quality there is high rigidity, and can bear higher rotating speed, and then increase feed velocity and the production capacity of cutting.But the carbide alloy mini milling cutter of prior art is difficult to reach processing request.
Summary of the invention
The object of the invention is to overcome the deficiency of prior art, PVD coating mini milling cutter and preparation method thereof for a kind of PCB is provided, by the improvement to PVD coating structure, both overcome a processing difficult problem for difficult processing printed circuit board, overcome again a common mini milling cutter not long difficult problem in service life.
The technical solution adopted for the present invention to solve the technical problems is: PVD coating mini milling cutter for a kind of PCB, comprises matrix and adopt physical gas-phase deposite method to be deposited on a layer or the coating a plurality of layers and that have hard and wear-resisting feature on matrix; The described coating with hard and wear-resisting feature is MeC
xn
yo
zcoating, wherein Me is element al (aluminium), Cr(chromium), Ti(titanium), Zr(zirconium), Si(silicon), Hf(hafnium), Nb(niobium), Ni(nickel), W(tungsten), Ta(tantalum), B(boron), V(vanadium), Y(yttrium) and Cu(copper) in wherein one or more, x+y+z=1; And layer on described matrix or the gross thickness of a plurality of layers are between 0.1 μ m to 10 μ m.
Described matrix adopting Hardmetal materials, cermet material, ceramic material, the material based on cubic boron nitride or high speed steel material are made.
Described MeC
xn
yo
zcoating, wherein Me is wherein a kind of in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu, preferably, Me is wherein a kind of in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W and Ta.
Described MeC
xn
yo
zcoating, wherein Me is wherein two kinds in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu, preferably, Me is wherein two kinds in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta and B.
Described MeC
xn
yo
zcoating, wherein Me is wherein three kinds in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu, preferably, Me is wherein three kinds in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta and B.
Described MeC
xn
yo
zcoating, wherein Me be in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu wherein four or more, preferably, Me be in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B and Cu wherein four or more, be more preferably and be, Me be in element al, Cr, Ti, Zr, Si, Ni and W wherein four or more.
Layer on described matrix or the gross thickness of a plurality of layers are between 0.5 μ m to 4 μ m.
Described MeC
xn
yo
zcoating, z=0 preferably, x+y=1; X=0 more preferably, z=0, y=1.
The preparation method of PVD coating mini milling cutter for a kind of PCB, to utilize TiN, TiC, Ti (C, N) or (Al, Cr) N, the preferred single and/or laminated coating in the inside of (Al, Cr) N, utilize the single and/or laminated coating in the outside of (Al, Cr, Me1) N to apply described matrix, wherein, Me1 be in element ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu wherein one or more, preferably, Me1 be in elements Si, W, Ti, Zr and Ni wherein one or more.
Described employing physical gas-phase deposite method is for adopting vacuum evaporation coating, ion plating or magnetron sputtering, and preferred ion is plated, and under the following conditions by the described coating of growing with the multi-arc ion coating of Cr+Al target pure and/or alloying and Me1 target:
Gross pressure is 1 * 10
-5pa to 10Pa, is preferably 1 * 10
-4pa to 1 * 10
-1the N of Pa
2in+Ar atmosphere, preferably at pure N
2in;
Temperature is between 200 ℃ to 750 ℃, preferably between 350 ℃ to 650 ℃;
Be biased in-10V is between-300V, preferably-50V and-200V between;
Evaporation current is between 55A to 250A.
PVD coating mini milling cutter and preparation method thereof for a kind of PCB of the present invention, by mini milling cutter being applied to one or more layers wear-resistant coating, coating is as thermodynamic barrier and chemical barrier, can reduce phase counterdiffusion and the chemical reaction of cutter and workpiece material element, reduce the coefficient of friction of the two simultaneously, thereby improve the service life of cutter.This is because the service life of mini milling cutter and the chip removal ability of milling cutter have very close relationship, highly polished and be cut the coating that material compatibility is low and there is low coefficient of friction and high oxidation resistance temperature, be conducive to the raising of chip removal ability and cutting power, thereby be beneficial to the cutting ability that improves mini milling cutter, and this coating mini milling cutter can mass production, be easy to realize industrialization, have the prospect that is widely used in pcb board processing, market potential is very large.
