CN103715109A - 在裸片垫上具有印刷电介质粘合剂的封装ic - Google Patents

在裸片垫上具有印刷电介质粘合剂的封装ic Download PDF

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CN103715109A
CN103715109A CN201310463563.XA CN201310463563A CN103715109A CN 103715109 A CN103715109 A CN 103715109A CN 201310463563 A CN201310463563 A CN 201310463563A CN 103715109 A CN103715109 A CN 103715109A
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nude film
pad
film pad
encapsulation
lead frame
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CN103715109B (zh
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阮·穆赫德·米苏阿里·苏莱曼
阿扎达尔·达哈兰
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Texas Instruments Inc
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Abstract

一种组装封装集成电路IC的方法(100)包含将粘性电介质可聚合材料印刷(101)到引线框的裸片垫上，所述引线框具有定位在所述裸片垫外部的金属端子。放置(102)顶侧包含多个结合垫的IC裸片，使所述IC裸片的底侧放置到所述粘性电介质可聚合材料上。对所述多个结合垫与所述引线框的所述金属端子之间的结合线进行线结合(104)。

Description

在裸片垫上具有印刷电介质粘合剂的封装IC
技术领域
所揭示的实施例涉及集成电路(IC)组合件，且更特定来说涉及将半导体IC裸片附接到引线框以及由此产生的封装IC。
背景技术
在封装半导体IC的组装期间，半导体IC裸片的底侧通常由固态形式的电介质裸片附接膜(DAF)(例如，完全固化的环氧树脂)附接到引线框的裸片桨(或裸片垫)。接着将IC裸片上的结合垫通过结合线附接到引线框的金属端子。
一些IC经设计以电接触IC裸片的底侧，而其它IC经设计以使IC裸片的底侧与裸片垫电隔离。对于其中IC裸片需要使其底侧与裸片垫电隔离且在操作期间IC裸片的底侧与裸片垫之间存在电位差的封装IC，IC裸片的底侧到裸片垫之间归因于DAF隔离故障而发生的经由电介质DAF的电泄漏可导致电测试期间的良率损失，或导致现场使用期间的电故障。
发明内容
所揭示的实施例认识到，其中IC裸片的底侧经设计以与裸片垫电隔离的封装集成电路(IC)的电泄漏和良率损失的原因是归因于电介质裸片附接隔离故障。所了解到的故障机制包含归因于裸片附接处理时裸片拾取期间的撕裂的DAF的边缘上丢失的电介质DAF，以及对于在晶片分离之前上面具有层压DAF的常规IC裸片的DAF中的空隙(例如，针孔)。此类事件可使得在裸片放置于裸片垫上之后IC裸片的底侧暴露于金属裸片垫表面(例如，铜或铜合金)，这可导致电泄漏，例如归因于可充当连接(导电)桥的硅碎片或湿气的存在。
所揭示的实施例通过将粘性可聚合材料(例如，环氧树脂)的形式的粘合剂印刷到裸片垫上来解决裸片附接隔离问题。由于在裸片附接处理时裸片拾取期间IC裸片的底侧上无电介质材料，所以排除裸片拾取引起的电介质隔离问题。由于使用印刷粘性可聚合材料代替施配(例如，针施配或通过喷射)液态形式的裸片附接粘合剂，所以所揭示的方法避免在施配液态形式的聚合物粘合剂的情况下可发生的流出或溢出，尤其是对于具有大裸片尺寸与裸片垫比率(例如，0.8到1.0的范围内)的封装IC。
