CN103633074A - Packaging structure for million sets of encoding transmitting chips - Google Patents
Packaging structure for million sets of encoding transmitting chips Download PDFInfo
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- CN103633074A CN103633074A CN201310682388.3A CN201310682388A CN103633074A CN 103633074 A CN103633074 A CN 103633074A CN 201310682388 A CN201310682388 A CN 201310682388A CN 103633074 A CN103633074 A CN 103633074A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
The invention discloses a packaging structure for million sets of encoding transmitting chips. The packaging structure comprises a framework, an RC oscillator, an integrated circuit chip, lead wires, a gasket, die attach adhesive and packaging adhesive, wherein the integrated circuit chip is fixed on the gasket by the die attach adhesive; the framework is provided with eight pins; the RC oscillator is electrically connected with the integrated circuit chip; the integrated circuit chip is electrically connected with the eight pins of the framework by the lead wires respectively; the RC oscillator is one RC oscillator with the fixed frequency; the RC oscillator, the integrated circuit chip and the framework are wholly packaged by the packaging adhesive. According to the packaging structure, an SOP8 or DIP8 type packaging technology is used for packaging, so that the production cost and reducing the volume can be reduced, and the high cost performance is realized; the million sets of encoding transmitting chips adopt the high-precision RC oscillator with the fixed frequency so that the production cost can be further reduced and the production efficiency is improved; the power consumption is easy to reduce and the environmental protection requirements are met.
Description
Technical field
The present invention relates to chip technology field, relate in particular to a kind of encapsulating structure of 1,000,000 group coding transmitting chips of eight pins.
Background technology
Chip encapsulation technology wraps up memory chip exactly, to avoid chip to contact with extraneous, prevents a kind of technology of the infringement of outer bound pair chip.Airborne impurity and bad air, so steam all can corrode the precision circuit on chip, and then cause electric property to decline.Different encapsulation technologies is widely different in manufacturing process and process aspect, after encapsulation, the performance of memory chip self performance is also played to vital effect.The encapsulation technology of chip is varied, specifically has DIP, POFP, TSOP, BGA, QFP, CSP etc., not lower 30 kinds of kinds.And, along with the develop rapidly of photoelectricity, micro-electric manufacturing process technology, electronic product all the time towards less, gentlier, the future development of more cheap, low-power consumption, so the packing forms of chip component is also constantly improved.
But the encapsulation of coded excitation chip used is mainly to adopt DIP14 and two kinds of encapsulation technologies of SOP14 in existing market, and the cost of these two kinds of encapsulation technologies is higher, and the coded excitation chip volume after encapsulation is larger; And coded excitation chip internal connects RC oscillator and needs two pins (being OSCL and OSCO), and this is unfavorable for microminiaturization and the low-power of coded excitation chip, also further increase cost.
Therefore, there is defect in prior art, needs to improve.
Summary of the invention
Technical problem to be solved by this invention is: a kind of encapsulating structure of 1,000,000 group coding transmitting chips is provided, can solves well the problem that volume is large, production cost is higher of coded excitation chip in prior art.
Technical scheme of the present invention is as follows: the encapsulating structure that the invention provides a kind of 1,000,000 group coding transmitting chips comprises: framework, is packaged in RC oscillator, integrated circuit (IC) chip, lead-in wire, pad, crystal-bonding adhesive and packaging plastic in described framework; Described integrated circuit (IC) chip is fixed on described pad by crystal-bonding adhesive, described framework has eight pins, described RC oscillator and described integrated circuit (IC) chip are electrically connected, described integrated circuit (IC) chip is electrically connected with eight pins of described framework respectively by lead-in wire, the RC oscillator that described RC oscillator is a fixed frequency, described RC oscillator, integrated circuit (IC) chip and framework are by packaging plastic overall package.
The quantity of described lead-in wire is eight, and go between described in each one end and described integrated circuit (IC) chip are electrically connected, and pin is electrically connected described in the other end and, each pin only with a lead-in wire electric connection.
Described eight pins are respectively: the first to the 6th switch pin, a ground wire pin and an output pin, and the described first to the 6th switch pin is for connecting valve, and described output pin is for connecting outside infrared transmitting circuit or radio transmitter.
Described eight pins are symmetrically set on the both sides that described framework is relative.
After described encapsulating structure encapsulation, be SOP8 type or DIP8 type.
