CN106890684B - Glass base chip and preparation method thereof - Google Patents
Glass base chip and preparation method thereof Download PDFInfo
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- CN106890684B CN106890684B CN201710193907.8A CN201710193907A CN106890684B CN 106890684 B CN106890684 B CN 106890684B CN 201710193907 A CN201710193907 A CN 201710193907A CN 106890684 B CN106890684 B CN 106890684B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
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Abstract
The present invention relates to a kind of glass base micro-fluidic chips and preparation method thereof.The glass base chip interior has microchannel, and the microchannel includes several first microchannels, and first microchannel is closed chamber；The production method includes the following steps: to obtain bottom sheet glass and cover glass piece；The microchannel is formed after the cover glass piece is fitted in the bottom sheet glass, obtains adhesive piece；The adhesive piece is transferred in heating device, the annealing temperature of glass or more is warming up to the heating rate of 0.5~2 DEG C/min；Then annealed cooling process again, obtains the glass base chip.The present invention is directed to the sheet glass comprising closing micro-structure, can be during heating up bonding by Reasonable Regulation And Control heating rate, the micro-moisture in the first microchannel is set equably to vaporize, evaporate, the structure for guaranteeing closing microchannel, can save the Production Time of chip, improve production efficiency.
Description
Technical field
The present invention relates to micro-fluidic chip manufacturing technologies, more particularly to glass base chip and preparation method thereof.
Background technique
Micro-fluidic chip is a kind of scientific skill to be manipulated fluid for main feature in igfet channel in the micron-scale
Art has the unit operations such as sample preparation, separation analysis, detection in the laboratories such as biology, chemistry are miniature several to one
Ability on square centimeter chip, therefore also referred to as " micro-total analysis system ".Due to being consumed less with integrated level height, reagent,
Analysis speed is fast, is easy to the features such as automating, micro-fluidic chip by the extensive research of researcher, and biology, medicine,
There is commercial prod in the fields such as chemistry.
Material for making micro-fluidic chip has glass, polymer material, paper etc., wherein in many colleges and universities, research institute
There is a kind of relevant experimental instrument and equipment production dimethyl silicone polymer (PDMS) base micro-fluidic chip --- polymeric material
Expect chip.However, the electric osmose performance of PDMS base micro-fluidic chip is poor, make it difficult to be suitable for electrophoresis experiment；PDMS is hydrophobicity
Material generally requires to carry out hydrophily processing to chip when being tested using aqueous samples.Therefore, PDMS base miniflow
Control chip is used limitation to a certain extent.
As PDMS, glass be also it is a kind of be usually used in process micro-fluidic chip material, with high Young's modulus,
The features such as stable chemical property and thermal property, conductivity are low, the transparency is good.
Currently, the method for bonding glass base micro-fluidic chip is numerous.In spite of researcher attempted epoxy resin gluing,
The fairly simple reversible keying method such as film bond method, but effect is undesirable, therefore irreversible high temperature bonding method is answered
It is wider with range.High temperature bonding method refers to by the way that two pieces of clean glass sheets to be bonded fit together, and is then transferred into horse
Not in furnace, temperature is set to rise to the annealing temperature of glass or more by heating pressurization, polymerization occurs for two pieces of glass interfaces anti-at this time
It answers and is combined together, the bonding process of entire chip is then completed using temperature controls stages such as annealing, coolings.However, working as core
In piece contain closed micro-structure when, such as cross chip split tunnel side etching on indicate distance graduation mark,
It is difficult to the microchannel structure of moulding closure according to conventional high temperature bonding method, or even the overall structure of chip can be destroyed, it is difficult to be protected
Demonstrate,prove the product quality of glass base micro-fluidic chip.
In addition, the method for currently used production glass base micro-fluidic chip is the side of standard lithographic combination wet etching
Method: the exposure mask containing patterning is covered on the glass for being pre-coated with glimmer glue-line and sacrificial layer (sol evenning chromium plate)；Then,
Under the irradiation of some strength parallel ultraviolet, the pattern on exposure mask is transferred to sol evenning chromium plate；Pass through development, fixing and wet process again
Etching and etc. wanted micro-structure can be produced on sol evenning chromium plate；Sol evenning chromium plate containing micro-structure is then covered with one
Glass sheet glass bonding packaging can produce a complete chip.However, need to make sol evenning chromium plate using this method,
It is related to the expensive instrument and equipment of purchase.This not only makes the cost for processing glass base micro-fluidic chip sharp rise, but also right
For some small enterprises and the first researcher that enters a profession, it is even more difficult to corresponding economic capability.Although current someone uses laser
The technologies such as ablation, powder blast technique, supercritical ultrasonics technology process microchannel on glass, but these mechanical processing methods obtain it is micro- logical
Road roughness is relatively large, it is difficult to meet requirement.
