CN106890684A - Glass base chip and preparation method thereof - Google Patents
Glass base chip and preparation method thereof Download PDFInfo
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- CN106890684A CN106890684A CN201710193907.8A CN201710193907A CN106890684A CN 106890684 A CN106890684 A CN 106890684A CN 201710193907 A CN201710193907 A CN 201710193907A CN 106890684 A CN106890684 A CN 106890684A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
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Abstract
The present invention relates to a kind of glass base micro-fluidic chip and preparation method thereof.The glass base chip internal has microchannel, and the microchannel includes some first microchannels, and first microchannel is the chamber of closing；The preparation method comprises the following steps：Obtain bottom sheet glass and cover glass piece；The microchannel is formed after the cover glass piece is fitted in into the bottom sheet glass, adhesive piece is obtained；The adhesive piece is transferred in heater, is warming up to more than the annealing temperature of glass with the heating rate of 0.5~2 DEG C/min；Then annealed cooling process again, obtains the glass base chip.The present invention is directed to the sheet glass comprising closing micro-structural, by Reasonable Regulation And Control heating rate, can be during the bonding that heats up, the micro-moisture in the first microchannel is set equably to vaporize, evaporate, ensure the structure of closing microchannel, the Production Time of chip, improve production efficiency can be saved.
Description
Technical field
The present invention relates to micro-fluidic chip manufacturing technology, more particularly to glass base chip and preparation method thereof.
Background technology
Micro-fluidic chip is a kind of to be manipulated in micron order igfet channel the science skill for principal character to fluid
Art, with the unit operation micro such as sample preparation, separation analysis, detection in the laboratories such as biology, chemistry is several to one
Ability on square centimeter chip, therefore also referred to as " micro-total analysis system ".Due to integrated level is high, reagent consumption less,
Analyze speed is fast, the features such as be easy to automation, micro-fluidic chip has been subject to that researcher's is widely studied, and it is biological, medical,
Commercial prod is occurred in that in the fields such as chemistry.
Material for making micro-fluidic chip has glass, polymeric material, paper etc., wherein, in many colleges and universities, research institute
The experimental instrument and equipment for having correlation makes a kind of dimethyl silicone polymer (PDMS) base micro-fluidic chip --- polymeric material
Material chip.However, the electric osmose poor performance of PDMS base micro-fluidic chips, makes it difficult to be applied to electrophoresis experiment；PDMS is hydrophobicity
Material, when being tested using aqueous samples, generally requires to carry out hydrophily treatment to chip.Therefore, PDMS bases miniflow
Control chip is subject to use limitation to a certain extent.
As PDMS, glass be also it is a kind of be usually used in process micro-fluidic chip material, its have Young's modulus high,
Stabilization chemical property and thermal property, electrical conductivity it is low, it is transparent good the features such as.
At present, the method for bonding glass base micro-fluidic chip is numerous.In spite of researcher attempted epoxy resin gluing,
The fairly simple reversible keying method such as film bond method, but effect is undesirable, therefore irreversible high temperature bonding method should
It is wider with scope.High temperature bonding method refers to be fit together by by two pieces of clean glass sheets to be bonded, is then transferred into horse
Not in stove, temperature is set to rise to more than the annealing temperature of glass by heating pressurization, now two pieces of glass interfaces occur polymerization instead
Answer and be combined together, then complete the bonding process of whole chip by temperature control stages such as annealing, coolings again.However, working as core
When in piece containing the micro-structural closed, for example, the graduation mark of distance is represented in the split tunnel side etching of cross chip,
The MCA of moulding closure, or even the overall structure that chip can be destroyed are difficult to according to conventional high temperature bonding method, it is difficult to protect
Demonstrate,prove the product quality of glass base micro-fluidic chip.
