CN103681984B - 发光装置的密封构件的拆卸方法及能将密封构件拆卸的发光装置 - Google Patents

发光装置的密封构件的拆卸方法及能将密封构件拆卸的发光装置 Download PDF

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Publication number
CN103681984B
CN103681984B CN201310449618.1A CN201310449618A CN103681984B CN 103681984 B CN103681984 B CN 103681984B CN 201310449618 A CN201310449618 A CN 201310449618A CN 103681984 B CN103681984 B CN 103681984B
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sealing member
light emitting
emitting device
substrate
light
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Chinese (zh)
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CN103681984A (zh
Inventor
宫田忠明
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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CN201310449618.1A 2012-09-25 2013-09-24 发光装置的密封构件的拆卸方法及能将密封构件拆卸的发光装置 Active CN103681984B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012210906A JP6131555B2 (ja) 2012-09-25 2012-09-25 発光装置の封止部材の取り外し方法および封止部材を取り外すことが可能な発光装置
JP2012-210906 2012-09-25

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CN103681984A CN103681984A (zh) 2014-03-26
CN103681984B true CN103681984B (zh) 2018-01-26

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JP (1) JP6131555B2 (enExample)
CN (1) CN103681984B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110379913A (zh) * 2019-08-16 2019-10-25 惠州雷曼光电科技有限公司 Led芯片的维修方法及维修装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017094461A1 (ja) * 2015-12-01 2017-06-08 シャープ株式会社 画像形成素子
JP6728676B2 (ja) * 2015-12-26 2020-07-22 日亜化学工業株式会社 発光装置
KR20190019745A (ko) 2017-08-18 2019-02-27 주식회사 루멘스 발광소자 및 그 제조방법
JP7148780B2 (ja) * 2017-09-29 2022-10-06 日亜化学工業株式会社 半導体装置の製造方法
JPWO2019188063A1 (ja) * 2018-03-27 2021-04-22 ソニーセミコンダクタソリューションズ株式会社 素子組立体及び素子・実装用基板組立体
US10964852B2 (en) * 2018-04-24 2021-03-30 Samsung Electronics Co., Ltd. LED module and LED lamp including the same
CN108772611A (zh) * 2018-05-24 2018-11-09 武汉锐科光纤激光技术股份有限公司 电子元器件拆除方法及装置
CN111716006B (zh) * 2020-06-17 2022-03-25 昂纳信息技术（深圳）有限公司 一种激光拆解光学元件的方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101442040A (zh) * 2007-11-20 2009-05-27 奇力光电科技股份有限公司 发光二极管封装结构及其制造方法
CN102683558A (zh) * 2011-03-16 2012-09-19 株式会社东芝 半导体发光装置的晶片和用于制造半导体发光装置的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428269A (ja) * 1990-05-23 1992-01-30 Fujikura Ltd Ｌｅｄベアチップの実装構造
JP2011159832A (ja) * 2010-02-01 2011-08-18 Yamaguchi Univ 半導体発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101442040A (zh) * 2007-11-20 2009-05-27 奇力光电科技股份有限公司 发光二极管封装结构及其制造方法
CN102683558A (zh) * 2011-03-16 2012-09-19 株式会社东芝 半导体发光装置的晶片和用于制造半导体发光装置的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110379913A (zh) * 2019-08-16 2019-10-25 惠州雷曼光电科技有限公司 Led芯片的维修方法及维修装置

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JP6131555B2 (ja) 2017-05-24
JP2014067805A (ja) 2014-04-17
CN103681984A (zh) 2014-03-26

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