CN103088376A - Ceramic-encapsulated shell Ni-Co electroplating process - Google Patents
Ceramic-encapsulated shell Ni-Co electroplating process Download PDFInfo
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- CN103088376A CN103088376A CN2012105695281A CN201210569528A CN103088376A CN 103088376 A CN103088376 A CN 103088376A CN 2012105695281 A CN2012105695281 A CN 2012105695281A CN 201210569528 A CN201210569528 A CN 201210569528A CN 103088376 A CN103088376 A CN 103088376A
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Abstract
The invention discloses a ceramic-encapsulated shell Ni-Co electroplating process. According to the process, two electroplating power supplies are used, an anode of one power supply is connected with a nickel plate according to the existing process, and an anode of the other power supply is connected with a cobalt metal plate. In an electroplating process, the cobalt metal plate can continuously supplement cobalt ions for an electroplating bath solution, so as to maintain the stability of the cobalt ion concentration. Dispensing with the traditional process, the content of cobalt ions can be continuously detected, the salt solution of cobalt is supplemented into the electroplating bath solution necessarily in deficiency.
Description
Technical field
The present invention relates to a kind of ceramic packing shell nickel cobalt electroplating technology, belong to the semiconductor packages field.
Background technology
The electronickelling cobalt technique of semiconductive ceramic package casing routine uses the thionamic acid salts solution of nickel as electroplate liquid, and adds the thionamic acid cobalt and realize nickel-cobalt alloy plating coating in this solution.This technique is to control by the cobalt salt content of adjusting in electroplate liquid the ratio that contains cobalt in coating, some subtle change of cobalt salt all can cause the wide variation of cobalt ratio in coating, therefore need the content of nickel, cobalt element in continuous analytical solution, and in time replenish cobalt salt and guarantee the stable of cobalt ratio in coating.
Summary of the invention
Goal of the invention: the present invention proposes a kind of ceramic packing shell nickel cobalt electroplating technology, can keep in electroplating process that in electroplate liquid, the concentration ratio of nickel ion and cobalt ion is stabilized in certain scope, need not constantly detect and add cobalt salt to keep the concentration of cobalt ion in electroplate liquid in electroplating process.
Technical scheme: the technical solution used in the present invention is a kind of ceramic packing shell nickel cobalt electroplating technology, and this technique is used two electroplating power supplies when the electronickelling cobalt, and power anode connects respectively nickel plate and cobalt plate, and the negative electrode of two power supplys all is connected with the ceramic packing shell; The supply current that connects the cobalt plate and the ratio of the supply current that is connected the nickel plate are the inverse of ratio of the rate of deposition of cobalt and nickel;
The electroplate liquid composition is:
Nickel sulfamic acid 600g/L
Thionamic acid cobalt 17g/L
Boric acid 45g/L
Nickelous chloride 8g/L
The pH value of electroplate liquid remains on 4.0, and temperature is 60 degrees centigrade.
The composition further improvement of the present invention, described nickel plate and cobalt plate are staggered front to back setting, and the nickel plate than cobalt plate more near electroplating cathode.
Beneficial effect: the present invention uses two electroplating power supplies, and the anode of one of them power supply connects nickel plate, the anodic bonding cobalt metal sheet of another power supply according to existing technique.In electroplating process, the cobalt plate can constantly replenish cobalt ion to electroplate liquid, keeps concentration of cobalt ions stable.Need not as traditional technology, constantly detect cobalt ion content, also will be to the salts solution of additional cobalt in electroplate liquid when not enough.
Embodiment
Below in conjunction with specific embodiment, further illustrate the present invention, should understand these embodiment only is used for explanation the present invention and is not used in and limits the scope of the invention, after having read the present invention, those skilled in the art all fall within the application's claims limited range to the modification of the various equivalent form of values of the present invention.
The present invention includes following steps:
1, at first the ceramic packing shell of electroplated dress is hung on Electropolating hangers, then Electropolating hangers is mounted on carries out electrolytic degreasing in the alkali groove.The temperature of electrolytic degreasing is 50 degrees centigrade, and the time is 5 minutes, and current density is 3A/d m
2
2, carry out chlorohydric acid pickling activation 4 minutes, acid solution is 50% hydrochloric acid soln, and temperature is 40 ℃.
3, impactive nickel plating carries out nickel preplating, solution composition:
Nickelous chloride 240g/L
Hydrochloric acid 130ml/L
35 ℃ of temperature
Current density is 3A/dm
2
4 minutes time
4, install electroplanting device.Fill electroplate liquid in plating tank, the electroplate liquid composition is:
Nickel sulfamic acid 600g/L
Thionamic acid cobalt 17g/L
Boric acid 45g/L
Nickelous chloride 8g/L
The pH value of electroplate liquid remains on 4.0, and temperature is 60 degrees centigrade.
The positive pole of two groups of electroplating power supplies is connected on respectively on the anode bar that mounts the nickel plate and mounts on the anode bar of cobalt plate, and nickel plate and cobalt plate are all made narrow strip.The negative pole of two groups of power supplys is connected on cathode bar jointly.The ceramic packing shell of electroplated is mounted on cathode bar.The nickel plate is with respect to the more close cathode bar of cobalt plate, and both are staggered front to back setting.Under the identical condition of current density, because Ni-Co alloy codeposition belongs to the out-phase codeposition, Co preferential deposition in deposition process, the supply current that therefore connects the cobalt plate is less than the supply current that connects the nickel plate, and Ni in the ratio of two electric currents and Ni-Co alloy layer, Co ratio are consistent.