Additionally, the method for making glass base micro-fluidic chip conventional at present is the side of standard lithographic combination wet etching
Method：Mask containing patterning is covered in and is pre-coated with the glass of glimmer glue-line and sacrifice layer (sol evenning chromium plate)；Then,
Under the irradiation of some strength parallel ultraviolet, the pattern on mask is transferred to sol evenning chromium plate；Again by development, fixing and wet method
The steps such as etching just can produce wanted micro-structural on sol evenning chromium plate；Sol evenning chromium plate containing micro-structural is then covered with one
Glass sheet glass bonding packaging, just can produce a complete chip.However, need to make sol evenning chromium plate using the method,
It is related to the expensive instrument and equipment of purchase.This cost for not only causing to process glass base micro-fluidic chip sharp rises, and right
For some small enterprises and the first researcher that enters a profession, corresponding economic capability has even more been difficult to.Although current someone uses laser
The technologies such as ablation, powder blast technique, supercritical ultrasonics technology process microchannel on glass, but these mechanical processing methods obtain it is micro- logical
Road roughness is relatively large, it is difficult to meet use requirement.
The content of the invention
Based on this, it is necessary to provide a kind of preparation method of glass base chip.
A kind of preparation method of glass base chip, the glass base chip internal has microchannel, and the microchannel includes
Some first microchannels, first microchannel is the chamber of closing；
The preparation method comprises the following steps：
Obtain bottom sheet glass and cover glass piece；
The microchannel is formed after the cover glass piece is fitted in into the bottom sheet glass, adhesive piece is obtained；
The adhesive piece is transferred in heater, the annealing of glass is warming up to the heating rate of 0.5~2 DEG C/min
It is more than temperature；Then annealed cooling process again, obtains the glass base chip.
The present invention is had found by studying, for the glass base chip comprising closing microchannel (i.e. the first microchannel), when adopting
During with traditional high temperature bonding method, wherein the micro-moisture meeting rapid vaporization for including, causes it to form gas when bonding is melted
Chamber, and then influence even to destroy the structure of the first microchannel.And according to the high temperature bonding method of substep, will chip to be bonded
Low temperature (typically 60~100 DEG C) is dried in secondary microchannel and is then transferred to Muffle furnace after moisture disappearance in drying box, then needed
Several or even more than ten hour is expended, so can undoubtedly increase Production Time and the step of chip.
Based on this, the preparation method of glass base chip of the invention, by Reasonable Regulation And Control heating rate be 0.5~2 DEG C/
Min, can make the micro-moisture in the first microchannel equably vaporize, evaporate, it is ensured that closing is micro- during the bonding that heats up
The structure of passage, can save the Production Time of chip, improve production efficiency.
The annealing temperature of glass of the present invention can carry out conventional determination according to different glass materials.
Wherein in one embodiment, the heating rate is 0.8~1.5 DEG C/min.
Wherein in one embodiment, 545~555 are warming up to the heating rate (Mean Speed) of 0.9~1.1 DEG C/min
DEG C, and 55~65min is incubated at 545~555 DEG C；Then it is warming up to 595~605 DEG C in 55~65min, and 595~
175~185min is incubated at 605 DEG C.
Wherein in one embodiment, the annealing cooling process is to be down to room temperature with the Mean Speed of 1~3 DEG C/min.
Wherein in one embodiment, the microchannel also includes some second microchannels；Second microchannel has
Some openings being connected with air.
Wherein in one embodiment, the surface etch of the bottom sheet glass has depressed part, by cover glass piece laminating
In behind the surface, the microchannel is formed between the depressed part and the cover glass piece.
Wherein in one embodiment, the surface etch of the bottom sheet glass has depressed part, by cover glass piece laminating
In behind the surface, the microchannel is formed between the depressed part and the cover glass piece；
The method for obtaining the bottom sheet glass comprises the following steps：
Substrate is obtained, substrate depressed part is etched with the substrate, and be provided with and entering that the substrate depressed part is connected
Liquid mouthful；The substrate depressed part is corresponding with the depressed part that the bottom glass sheet surface is etched；
The substrate and sheet glass are carried out into reversible keying, the substrate depressed part forms chamber with the surface of sheet glass；
Etching liquid is injected from the inlet to the chamber, the sheet glass is performed etching, i.e., in the sheet glass
Surface form the depressed part；
The substrate is removed, the bottom sheet glass is obtained final product.