所揭示的封装IC具有特性结构，因为印刷电介质聚合物裸片附接材料的区域大于IC裸片的区域。因此，将有一些电介质聚合物裸片附接材料相对于IC裸片横向延伸从而导致与模具化合物的界面。另外，电介质聚合物裸片附接材料提供大体垂直外壁，本文界定为相对于裸片垫的顶部表面成80到100度。
附图说明
现将参看附图，附图不一定按比例绘制，其中：
图1是展示根据实例实施例包含将粘性可聚合材料印刷到裸片垫上的组装封装IC的实例方法中的步骤的流程图。
图2A是根据实例实施例的实例无引线封装IC的横截面图，所述无引线封装IC具有通过将粘性电介质可聚合材料印刷到裸片垫上而获得的裸片垫上的电介质裸片附接材料。图2B是图2A所示的裸片垫上的电介质聚合物裸片附接材料上的IC裸片的俯视图描绘。
图3A是根据实例实施例的实例无引线封装多芯片模块(MCM)的横截面图，所述无引线封装多芯片模块(MCM)具有包含通过使用施配环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料的第一IC裸片以及包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料的第二IC裸片，其附接在分离的裸片垫上。图3B是图3A所示的分离裸片垫上的其相应电介质聚合物裸片附接材料上的第一IC裸片和第二IC裸片的俯视图描绘。
图3C是根据实例实施例的实例无引线封装MCM的横截面图，所述无引线封装MCM具有包含通过使用施配环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料的第一IC裸片以及包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料的第二IC裸片，其在单一裸片垫上。图3D是图3C所示的单一裸片垫上的其相应电介质聚合物裸片附接材料上的第一IC裸片和第二IC裸片的俯视图描绘。
图4A是根据实例实施例的实例无引线封装MCM的横截面图，所述无引线封装MCM具有均包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料的第一IC裸片和第二IC裸片，其中施配环氧树脂裸片附接在单一裸片垫上。图4B是图4A所示的单一裸片垫上的电介质裸片附接聚合物材料上的第一IC裸片和第二IC裸片的俯视图描绘。
图4C是根据实例实施例的实例无引线封装MCM，所述无引线封装MCM具有均包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料的第一IC裸片和第二IC裸片，其在分离的裸片垫上。图4D是图4C所示的分离裸片垫上的电介质聚合物裸片附接材料上的第一IC裸片和第二IC裸片的俯视图描绘。
具体实施方式
参看图式描述实例实施例，图式中相同参考数字用于表示类似或等效元件。图式不一定按比例绘制。动作或事件的所说明的次序不应视为具有限制性，因为一些动作或事件可以不同次序发生和/或与其它动作或事件同时发生。此外，可能不需要一些所说明的动作或事件来实施根据本发明的方法。
图1是展示根据实例实施例包含将粘性电介质可聚合材料印刷到裸片垫上的组装封装IC的实例方法100中的步骤的流程图。在方法100之前，将完成包含多个IC裸片的晶片制造之后的衬底(例如，硅晶片)进行底侧薄化(例如，本底)，且接着用切割带层压。在任选紫外(UV)辐射之后，接着分离IC裸片(即，通过切割分离)。
