CN103723676A - Manufacturing method of micro-fluid channel - Google Patents
Manufacturing method of micro-fluid channel Download PDFInfo
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- CN103723676A CN103723676A CN201310750237.7A CN201310750237A CN103723676A CN 103723676 A CN103723676 A CN 103723676A CN 201310750237 A CN201310750237 A CN 201310750237A CN 103723676 A CN103723676 A CN 103723676A
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Abstract
The invention provides a manufacturing method of a micro-fluid channel. According to an adopted technical scheme, the manufacturing method comprises the following steps of adhering a substrate with a micro-channel structure to a substrate surface to be processed; and then continuously introducing an etching solution to the substrate surface by virtue of an external pump valve system so as to realize rapid processing of the micro-fluid channel. By using the manufacturing method of the micro-fluid channel provided by the invention, a manufacturing process is rapid and simple, an etching sacrificial layer does not need to be prepared, the usage amount of the etching solution is greatly reduced, meanwhile the etching efficiency is remarkably improved; the manufacturing method is especially suitable for rapidly manufacturing micro-fluidic chips with low cost and slight pollution on a large scale.
Description
Technical field
The present invention relates to micro-manufacture field, particularly a kind of preparation method of microfluidic channel.
Background technology
Micro-fluidic chip is that a class be take minisize reaction or the analytical system that microchannel network is architectural feature.Owing to having, analysis speed is fast, reagent consumption less, use cost is low, easy of integration and the advantage such as automation, micro-fluidic chip is widely used in the research in the fields such as chemistry, biology, medical science.
At present, for making the material of micro-fluidic chip, mainly contain the inorganic material such as silicon, glass, quartz, metal, also there are the organic high molecular polymers such as polymethyl methacrylate (PMMA), dimethyl silicone polymer (PDMS), various materials have respectively its feature, are applicable to different field.The manufacture craft of micro-fluidic chip mainly comprises microchannel preparation and chip bonding, existing microchannel preparation method comprises wet etching, dry etching, laser ablation, machining, injection molding etc., wherein, wet etching is the main processing method of microchannel in the inorganic material such as silicon, glass, quartz, metal.The characteristic size of the microchannel of materials such as silicon, glass is that width is generally less than 200 microns, the degree of depth is tens of microns, the substrate that its processing mainly has a sacrifice layer of microchannel figure by effects on surface carries out wet etching to be realized, due to the etch rate of above-mentioned material in corrosive liquid system very fast (generally can reach several microns per minute), and wet etching can carry out in enormous quantities in etching groove, so wet etching is suitable for the production in enormous quantities of the micro-fluidic chip of above-mentioned material.
But, in the process of wet etching processing microchannel, first must in substrate surface processing, there is by photoetching method the sacrifice layer of microchannel figure, sacrificial layer material is generally metal and the photoresists such as chromium, gold, platinum, sacrifice layer figure is generally processed by photoetching process, the steps such as related mask manufacture and exposure imaging need expensive instrument, clean-room environment and loaded down with trivial details preparation process, therefore cannot meet fast and the needs of batch production; Secondly, traditional wet etching often adopts base material is immersed in a large amount of etching liquid systems and is realized in conjunction with mechanical agitation, therefore before wet etching, some carry out special protection without machining area by the back side of base material etc. often must to adopt certain methods, very loaded down with trivial details; In addition, these etching liquids of preparing for microchannel mostly are strong acid, highly basic or toxic organic solvent, easy contaminated environment, and liquid waste processing is very loaded down with trivial details, and cost is higher.Therefore, be badly in need of a kind of etching technics of development, consumption that can at utmost low reduction etching liquid, improves etching efficiency, thereby reduces environmental pollution and reduce the processing cost of micro-fluidic chip.
Summary of the invention
The object of the invention is to the problems referred to above of preparing for current microfluidic channel, a kind of new wet etching preparation method is provided.
This method does not need complicated instrument and equipment and strict experiment condition, and greatly reduces etching liquid consumption, can realize easy quick, low-cost, the high-precision micro-processing of microfluidic channel in micro-fluidic chip preparation process.For achieving the above object, the technical solution used in the present invention is at a substrate with MCA of substrate surface laminating to be processed, then by external pump valve system, etching liquid is directed into substrate surface continuously, thereby realizes the rapid processing of microfluidic channel.