The preparation method of the bottom sheet glass, it is reversible by first being carried out with sheet glass using the substrate for being etched with substrate depressed part
Bonding, then to etching liquid is injected in the chamber for being formed, etching liquid is performed etching according to the shape of substrate depressed part to sheet glass,
The depressed part accordingly can be formed in glass sheet surface, thus without making and use sol evenning chromium plate, it is to avoid costliness
Instrument and equipment acquisition expenses, it is to avoid the problem of the Heavy-metal Polluted Environment caused using sol evenning chromium plate, and simple to operate, processing
Difficulty and cost are relatively low, are easy to batch production, can carry out chip manufacture in institute of most of scientific research institutions and enterprise, have
Good application prospect.
Wherein in one embodiment, the etching solution includes that volume ratio is 1:1~3:15~25 hydrofluoric acid (HF), nitre
Acid and water.
It is easily anti-with hydrofluoric acid if glass is containing the material compared with poly-metal deoxide for the making of bottom sheet glass
Answer and generate the precipitation in water hard to tolerate, and then influence the etching quality of microchannel.The present invention passes through to use above-mentioned etching liquid, rationally
The volume ratio of control hydrofluoric acid, nitric acid and water, while ensureing that etching liquid has sufficiently fast etch rate to glass, not only keeps away
Exempt to be destroyed because of the excessive concentration of hydrofluoric acid and nitric acid being bonded for substrate and sheet glass, it is ensured that microchannel shape on the sheet glass of bottom
Into accuracy and homogeneity.
Depending on the depth of the depressed part required for the basis of time of above-mentioned etching.Wherein in one embodiment, the quarter
The time of erosion is 40min, and temperature is 25 DEG C.
Wherein in one embodiment, the material of the substrate is dimethyl silicone polymer (PDMS), polymethylacrylic acid
One or more combination in methyl esters (PMMA), makrolon (PC).Using the substrate of the material, in etching process, not with
Etching liquid reacts, and can avoid impacting etching liquid with the reaction of sheet glass.
Wherein in one embodiment, after the substrate is carried out into reversible keying with the sheet glass, gained chip is entered
Row heated baking, baking temperature is 60~70 DEG C, and the time is 1~3 hour.To increase the bonding between substrate and sheet glass.
Wherein in one embodiment, the method for the reversible keying is pressurization bonding, pastes bonding, oxygen plasma method
In the combination of one or more.
Wherein in one embodiment, the charge velocity of the etching liquid is 0.1 μ L/min~5 μ L/min.When it is described can
When the method for inverse bonding is oxygen plasma method, the charge velocity of the etching liquid is preferably 0.5 μ L/min~2 μ L/min.
Wherein in one embodiment, the method for removing the substrate is：Using the concentrated sulfuric acid or the concentrated sulfuric acid and other strong acid
Removed after the mixed liquid dipping for being constituted.
Wherein in one embodiment, after removing the substrate, the bottom sheet glass is rinsed with water, and institute is blown out with nitrogen
State the liquid in depressed part.
The preparation method that the present invention also provides described glass base chip makes the glass base chip for obtaining.
Compared with prior art, the invention has the advantages that：
The preparation method of glass base chip of the invention, for the glass base chip comprising the first microchannel, by reasonable
Regulation and control heating rate is 0.5~2 DEG C/min, during the bonding that heats up the micro-moisture in the first microchannel can be made equal
Vaporize evenly, evaporate, it is ensured that the structure of closing microchannel, the Production Time of chip, improve production efficiency can be saved.
