CN106811775A - The nickel-plating bath of new tetrafluoro boric acid nickel - Google Patents
The nickel-plating bath of new tetrafluoro boric acid nickel Download PDFInfo
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- CN106811775A CN106811775A CN201611252880.7A CN201611252880A CN106811775A CN 106811775 A CN106811775 A CN 106811775A CN 201611252880 A CN201611252880 A CN 201611252880A CN 106811775 A CN106811775 A CN 106811775A
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- Prior art keywords
- nickel
- boric acid
- tetrafluoro boric
- new
- tetrafluoro
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Nickel-plating bath (the gkg of new tetrafluoro boric acid nickel‑1), it is made up of following composition：Bromination N n-propyl pyridines:155~165, tetrafluoro boric acid nickel：40~50, ammonium tetrafluoroborate:75~85, acetone：690~715, tetrafluoro boric acid：3~5, boric acid：2~4, sodium chloride:2~4.The application of nickel plating is very wide, can be divided into two kinds of decorative and protective and feature.Matrix material can be protected not corroded as decorative and protective nickel coating.Bright nickel plating layer is obtained by the method for polishing dark nickel coating or direct bright nickel plating, the effect of decoration has been reached.Fluoboric acid nickel plating solution metal nickel content is high, and deposition velocity is fast, and cathode efficiency is high, and the internal stress of coating is high, but the corrosive power of plating solution is poor, is only applicable to plate thick nickel or electroformed nickel.
Description
Technical field
The present invention relates to a kind of electroplate liquid, the especially nickel-plating bath of new tetrafluoro boric acid nickel.
Background technology
The application of nickel plating is very wide, can be divided into two kinds of decorative and protective and feature.Can be protected as decorative and protective nickel coating
Shield matrix material is not corroded.Bright nickel plating layer is obtained by the method for polishing dark nickel coating or direct bright nickel plating, dress has been reached
The effect of decorations.The performance of nickel coating and the nickel plating technology for using have a very big relation, and the performance of different its coating of technique has very
Big difference.According to the difference that plating solution is constituted, nickel plating solution can be divided into：Watt type nickel plating solution, chloride-sulfate plating solution,
Chloride nickel plating solution, whole sulphate nickel plating solution, fluoboric acid nickel plating solution, nickel plating by amino sulphonate solution, solvay-type nickel plating
Solution, other nickel plating solutions.Fluoboric acid nickel plating solution metal nickel content is high, and deposition velocity is fast, and cathode efficiency is high, coating
Internal stress is high, but the corrosive power of plating solution is poor, is only applicable to plate thick nickel or electroformed nickel.
The content of the invention
To achieve the above object, the technical solution adopted by the present invention is：Nickel-plating bath (the g of new tetrafluoro boric acid nickel
kg-1) formula：
Bromination N- n-propyl pyridines:155~165
Tetrafluoro boric acid nickel：40~50
Ammonium tetrafluoroborate:75~85
Acetone：690~715
Tetrafluoro boric acid：3~5
Boric acid：2~4
Sodium chloride:2~4
The nickel-plating bath of new tetrafluoro boric acid nickel, its electrochemical window is wider, and side reaction is less in electrodeposition process, because
The metal quality that this is obtained is higher；The operating temperature range of electroplate liquid is relatively wide, is conducive to studying the influence of electrodeposition technology.
Not the problems such as this electroplate liquid does not exist aquation, hydrolysis, liberation of hydrogen, with corroding the property that small, the pollution green solvent such as small should possess.
Specific embodiment：
Specific implementation of the patent mode is illustrated in detail further below：
Use raw material：Bromination N- n-propyl pyridines, tetrafluoro boric acid nickel, ammonium tetrafluoroborate, acetone, tetrafluoro boric acid, boric acid, chlorine
Change sodium.