Summary of the invention
Based on this, it is necessary to provide a kind of production method of glass base chip.
A kind of production method of glass base chip, the glass base chip interior have microchannel, and the microchannel includes
Several first microchannels, first microchannel are closed chamber；
The production method includes the following steps:
Obtain bottom sheet glass and cover glass piece；
The microchannel is formed after the cover glass piece is fitted in the bottom sheet glass, obtains adhesive piece；
The adhesive piece is transferred in heating device, the annealing of glass is warming up to the heating rate of 0.5~2 DEG C/min
It is more than temperature；Then annealed cooling process again, obtains the glass base chip.
The present invention passes through the study found that for the glass base chip comprising closing microchannel (i.e. the first microchannel), when adopting
When with traditional high temperature bonding method, micro-moisture meeting rapid vaporization wherein included causes it to will form gas when melting bonding
Chamber, and then influence the structure for even destroying the first microchannel.And according to the high temperature bonding method of substep, i.e., by chip to be bonded
Low temperature (usually 60~100 DEG C) is dry to Muffle furnace is then transferred to after moisture disappearance in secondary microchannel in drying box, then needs
Several or even a hour more than ten is expended, undoubtedly will increase Production Time and the step of chip in this way.
Based on this, the production method of glass base chip of the invention, by Reasonable Regulation And Control heating rate be 0.5~2 DEG C/
Min can make the micro-moisture in the first microchannel equably vaporize, evaporate, guarantee that closing is micro- during heating up bonding
The structure in channel can save the Production Time of chip, improve production efficiency.
The annealing temperature of glass of the present invention can carry out conventional determine according to different glass materials.
The heating rate is 0.8~1.5 DEG C/min in one of the embodiments,.
545~555 are warming up in one of the embodiments, with the heating rate (Mean Speed) of 0.9~1.1 DEG C/min
DEG C, and 55~65min is kept the temperature at 545~555 DEG C；Then it is warming up to 595~605 DEG C in 55~65min, and 595~
175~185min is kept the temperature at 605 DEG C.
The annealing cooling process is to be down to room temperature with the Mean Speed of 1~3 DEG C/min in one of the embodiments,.
The microchannel further includes several second microchannels in one of the embodiments,；Second microchannel has
Several openings being connected with atmosphere.
The surface etch of the bottom sheet glass has recessed portion in one of the embodiments, and the cover glass piece is bonded
Behind the surface, the microchannel is formed between the recessed portion and the cover glass piece.
The surface etch of the bottom sheet glass has recessed portion in one of the embodiments, and the cover glass piece is bonded
Behind the surface, the microchannel is formed between the recessed portion and the cover glass piece；
The method for obtaining the bottom sheet glass includes the following steps:
Obtain substrate, substrate recessed portion be etched on the substrate, and be equipped be connected with the substrate recessed portion into
Liquid mouth；The substrate recessed portion is corresponding with the recessed portion that the bottom glass sheet surface etches；
The substrate and sheet glass are subjected to reversible keying, the surface formation chamber of the substrate recessed portion and sheet glass；
Etching liquid is injected from the inlet to the chamber, the sheet glass is performed etching, i.e., in the sheet glass
Surface form the recessed portion；
The substrate is removed to get the bottom sheet glass.
The production method of the bottom sheet glass, by first reversible using the substrate and sheet glass progress that are etched with substrate recessed portion
Bonding, then injects etching liquid into the chamber of formation, and etching liquid performs etching sheet glass according to the shape of substrate recessed portion,
The recessed portion accordingly can be formed in glass sheet surface, thus without making and using sol evenning chromium plate, avoid valuableness
Instrument and equipment acquisition expenses, the problem of avoiding Heavy-metal Polluted Environment caused by using sol evenning chromium plate, and easy to operate, processing
Difficulty and cost are lower, convenient for batch production, can carry out chip manufacture in most of institutes, scientific research institutions and enterprise, have
Good application prospect.
