CN106757187A - A kind of new nickel-plating bath containing sulfamate - Google Patents
A kind of new nickel-plating bath containing sulfamate Download PDFInfo
- Publication number
- CN106757187A CN106757187A CN201611252772.XA CN201611252772A CN106757187A CN 106757187 A CN106757187 A CN 106757187A CN 201611252772 A CN201611252772 A CN 201611252772A CN 106757187 A CN106757187 A CN 106757187A
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- CN
- China
- Prior art keywords
- nickel
- boric acid
- plating
- bath containing
- bromination
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Containing the new nickel-plating bath (gkg of sulfamate‑1), it is made up of following composition：Bromination N normal-butyl pyridines:160~170, nickel sulfamic acid:50~60, tetrafluoro boric acid:75~85, acetone：680~710, boric acid：2~4, cobalt chloride:2~4.The deposition velocity of nickel plating by amino sulphonate is fast, and the internal stress of coating is low, and the dispersibility of plating solution is good.If control electric current density and temperature, add saccharin and cobalt salt to control the internal stress of coating, the coating of zero stress can be obtained under suitable condition.Therefore be generally used for printing the gold-plated preceding nickel plating of version and plating.Plating solution should strictly control the content of chlorion, and the content of general chlorine is 5 gram per liters, but this plating solution high cost, sulfamate facile hydrolysis higher or in the case that pH is relatively low in temperature.
Description
Technical field
The present invention relates to a kind of electroplate liquid, especially a kind of new nickel-plating bath containing sulfamate.
Background technology
The performance of nickel coating and the nickel plating technology for using have a very big relation, and the performance of different its coating of technique has very big
Difference.According to the difference that plating solution is constituted, nickel plating solution can be divided into：Watt type nickel plating solution, chloride-sulfate plating solution, chlorine
Compound nickel plating solution, whole sulphate nickel plating solution, fluoboric acid nickel plating solution, nickel plating by amino sulphonate solution, solvay-type nickel plating are molten
Liquid, other nickel plating solutions.The deposition velocity of nickel plating by amino sulphonate is fast, and the internal stress of coating is low, and the dispersibility of plating solution is good.If
Control electric current density and temperature, add saccharin and cobalt salt to control the internal stress of coating, and zero can be obtained under suitable condition
The coating of stress.
The content of the invention
To achieve the above object, the technical solution adopted by the present invention is：New nickel-plating bath containing sulfamate
(g·kg-1) formula：
Bromination N- normal-butyl pyridines:160~170
Nickel sulfamic acid:50~60
Tetrafluoro boric acid:75~85
Acetone：680~710
Boric acid：2~4
Cobalt chloride:2~4
New nickel-plating bath containing sulfamate, this electroplate liquid do not exist aquation, hydrolysis, liberation of hydrogen the problems such as, have
Corrosion is small, pollute the property that the green solvent such as small should possess.Meanwhile, electro-deposition can obtain most of obtaining in aqueous
Metal, not side reaction, metal quality is more preferable because obtained from.
Specific embodiment：
Use raw material：Bromination N- normal-butyl pyridines, nickel sulfamic acid, tetrafluoro boric acid, acetone, boric acid, cobalt chloride.
Embodiment 1：
Bromination N- normal-butyl pyridines:160g
Nickel sulfamic acid:50g
Tetrafluoro boric acid:75g
Acetone：710g
Boric acid：2g
Cobalt chloride:3g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 2：
Bromination N- normal-butyl pyridines:165g
Nickel sulfamic acid:55g
Tetrafluoro boric acid:80g
Acetone：695g
Boric acid：3g
Cobalt chloride:2g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 3：
Bromination N- normal-butyl pyridines:170g
Nickel sulfamic acid:60g
Tetrafluoro boric acid:85g
Acetone：680g
Boric acid：3g
Cobalt chloride：2g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 4：
Bromination N- normal-butyl pyridines:160g
Nickel sulfamic acid:55g
Tetrafluoro boric acid:78g
Acetone：702g
Boric acid：3g
Cobalt chloride：2g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 5：
Bromination N- normal-butyl pyridines:165g
Nickel sulfamic acid:50g
Tetrafluoro boric acid:78g
Acetone：701g
Boric acid：4g
Cobalt chloride：2g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 6：
Bromination N- normal-butyl pyridines:170g
Nickel sulfamic acid:55g
Tetrafluoro boric acid:82g
Acetone：686g
Boric acid：4g
Cobalt chloride：3g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 7：
Bromination N- normal-butyl pyridines:160g
Nickel sulfamic acid:60g
Tetrafluoro boric acid:80g
Acetone：692g
Boric acid：4g
Cobalt chloride：4g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 8：
Bromination N- normal-butyl pyridines:165g
Nickel sulfamic acid:60g
Tetrafluoro boric acid:82g
Acetone：687g
Boric acid：2g
Cobalt chloride：4g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
Embodiment 9：
Bromination N- normal-butyl pyridines:170g
Nickel sulfamic acid:50g
Tetrafluoro boric acid:80g
Acetone：693g
Boric acid：3g
Cobalt chloride：4g
Said components are taken, 1000 grams of the new nickel-plating bath containing sulfamate is mixed into.