Embodiment 1：
Bromination N- n-propyl pyridines:155g
Tetrafluoro boric acid nickel：40g
Ammonium tetrafluoroborate:85g
Acetone：710g
Tetrafluoro boric acid：3g
Boric acid：4g
Sodium chloride:3g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 2：
Bromination N- n-propyl pyridines:160g
Tetrafluoro boric acid nickel：45g
Ammonium tetrafluoroborate:85g
Acetone：700g
Tetrafluoro boric acid：4g
Boric acid：2g
Sodium chloride:4g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 3：
Bromination N- n-propyl pyridines:165g
Tetrafluoro boric acid nickel：50g
Ammonium tetrafluoroborate：85g
Acetone：690g
Tetrafluoro boric acid：3g
Boric acid：4g
Sodium chloride:3g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 4：
Bromination N- n-propyl pyridines:155g
Tetrafluoro boric acid nickel：45g
Ammonium tetrafluoroborate：80g
Acetone：710g
Tetrafluoro boric acid：4g
Boric acid：3g
Sodium chloride:3g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 5：
Bromination N- n-propyl pyridines:160g
Tetrafluoro boric acid nickel：50g
Ammonium tetrafluoroborate：80g
Acetone：700g
Tetrafluoro boric acid：3g
Boric acid：4g
Sodium chloride:3g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 6：
Bromination N- n-propyl pyridines:165g
Tetrafluoro boric acid nickel：40g
Ammonium tetrafluoroborate：80g
Acetone：705g
Tetrafluoro boric acid：4g
Boric acid：2g
Sodium chloride:4g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 7：
Bromination N- n-propyl pyridines:155g
Tetrafluoro boric acid nickel：50g
Ammonium tetrafluoroborate：75g
Acetone：710g
Tetrafluoro boric acid：4g
Boric acid：2g
Sodium chloride:4g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 8：
Bromination N- n-propyl pyridines:160g
Tetrafluoro boric acid nickel：40g
Ammonium tetrafluoroborate：75g
Acetone：715g
Tetrafluoro boric acid：5g
Boric acid：3g
Sodium chloride：2g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
Embodiment 9：
Bromination N- n-propyl pyridines:165g
Tetrafluoro boric acid nickel：45g
Ammonium tetrafluoroborate：75g
Acetone：705g
Tetrafluoro boric acid：5g
Boric acid：3g
Sodium chloride：2g
Said components are taken, the nickel-plating bath of 1000 grams of new tetrafluoro boric acid nickel is mixed into.
During with present invention plating, it is desirable to pH value of solution:2.5~3.5, solution temperature (DEG C)：40~50, current density (A/
dm2):6.5~7.5.
Claims (10)
1. the nickel-plating bath of new tetrafluoro boric acid nickel, it is characterised in that：Every kilogram of electroplate liquid contains following component：
Bromination N- n-propyl pyridines:155~165g
Tetrafluoro boric acid nickel：40~50g
Ammonium tetrafluoroborate:75~85g
Acetone：690~715g
Tetrafluoro boric acid：3~5g
Boric acid：2~4g
Sodium chloride:2~4g.
2. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:155g
Tetrafluoro boric acid nickel：40g
Ammonium tetrafluoroborate:85g
Acetone：710g
Tetrafluoro boric acid：3g
Boric acid：4g
Sodium chloride:3g.
3. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:160g
Tetrafluoro boric acid nickel：45g
Ammonium tetrafluoroborate:85g
Acetone：700g
Tetrafluoro boric acid：4g
Boric acid：2g
Sodium chloride:4g.
4. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:165g
Tetrafluoro boric acid nickel：50g
Ammonium tetrafluoroborate：85g
Acetone：690g
Tetrafluoro boric acid：3
Boric acid：4g
Sodium chloride:3g.
5. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:155g
Tetrafluoro boric acid nickel：45g
Ammonium tetrafluoroborate：80g
Acetone：710g
Tetrafluoro boric acid：4g
Boric acid：3g
Sodium chloride:3g.
6. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:160g
Tetrafluoro boric acid nickel：50g
Ammonium tetrafluoroborate：80g
Acetone：700g
Tetrafluoro boric acid：3g
Boric acid：4g
Sodium chloride:3g.
7. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:165g
Tetrafluoro boric acid nickel：40g
Ammonium tetrafluoroborate：80g
Acetone：705g
Tetrafluoro boric acid：4g
Boric acid：2g
Sodium chloride:4g.
8. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:155g
Tetrafluoro boric acid nickel：50g
Ammonium tetrafluoroborate：75g
Acetone：710g
Tetrafluoro boric acid：4g
Boric acid：2g
Sodium chloride:4g.
9. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Under every kilogram of electroplate liquid contains
Row component：
Bromination N- n-propyl pyridines:160g
Tetrafluoro boric acid nickel：40g
Ammonium tetrafluoroborate：75g
Acetone：715g
Tetrafluoro boric acid：5g
Boric acid：3g
Sodium chloride：2g.
10. the nickel-plating bath of new tetrafluoro boric acid nickel as claimed in claim 1, it is characterised in that：Every kilogram of electroplate liquid contains
Following component：
Bromination N- n-propyl pyridines:165g
Tetrafluoro boric acid nickel：45g
Ammonium tetrafluoroborate：75g
Acetone：705g
Tetrafluoro boric acid：5g
Boric acid：3g
Sodium chloride：2g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611252880.7A CN106811775A (en) | 2016-12-30 | 2016-12-30 | The nickel-plating bath of new tetrafluoro boric acid nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611252880.7A CN106811775A (en) | 2016-12-30 | 2016-12-30 | The nickel-plating bath of new tetrafluoro boric acid nickel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106811775A true CN106811775A (en) | 2017-06-09 |
Family
ID=59109199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611252880.7A Pending CN106811775A (en) | 2016-12-30 | 2016-12-30 | The nickel-plating bath of new tetrafluoro boric acid nickel |
Country Status (1)
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Citations (7)
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|---|---|---|---|---|
| CN102191517A (en) * | 2010-03-10 | 2011-09-21 | 中国科学院过程工程研究所 | Method of electroplating zinc, nickel, molybdenum and their alloys by using ionic liquid |
| CN102912391A (en) * | 2012-10-12 | 2013-02-06 | 彩虹集团公司 | Method for conducting low temperature electric deposition on nickel by utilizing ion liquid |
| CN103628100A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for indium electroplating |
| CN103628101A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for plating gallium |
| CN104480499A (en) * | 2014-12-15 | 2015-04-01 | 中国工程物理研究院材料研究所 | Nickel electroplating method adopting ionic liquid |
| US20150292098A1 (en) * | 2014-04-15 | 2015-10-15 | Patrick Benaben | Ionic Liquid Electrolyte and Method to Electrodeposit Metals |
| CN105018975A (en) * | 2015-07-23 | 2015-11-04 | 珠海元盛电子科技股份有限公司 | Method for electroplating printed circuit with nickel through ionic liquid |
-
2016
- 2016-12-30 CN CN201611252880.7A patent/CN106811775A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102191517A (en) * | 2010-03-10 | 2011-09-21 | 中国科学院过程工程研究所 | Method of electroplating zinc, nickel, molybdenum and their alloys by using ionic liquid |
| CN102912391A (en) * | 2012-10-12 | 2013-02-06 | 彩虹集团公司 | Method for conducting low temperature electric deposition on nickel by utilizing ion liquid |
| CN103628100A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for indium electroplating |
| CN103628101A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for plating gallium |
| US20150292098A1 (en) * | 2014-04-15 | 2015-10-15 | Patrick Benaben | Ionic Liquid Electrolyte and Method to Electrodeposit Metals |
| CN104480499A (en) * | 2014-12-15 | 2015-04-01 | 中国工程物理研究院材料研究所 | Nickel electroplating method adopting ionic liquid |
| CN105018975A (en) * | 2015-07-23 | 2015-11-04 | 珠海元盛电子科技股份有限公司 | Method for electroplating printed circuit with nickel through ionic liquid |
Non-Patent Citations (3)
| Title |
|---|
| 张允诚等: "《湿法冶金（第2版）》", 31 December 2011 * |
| 张胜涛等: "《电镀工程》", 31 May 2002 * |
| 汪多仁: "《绿色增塑剂》", 31 October 2011 * |
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Application publication date: 20170609 |