The etching solution includes hydrofluoric acid (HF), the nitre that volume ratio is 1:1~3:15~25 in one of the embodiments,
Acid and water.
Production for bottom sheet glass, if glass is easy anti-with hydrofluoric acid containing the material compared with poly-metal deoxide
It answers and generates the precipitating hard to tolerate in water, and then influence the etching quality of microchannel.The present invention is by using above-mentioned etching liquid, rationally
The volume ratio for controlling hydrofluoric acid, nitric acid and water is not only kept away while guaranteeing that etching liquid has sufficiently fast etch rate to glass
Destroy being bonded for substrate and sheet glass due to exempting from the excessive concentration because of hydrofluoric acid and nitric acid, it is ensured that microchannel shape on the sheet glass of bottom
At accuracy and homogeneity.
Depending on the depth of recessed portion required for the basis of time of above-mentioned etching.The quarter in one of the embodiments,
The time of erosion is 40min, and temperature is 25 DEG C.
The material of the substrate is dimethyl silicone polymer (PDMS), polymethylacrylic acid in one of the embodiments,
One of methyl esters (PMMA), polycarbonate (PC) or multiple combinations.Using the substrate of the material, in etching process, not with
Etching liquid reacts, and can be avoided and impacts to etching liquid with reacting for sheet glass.
After the substrate and the sheet glass are carried out reversible keying in one of the embodiments, to gained chip into
Row heated baking, baking temperature are 60~70 DEG C, and the time is 1~3 hour.To increase the bonding between substrate and sheet glass.
The method of the reversible keying is pressurization bonding, pastes bonding, oxygen plasma method in one of the embodiments,
One or more of combination.
The charge velocity of the etching liquid is 0.1 μ of μ L/min~5 L/min in one of the embodiments,.When it is described can
When the method for inverse bonding is oxygen plasma method, the charge velocity of the etching liquid is preferably 0.5 μ of μ L/min~2 L/min.
The method of the substrate is removed in one of the embodiments, are as follows: utilizes the concentrated sulfuric acid or the concentrated sulfuric acid and other strong acid
It is removed after composed mixed liquid dipping.
After removing the substrate in one of the embodiments, it is rinsed with water the bottom sheet glass, and blow out institute with nitrogen
State the liquid in recessed portion.
The present invention also provides the prepared glass base chips of production method of the glass base chip.
Compared with prior art, the invention has the following advantages:
The production method of glass base chip of the invention, for the glass base chip comprising the first microchannel, by reasonable
Regulation heating rate is 0.5~2 DEG C/min, the micro-moisture in the first microchannel can be kept equal during heating up bonding
It vaporizes, evaporate evenly, guarantee the structure of closing microchannel, the Production Time of chip can be saved, improve production efficiency.
The production method of bottom sheet glass of the invention, by first using be etched with substrate recessed portion substrate and sheet glass into
Row reversible keying, is then performed etching using etching liquid again, can form the recessed portion on the surface of sheet glass.Thus it is not required to
Sol evenning chromium plate is made and used, expensive instrument and equipment acquisition expenses is avoided, avoids weight caused by using sol evenning chromium plate
The problem of metallic pollution environment, and it is easy to operate, difficulty of processing and cost are lower, can be most of convenient for batch production
Carry out chip manufacture in institute, scientific research institutions and enterprise, has a good application prospect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the bottom sheet glass in one embodiment of the invention；
Fig. 2 is the production process schematic diagram of the bottom sheet glass in one embodiment of the invention；
Fig. 3 is the production process schematic diagram of the substrate in one embodiment of the invention；
Fig. 4 is the pictorial diagram of the prepared glass base micro-fluidic chip of one embodiment of the invention.
Specific embodiment
Glass base chip and preparation method thereof of the invention is described in further detail below in conjunction with specific embodiment.
Embodiment
The present embodiment provides a kind of production method of glass base micro-fluidic chip, tool inside the glass base micro-fluidic chip
There is microchannel, which includes the first microchannel, and first microchannel does not have the opening being connected with atmosphere, for closing
Micro-structure.In the present embodiment, the glass base micro-fluidic chip is additionally provided with aperture, which further includes second micro- logical
Road, the both ends of second microchannel are connected to the aperture, form two openings that can be connected with atmosphere.It is understood that
In other embodiments, the both ends of the second microchannel can also be connected to the edge of the glass base micro-fluidic chip, with formed with
The opening that atmosphere is connected.