It is 0.5A/dm that current density is set to overall current density
2: in this formula Ni-Co alloy layer, Co content is about 25% left and right, so nickel current density 0.4A/dm
2, cobalt nickel current density 0.1A/dm
2, the time is 60 minutes.
5, impact gold-plated carry out gold-plated in advance, solution composition:
Gold 0.9g/L
All the other are commercially available
0.5 minute time
35 ℃ of temperature
Current density is 1A/dm
2
6, electrolytic gold plating, solution composition:
Gold 8g/L
All the other are commercially available
20 minutes time
65 ℃ of temperature
Current density is 0.2A/dm
2
7, electroplate the ceramic packing shell of completing and take out, dewatered drying.
Claims (2)
1. a ceramic packing shell nickel cobalt electroplating technology, is characterized in that, this technique is used two electroplating power supplies when the electronickelling cobalt, and power anode connects respectively nickel plate and cobalt plate, and the negative electrode of two power supplys all is connected with the ceramic packing shell; The supply current that connects the cobalt plate and the ratio of the supply current that is connected the nickel plate are the inverse of ratio of the rate of deposition of cobalt and nickel;
The electroplate liquid composition is:
Nickel sulfamic acid 600g/L
Thionamic acid cobalt 17g/L
Boric acid 45g/L
Nickelous chloride 8g/L
The pH value of electroplate liquid remains on 4.0, and temperature is 60 degrees centigrade.
2. ceramic packing shell nickel cobalt electroplating technology according to claim 1, it is characterized in that: described nickel plate and cobalt plate are staggered front to back setting, and the nickel plate than cobalt plate more near electroplating cathode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210569528.1A CN103088376B (en) | 2012-12-25 | 2012-12-25 | A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210569528.1A CN103088376B (en) | 2012-12-25 | 2012-12-25 | A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103088376A true CN103088376A (en) | 2013-05-08 |
| CN103088376B CN103088376B (en) | 2016-02-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210569528.1A Expired - Fee Related CN103088376B (en) | 2012-12-25 | 2012-12-25 | A kind of Ceramic-encapsulatedshell shell Ni-Co electroplating technology |
Country Status (1)
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| CN (1) | CN103088376B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107513734A (en) * | 2017-08-11 | 2017-12-26 | 常熟市明瑞针纺织有限公司 | A kind of processing technology of wear-resisting warp knitting machine cam |
| CN109023496A (en) * | 2018-06-26 | 2018-12-18 | 南通汇丰电子科技有限公司 | It is a kind of for controlling the method and system of electroplated Sn-Bi alloy |
| CN109321957A (en) * | 2018-10-24 | 2019-02-12 | 中国电子科技集团公司第五十五研究所 | A kind of environment-friendly type shell plating pre-treatment etching solution technique and coating method |
| CN111074308A (en) * | 2019-12-30 | 2020-04-28 | 福建南平南孚电池有限公司 | Method and device for electroplating nickel-cobalt alloy coating on surface of steel shell |
Citations (3)
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| US4046647A (en) * | 1976-06-17 | 1977-09-06 | M&T Chemicals Inc. | Additive for improved electroplating process |
| CN1455026A (en) * | 2003-05-21 | 2003-11-12 | 鞍钢附属企业公司一炼钢冶金修造厂 | Combined-box alloy plating process of continuous casting crystallizer copper plate |
| CN102131961A (en) * | 2008-09-29 | 2011-07-20 | 威廉·D·赫斯特 | Alloy coating apparatus and metalliding method |
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2012
- 2012-12-25 CN CN201210569528.1A patent/CN103088376B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4046647A (en) * | 1976-06-17 | 1977-09-06 | M&T Chemicals Inc. | Additive for improved electroplating process |
| CN1455026A (en) * | 2003-05-21 | 2003-11-12 | 鞍钢附属企业公司一炼钢冶金修造厂 | Combined-box alloy plating process of continuous casting crystallizer copper plate |
| CN102131961A (en) * | 2008-09-29 | 2011-07-20 | 威廉·D·赫斯特 | Alloy coating apparatus and metalliding method |
Non-Patent Citations (3)
| Title |
|---|
| 屠振密: "《电镀合金原理与工艺》", 31 August 1993, 国防工业出版社, article "镍钴合金", pages: 328-329 * |
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| 王占华等: ""底镀层对陶瓷封装芯腔表面高温变色的影响"", 《电子元件与材料》, vol. 22, no. 3, 31 March 2003 (2003-03-31) * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107513734A (en) * | 2017-08-11 | 2017-12-26 | 常熟市明瑞针纺织有限公司 | A kind of processing technology of wear-resisting warp knitting machine cam |
| CN109023496A (en) * | 2018-06-26 | 2018-12-18 | 南通汇丰电子科技有限公司 | It is a kind of for controlling the method and system of electroplated Sn-Bi alloy |
| CN109321957A (en) * | 2018-10-24 | 2019-02-12 | 中国电子科技集团公司第五十五研究所 | A kind of environment-friendly type shell plating pre-treatment etching solution technique and coating method |
| CN109321957B (en) * | 2018-10-24 | 2023-01-17 | 中国电子科技集团公司第五十五研究所 | Environment-friendly shell plating pretreatment etching solution process and plating method |
| CN111074308A (en) * | 2019-12-30 | 2020-04-28 | 福建南平南孚电池有限公司 | Method and device for electroplating nickel-cobalt alloy coating on surface of steel shell |
| CN111074308B (en) * | 2019-12-30 | 2021-03-12 | 福建南平南孚电池有限公司 | Method and device for electroplating nickel-cobalt alloy coating on surface of steel shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103088376B (en) | 2016-02-10 |
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