During with present invention plating, it is desirable to pH value of solution:3.0~5.0, solution temperature (DEG C)：40~60, current density (A/
dm2):2.6~3.9.
Claims (10)
1. a kind of new nickel-plating bath containing sulfamate, it is characterised in that：Every kilogram of electroplate liquid contains following component：
Bromination N- normal-butyl pyridines:160~170g
Nickel sulfamic acid:50~60g
Tetrafluoro boric acid:75~85g
Acetone：680~710g
Boric acid：2~4g
Cobalt chloride:2~4g.
2. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:160g
Nickel sulfamic acid:50g
Tetrafluoro boric acid:75g
Acetone：710g
Boric acid：2g
Cobalt chloride:3g.
3. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:165g
Nickel sulfamic acid:55g
Tetrafluoro boric acid:80g
Acetone：695g
Boric acid：3g
Cobalt chloride:2g.
4. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:170g
Nickel sulfamic acid:60g
Tetrafluoro boric acid:85g
Acetone：680g
Boric acid：3g
Cobalt chloride：2g.
5. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:160g
Nickel sulfamic acid:55g
Tetrafluoro boric acid:78g
Acetone：702g
Boric acid：3g
Cobalt chloride：2g.
6. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:165g
Nickel sulfamic acid:50g
Tetrafluoro boric acid:78g
Acetone：701g
Boric acid：4g
Cobalt chloride：2g.
7. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:170g
Nickel sulfamic acid:55g
Tetrafluoro boric acid:82g
Acetone：686g
Boric acid：4g
Cobalt chloride：3g.
8. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:160g
Nickel sulfamic acid:60g
Tetrafluoro boric acid:80g
Acetone：692g
Boric acid：4g
Cobalt chloride：4g.
9. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of plating
Liquid contains following component：
Bromination N- normal-butyl pyridines:165g
Nickel sulfamic acid:60g
Tetrafluoro boric acid:82g
Acetone：687g
Boric acid：2g
Cobalt chloride：4g.
10. a kind of new nickel-plating bath containing sulfamate as claimed in claim 1, it is characterised in that：Every kilogram of electricity
Plating solution contains following component：
Bromination N- normal-butyl pyridines:170g
Nickel sulfamic acid:50g
Tetrafluoro boric acid:80g
Acetone：693g
Boric acid：3g
Cobalt chloride：4g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611252772.XA CN106757187A (en) | 2016-12-30 | 2016-12-30 | A kind of new nickel-plating bath containing sulfamate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611252772.XA CN106757187A (en) | 2016-12-30 | 2016-12-30 | A kind of new nickel-plating bath containing sulfamate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106757187A true CN106757187A (en) | 2017-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611252772.XA Pending CN106757187A (en) | 2016-12-30 | 2016-12-30 | A kind of new nickel-plating bath containing sulfamate |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670096A (en) * | 2019-11-17 | 2020-01-10 | 沈阳师范大学 | Novel practical electroplating solution for plating nickel iron |
| RU2769796C1 (en) * | 2021-08-06 | 2022-04-06 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Ангарский государственный технический университет" | Bright nickel electrolyte |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101988210A (en) * | 2010-12-03 | 2011-03-23 | 沈阳师范大学 | Ionic liquid indium chloride/n-butyl pyridine chloride system electroplating solution |
| CN102191517A (en) * | 2010-03-10 | 2011-09-21 | 中国科学院过程工程研究所 | Method of electroplating zinc, nickel, molybdenum and their alloys by using ionic liquid |
| CN103628101A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for plating gallium |
| CN103628100A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for indium electroplating |
| US20150292098A1 (en) * | 2014-04-15 | 2015-10-15 | Patrick Benaben | Ionic Liquid Electrolyte and Method to Electrodeposit Metals |
-
2016
- 2016-12-30 CN CN201611252772.XA patent/CN106757187A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102191517A (en) * | 2010-03-10 | 2011-09-21 | 中国科学院过程工程研究所 | Method of electroplating zinc, nickel, molybdenum and their alloys by using ionic liquid |
| CN101988210A (en) * | 2010-12-03 | 2011-03-23 | 沈阳师范大学 | Ionic liquid indium chloride/n-butyl pyridine chloride system electroplating solution |
| CN103628101A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for plating gallium |
| CN103628100A (en) * | 2013-12-09 | 2014-03-12 | 沈阳师范大学 | Novel electroplating solution for indium electroplating |
| US20150292098A1 (en) * | 2014-04-15 | 2015-10-15 | Patrick Benaben | Ionic Liquid Electrolyte and Method to Electrodeposit Metals |
Non-Patent Citations (2)
| Title |
|---|
| 张允诚 等: "《电镀手册》", 31 December 2011, 国防工业出版社 * |
| 李进军 等: "《绿色化学导论》", 31 August 2015, 武汉大学出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670096A (en) * | 2019-11-17 | 2020-01-10 | 沈阳师范大学 | Novel practical electroplating solution for plating nickel iron |
| RU2769796C1 (en) * | 2021-08-06 | 2022-04-06 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Ангарский государственный технический университет" | Bright nickel electrolyte |
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Application publication date: 20170531 |
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