The present invention proposes a kind of preparation method of microfluidic channel, it is characterized in that the preparation method of described microfluidic channel comprises following characteristics step:
1), with computer aided design software design with draw microchannel figure, on a smooth substrate, process open MCA and fluid passing hole;
2) substrate processing and work surface are carried out to reversible keying, obtain closed MCA;
3) by pump valve system, etching liquid is imported to microchannel continuously, work surface is carried out to local wet etching, substrate is peeled off from work surface after being etched to desired depth, obtain microfluidic channel.
In step 1) in, described substrate material not with subsequent step in etching liquid react, specifically comprise polytetrafluoroethylene (PTFE), dimethyl silicone polymer, polymethyl methacrylate, glass etc.; Described open MCA and fluid passing hole are to obtain by traditional micro-processing method, comprise laser ablation, lathe in machining etc.
In step 2) in, described substrate and the reversible keying of work surface comprise the modes such as direct laminating, pressurizing attaching, stickup bonding, and its bond strength need guarantee not occur fluid leakage, and the two can be peeled off at an easy rate simultaneously.
In step 3) in, described pump valve system comprises syringe pump, peristaltic pump, piezoelectric pump, and magnetic valve etc., in order to prevent the infringement of etching liquid to pump valve system, preferentially use inertia flexible pipe and externally positioned type peristaltic pump etching liquid to be delivered to from storage container to microchannel.Described etching liquid can be reused, the closed circuit system for example forming by peristaltic pump, inertia flexible pipe and chip, can by etching liquid continuously, repeatedly by carrying out etching in microchannel, like this.
In step 3) in, the width of described microchannel and the degree of depth are 0.1～1000 micron.
The preparation method of microfluidic channel proposed by the invention, described material to be processed can be the inorganic material such as glass, quartz, silicon, metal, can be also the macromolecular materials such as polymethyl methacrylate; Corresponding etching liquid comprises acid, alkali, organic solvent etc., for example, select HF solution during etching glass microchannel; During etch silicon microchannel, can adopt commercially available alkaline etch bath; During etching PMMA passage, can select organic etching liquids such as chloroform.
Use the preparation method of microfluidic channel proposed by the invention, preparation process is fast and convenient, preparation without etching sacrificial layer, and greatly reduced etching liquid use amount, significantly improve etching efficiency simultaneously, be particularly suitable for quick, in enormous quantities, low-cost, the oligosaprobic preparation of micro-fluidic chip.
Accompanying drawing explanation
Fig. 1. a kind of process schematic diagram of microchannel.Wherein, (a) for thering is cover plate and the base material reversible keying to be processed of open channel structure; (b) for being continuously pumped into etching liquid; (c) etching of microchannel; (d) be that cover plate and base material to be processed are peeled off acquisition microchannel.
Fig. 2. the preparation process schematic diagram of a kind of linearity microchannel.Wherein, A is the cover plate with MCA, and B is base material to be processed, and C is microchannel, and D is the etching liquid that pumps into microchannel, and E is the MCA that substrate surface etching obtains.
Fig. 3. a kind of for preparing fast the circular flow ejector half system composition schematic diagram of microchannel.Wherein, a1 is the cover plate with microchannel and the base material to be etched that reversible keying forms, and b1 is the polytetrafluoro flexible pipe that is full of etching liquid, and c1 is microchannel, and d1 is peristaltic pump.
Fig. 4. a kind of for preparing fast the way flow ejector half system composition schematic diagram of microchannel.Wherein, a2 is cover plate and base material to be etched, and b2 is the polytetrafluoro flexible pipe that is full of etching liquid, and c2 is microchannel, and d2 is peristaltic pump, and e is etching liquid container, and f is waste fluid container.
Specific embodiments
The following examples will be further described the present invention, but not thereby limiting the invention.
The preparation of 1 one kinds of linear pattern glass microchannels of embodiment
Fig. 1 is the process schematic diagram of a kind of microchannel provided by the invention.Concrete preparation process is as follows: first utilize accurate digital control CNC engraving technology to process MCA on a smooth teflon substrate, (Fig. 1 a) then to use fixture to carry out reversible keying this substrate and surface of plate glass to be processed; Then use outside peristaltic pump system that hf etching liquid is imported to microchannel (Fig. 1 b) continuously along a teflon hose; Hf etching liquid is etched to desired depth (Fig. 1 c) by the region at place, microchannel on glass substrate; Finally, teflon substrate, from glass baseplate sur-face peeling, is obtained to glass microchannel.