The preparation method of bottom sheet glass of the invention, by first being entered with sheet glass using the substrate for being etched with substrate depressed part
Row reversible keying, is then performed etching using etching liquid again, you can form the depressed part on the surface of sheet glass.Thus it is not required to
Make and use sol evenning chromium plate, it is to avoid expensive instrument and equipment acquisition expenses, it is to avoid the weight that is caused using sol evenning chromium plate
The problem of metallic pollution environment, and it is simple to operate, difficulty of processing and cost are relatively low, are easy to batch production, can be most of
Carry out chip manufacture in institute of scientific research institutions and enterprise, have a good application prospect.
Brief description of the drawings
Fig. 1 is the structural representation of the bottom sheet glass in one embodiment of the invention；
Fig. 2 is the Making programme schematic diagram of the bottom sheet glass in one embodiment of the invention；
Fig. 3 is the Making programme schematic diagram of the substrate in one embodiment of the invention；
Fig. 4 is the pictorial diagram that one embodiment of the invention makes the glass base micro-fluidic chip for obtaining.
Specific embodiment
Glass base chip of the invention and preparation method thereof is described in further detail below in conjunction with specific embodiment.
Embodiment
The present embodiment provides a kind of preparation method of glass base micro-fluidic chip, glass base micro-fluidic chip inside tool
There is microchannel, the microchannel includes the first microchannel, first microchannel does not have the opening being connected with air, be closing
Micro-structural.In the present embodiment, the glass base micro-fluidic chip is additionally provided with perforate, and the microchannel also includes that second is micro- logical
Road, the two ends of second microchannel are connected to the perforate, form two openings that can be connected with air.It is understood that
In other embodiments, the two ends of the second microchannel can be also connected to the edge of the glass base micro-fluidic chip, with formed with
The opening that air is connected.
Above-mentioned preparation method comprises the following steps：
(1) bottom sheet glass and cover glass piece are obtained；
(2) bottom sheet glass and cover glass piece are cleaned up, are fit together in ultra-pure water, form above-mentioned microchannel,
Obtain adhesive piece；
(3) adhesive piece is transferred in Muffle furnace, moving back for glass is warming up to the heating rate of 0.5~2 DEG C/min
More than fiery temperature, then after annealed cooling process, glass base micro-fluidic chip is obtained final product.
In the present embodiment, the bottom sheet glass and cover glass piece material for using are calcium soda-lime glass；The annealing temperature is 500
~530 DEG C.
In the present embodiment, the method for intensification is specially and is warming up to 550 DEG C with the Mean Speed of 1 DEG C/min, and at 550 DEG C
Lower insulation 60min；Then 600 DEG C are warming up in 60min, and 180min is incubated at 600 DEG C.Then with the flat of 2 DEG C/min
Room temperature is down in equal speed annealing cooling.
It is possible thereby to during the bonding that heats up, microchannel is made to greatest extent, it is especially micro- in the first microchannel
The ground vaporization of amount uniform moisture, evaporation, it is ensured that the structure of closing microchannel, can save the Production Time of chip, improve production effect
Rate.
In the present embodiment, as shown in figure 1, the surface etch of bottom sheet glass 10 has depressed part, the depressed part includes first
The depressed part 12 of depressed part 11 and second, while being additionally provided with perforate 13.Wherein, the both ends of the first depressed part 11 are respectively positioned on bottom
Within the edge of sheet glass 10, after bottom sheet glass and cover glass piece are fitted, shape between the first depressed part 11 and cover glass piece
Into first microchannel；The two ends of the second depressed part 12 are connected at perforate 13, and bottom sheet glass is fitted with cover glass piece
Afterwards, second microchannel is formed between the second depressed part 12 and cover glass piece.
As shown in Fig. 2 the method for obtaining bottom sheet glass 10 comprises the following steps：
1.1 obtain substrate, as shown in Figure 2 a, substrate depressed part 21, the figure of substrate depressed part 21 are provided with substrate 20
The depressed part etched needed for surface according to bottom sheet glass 10 makes, corresponding with the depressed part.Specifically, substrate depressed part 21
Including the first substrate depressed part and the second substrate depressed part, the first substrate depressed part is corresponding with the first depressed part 11, and
The inlet 22 for being communicated to the first substrate depressed part is additionally provided with substrate 20, specifically can be using card punch in suitable position
Putting carries out punching formation, and quantity is configured also dependent on needs, it is ensured that all first substrate depressed parts subsequently can enter
The perfusion of row etching liquid.The second substrate depressed part is corresponding with the second depressed part 12.