PVD coating mini milling cutter and preparation method thereof for a kind of PCB of the present invention, adopted physical gas-phase deposite method to be called for short PVD(Physical Vapor Deposition), the method refers under vacuum condition, adopt the arc-discharge technique of low-voltage, large electric current, utilize gas discharge that target is evaporated and make to be evaporated material and gas all ionizes, utilize the acceleration of electric field, make to be evaporated material and product is deposited on workpiece.
PVD coating mini milling cutter and preparation method thereof for a kind of PCB of the present invention, matrix adopting Hardmetal materials, cermet material, ceramic material, the material based on cubic boron nitride or high speed steel material are made, carbide alloy is a kind of alloy material of being made by powder metallurgical technique by the hard compounds of refractory metal and binding metal, has that hardness is high, wear-resisting, intensity and a series of premium properties such as toughness is better, heat-resisting, corrosion-resistant; The structural material that cermet is comprised of ceramic hard phase and metal or alloy Binder Phase, cermet had both kept the characteristics such as ceramic high strength, high rigidity, wear-resistant, high temperature resistant, anti-oxidant and chemical stability, had again good metal toughness and plasticity; Ceramic material is oxide, nitride, boride and carbide etc. mostly, and common ceramic material has clay, aluminium oxide, kaolin etc.; High-speed steel is a kind of tool steel with high rigidity, high-wearing feature and high-fire resistance.
The invention has the beneficial effects as follows:
The coating mini milling cutter of producing by the present invention, because the coating on milling cutter surface has good wearability, lower coefficient of friction, thereby in processing PCB sheet material process, can significantly improve the service life of mini milling cutter, improve pcb board material crudy, and then improve cutter manufacturer's cutter added value and save the cost of charp tool that cutter uses business; The feature of mini milling cutter composite coating of the present invention is that hardness is high, good toughness, coefficient of friction are low, and itself and matrix have good combination power, thereby while making this coating mini milling cutter processing PCB plate, chip removal performance is good, extend service life, and this coating mini milling cutter can mass production, be easy to realize industrialization, has the prospect that is widely used in pcb board processing, and market potential is very large.
Below in conjunction with drawings and Examples, the present invention is described in further detail; But a kind of PCB of the present invention is not limited to embodiment with PVD coating mini milling cutter and preparation method thereof.
Accompanying drawing explanation
Fig. 1 is embodiment mono-coating mini milling cutter of the present invention schematic cross-section;
Fig. 2 is embodiment bis-coating mini milling cutter of the present invention schematic cross-section;
Fig. 3 is embodiment tri-coating mini milling cutter of the present invention schematic cross-section;
Fig. 4 is embodiment tetra-coating mini milling cutter of the present invention schematic cross-section;
Fig. 5 is embodiment five coating mini milling cutter of the present invention schematic cross-section.
The specific embodiment
Embodiment mono-
Shown in Figure 1, PVD coating mini milling cutter for a kind of PCB of the present invention, comprises matrix 10 and adopts physical gas-phase deposite method to be deposited on the two-layer coating with hard and wear-resisting feature on matrix; One of them coating 11 is TiN coating, and another coating 12 is AlTiSiN coating.
The MeC of coating 11
xn
yo
zin, Me only has a kind of element, and x=0, z=0, y=1;
The MeC of coating 12
xn
yo
zin, Me has three kinds of elements, and x=0, z=0, y=1.
The coating production of the present embodiment is as follows:
Choosing sword footpath is the carbide alloy PCB mini milling cutter of D1.0mm, and this PCB mini milling cutter must, through cleaning such as oil removing cleanings, be treated that PCB mini milling cutter surface reaches coating standard, then carry out deposited coatings.The one, PCB milling cutter is installed, PCB mini milling cutter is placed in to ion coating plating stove; The 2nd, vacuumize, it is 5 * 10 that unlatching mechanical pump is evacuated to vacuum
-3pa; The 3rd, heating, opens heating source, reaches 350 ℃; The 4th, Ions Bombardment purifies, and the Ar plasma bombardment strengthening by high impulse bias voltage purifies mini milling cutter surface; The 5th, depositing first coating 11 is TiN coating, introduces N2, be adjusted to-150V of bias voltage, and evaporation current is 100A, deposition 0.5 μ m to 1 μ m thickness; The 6th, depositing second coating 12 is AlTiSiN coating, be adjusted to-200V of bias voltage, and evaporation current is 150A, deposition 1 μ m to 1.5 μ m thickness; The 7th, cooling, after 30min to be cooled, take out coating mini milling cutter.Coating mini milling cutter is not compared, and the coating mini milling cutter cutting quality in the present embodiment improves, and the working durability is improved 3.5 times.