More specifically, the structure of a kind of linear pattern glass microchannel and processing method are as shown in Figure 2, a polytetrafluoroethylene (PTFE) cover plate A with two parallel lines passages is fitted tightly on glass substrate B to be processed, hf etching liquid D is fed in two channel C, after etching 20～30 minutes, cover plate and substrate are peeled off, on glass baseplate, obtained two microfluidic channel E.In order to obtain linear glass microchannel and at utmost to save etching liquid consumption, the present embodiment is used a kind of circular flow ejector half system (system composition is shown in Fig. 3), this system comprises the cover plate with microchannel (c1) and the base material to be etched (a1) that reversible keying forms, and is full of polytetrafluoro flexible pipe (b1) and the peristaltic pump (d1) of etching liquid.Its chips and flexible pipe form a closed circuit circulatory system, and etching liquid, under the driving of peristaltic pump, carries out etching thereby can enter in microchannel to glass baseplate surface to be etched continuous circulation.Use this system, etching liquid consumption can be reduced to 1 milliliter, due to flowing through from surface to be etched that etching liquid moves in circles, realize the continuous renewal of etching liquid and reuse, greatly strengthen etching efficiency on the one hand, saved on the other hand etching liquid consumption.
The preparation of 2 one kinds of cross type glass microchannels of embodiment
The structure of a kind of cross type glass microchannel and preparation method are as shown in Figure 4.A polytetrafluoroethylene (PTFE) cover plate with cross type passage is fitted tightly and on glass substrate to be processed, forms the chip a2 with sealing microchannel c2, use peristaltic pump d2 that hf etching liquid is extracted out from storage container e and inject chip entrance along teflon hose b2, etching waste liquid exports to waste liquid storage container f from three outlets of chip.After etching 20～30 minutes, cover plate and substrate are peeled off, on glass baseplate, obtained cross type microfluidic channel.Use this system, etching liquid consumption can be reduced to several milliliters of ranks, because etching liquid flows through from surface to be etched continuously, realize the continuous renewal of etching liquid, therefore use preparation method provided by the invention and system to carry out the preparation of glass microchannel, greatly strengthen etching efficiency on the one hand, saved on the other hand etching liquid consumption.
The preparation of 3 one kinds of silicon base microchannels of embodiment
On silicon chip, the preparation process of microchannel as shown in Figure 1, concrete preparation process is as follows: first utilize accurate digital control CNC engraving technology to process MCA on a smooth teflon substrate, (Fig. 1 a) then to use fixture to carry out reversible keying on this substrate and polished silicon slice surface to be processed; Then use outside peristaltic pump system that commercially available process silicon etching solution is imported to microchannel (Fig. 1 b) continuously along teflon hose; Process silicon etching solution is etched to desired depth (Fig. 1 c) by the region at place, microchannel on silicon chip; Finally, teflon substrate is peeled off from silicon chip surface, obtained silicon base microchannel.
The preparation of 4 one kinds of copper substrate microchannels of embodiment
On copper base, the preparation process of microchannel as shown in Figure 1, concrete preparation process is as follows: first utilize accurate digital control CNC engraving technology to process MCA on a smooth teflon substrate, (Fig. 1 a) then to use fixture to carry out reversible keying on this substrate and polishing copper sheet surface to be processed; Then use outside peristaltic pump system that HCl etching liquid is imported to microchannel (Fig. 1 b) continuously along teflon hose; HCl etching liquid is etched to desired depth (Fig. 1 c) by the region at place, microchannel on copper sheet; Finally, teflon substrate, from copper sheet sur-face peeling, is obtained to copper substrate microchannel.
Claims (8)
1. a preparation method for microfluidic channel, is characterized in that the preparation method of described microfluidic channel comprises following characteristics step:
1), with computer aided design software design with draw microchannel figure, on a smooth substrate, process open MCA and fluid passing hole;
2) substrate processing and work surface are carried out to reversible keying, obtain closed MCA;
3) by pump valve system, etching liquid is imported to microchannel continuously, work surface is carried out to local wet etching, substrate is peeled off from work surface after being etched to desired depth, obtain microfluidic channel.
2. the preparation method of a kind of microfluidic channel as claimed in claim 1, it is characterized in that in step 1) in, described substrate material not with subsequent step in etching liquid react, specifically comprise polytetrafluoroethylene (PTFE), dimethyl silicone polymer, polymethyl methacrylate, glass etc.; Described open MCA and fluid passing hole are to obtain by traditional micro-processing method, comprise laser ablation, lathe in machining etc.
3. the preparation method of a kind of microfluidic channel as claimed in claim 1, it is characterized in that in step 2) in, described substrate and the reversible keying of work surface comprise the modes such as direct laminating, pressurizing attaching, stickup bonding, its bond strength need guarantee not occur fluid leakage, and the two can be peeled off at an easy rate simultaneously.