步骤101包括将粘性电介质可聚合材料印刷到引线框的裸片垫(或裸片桨)上，所述引线框具有定位在裸片垫外部的金属端子。如本文使用的“印刷”指代将粘性材料导引到定位在裸片垫上方的结构，包含掩蔽结构(例如，丝网或模版)，所述掩蔽结构具有至少一个孔隙以裸片垫上在所述孔隙界定的区域中形成粘性材料的图案。如本文使用的“粘性”指代材料可流动，以允许通过模版印刷或丝网印刷来施加。实例粘性电介质可聚合材料(任何固化之前)可具有1,000到200,000mPa.S(cP)范围内的25℃布氏粘度，通常在20,000到80,000cP范围内。通常在印刷之前或之后以及在裸片结合(下文描述的步骤102)之前执行部分固化。举例来说，对于典型的环氧树脂，可使用利用60℃到140℃的温度范围在印刷之后以及裸片结合之前在烤箱中部分固化持续20分钟到3小时的持续时间。
如本文使用，“可聚合材料”指代作为溶剂载体中的固态树脂的粘性混合物的材料。粘性电介质可聚合材料可被视为是例如上文描述的部分固化处理之后的B阶热固树脂，所述部分固化处理可提供材料的部分固化(某一程度的聚合；通常小于10％)。当此系统接着在升高的温度下被再加热或适宜地辐射时，交联可完整使得系统完全固化(交联)。
可针对引线框薄片(或引线框载体)的相应引线框使用丝网印刷装置将电介质可聚合材料印刷到多个裸片垫上。丝网印刷在印刷和表面涂覆技术中已知为使用包括编织网的丝网印刷装置的印刷技术，所述编织网支撑提供阻隔功能的模版。所附接的模版形成网的开放区域，其转移可经由网作为尖锐边缘图像挤压到衬底表面上的可印刷材料。填充刀片(或刮板)在丝网模版上移动，从而迫使可印刷材料到达网开口上以供在刮板冲程期间通过毛细管作用转移。模版印刷是使用金属模版(具有开口的金属薄片)的另一印刷方法。引线框可为有引线引线框或无引线引线框(小外形无引线(SON))，包含四方扁平无引线(QFN)或双扁平无引线(DFN)。
电介质聚合物裸片附接材料包括可交联聚合物，例如环氧树脂共聚物，例如ABLECOAT8006NS(加州，欧文，汉高粘合剂公司(Henkel Adhesives))，或其它适宜的电介质可交联材料。环氧树脂在化学领域也称为聚环氧化物，其是一种通过环氧“树脂”与聚胺“硬化剂”反应而形成的热固聚合物。当树脂与硬化剂混合时，形成共价键。在适宜的固化之后，材料很大程度上交联，且因此具有刚性且坚固。
所印刷的电介质可聚合材料通常厚度在5μm到100μm范围内。由于电介质可聚合材料在裸片垫上，所以不需要IC裸片的底侧提供为裸片附接材料。然而，IC裸片的底侧可任选地提供为电介质裸片附接材料，例如常规DAF。
步骤102包括裸片附接步骤，其包括放置IC裸片，IC裸片的顶侧上具有多个结合垫且其底侧放置到电介质可聚合材料上。所述裸片可拾取且放置到裸片垫上的电介质可聚合材料上。在此步骤期间，通常在将IC裸片结合到印刷电介质可聚合材料期间将IC裸片或裸片垫加热到50℃到180℃。与施配液态环氧树脂相比，归因于使用已部分固化的粘性电介质可聚合材料(例如，B阶环氧树脂)而排除环氧树脂流出或溢出。
接着通常将电介质可聚合材料加热或辐射以将其硬化到C阶，使得所得聚合物很大程度上交联，且因此具有刚性且坚固。步骤103包括固化电介质可聚合材料以完成交联，从而致使材料具有刚性且坚固。通常使用热量来固化。举例来说，可使用150℃到190℃下20分钟到3小时。
步骤104包括将所述多个结合垫与引线框的金属端子之间的结合线进行线结合以形成完成的IC组合件。在将结合垫的每一者线结合到引线框的金属端子的相应者之后，对于包括多个引线框的引线框薄片的典型情况，接着使完成的IC组合件彼此分离。步骤105包括模制模具材料(例如，基于环氧树脂的模制化合物)以为完成的IC组合件提供囊封以形成封装IC。模具材料具有与裸片垫上的电介质聚合物裸片附接材料相比不同的组分。举例来说，裸片附接材料组分可经选择以提供针对从IC裸片的热耗散的所要导热性、电性质或其它性质，而模具材料组分可基于例如可模制性、冲击强度和防湿性或其它性质来选择。
在其中引线框为引线框薄片的一部分的典型组合件情况下，分离过程将包括多个引线框的引线框薄片切割为分离的完成的IC。激光或切割锯可用于分离。