Embodiment bis-
Shown in Figure 2, PVD coating mini milling cutter for a kind of PCB of the present invention, comprises matrix 10 and adopts physical gas-phase deposite method to be deposited on the two-layer coating with hard and wear-resisting feature on matrix; One of them coating 21 is AlCrN coating, and another coating 22 is AlCrSiWN coating.
The MeC of coating 21
xn
yo
zin, Me has two kinds of elements, and x=0, z=0, y=1;
The MeC of coating 22
xn
yo
zin, Me has four kinds of elements, and x=0, z=0, y=1.
The coating production of the present embodiment is as follows:
Choosing sword footpath is the carbide alloy PCB mini milling cutter of D1.7m, and this PCB mini milling cutter must, through cleaning such as oil removing cleanings, be treated that PCB mini milling cutter surface reaches coating standard, then carry out deposited coatings.The one, PCB milling cutter is installed, PCB mini milling cutter is placed in to ion coating plating stove; The 2nd, vacuumize, it is 3 * 10 that unlatching mechanical pump is evacuated to vacuum
-3pa; The 3rd, heating, opens heating source, reaches 500 ℃; The 4th, Ions Bombardment purifies, and the Ar plasma bombardment strengthening by high impulse bias voltage purifies mini milling cutter surface; The 5th, depositing first coating 21 is AlCrN coating, introduces N2, be adjusted to-170V of bias voltage, and evaporation current is 150A, deposition 1 μ m to 1.5 μ m thickness; The 6th, deposition the second coating 22 is AlCrSiWN coating, be adjusted to-200V of bias voltage, and evaporation current is 180A, deposition 0.5 μ m to 1 μ m thickness; The 7th, cooling, after 30min to be cooled, take out coating mini milling cutter.Coating mini milling cutter is not compared, and the coating mini milling cutter cutting quality in the present embodiment improves, and the working durability is improved 2.3 times.
Embodiment tri-
Shown in Figure 3, PVD coating mini milling cutter for a kind of PCB of the present invention, comprises matrix 10 and adopts physical gas-phase deposite method to be deposited on the coating with hard and wear-resisting feature of three layers on matrix; One of them coating 31 is TiN coating, and another coating 32 is AlCrN coating, and another coating 33 is AlCrTiZrNiN coating.
The MeC of coating 31
xn
yo
zin, Me only has a kind of element, and x=0, z=0, y=1;
The MeC of coating 32
xn
yo
zin, Me has two kinds of elements, and x=0, z=0, y=1;
The MeC of coating 33
xn
yo
zin, Me has five kinds of elements, and x=0, z=0, y=1.
The coating production of the present embodiment is as follows:
Choosing sword footpath is the carbide alloy PCB mini milling cutter of D2.0mm, and this PCB mini milling cutter must, through cleaning such as oil removing cleanings, be treated that PCB mini milling cutter surface reaches coating standard, then carry out deposited coatings.The one, PCB milling cutter is installed, PCB mini milling cutter is placed in to ion coating plating stove; The 2nd, vacuumize, it is 3 * 10 that unlatching mechanical pump is evacuated to vacuum
-3pa; The 3rd, heating, opens heating source, reaches 500 ℃; The 4th, Ions Bombardment purifies, and the Ar plasma bombardment strengthening by high impulse bias voltage purifies mini milling cutter surface; The 5th, depositing first coating 31 is TiN coating, introduces N2, be adjusted to-150V of bias voltage, and evaporation current is 100A, deposition 0.2 μ m to 0.5 μ m thickness; The 6th, depositing second coating 32 is AlCrN coating, be adjusted to-170V of bias voltage, and evaporation current is 150A, deposition 0.5 μ m to 1 μ m thickness; The 7th, depositing the 3rd coating 33 is AlCrTiZrNiN coating, be adjusted to-200V of bias voltage, and evaporation current is 180A, deposition 0.5 μ m to 1 μ m thickness; The 8th, cooling, after 30min to be cooled, take out coating mini milling cutter.Coating mini milling cutter is not compared, and the coating mini milling cutter cutting quality in the present embodiment improves, and the working durability is improved 3.1 times.