4. the preparation method of a kind of microfluidic channel as claimed in claim 1, it is characterized in that in step 3) in, described pump valve system comprises syringe pump, peristaltic pump, piezoelectric pump, and magnetic valve etc., in order to prevent the infringement of etching liquid to pump valve system, preferentially use peristaltic pump and inertia flexible pipe etching liquid to be delivered to from storage container to microchannel.
5. the preparation method of a kind of microfluidic channel as claimed in claim 1, it is characterized in that in step 3) in, described etching liquid can be reused, the closed circuit system for example forming by peristaltic pump, inertia flexible pipe and chip, can by etching liquid continuously, repeatedly by carrying out etching in microchannel.
6. the preparation method of a kind of microfluidic channel as claimed in claim 1, is characterized in that in step 3) in, the width of described microchannel and the degree of depth are 0.1～1000 micron.
7. the preparation method of a kind of microfluidic channel as claimed in claim 1, is characterized in that described material to be processed can be the inorganic material such as glass, quartz, silicon, metal, can be also the macromolecular materials such as polymethyl methacrylate; Corresponding etching liquid comprises acid, alkali, organic solvent etc.
8. the preparation method of a kind of microfluidic channel as claimed in claim 1, it is characterized in that in preparation process fast and convenient, not only can avoid the preparation of etching sacrificial layer, and greatly reduced etching liquid use amount, significantly improve etching efficiency simultaneously, be particularly suitable for quick, in enormous quantities, low-cost, the oligosaprobic preparation of micro-fluidic chip.
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Cited By (7)
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| CN105036061A (en) * | 2015-07-01 | 2015-11-11 | 北京工业大学 | Manufacturing method of microchannel with recessed lower wall |
| CN105498868A (en) * | 2015-11-20 | 2016-04-20 | 华南师范大学 | Microfluidic chip packaging method |
| CN106890684A (en) * | 2017-03-28 | 2017-06-27 | 广东顺德工业设计研究院(广东顺德创新设计研究院) | Glass base chip and preparation method thereof |
| CN107262173A (en) * | 2017-08-03 | 2017-10-20 | 广东顺德工业设计研究院(广东顺德创新设计研究院) | PDMS micro-fluidic chips and the method that PDMS micro-fluidic chips are prepared based on wet etching |
| CN110982666A (en) * | 2019-12-19 | 2020-04-10 | 深圳市华迈生物医疗科技有限公司 | Device, system and method for real-time fluorescence quantitative nucleic acid amplification detection |
| CN112326100A (en) * | 2020-10-28 | 2021-02-05 | 吉林大学 | Fluid pressure sensor based on micro-nano structure array surface and preparation method thereof |
| CN112816535A (en) * | 2020-12-30 | 2021-05-18 | 哈尔滨工业大学（深圳） | Patterned electrode, and preparation method and application thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105036061A (en) * | 2015-07-01 | 2015-11-11 | 北京工业大学 | Manufacturing method of microchannel with recessed lower wall |
| CN105498868A (en) * | 2015-11-20 | 2016-04-20 | 华南师范大学 | Microfluidic chip packaging method |
| CN106890684A (en) * | 2017-03-28 | 2017-06-27 | 广东顺德工业设计研究院(广东顺德创新设计研究院) | Glass base chip and preparation method thereof |
| CN107262173A (en) * | 2017-08-03 | 2017-10-20 | 广东顺德工业设计研究院(广东顺德创新设计研究院) | PDMS micro-fluidic chips and the method that PDMS micro-fluidic chips are prepared based on wet etching |
| CN110982666A (en) * | 2019-12-19 | 2020-04-10 | 深圳市华迈生物医疗科技有限公司 | Device, system and method for real-time fluorescence quantitative nucleic acid amplification detection |
| CN112326100A (en) * | 2020-10-28 | 2021-02-05 | 吉林大学 | Fluid pressure sensor based on micro-nano structure array surface and preparation method thereof |
| CN112326100B (en) * | 2020-10-28 | 2021-12-07 | 吉林大学 | Fluid pressure sensor based on micro-nano structure array surface and preparation method thereof |
| CN112816535A (en) * | 2020-12-30 | 2021-05-18 | 哈尔滨工业大学（深圳） | Patterned electrode, and preparation method and application thereof |
| CN112816535B (en) * | 2020-12-30 | 2022-08-12 | 哈尔滨工业大学（深圳） | Patterned electrode, and preparation method and application thereof |
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