In the present embodiment, the material of substrate is PDMS.It is understood that in other embodiments, also can using PMMA and/or
PC, thus in etching process, it is ensured that substrate does not react with etching liquid, can avoid the reaction to etching liquid and sheet glass
Impact.
Sheet glass 30 is taken, sheet glass 30 is punched by laser, ultrasonic wave or diamond bit, form perforate 13
(not shown in Fig. 2).
1.2 as shown in Figure 2 b, and by substrate 20, (Citotest Labware Manufacturing Co., Ltd., standard level is micro- with sheet glass 30
Mirror slide) reversible keying is carried out, the first substrate depressed part forms first chamber, the second substrate depression with the surface of sheet glass 30
Portion forms second chamber with the surface of sheet glass 30, obtains PDMS- glass heterozygosis micro-fluidic chips.
In the present embodiment, the method for the reversible keying is oxygen plasma method, and gained chip carried out after bonding
Heated baking, baking temperature is 65 DEG C, and the time is 2h, to increase the bonding between substrate 20 and sheet glass 30.It is understood that at it
In its embodiment, heated baking is not also carried out, or use other reversible keying methods, such as in stickup bonding, pressurization bonding
Plant or several combinations.
1.3 in the first chamber and second chamber to irrigating etching liquid：
As shown in Figure 2 c, for the first chamber, one end of plastic tube is connected with the inlet 22 of substrate 20, it is another
Hold and be connected with the syringe 40 for being pre-loaded with etching liquid, then syringe 40 is fixed on sampling pump 50.By setting sample introduction
The flow velocity of pump 50, makes sampling pump 50 upon actuation given either continuously or intermittently to etching liquid is irrigated in first chamber, thus to sheet glass 30
Perform etching, i.e., form first depressed part on the surface of sheet glass.
For the second chamber, because the first substrate depressed part is connected with perforate 13 and forms opening, can be without volume
Exterior open cell, one end of plastic tube is connected with the opening, and the other end is connected with syringe 40.Then similarly, by setting
Determine the flow velocity of sampling pump 50, make sampling pump 50 upon actuation given either continuously or intermittently to etching liquid is irrigated in second chamber, thus to glass
Glass piece 30 is performed etching, i.e., form second depressed part on the surface of sheet glass.
In the present embodiment, the etching liquid for using is 1 including volume ratio:2:21 HF, nitric acid and water, the injection of etching liquid
Speed is 0.5 μ L/min~2 μ L/min.And the etch rate and required glass of the basis of time etching liquid needed for irrigating etching liquid
Depending on glass base micro-fluidic chip channel depth, the time for etching in the present embodiment is 40min, and temperature is 25 DEG C.
1.4 remove substrate, and then gained sheet glass is placed in the concentrated sulfuric acid, with the further PDMS for removing residual, take out
Afterwards again with water rinse gained sheet glass, nitrogen blowout depressed part in liquid, in order to avoid residual etching liquid sheet glass is carried out after
Continuous etching, obtains final product the sheet glass with the depressed part corresponding with the figure of substrate depressed part 21, i.e. bottom sheet glass 10, such as Fig. 2 d institutes
Show.
More specifically, in the present embodiment, as shown in figure 3, the method that substrate is obtained in step 1.1 may include following step
Suddenly：
1.1.1 Wafer Cleaning：Silicon chip surface cleaning is enable by conventional degreasing, pickling, water-washing step, specifically can be according to
It is secondary to be cleaned through acetone, the concentrated sulfuric acid and ultra-pure water；Then by its removal moisture drying, Fig. 3 a.
1.1.2 spin coating：Clean silicon chip is placed on sol evenning machine, it is coated with certain thickness by spin coating method
Negative photoresist (SU-8 photoresists), Fig. 3 b.