Above-mentioned production method includes the following steps:
(1) bottom sheet glass and cover glass piece are obtained；
(2) bottom sheet glass and cover glass piece are cleaned up, are fit together in ultrapure water, form above-mentioned microchannel,
Obtain adhesive piece；
(3) adhesive piece is transferred in Muffle furnace, moving back for glass is warming up to the heating rate of 0.5~2 DEG C/min
More than fiery temperature, then to get glass base micro-fluidic chip after annealed cooling process.
In the present embodiment, the bottom sheet glass and cover glass piece material used is calcium soda-lime glass；The annealing temperature is 500
~530 DEG C.
In the present embodiment, the method for heating is specially warming up to 550 DEG C with the Mean Speed of 1 DEG C/min, and at 550 DEG C
Lower heat preservation 60min；Then it is warming up to 600 DEG C in 60min, and keeps the temperature 180min at 600 DEG C.Then with the flat of 2 DEG C/min
Room temperature is down in equal rate annealing.
It is possible thereby to make to greatest extent micro- in microchannel, especially the first microchannel during heating up bonding
It vaporizes, evaporate to amount uniform moisture, guaranteeing the structure of closing microchannel, the Production Time of chip can be saved, improving production effect
Rate.
In the present embodiment, as shown in Figure 1, the surface etch of bottom sheet glass 10 has recessed portion, which includes first
Recessed portion 11 and the second recessed portion 12, while being additionally provided with aperture 13.Wherein, the both ends of the first recessed portion 11 are respectively positioned on bottom
Within the edge of sheet glass 10, after bottom sheet glass and cover glass piece are fitted, shape between the first recessed portion 11 and cover glass piece
At first microchannel；The both ends of second recessed portion 12 are connected at aperture 13, and bottom sheet glass and cover glass piece are fitted
Afterwards, second microchannel is formed between the second recessed portion 12 and cover glass piece.
As shown in Fig. 2, the method for obtaining bottom sheet glass 10 includes the following steps:
1.1 acquisition substrates are provided with substrate recessed portion 21, the figure of substrate recessed portion 21 as shown in Figure 2 a on substrate 20
It is made according to the recessed portion of etching needed for the surface of bottom sheet glass 10, it is corresponding with the recessed portion.Specifically, substrate recessed portion 21
Including the first substrate recessed portion and the second substrate recessed portion, the first substrate recessed portion is corresponding with the first recessed portion 11, and
It is additionally provided with the inlet 22 for being connected to the first substrate recessed portion on substrate 20, punch specifically can be used in suitable position
Set and carry out punching formation, quantity can also be configured as needed, guarantee all first substrate recessed portions it is subsequent can be into
The perfusion of row etching liquid.The second substrate recessed portion is corresponding with the second recessed portion 12.
In the present embodiment, the material of substrate is PDMS.It is understood that in other embodiments, can also be used PMMA and/or
PC guarantees that substrate does not react with etching liquid, can be avoided reacting to etching liquid and sheet glass thus in etching process
It impacts.
Sheet glass 30 is taken, sheet glass 30 is punched by laser, ultrasonic wave or diamond bit, forms aperture 13
(being not shown in Fig. 2).
1.2 as shown in Figure 2 b, and by substrate 20, (Citotest Labware Manufacturing Co., Ltd., standard level are micro- with sheet glass 30
Mirror glass slide) carry out reversible keying, the surface formation first chamber of the first substrate recessed portion and sheet glass 30, the second substrate recess
Portion and the surface of sheet glass 30 form second chamber, obtain PDMS- glass heterozygosis micro-fluidic chip.
In the present embodiment, the method for the reversible keying is oxygen plasma method, and is carried out after bonding to gained chip
Heated baking, baking temperature is 65 DEG C, time 2h, to increase the bonding between substrate 20 and sheet glass 30.It is understood that at it
In its embodiment, also without heated baking, or other reversible keying methods are used, as pasted be bonded, in pressurization bonding one
Kind or several combinations.
1.3 are perfused etching liquid into the first chamber and second chamber:
As shown in Figure 2 c, for the first chamber, one end of plastic tube is connected with the inlet 22 of substrate 20, it is another
It holds and is connected with the syringe 40 for being pre-loaded with etching liquid, then syringe 40 is fixed on sampling pump 50.By setting sample introduction
50 flow velocitys are pumped, make sampling pump 50 that etching liquid continuously or intermittently be perfused into first chamber after actuation, thus to sheet glass 30
It performs etching, i.e., forms first recessed portion on the surface of sheet glass.
