CN103716987B - 印刷线路板的盲孔导通结构及其制造方法 - Google Patents
印刷线路板的盲孔导通结构及其制造方法 Download PDFInfo
- Publication number
- CN103716987B CN103716987B CN201210379950.0A CN201210379950A CN103716987B CN 103716987 B CN103716987 B CN 103716987B CN 201210379950 A CN201210379950 A CN 201210379950A CN 103716987 B CN103716987 B CN 103716987B
- Authority
- CN
- China
- Prior art keywords
- blind hole
- layer
- substrate
- printed substrate
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210379950.0A CN103716987B (zh) | 2012-10-09 | 2012-10-09 | 印刷线路板的盲孔导通结构及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210379950.0A CN103716987B (zh) | 2012-10-09 | 2012-10-09 | 印刷线路板的盲孔导通结构及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103716987A CN103716987A (zh) | 2014-04-09 |
CN103716987B true CN103716987B (zh) | 2017-04-26 |
Family
ID=50409415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210379950.0A Active CN103716987B (zh) | 2012-10-09 | 2012-10-09 | 印刷线路板的盲孔导通结构及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103716987B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112312650A (zh) * | 2019-08-02 | 2021-02-02 | 李家铭 | 微细层间线路结构及其制法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552483B (en) * | 2001-06-01 | 2003-09-11 | Nec Corp | Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board, method of printing a solder paste, surface-mounted structural assembly and method of manufacturing the same |
CN1610596A (zh) * | 2003-03-17 | 2005-04-27 | 三菱电机株式会社 | 激光加工方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59200492A (ja) * | 1983-04-27 | 1984-11-13 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
-
2012
- 2012-10-09 CN CN201210379950.0A patent/CN103716987B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552483B (en) * | 2001-06-01 | 2003-09-11 | Nec Corp | Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board, method of printing a solder paste, surface-mounted structural assembly and method of manufacturing the same |
CN1610596A (zh) * | 2003-03-17 | 2005-04-27 | 三菱电机株式会社 | 激光加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103716987A (zh) | 2014-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101436549B (zh) | 铜核层多层封装基板的制作方法 | |
CN103458628B (zh) | 多层电路板及其制作方法 | |
US9730328B2 (en) | Printed circuit board with embedded component and method for manufacturing same | |
CN101128091A (zh) | 元件嵌入式多层印刷线路板及其制造方法 | |
CN103339726A (zh) | 电子部件及其制造方法和带有电子部件的电路板 | |
US7006359B2 (en) | Modular electronic assembly and method of making | |
CN105990157A (zh) | 封装结构及其制作方法 | |
CN103517582A (zh) | 多层电路板及其制作方法 | |
CN106548985A (zh) | 封装载板及其制作方法 | |
CN104244582A (zh) | 埋入式高密度互连印刷电路板及其制作方法 | |
US7869222B2 (en) | Embedded electronic component structure and fabrication method thereof | |
CN103871996A (zh) | 封装结构及其制作方法 | |
CN103716987B (zh) | 印刷线路板的盲孔导通结构及其制造方法 | |
CN206877985U (zh) | 半导体封装装置和半导体引线框架 | |
CN102858098B (zh) | 不对称pcb电路板的制作方法 | |
CN109803494B (zh) | 电路板及其制造方法 | |
TWI270331B (en) | Circuit board with multi circuit layers and method for fabricating the same | |
CN110519915A (zh) | 一种盲埋孔印制电路板及其制作方法 | |
US20080164562A1 (en) | Substrate with embedded passive element and methods for manufacturing the same | |
JP4564820B2 (ja) | 多数個取り配線基板およびその製造方法 | |
CN201717256U (zh) | 无源器件、无源器件埋入式电路板 | |
CN104254191B (zh) | 无芯层封装基板及其制作方法 | |
TW200623997A (en) | Method for fabricating a multi-layer packaging substrate | |
TW201415966A (zh) | 印刷線路板(pcb)之盲孔導通結構及其製法 | |
CN107305849A (zh) | 封装结构及其制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180202 Address after: Chinese Taiwan Taoyuan City Co-patentee after: XIAMEN MSSB TECHNOLOGY CO.,LTD. Patentee after: MAO BANG ELECTRONIC CO.,LTD. Address before: China Taiwan Taoyuan County Patentee before: MAO BANG ELECTRONIC CO.,LTD. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210712 Address after: 361101 room e502b, Taiwan Science and technology enterprise cultivation center, Xiamen Torch hi tech Zone (Xiang'an) Industrial Zone, Fujian Province Patentee after: XIAMEN MSSB TECHNOLOGY Co.,Ltd. Address before: Taoyuan City, Taiwan, China Patentee before: MAO BANG ELECTRONIC Co.,Ltd. Patentee before: XIAMEN MSSB TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 361101 room e502b, Taiwan Science and technology enterprise cultivation center, Xiamen Torch hi tech Zone (Xiang'an) Industrial Zone, Fujian Province Patentee after: Jingwang Semiconductor (Xiamen) Co.,Ltd. Address before: 361101 room e502b, Taiwan Science and technology enterprise cultivation center, Xiamen Torch hi tech Zone (Xiang'an) Industrial Zone, Fujian Province Patentee before: XIAMEN MSSB TECHNOLOGY CO.,LTD. |
|
CP01 | Change in the name or title of a patent holder |