图2A是根据实例实施例的实例无引线封装IC200的横截面图，所述无引线封装IC200具有通过包含将电介质可聚合材料印刷到裸片垫上的组装工艺而获得的裸片垫208上的电介质聚合物裸片附接材料218。封装IC200包括包含定位在裸片垫208外部的金属端子202的引线框。IC裸片210具有包含多个结合垫211和电路(例如，晶体管、互连，未图示)的顶侧212，以及通过将电介质可聚合材料印刷到裸片垫208上而获得的电介质聚合物裸片附接材料218附接的无源底侧213。
结合线217在结合垫211与金属端子202之间。模具材料219(展示为“模具”)为封装IC200提供囊封。如图所示，电介质聚合物裸片附接材料218的区域超过IC裸片210的区域，使得电介质聚合物裸片附接材料218与模具材料219介接。电介质聚合物裸片附接材料还提供相对于裸片垫的顶部表面的大体垂直外壁218a(如上所示，本文界定为80到100度)。图2B是图2A所示的裸片垫208上的电介质聚合物裸片附接材料218上的IC裸片210的俯视图描绘250。
由于电介质可聚合材料218以粘性形式印刷在裸片垫208的表面上，所以不存在可能由于施配液态形式的环氧树脂而发生的环氧树脂流出或溢出，尤其是在施加到涉及大裸片尺寸与裸片垫比率的封装的情况下。所揭示的实施例对于MCM QFN/SON也是可能的，因为归因于不存在环氧树脂流出或溢出，更多IC裸片或模块可放置到单一QFN封装中。
对于多芯片模块(MCM)应用，可使用常规施配裸片附接材料来附接IC裸片的一者以利用施配裸片附接材料的与印刷裸片附接材料相比可能较高的电和热性能，同时可使用如本文揭示的印刷裸片附接材料来附接MCM中的另一IC裸片。在典型施配和印刷裸片附接材料MCM实施例中，印刷裸片附接材料将具有低电导率以为需要与裸片垫电隔离的IC裸片提供电隔离，而施配材料将为用于需要电连接到裸片垫的IC裸片的导电(以及通常导热)材料。
图3A是根据实例实施例的实例无引线封装多芯片模块(MCM)300的横截面图，所述无引线封装多芯片模块(MCM)300具有包含通过使用施配环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料318的第一IC裸片310a以及包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料218的第二IC裸片310b，其附接在分离的裸片垫308上。图3B是图3A所示的分离裸片垫308上的其相应电介质聚合物裸片附接材料上的第一IC裸片310a和第二IC裸片310b的俯视图描绘330。
图3C是根据实例实施例的实例无引线封装MCM350的横截面图，所述无引线封装MCM350具有包含通过使用施配环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料318的第一IC裸片360a以及包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料218的第二IC裸片360b，其在单一裸片垫358上。图3D是图3C所示的单一裸片垫358上的其相应电介质聚合物裸片附接材料上的第一IC裸片和第二IC裸片的俯视图描绘380。
图4A是根据实例实施例的实例无引线封装MCM400的横截面图，所述无引线封装MCM400具有均包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料218的第一IC裸片410a和第二IC裸片410b，其中施配环氧树脂裸片附接在单一裸片垫358上。图4B是图4A所示的单一裸片垫358上的电介质聚合物裸片附接材料218上的第一IC裸片410a和第二IC裸片410b的俯视图描绘430。
图4C是根据实例实施例的实例无引线封装MCM450，所述无引线封装MCM450具有均包含通过使用印刷环氧树脂裸片附接的工艺形成的电介质裸片附接聚合物材料218的第一IC裸片460a和第二IC裸片460b，其在分离的裸片垫308上。图4D是图4C所示的分离裸片垫308上的电介质聚合物裸片附接材料218上的第一IC裸片460a和第二IC裸片460b的俯视图描绘480。