1.1.3 front baking：The silicon chip for scribbling negative photoresist is toasted by the mode such as flat plate heat or heated at constant temperature case, so that negative light
Solvent volatilization in photoresist liquid, baking condition is to toast 15min at 95 DEG C.
1.1.4 expose：Mask is placed between negative photoresist and the light source of litho machine, is exposed using ultraviolet light, exposed
The light time can be 10s, the channel pattern on mask is transferred on negative photoresist, Fig. 3 c.
1.1.5 dry afterwards：After end exposure, dried after being carried out during the silicon chip after exposure is placed in into flat plate heat or heated at constant temperature case,
After the condition dried afterwards is first to toast 1min at 65 DEG C, then 15min is toasted at 95 DEG C, to promote exposure area in negative photoresist
Cross-linking reaction.
1.1.6 develop：After the completion of dry after, the glue of non-exposed areas in negative photoresist is removed by developer solution, with obtain with
The opposite passageway pattern of mask, that is, obtain the silicon chip with microchannel pattern.Herein, the silicon chip is also referred to as formpiston, figure
3d。
1.1.7 hard mould：To increase the adhesion between rubber moulding and silicon chip substrate, the formpiston that development is obtained after terminating needs
65 DEG C of baking 2h.
1.1.8 fall glue：Dimethyl silicone polymer (PDMS) monomer presses 10 with curing agent:After 1 ratio is mixed, degassing is obtained
The clear prepolymer of bubble-free；Then prepolymer is poured on the good formpiston with cofferdam structure of pre-production, Fig. 3 e.Immediately
It is transferred in flat plate heat or heated at constant temperature case etc. and is heated, the temperature of heating is 65 DEG C, and the time is 3h, makes prepolymer completely solid
Change.
1.1.9 the demoulding, punching：Carefully peeled off from formpiston solidification with MCA (i.e. substrate depressed part)
PDMS, Fig. 3 f, then punch to form feed pathway using card punch, obtain final product substrate 20.
It is understood that in other embodiments, in step 1.1.1, the silicon chip for being used can be replaced by glass, metal etc..
In step 1.1.2, spin coating operation can also be certain in silicon chip applied atop by methods such as spread coating, spraying processes
The negative photoresist of thickness.
In step 1.1.4, exposure process is also not limited to use litho machine, it is also possible to by other method come photoetching
Journey.
The micro- photograph of the glass base micro-fluidic chip for obtaining is made by the preparation method of above-mentioned glass base micro-fluidic chip
Piece is as shown in Figure 4.
Any being taken on the first microchannel and the second microchannel that make the glass base micro-fluidic chip for obtaining a little is surveyed
Amount, the mean breadth for obtaining is 73 μm, and relative standard deviation (RSD) is 0.03%.Thus illustrate that obtained glass base is micro-fluidic
The width homogeneity of chip microchannel is high, and crudy is high.It is also possible to it was observed that the structure of the first microchannel is more complete
It is whole.
Comparative example
A kind of preparation method of glass base micro-fluidic chip of this comparative example, the same embodiment of its step, difference is：Step
(3) in, it is warming up to more than the annealing temperature of glass (600 DEG C) with the average heating rate of 5 DEG C/min.
First microchannel of the glass base micro-fluidic chip that making is obtained, the first microchannel phase with embodiment same position
Than, the first microchannel gross distortion of comparative example is found, the blister heaved is formd, chip surface out-of-flatness is not only resulted in, also
The second microchannel nearby is caused to be distorted deformation.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of preparation method of glass base chip, it is characterised in that the glass base chip internal has microchannel, described micro-
Passage includes some first microchannels, and first microchannel is the chamber of closing；
The preparation method comprises the following steps：
Obtain bottom sheet glass and cover glass piece；
The microchannel is formed after the cover glass piece is fitted in into the bottom sheet glass, adhesive piece is obtained；
The adhesive piece is transferred in heater, the annealing temperature of glass is warming up to the heating rate of 0.5~2 DEG C/min
More than；Then annealed cooling process again, obtains the glass base chip.
