CN103628100B - A kind of electroplate liquid of indium plating - Google Patents
A kind of electroplate liquid of indium plating Download PDFInfo
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- CN103628100B CN103628100B CN201310667512.9A CN201310667512A CN103628100B CN 103628100 B CN103628100 B CN 103628100B CN 201310667512 A CN201310667512 A CN 201310667512A CN 103628100 B CN103628100 B CN 103628100B
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- electroplate liquid
- indium
- chlorination
- methylpyrrolidone
- dextrin
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Abstract
A kind of electroplate liquid (gkg of Novel electroplating indium-1), it is made up of following composition: sodium tetrafluoroborate: 55~65, and chlorination N-n-pro-pyl pyridine: 140~150, acetone: 770~800, indium acetate: 3~5,1-METHYLPYRROLIDONE: 2~4, gelatin: 1~3, dextrin: 1~3. A kind of electroplate liquid of Novel electroplating indium, plating can obtain high-quality coating, and eliminate electrodeposit liquid has become environment-protecting industrial urgent problem to the harm of environment simultaneously, and electroplating technology of the present invention can reduce costs, be conducive to again improve electroplating quality, and safety and environmental protection.
Description
Technical field: the electroplate liquid that the present invention relates to a kind of Novel electroplating indium.
Background technology: the production of high purity indium is mainly to produce by electrolytic refining process at home. Plating solution of indium has cyanide type, sulfate type, fluoboric acid type, dithiocarbamic acid type etc., may occur liberation of hydrogen effect, hydrolysis effect and emulsion etc. in electrolysis, therefore, and must strict composition and the electrolytic condition of controlling electrolyte. Along with scientific and technological development, the quality to dissipated metal high purity indium and alloy thereof, properity, type requirements are also more and more higher. Traditional smelting, refining and alloy preparation method can not meet the current needs of producing dissipated metal and alloy thereof completely, and also there is shortcoming in various degree in traditional method, as high-temperature operation, energy consumption is high, environmental pollution is serious etc., therefore needs to seek a kind of new method.
Summary of the invention: for above-mentioned the deficiencies in the prior art, the invention provides a kind of electroplate liquid of Novel electroplating indium.
For achieving the above object, the technical solution used in the present invention is: a kind of electroplate liquid of Novel electroplating indium, and every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 55~65g
Chlorination N-n-pro-pyl pyridine: 140~150g
Acetone: 770~800g
Indium acetate: 3~5g
1-METHYLPYRROLIDONE: 2~4g
Gelatin: 1~3g
Dextrin: 1~3g.
Detailed description of the invention:
Use raw material: sodium tetrafluoroborate, chlorination N-n-pro-pyl pyridine, acetone, indium acetate, 1-METHYLPYRROLIDONE, gelatin, dextrin.
A kind of electroplate liquid of Novel electroplating indium, plating can obtain high-quality coating, and eliminate electrodeposit liquid has become environment-protecting industrial urgent problem to the harm of environment simultaneously, and electroplating technology of the present invention can reduce costs, be conducive to again improve electroplating quality, and safety and environmental protection.
Embodiment 1:
Sodium tetrafluoroborate: 55g
Chlorination N-n-pro-pyl pyridine: 145g
Acetone: 789g
Indium acetate: 3g
1-METHYLPYRROLIDONE: 4g
Gelatin: 3g
Dextrin: 1g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 2:
Sodium tetrafluoroborate: 55g
Chlorination N-n-pro-pyl pyridine: 150g
Acetone: 784g
Indium acetate: 4g
1-METHYLPYRROLIDONE: 3g
Gelatin: 2g
Dextrin: 2g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 3:
Sodium tetrafluoroborate: 55g
Chlorination N-n-pro-pyl pyridine: 140g
Acetone: 794g
Indium acetate: 5g
1-METHYLPYRROLIDONE: 2g
Gelatin: 1g
Dextrin: 3g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 4:
Sodium tetrafluoroborate: 60g
Chlorination N-n-pro-pyl pyridine: 140g
Acetone: 789g
Indium acetate: 3g
1-METHYLPYRROLIDONE: 4g
Gelatin: 3g
Dextrin: 1g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 5:
Sodium tetrafluoroborate: 60g
Chlorination N-n-pro-pyl pyridine: 145g
Acetone: 784g
Indium acetate: 4g
1-METHYLPYRROLIDONE: 3g
Gelatin: 2g
Dextrin: 2g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 6:
Sodium tetrafluoroborate: 60g
Chlorination N-n-pro-pyl pyridine: 150g
Acetone: 779g
Indium acetate: 5g
1-METHYLPYRROLIDONE: 2g
Gelatin: 1g
Dextrin: 3g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 7:
Sodium tetrafluoroborate: 65g
Chlorination N-n-pro-pyl pyridine: 140g
Acetone: 784g
Indium acetate: 3g
1-METHYLPYRROLIDONE: 4g
Gelatin: 3g
Dextrin: 1g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 8:
Sodium tetrafluoroborate: 65g
Chlorination N-n-pro-pyl pyridine: 145g
Acetone: 779g
Indium acetate: 4g
1-METHYLPYRROLIDONE: 3g
Gelatin: 2g
Dextrin: 2g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
Embodiment 9:
Sodium tetrafluoroborate: 65g
Chlorination N-n-pro-pyl pyridine: 150g
Acetone: 774g
Indium acetate: 5g
1-METHYLPYRROLIDONE: 2g
Gelatin: 1g
Dextrin: 3g
Get said components, be mixed into the electroplate liquid of a kind of Novel electroplating indium of 1000 grams.