所揭示的实施例可集成到多种组装流程中以形成多种不同IC装置和相关产品。IC组合件可包括单一IC裸片或多个IC裸片，例如包括多个堆叠IC裸片的PoP配置。IC裸片可在其中包含各个元件且/或在其上包含各个层，包含障壁层、电介质层、装置结构、有源元件和无源元件(包含源极区、漏极区、位线、基极、发射极、集极、导线、导电通孔等)。此外，IC裸片可由包含双极、CMOS、BiCMOS和MEMS的多种工艺形成。
本发明所涉及的领域的技术人员将了解，在所主张的本发明的范围内，许多其它实施例和实施例的变型是可能的，且可在不脱离本发明的范围的情况下对所描述的实施例作出进一步添加、删减、替换和修改。

Claims (20)

1.一种组装封装集成电路IC的方法，其包括：
将粘性电介质可聚合材料印刷到引线框的裸片垫上，所述引线框具有定位在所述裸片垫外部的金属端子；
放置顶侧包含多个结合垫的至少一个IC裸片，使其底侧放置到所述粘性电介质可聚合材料上，以及
对所述多个结合垫与所述引线框的所述金属端子之间的结合线进行线结合。
2.根据权利要求1所述的方法，其进一步包括在所述放置之前部分固化所述粘性电介质可聚合材料以形成B阶材料。
3.根据权利要求2所述的方法，其中所述部分固化包括在60℃与140℃之间的温度下加热20分钟到3小时。
4.根据权利要求2所述的方法，其进一步包括在所述线结合之前进一步固化所述B阶材料。
5.根据权利要求4所述的方法，其中所述进一步固化包括在150℃与190℃之间的温度下加热20分钟到3小时。
6.根据权利要求1所述的方法，其中所述粘性电介质可聚合材料包括环氧树脂。
7.根据权利要求1所述的方法，其中所述引线框包括无引线引线框。
8.根据权利要求1所述的方法，其进一步包括在所述线结合之后用模具材料囊封。
9.根据权利要求1所述的方法，其中所述至少一个IC裸片包括在所述裸片垫上相对于彼此横向定位的至少第一IC裸片和第二IC裸片，以提供多芯片模块MCM。
10.根据权利要求9所述的方法，其中所述裸片垫是分离裸片垫。
11.根据权利要求9所述的方法，其中所述裸片垫由单一裸片垫组成。
12.根据权利要求9所述的方法，其中将所述印刷用于所述第一IC裸片，且其中将施配电介质液态聚合物材料用于所述第二IC裸片到所述裸片垫的附接。
13.根据权利要求9所述的方法，其中将所述印刷用于所述第一IC裸片以及用于所述第二IC裸片两者。
14.一种封装集成电路IC，其包括：
引线框，其包含定位在裸片垫外部的金属端子；
至少一个IC裸片，其顶侧具有多个结合垫且其底侧通过电介质聚合物材料附接到所述裸片垫；
所述多个结合垫与所述金属端子之间的结合线；
模具材料，其不同于为所述封装IC提供囊封的所述电介质聚合物材料，
其中所述电介质聚合材料的区域超过所述IC裸片的区域，其中所述电介质聚合物材料与所述模具材料形成电介质聚合物/模具材料界面，且其中所述电介质聚合物材料提供相对于所述裸片垫的顶部表面的80与100度之间的大体垂直外壁。
15.根据权利要求14所述的封装IC，其中所述电介质聚合物材料在整个所述IC裸片的所述区域上横向延伸超出所述IC裸片的所述区域。
16.根据权利要求14所述的封装IC，其中所述引线框包括无引线引线框。
17.根据权利要求14所述的封装IC，其中所述至少一个IC裸片包括在所述裸片垫上相对于彼此横向定位的至少第一IC裸片和第二IC裸片，以提供多芯片模块MCM。
18.根据权利要求17所述的封装IC，其中所述裸片垫是分离裸片垫。
19.根据权利要求17所述的封装IC，其中所述裸片垫由单一裸片垫组成。
20.根据权利要求14所述的封装IC，其中所述电介质聚合物材料包括交联环氧树脂。
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