Adopt such scheme, the encapsulating structure of 1,000,000 group coding transmitting chips of the present invention, adopt SOP8 or DIP8 type encapsulation technology to encapsulate, production cost can be reduced to 5/8 of coded excitation chip production cost in prior art, and volume can be reduced to 3/5 of coded excitation chip volume in prior art; This 1,000,000 group coding transmitting chip adopts RC oscillator and the ic chip package of a high accuracy fixed frequency to form, the RC oscillator of this fixed frequency does not need two pins (OSCL and OSCO) to be connected, can further reduce production costs, enhance productivity, and the coded excitation chip with this encapsulating structure is when without button, coded excitation chip current is 0, is conducive to reduce power consumption, meets environmental protection demand.
Accompanying drawing explanation
Fig. 1 is the 1000000 group coding transmitting chips of one embodiment of the invention and the annexation schematic diagram of external switch.
Fig. 2 is the profile of the encapsulating structure of the present invention's 1,000,000 group coding transmitting chips.
Fig. 3 is the 1000000 group coding transmitting chips of another embodiment of the present invention and the annexation schematic diagram of external switch.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Refer to Fig. 1 and Fig. 2, the invention provides a kind of encapsulating structure of 1,000,000 group coding transmitting chips, comprising: framework 10, is packaged in RC oscillator 20, integrated circuit (IC) chip 30, pad 40, crystal-bonding adhesive 50, packaging plastic 60 and eight lead-in wires 70 in this framework 10.Described RC oscillator 20 is electrically connected with described integrated circuit (IC) chip 30; Described framework 10 has eight pins 12, and described integrated circuit (IC) chip 30 is electrically connected with eight pins 12 of described framework 10 respectively by lead-in wire 70.After the encapsulation of described encapsulating structure, be SOP8 type or DIP8 type, be conducive to reduce the production cost of coded excitation chip and reduce volume, realize high performance-price ratio, and adopt the reliability of coded excitation chip of this encapsulating structure high, production efficiency is high.Concrete, production cost can be reduced to 5/8 of coded excitation chip production cost in prior art, and volume can be reduced to 3/5 of coded excitation chip volume in prior art.
Described RC oscillator 20 is the RC oscillator of a high accuracy fixed frequency, makes the precision of this coded excitation chip can accomplish 1%, is better than 10% precision of coded excitation chip in existing market.And, this RC oscillator 20 need not need two pins (OSCL and OSCO) to be connected as the RC oscillator in coded excitation chip in prior art, be conducive to reduce the quantity of the pin 12 that coded excitation chip is connected with external circuit, realize eight pin package, thereby can further reduce production costs.
Further, described crystal-bonding adhesive 50 is coated on described pad 40, and described integrated circuit (IC) chip 30 is fixed on described pad 40 by this crystal-bonding adhesive 50.Described packaging plastic 60 for moulding Protective IC chip 30, RC oscillator 20, the devices such as 70 go between.70 one end and the described integrated circuit (IC) chip of going between described in each 30 is electrically connected, and pin 12 is electrically connected described in the other end and, 12 of each pins and lead-in wire 70 electric connections.
Refer to Fig. 1, described eight pins 12 are symmetrically set on the both sides that described framework 10 is relative, concrete, described eight pins 12 are respectively: the first to the 6th switch pin K1, K2, K3, K4, K5, K6, a ground wire pin GND and an output pin TX, the described first to the 6th switch pin K1, K2, K3, K4, K5, K6 are for connecting valve S1, S2, S3, S4, S5, S6, and described output pin TX is for connecting outside infrared transmitting circuit or radio transmitter 80.Described first to fourth switch pin K1, K2, K3, K4 are located at the same side of this coded excitation chip, and described output pin TX, grounding pin GND, the 5th switch pin K5 and the 6th switch pin K6 are located at the same side of this transmitting chip.Each switch pin is electrically connected with one end of a switch respectively, and the other end of all switch S 1, S2, S3, S4, S5, S6 is electrically connected with ground wire pin GND.When these six switch S 1, S2, S3, S4, S5, S6 all disconnect, when this coded excitation chip is without button, the electric current of this coded excitation chip is 0, is conducive to reduce the power consumption of coded excitation chip, meets environmental protection demand.
Refer to Fig. 3, as alternative another embodiment, wherein, output pin TX, grounding pin GND, the first switch pin K1 and second switch pin K2 are located at the same side of this coded excitation chip, described the 3rd to the 6th switch pin K3, K4, K5, K6 are located at the same side of this transmitting chip, and the annexation of each pin and external circuit is same as the previously described embodiments.