Embodiment tetra-
Shown in Figure 4, PVD coating mini milling cutter for a kind of PCB of the present invention, comprises matrix 10 and adopts physical gas-phase deposite method to be deposited on the two-layer coating with hard and wear-resisting feature on matrix; One of them coating 41 is AlTiN coating, and another coating 42 is AlTiCN coating.
The MeC of coating 41
xn
yo
zin, Me has two kinds of elements, and x=0, z=0, y=1;
The MeC of coating 42
xn
yo
zin, Me has two kinds of elements, and z=0, x=0.5, y=0.5.
The coating production of the present embodiment is as follows:
Choosing sword footpath is the carbide alloy PCB mini milling cutter of D1.0mm, and this PCB mini milling cutter must, through cleaning such as oil removing cleanings, be treated that PCB mini milling cutter surface reaches coating standard, then carry out deposited coatings.The one, PCB milling cutter is installed, PCB mini milling cutter is placed in to ion coating plating stove; The 2nd, vacuumize, it is 4 * 10 that unlatching mechanical pump is evacuated to vacuum
-3pa; The 3rd, heating, opens heating source, reaches 550 ℃; The 4th, Ions Bombardment purifies, and the Ar plasma bombardment strengthening by high impulse bias voltage purifies mini milling cutter surface; The 5th, depositing first coating 41 is TiAlN coating, introduces N2, be adjusted to-150V of bias voltage, and evaporation current is 100A, deposition 0.5 μ m to 1 μ m thickness; The 6th, depositing second coating 42 is AlTiCN coating, be adjusted to-170V of bias voltage, and evaporation current is 150A, deposition 1 μ m to 1.5 μ m thickness; The 7th, cooling, after 30min to be cooled, take out coating mini milling cutter.Coating mini milling cutter is not compared, and the coating mini milling cutter cutting quality in the present embodiment improves, and the working durability is improved 3.0 times.
Embodiment five
Shown in Figure 5, PVD coating mini milling cutter for a kind of PCB of the present invention, comprises matrix 10 and adopts physical gas-phase deposite method to be deposited on the two-layer coating with hard and wear-resisting feature on matrix; One of them coating 51 is AlTiN coating, and another coating 52 is AlTiCNO coating.
The MeC of coating 51
xn
yo
zin, Me has two kinds of elements, and x=0, z=0, y=1;
The MeC of coating 52
xn
yo
zin, Me has two kinds of elements, and x=0.45, y=0.5, z=0.05.
The coating production of the present embodiment is as follows:
Choosing sword footpath is the carbide alloy PCB mini milling cutter of D1.0mm, and this PCB mini milling cutter must, through cleaning such as oil removing cleanings, be treated that PCB mini milling cutter surface reaches coating standard, then carry out deposited coatings.The one, PCB milling cutter is installed, PCB mini milling cutter is placed in to ion coating plating stove; The 2nd, vacuumize, it is 4 * 10 that unlatching mechanical pump is evacuated to vacuum
-3pa; The 3rd, heating, opens heating source, reaches 550 ℃; The 4th, Ions Bombardment purifies, and the Ar plasma bombardment strengthening by high impulse bias voltage purifies mini milling cutter surface; The 5th, depositing first coating 51 is TiAlN coating, introduces N2, be adjusted to-150V of bias voltage, and evaporation current is 100A, deposition 0.5 μ m to 1 μ m thickness; The 6th, depositing second coating 52 is AlTiCNO coating, be adjusted to-200V of bias voltage, and evaporation current is 150A, deposition 1 μ m to 1.5 μ m thickness; The 7th, cooling, after 30min to be cooled, take out coating mini milling cutter.Coating mini milling cutter is not compared, and the coating mini milling cutter cutting quality in the present embodiment improves, and the working durability is improved 3.5 times.
Above-described embodiment is only used for further illustrating PVD coating mini milling cutter and preparation method thereof for a kind of PCB of the present invention; but the present invention is not limited to embodiment; any simple modification, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment, all fall in the protection domain of technical solution of the present invention.
Claims (10)
1. a PVD coating mini milling cutter for PCB, comprises matrix and adopts physical gas-phase deposite method to be deposited on a layer or the coating a plurality of layers and that have hard and wear-resisting feature on matrix; It is characterized in that: described in there is hard and wear-resisting feature coating be MeC
xn
yo
zcoating, wherein Me be in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu wherein one or more, x+y+z=1; And layer on described matrix or the gross thickness of a plurality of layers are between 0.1 μ m to 10 μ m.