Volume can be not necessarily to since the first substrate recessed portion is connected with aperture 13 and forms opening for the second chamber
One end of plastic tube is connected by exterior open cell with the opening, and the other end is connected with syringe 40.Then similarly, by setting
Determine 50 flow velocity of sampling pump, makes sampling pump 50 that etching liquid continuously or intermittently be perfused into second chamber after actuation, thus to glass
Glass piece 30 performs etching, i.e., forms second recessed portion on the surface of sheet glass.
In the present embodiment, the etching liquid used includes volume ratio for the HF of 1:2:21, nitric acid and water, the injection of etching liquid
Rate is 0.5 μ of μ L/min~2 L/min.And the etch rate of basis of time etching liquid and required glass needed for etching liquid is perfused
Depending on glass base micro-fluidic chip channel depth, the time etched in the present embodiment is 40min, and temperature is 25 DEG C.
1.4 remove substrate, and then gained sheet glass is placed in the concentrated sulfuric acid, further to remove remaining PDMS, take out
Be rinsed with water again afterwards gained sheet glass, nitrogen blow out recessed portion in liquid, in order to avoid remaining etching liquid to sheet glass carry out after
Continuous etching is to get the sheet glass with recessed portion corresponding with 21 figure of substrate recessed portion, i.e. bottom sheet glass 10, such as Fig. 2 d institute
Show.
More specifically, in the present embodiment, as shown in figure 3, the method for obtaining substrate in step 1.1 may include walking as follows
It is rapid:
1.1.1 Wafer Cleaning: enabling silicon chip surface cleaning by conventional degreasing, pickling, water-washing step, specifically can be according to
It is secondary to be cleaned through acetone, the concentrated sulfuric acid and ultrapure water；Then by its removal moisture drying, Fig. 3 a.
1.1.2 spin coating: clean silicon wafer is placed on sol evenning machine, coats it with certain thickness by spin coating method
Negative photoresist (SU-8 photoresist), Fig. 3 b.
1.1.3 front baking: the silicon wafer for being coated with negative photoresist is toasted by the modes such as flat plate heat or heated at constant temperature case, so that negative light
Solvent volatilization in photoresist liquid, baking condition are to toast 15min at 95 DEG C.
1.1.4 it exposes: exposure mask being placed between negative photoresist and the light source of litho machine, is exposed using ultraviolet light, expose
It can be 10s between light time, be transferred to the channel pattern on exposure mask on negative photoresist, Fig. 3 c.
1.1.5 it dries afterwards: after end exposure, the silicon wafer after exposure being placed in flat plate heat or heated at constant temperature case after carrying out and dried,
The condition dried afterwards is after first toasting 1min at 65 DEG C, then at 95 DEG C toasts 15min, to promote exposure area in negative photoresist
Cross-linking reaction.
1.1.6 develop: after the completion dry after, the glue of non-exposed areas in negative photoresist is removed by developer solution, with obtain with
The opposite passageway pattern of exposure mask, that is, obtain the silicon wafer with microchannel pattern.Herein, which is also referred to as formpiston, figure
3d。
1.1.7 hard mould: to increase the adhesion strength between rubber moulding and silicon wafer substrate, the formpiston obtained after development needs to exist
65 DEG C of baking 2h.
1.1.8 it falls glue: after dimethyl silicone polymer (PDMS) monomer and curing agent are by the mixing of 10:1 ratio, deaerating, obtain
The clear prepolymer of bubble-free；Then prepolymer is poured on the good formpiston with cofferdam structure of pre-production, Fig. 3 e.Immediately
It is transferred in flat plate heat or heated at constant temperature case etc. and is heated, the temperature of heating is 65 DEG C, and time 3h keeps prepolymer completely solid
Change.
1.1.9 it demoulds, punch: carefully being removed from formpiston cured with microchannel structure (i.e. substrate recessed portion)
Then PDMS, Fig. 3 f punch to form feed pathway to get substrate 20 using punch.
It is understood that in other embodiments, in step 1.1.1, used silicon wafer can be replaced by glass, metal etc..
In step 1.1.2, spin coating process can also be certain in silicon wafer applied atop by the methods of spread coating, spray coating method
The negative photoresist of thickness.