In sum, the invention provides a kind of encapsulating structure of 1,000,000 group coding transmitting chips, it adopts SOP8 or DIP8 type encapsulation technology to encapsulate, production cost can be reduced to 5/8 of coded excitation chip production cost in prior art, and volume can be reduced to 3/5 of coded excitation chip volume in prior art; This 1,000,000 group coding transmitting chip adopts RC oscillator and the ic chip package of a high accuracy fixed frequency to form, the RC oscillator of this fixed frequency does not need two pins (OSCL and OSCO) to be connected, can further reduce production costs, enhance productivity, and the coded excitation chip with this encapsulating structure is when without button, coded excitation chip current is 0, is conducive to reduce power consumption, meets environmental protection demand.
These are only preferred embodiment of the present invention, be not limited to the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. an encapsulating structure for 1,000,000 group coding transmitting chips, is characterized in that, comprising: framework, is packaged in RC oscillator, integrated circuit (IC) chip, lead-in wire, pad, crystal-bonding adhesive and packaging plastic in described framework; Described integrated circuit (IC) chip is fixed on described pad by crystal-bonding adhesive, described framework has eight pins, described RC oscillator and described integrated circuit (IC) chip are electrically connected, described integrated circuit (IC) chip is electrically connected with eight pins of described framework respectively by lead-in wire, the RC oscillator that described RC oscillator is a fixed frequency, described RC oscillator, integrated circuit (IC) chip and framework are by packaging plastic overall package.
2. the encapsulating structure of 1,000,000 group coding transmitting chips according to claim 1, it is characterized in that, the quantity of described lead-in wire is eight, one end and the described integrated circuit (IC) chip of going between described in each is electrically connected, described in the other end and, pin is electrically connected, and each pin is only electrically connected with a lead-in wire.
3. the encapsulating structure of 1,000,000 group coding transmitting chips according to claim 1, it is characterized in that, described eight pins are respectively: the first to the 6th switch pin, a ground wire pin and an output pin, the described first to the 6th switch pin is for connecting valve, and described output pin is for connecting outside infrared transmitting circuit or radio transmitter.
4. the encapsulating structure of 1,000,000 group coding transmitting chips according to claim 1, is characterized in that, described eight pins are symmetrically set on the both sides that described framework is relative.
5. the encapsulating structure of 1,000,000 group coding transmitting chips according to claim 1, is characterized in that, after described encapsulating structure encapsulation, is SOP8 type or DIP8 type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310682388.3A CN103633074B (en) | 2013-12-16 | 2013-12-16 | The encapsulating structure of million groups of coded excitation chips |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310682388.3A CN103633074B (en) | 2013-12-16 | 2013-12-16 | The encapsulating structure of million groups of coded excitation chips |
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| CN103633074A true CN103633074A (en) | 2014-03-12 |
| CN103633074B CN103633074B (en) | 2016-06-15 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060244483A1 (en) * | 2005-05-02 | 2006-11-02 | Berry Jon S Ii | Distribution of signals throughout a spine of an integrated circuit |
| US7728625B1 (en) * | 2007-12-11 | 2010-06-01 | Lattice Semiconductor Corporation | Serial interface for programmable logic devices |
| CN202564200U (en) * | 2012-04-11 | 2012-11-28 | 深圳市英锐芯电子科技有限公司 | Sixteen-pin emission chip package structure |
| CN203721718U (en) * | 2013-12-16 | 2014-07-16 | 深圳市英锐芯电子科技有限公司 | Packaging structure for million sets of encoding transmitting chips |
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2013
- 2013-12-16 CN CN201310682388.3A patent/CN103633074B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060244483A1 (en) * | 2005-05-02 | 2006-11-02 | Berry Jon S Ii | Distribution of signals throughout a spine of an integrated circuit |
| US7728625B1 (en) * | 2007-12-11 | 2010-06-01 | Lattice Semiconductor Corporation | Serial interface for programmable logic devices |
| CN202564200U (en) * | 2012-04-11 | 2012-11-28 | 深圳市英锐芯电子科技有限公司 | Sixteen-pin emission chip package structure |
| CN203721718U (en) * | 2013-12-16 | 2014-07-16 | 深圳市英锐芯电子科技有限公司 | Packaging structure for million sets of encoding transmitting chips |
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| CN103633074B (en) | 2016-06-15 |
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