While plating with the present invention, require pH value of solution: 6.0~7.0, solution temperature (DEG C): 15~30, current density (A/dm2):1.5~3.5。
Claims (10)
1. an electroplate liquid for indium plating, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 55~65g
Chlorination N-n-pro-pyl pyridine: 140~150g
Acetone: 770~800g
Indium acetate: 3~5g
1-METHYLPYRROLIDONE: 2~4g
Gelatin: 1~3g
Dextrin: 1~3g.
2. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component::
Sodium tetrafluoroborate: 55g
Chlorination N-n-pro-pyl pyridine: 145g
Acetone: 789g
Indium acetate: 3g
1-METHYLPYRROLIDONE: 4g
Gelatin: 3g
Dextrin: 1g.
3. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 55g
Chlorination N-n-pro-pyl pyridine: 150g
Acetone: 784g
Indium acetate: 4g
1-METHYLPYRROLIDONE: 3g
Gelatin: 2g
Dextrin: 2g.
4. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 55g
Chlorination N-n-pro-pyl pyridine: 140g
Acetone: 794g
Indium acetate: 5g
1-METHYLPYRROLIDONE: 2g
Gelatin: 1g
Dextrin: 3g.
5. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 60g
Chlorination N-n-pro-pyl pyridine: 140g
Acetone: 789g
Indium acetate: 3g
1-METHYLPYRROLIDONE: 4g
Gelatin: 3g
Dextrin: 1g.
6. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 60g
Chlorination N-n-pro-pyl pyridine: 145g
Acetone: 784g
Indium acetate: 4g
1-METHYLPYRROLIDONE: 3g
Gelatin: 2g
Dextrin: 2g.
7. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 60g
Chlorination N-n-pro-pyl pyridine: 150g
Acetone: 779g
Indium acetate: 5g
1-METHYLPYRROLIDONE: 2g
Gelatin: 1g
Dextrin: 3g.
8. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 65g
Chlorination N-n-pro-pyl pyridine: 140g
Acetone: 784g
Indium acetate: 3g
1-METHYLPYRROLIDONE: 4g
Gelatin: 3g
Dextrin: 1g.
9. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 65g
Chlorination N-n-pro-pyl pyridine: 145g
Acetone: 779g
Indium acetate: 4g
1-METHYLPYRROLIDONE: 3g
Gelatin: 2g
Dextrin: 2g.
10. the electroplate liquid of a kind of indium plating as claimed in claim 1, is characterized in that: every kilogram of electroplate liquid contains following component:
Sodium tetrafluoroborate: 65g
Chlorination N-n-pro-pyl pyridine: 150g
Acetone: 774g
Indium acetate: 5g
1-METHYLPYRROLIDONE: 2g
Gelatin: 1g
Dextrin: 3g.
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CN103628100B true CN103628100B (en) | 2016-05-04 |
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CN106757210A (en) * | 2016-12-30 | 2017-05-31 | 沈阳师范大学 | A kind of nickel-clad iron electroplate liquid of tetrafluoro boric acid ni-type |
CN106757211A (en) * | 2016-12-30 | 2017-05-31 | 沈阳师范大学 | A kind of nickel-clad iron electroplate liquid of sulfamic acid salt form |
CN106868553A (en) * | 2016-12-30 | 2017-06-20 | 沈阳师范大学 | The nickel-plating bath of new chloride |
CN106757187A (en) * | 2016-12-30 | 2017-05-31 | 沈阳师范大学 | A kind of new nickel-plating bath containing sulfamate |
CN106811775A (en) * | 2016-12-30 | 2017-06-09 | 沈阳师范大学 | The nickel-plating bath of new tetrafluoro boric acid nickel |
CN106676587A (en) * | 2016-12-30 | 2017-05-17 | 沈阳师范大学 | Novel chloride/sulfate nickel-plating bath |
CN108588772A (en) * | 2018-04-03 | 2018-09-28 | 浙江大学 | A kind of preparation method of micro-nano porous indium electrode |
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CN101270490B (en) * | 2008-04-11 | 2010-04-14 | 沈阳师范大学 | Dissipated metal indium chloride/chloridization 1-methyl-3-butyl imidazole system plating solution |
US8545689B2 (en) * | 2010-09-02 | 2013-10-01 | International Business Machines Corporation | Gallium electrodeposition processes and chemistries |
CN101988210B (en) * | 2010-12-03 | 2013-03-20 | 沈阳师范大学 | Ionic liquid indium chloride/n-butyl pyridine chloride system electroplating solution |
CN102061492B (en) * | 2010-12-09 | 2013-03-20 | 沈阳师范大学 | Electroplate liquid based on room temperature ion liquid indium chloride/fluoboric acid 1-methyl-3-butylimidazole system |
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