2. PVD coating mini milling cutter for PCB according to claim 1, is characterized in that: described matrix adopting Hardmetal materials, cermet material, ceramic material, the material based on cubic boron nitride or high speed steel material are made.
3. PVD coating mini milling cutter for PCB according to claim 1 and 2, is characterized in that: described MeC
xn
yo
zcoating, wherein Me is wherein a kind of in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W and Ta.
4. PVD coating mini milling cutter for PCB according to claim 1 and 2, is characterized in that: described MeC
xn
yo
zcoating, wherein Me is wherein two kinds in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta and B.
5. PVD coating mini milling cutter for PCB according to claim 1 and 2, is characterized in that: described MeC
xn
yo
zcoating, wherein Me is wherein three kinds in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta and B.
6. PVD coating mini milling cutter for PCB according to claim 1 and 2, is characterized in that: described MeC
xn
yo
zcoating, wherein Me be in element al, Cr, Ti, Zr, Si, Hf, Nb, Ni, W, Ta, B and Cu wherein four or more.
7. PVD coating mini milling cutter for PCB according to claim 1 and 2, is characterized in that: layer on described matrix or the gross thickness of a plurality of layers are between 0.5 μ m to 4 μ m.
8. PVD coating mini milling cutter for PCB according to claim 1 and 2, is characterized in that: described MeC
xn
yo
zcoating, wherein, z=0, x+y=1; Or, x=0, z=0, y=1.
9. the preparation method of PVD coating mini milling cutter for a PCB, it is characterized in that: be on matrix, to adopt physical gas-phase deposite method deposited coatings, to utilize the single and/or laminated coating in the inside of TiN, TiC, Ti (C, N) or (Al, Cr) N, utilize the single and/or laminated coating in the outside of (Al, Cr, Me1) N to apply described matrix, wherein, Me1 be in element ti, Zr, Si, Hf, Nb, Ni, W, Ta, B, V, Y and Cu wherein one or more.
10. the preparation method of PVD coating mini milling cutter for PCB according to claim 9, it is characterized in that: described employing physical gas-phase deposite method is employing vacuum evaporation coating, ion plating or magnetron sputtering, and under the following conditions by the described coating of growing with the multi-arc ion coating of Cr+Al target pure and/or alloying and Me1 target:
Gross pressure is 1 * 10
-5the N of Pa to 10Pa
2in+Ar atmosphere;
Temperature is between 200 ℃ to 750 ℃;
Be biased in-10V is between-300V;
Evaporation current is between 55A to 250A.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203638A (en) * | 1995-11-30 | 1998-12-30 | 桑德维克公司 | Coated milling insert and method of making it |
| CN101088757A (en) * | 2006-06-15 | 2007-12-19 | 山特维克知识产权股份有限公司 | Coated inserts for milling |
| CN101204864A (en) * | 2006-12-15 | 2008-06-25 | 山特维克知识产权股份有限公司 | Coated cemented carbide endmill |
| CN101680075A (en) * | 2007-03-23 | 2010-03-24 | 奥尔利康贸易股份公司（特吕巴赫） | Be used for wear resistant hard coating of workpiece and preparation method thereof |
| CN102091923A (en) * | 2009-12-04 | 2011-06-15 | 山特维克知识产权股份有限公司 | Multilayer coated cutting tool |
| US20120114442A1 (en) * | 2009-04-03 | 2012-05-10 | Sandvik Intellectual Property Ab | Coated cutting tool for metal cutting applications generating high temperatures |
| CN103008746A (en) * | 2012-12-20 | 2013-04-03 | 上海壳瑞微材料科技有限公司 | Super-hard wear-resisting chromium-based composite coating micro milling cutter used for PCB (Printed Circuit Board) and preparation method thereof |
-
2013
- 2013-11-13 CN CN201310574249.9A patent/CN103737092A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203638A (en) * | 1995-11-30 | 1998-12-30 | 桑德维克公司 | Coated milling insert and method of making it |
| CN101088757A (en) * | 2006-06-15 | 2007-12-19 | 山特维克知识产权股份有限公司 | Coated inserts for milling |
| CN101204864A (en) * | 2006-12-15 | 2008-06-25 | 山特维克知识产权股份有限公司 | Coated cemented carbide endmill |
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