CN103088376B - A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology - Google Patents
A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology Download PDFInfo
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- CN103088376B CN103088376B CN201210569528.1A CN201210569528A CN103088376B CN 103088376 B CN103088376 B CN 103088376B CN 201210569528 A CN201210569528 A CN 201210569528A CN 103088376 B CN103088376 B CN 103088376B
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- cobalt
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- nickel
- electroplate liquid
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Abstract
The invention discloses a kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology, it uses two electroplating power supplies, and the anode of one of them power supply connects nickel plate according to existing technique, and the anode of another power supply connects cobalt metal sheet.In electroplating process, cobalt plate constantly can supplement cobalt ion to electroplate liquid, keeps concentration of cobalt ions to stablize.Without the need to as traditional technology, constantly detect cobalt ion content, time not enough, also will supplement the salts solution of cobalt in electroplate liquid.
Description
Technical field
The present invention relates to a kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology, belong to field of semiconductor package.
Background technology
The electronickelling cobalt technique of semiconductive ceramic package casing routine uses the sulfamate solution of nickel as electroplate liquid, and in this solution, adds thionamic acid cobalt to realize nickel-cobalt alloy plating coating.This technique is the ratio controlling to contain in coating cobalt by the cobalt salt content in adjustment electroplate liquid, some subtle change of cobalt salt all can cause the wide variation of cobalt ratio in coating, therefore need the content of nickel, cobalt element in continuous analytical solution, and supplement in time cobalt salt and ensure the stable of cobalt ratio in coating.
Summary of the invention
Goal of the invention: the present invention proposes a kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology, the concentration ratio of nickel ion and cobalt ion in electroplate liquid can be kept in electroplating process to be stabilized in certain scope, without the need to constantly detecting and add cobalt salt to maintain the concentration of cobalt ion in electroplate liquid in electroplating process.
Technical scheme: the technical solution used in the present invention is a kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology, this technique uses two electroplating power supplies when electroplating, and power anode connects nickel plate and cobalt plate respectively, and the negative electrode of two power supplys is all connected with ceramic packing shell; The supply current connecting cobalt plate is the inverse of the ratio of the rate of deposition of cobalt and nickel with the ratio of the supply current being connected nickel plate;
Electroplate liquid composition is:
Nickel sulfamic acid 600g/L
Thionamic acid cobalt 17g/L
Boric acid 45g/L
Nickelous chloride 8g/L
The pH value of electroplate liquid remains on 4.0, and temperature is 60 degrees Celsius.
Composition further improvement of the present invention, described nickel plate and cobalt plate are staggered front to back setting, and nickel plate than cobalt plate closer to electroplating cathode.
Beneficial effect: the present invention uses two electroplating power supplies, the anode of one of them power supply connects nickel plate according to existing technique, and the anode of another power supply connects cobalt metal sheet.In electroplating process, cobalt plate constantly can supplement cobalt ion to electroplate liquid, keeps concentration of cobalt ions to stablize.Without the need to as traditional technology, constantly detect cobalt ion content, time not enough, also will supplement the salts solution of cobalt in electroplate liquid.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the present invention further, these embodiments should be understood only be not used in for illustration of the present invention and limit the scope of the invention, after having read the present invention, the amendment of those skilled in the art to the various equivalent form of value of the present invention has all fallen within the application's claims limited range.
The present invention includes following steps:
1, first the ceramic packing shell of electroplated dress is hung on Electropolating hangers, then Electropolating hangers is mounted in alkali groove carries out electrolytic degreasing.The temperature of electrolytic degreasing is 50 degrees Celsius, and the time is 5 minutes, and current density is 3A/dm
2.
2, carry out chlorohydric acid pickling and activate 4 minutes, acid solution is 50% hydrochloric acid soln, and temperature is 40 DEG C.
3, impactive nickel plating carries out nickel preplating, solution composition:
Nickelous chloride 240g/L
Hydrochloric acid 130ml/L
Temperature 35 DEG C
Current density is 3A/dm
2
4 minutes time
4, electroplanting device is installed.Fill electroplate liquid in plating tank, electroplate liquid composition is:
Nickel sulfamic acid 600g/L
Thionamic acid cobalt 17g/L
Boric acid 45g/L
Nickelous chloride 8g/L
The pH value of electroplate liquid remains on 4.0, and temperature is 60 degrees Celsius.
The positive pole of two groups of electroplating power supplies be connected on respectively mount nickel plate anode bar on and mount on the anode bar of cobalt plate, nickel plate and cobalt plate all make narrow strip.The negative pole of two groups of power supplys is then connected on cathode bar jointly.The ceramic packing shell of electroplated is mounted on cathode bar.Nickel plate is relative to cobalt plate closer to cathode bar, and both are staggered front to back setting.Under the condition that current density is identical, because Ni-Co alloy codeposition belongs to out-phase codeposition, Co preferential deposition in deposition process, the supply current therefore connecting cobalt plate is less than the supply current connecting nickel plate, and the ratio of two electric currents is consistent with Ni, Co ratio in Ni-Co alloy layer.