In step 1.1.4, exposure process is also not limited to using litho machine, can also be by other methods come photoetching
Journey.
Pass through the micro- photograph of the prepared glass base micro-fluidic chip of the production method of above-mentioned glass base micro-fluidic chip
Piece is as shown in Figure 4.
It arbitrarily takes on the first microchannel and the second microchannel of prepared glass base micro-fluidic chip and is a little surveyed
Amount, obtained mean breadth are 73 μm, and relative standard deviation (RSD) is 0.03%.Thus illustrate that glass base obtained is micro-fluidic
The width homogeneity of chip microchannel is high, and processing quality is high.It is also possible to observe that the structure of the first microchannel is more complete
It is whole.
Comparative example
A kind of production method of glass base micro-fluidic chip of this comparative example, the same embodiment of step, difference are: step
(3) in, the annealing temperature of glass or more (600 DEG C) are warming up to the average heating rate of 5 DEG C/min.
First microchannel of prepared glass base micro-fluidic chip, the first microchannel phase with embodiment same position
Than finding that the first microchannel of comparative example is severely deformed, foring the blister heaved, do not only result in chip surface out-of-flatness, also
Cause nearby the second microchannel be distorted deformation.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (9)
1. a kind of production method of glass base chip, which is characterized in that the glass base chip interior has microchannel, described micro-
Channel includes several first microchannels, and first microchannel is closed chamber；
The production method includes the following steps:
Obtain bottom sheet glass and cover glass piece；
The microchannel is formed after the cover glass piece is fitted in the bottom sheet glass, obtains adhesive piece；
The adhesive piece is transferred in heating device, the annealing temperature of glass is warming up to the heating rate of 0.5~2 DEG C/min
More than；Then annealed cooling process again, obtains the glass base chip；
The method of the heating are as follows: be warming up to 545~555 DEG C with the heating rate of 0.9~1.1 DEG C/min, and 545~555
55~65min is kept the temperature at DEG C；Then 595~605 DEG C are warming up in 55~65min, and at 595~605 DEG C heat preservation 175~
185min。
2. the production method of glass base chip according to claim 1, which is characterized in that the heating rate be 0.8~
1.5℃/min。
3. the production method of glass base chip according to claim 1, which is characterized in that the annealing cooling process be with
The Mean Speed of 1~3 DEG C/min is down to room temperature.
4. the production method of glass base chip according to claim 1, which is characterized in that the microchannel further includes several
Second microchannel；Second microchannel has several openings being connected with atmosphere.
5. the production method of glass base chip according to claim 1-4, which is characterized in that the bottom sheet glass
Surface etch have recessed portion, after the cover glass piece is fitted in the surface, between the recessed portion and the cover glass piece
Form the microchannel；
The method for obtaining the bottom sheet glass includes the following steps:
Substrate is obtained, is etched with substrate recessed portion on the substrate, and offer the feed liquor being connected with the substrate recessed portion
Mouthful；The substrate recessed portion is corresponding with the recessed portion that the bottom glass sheet surface etches；
The substrate and sheet glass are subjected to reversible keying, the surface formation chamber of the substrate recessed portion and sheet glass；
Etching liquid is injected from the inlet to the chamber, the sheet glass is performed etching, i.e. the table in the sheet glass
Face forms the recessed portion；
The substrate is removed to get the bottom sheet glass.
6. the production method of glass base chip according to claim 5, which is characterized in that the etching liquid includes volume
Than the hydrofluoric acid, nitric acid and water for 1:1~3:15~25.
7. the production method of glass base chip according to claim 5, which is characterized in that the material of the substrate is poly- two
One of methylsiloxane, polymethyl methacrylate, polycarbonate or multiple combinations.
8. according to the production method of the described in any item glass base chips of claim 5-7, which is characterized in that by the substrate with
After the sheet glass carries out reversible keying, heated baking is carried out to gained chip, baking temperature is 60~70 DEG C, and the time is 1~3
Hour.
9. the prepared glass base chip of production method of the described in any item glass base chips of claim 1-8.
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| CN108114676A (en) * | 2017-12-08 | 2018-06-05 | 东南大学 | A kind of preparation method of glass micro channels reactor |
| CN112125277B (en) * | 2020-10-10 | 2024-02-13 | 上海科技大学 | Preparation process suitable for superconducting detector glass window |
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| CN106890684A (en) | 2017-06-27 |
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