2. the preparation method of glass base chip according to claim 1, it is characterised in that the heating rate is 0.8~
1.5℃/min。
3. the preparation method of glass base chip according to claim 1, it is characterised in that the method for the intensification is：With
The heating rate of 0.9~1.1 DEG C/min is warming up to 545~555 DEG C, and 55~65min is incubated at 545~555 DEG C；Then exist
595~605 DEG C are warming up in 55~65min, and 175~185min is incubated at 595~605 DEG C.
4. the preparation method of glass base chip according to claim 1, it is characterised in that the annealing cooling process be with
The Mean Speed of 1~3 DEG C/min is down to room temperature.
5. the preparation method of glass base chip according to claim 1, it is characterised in that the microchannel also includes some
Second microchannel；Second microchannel has some openings being connected with air.
6. the preparation method of the glass base chip according to claim any one of 1-5, it is characterised in that the bottom sheet glass
Surface etch have depressed part, after the cover glass piece is fitted in into the surface, between the depressed part and the cover glass piece
Form the microchannel；
The method for obtaining the bottom sheet glass comprises the following steps：
Substrate is obtained, substrate depressed part is etched with the substrate, and offer the feed liquor being connected with the substrate depressed part
Mouthful；The substrate depressed part is corresponding with the depressed part that the bottom glass sheet surface is etched；
The substrate and sheet glass are carried out into reversible keying, the substrate depressed part forms chamber with the surface of sheet glass；
Etching liquid is injected from the inlet to the chamber, the sheet glass is performed etching, i.e., in the table of the sheet glass
Face forms the depressed part；
The substrate is removed, the bottom sheet glass is obtained final product.
7. the preparation method of glass base chip according to claim 6, it is characterised in that the etching solution includes volume ratio
It is 1:1~3:15~25 hydrofluoric acid, nitric acid and water.
8. the preparation method of glass base chip according to claim 6, it is characterised in that the material of the substrate is poly- two
One or more combination in methylsiloxane, polymethyl methacrylate, makrolon.
9. the preparation method of the glass base chip according to claim any one of 6-8, it is characterised in that by the substrate with
After the sheet glass carries out reversible keying, heated baking is carried out to gained chip, baking temperature is 60~70 DEG C, and the time is 1~3
Hour.
10. the preparation method of the glass base chip described in any one of claim 1-9 makes the glass base chip for obtaining.
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| CN107876112A (en) * | 2017-10-20 | 2018-04-06 | 河南工业大学 | A kind of method of glass Direct Bonding artistic glass base microfluidic channel sealing-in |
| CN108114676A (en) * | 2017-12-08 | 2018-06-05 | 东南大学 | A kind of preparation method of glass micro channels reactor |
| CN112125277A (en) * | 2020-10-10 | 2020-12-25 | 上海科技大学 | Preparation process suitable for glass window of superconducting detector |
| CN114272965A (en) * | 2021-12-27 | 2022-04-05 | 广东省科学院半导体研究所 | Preparation method of glass substrate chip, glass substrate chip and application |
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| CN107876112A (en) * | 2017-10-20 | 2018-04-06 | 河南工业大学 | A kind of method of glass Direct Bonding artistic glass base microfluidic channel sealing-in |
| CN108114676A (en) * | 2017-12-08 | 2018-06-05 | 东南大学 | A kind of preparation method of glass micro channels reactor |
| CN112125277A (en) * | 2020-10-10 | 2020-12-25 | 上海科技大学 | Preparation process suitable for glass window of superconducting detector |
| CN112125277B (en) * | 2020-10-10 | 2024-02-13 | 上海科技大学 | Preparation process suitable for superconducting detector glass window |
| CN114272965A (en) * | 2021-12-27 | 2022-04-05 | 广东省科学院半导体研究所 | Preparation method of glass substrate chip, glass substrate chip and application |
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