It is 0.5A/dm that current density is set to overall current density
2: in this formula Ni-Co alloy layer, Co content is about about 25%, therefore nickel current density 0.4A/dm
2, cobalt current density 0.1A/dm
2, the time is 60 minutes.
5, impact gold-plated carry out gold-plated in advance, solution composition:
Gold 0.9g/L
All the other are commercially available
0.5 minute time
Temperature 35 DEG C
Current density is 1A/dm
2
6, electrolytic gold plating, solution composition:
Gold 8g/L
All the other are commercially available
20 minutes time
Temperature 65 DEG C
Current density is 0.2A/dm
2
7, the ceramic packing shell electroplated takes out, dewatered drying.
Claims (1)
1. a Ceramic-encapsulatedshell shell Ni-Co electroplating technology, is characterized in that, comprises the following steps:
1) first hung on Electropolating hangers by the ceramic packing shell of electroplated dress, then be mounted in alkali groove by Electropolating hangers and carry out electrolytic degreasing, the temperature of electrolytic degreasing is 50 degrees Celsius, and the time is 5 minutes, and current density is 3A/dm
2;
2) carry out chlorohydric acid pickling and activate 4 minutes, acid solution is 50% hydrochloric acid soln, and temperature is 40 DEG C;
3) impactive nickel plating carries out nickel preplating, solution composition:
4) install electroplanting device, fill electroplate liquid in plating tank, electroplate liquid composition is:
The pH value of electroplate liquid remains on 4.0, and temperature is 60 degrees Celsius;
The positive pole of two groups of electroplating power supplies be connected on respectively mount nickel plate anode bar on and mount on the anode bar of cobalt plate, nickel plate and cobalt plate all make narrow strip, the negative pole of two groups of power supplys is then connected on cathode bar jointly, the ceramic packing shell of electroplated is mounted on cathode bar, nickel plate relative to cobalt plate closer to cathode bar, both are staggered front to back setting, under the condition that current density is identical, because Ni-Co alloy codeposition belongs to out-phase codeposition, Co preferential deposition in deposition process, therefore the supply current connecting cobalt plate is less than the supply current connecting nickel plate, Ni in the ratio of two electric currents and Ni-Co alloy layer, Co ratio is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210569528.1A CN103088376B (en) | 2012-12-25 | 2012-12-25 | A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210569528.1A CN103088376B (en) | 2012-12-25 | 2012-12-25 | A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103088376A CN103088376A (en) | 2013-05-08 |
| CN103088376B true CN103088376B (en) | 2016-02-10 |
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| CN201210569528.1A Expired - Fee Related CN103088376B (en) | 2012-12-25 | 2012-12-25 | A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107513734A (en) * | 2017-08-11 | 2017-12-26 | 常熟市明瑞针纺织有限公司 | A kind of processing technology of wear-resisting warp knitting machine cam |
| CN109023496B (en) * | 2018-06-26 | 2020-08-21 | 南通汇丰电子科技有限公司 | Method and system for controlling electroplating of tin-bismuth alloy |
| CN109321957B (en) * | 2018-10-24 | 2023-01-17 | 中国电子科技集团公司第五十五研究所 | Environment-friendly shell plating pretreatment etching solution process and plating method |
| CN111074308B (en) * | 2019-12-30 | 2021-03-12 | 福建南平南孚电池有限公司 | Method and device for electroplating nickel-cobalt alloy coating on surface of steel shell |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4046647A (en) * | 1976-06-17 | 1977-09-06 | M&T Chemicals Inc. | Additive for improved electroplating process |
| CN1455026A (en) * | 2003-05-21 | 2003-11-12 | 鞍钢附属企业公司一炼钢冶金修造厂 | Combined-box alloy plating process of continuous casting crystallizer copper plate |
| CN102131961A (en) * | 2008-09-29 | 2011-07-20 | 威廉·D·赫斯特 | Alloy coating apparatus and metalliding method |
-
2012
- 2012-12-25 CN CN201210569528.1A patent/CN103088376B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4046647A (en) * | 1976-06-17 | 1977-09-06 | M&T Chemicals Inc. | Additive for improved electroplating process |
| CN1455026A (en) * | 2003-05-21 | 2003-11-12 | 鞍钢附属企业公司一炼钢冶金修造厂 | Combined-box alloy plating process of continuous casting crystallizer copper plate |
| CN102131961A (en) * | 2008-09-29 | 2011-07-20 | 威廉·D·赫斯特 | Alloy coating apparatus and metalliding method |
Non-Patent Citations (1)
| Title |
|---|
| "底镀层对陶瓷封装芯腔表面高温变色的影响";王占华等;《电子元件与材料》;20030331;第22卷(第3期);第35-37、48页 * |
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