CN109234771A - A kind of preparation method of ultra-thin hot plate liquid-sucking core - Google Patents
A kind of preparation method of ultra-thin hot plate liquid-sucking core Download PDFInfo
- Publication number
- CN109234771A CN109234771A CN201811090984.1A CN201811090984A CN109234771A CN 109234771 A CN109234771 A CN 109234771A CN 201811090984 A CN201811090984 A CN 201811090984A CN 109234771 A CN109234771 A CN 109234771A
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- copper
- time
- bath solution
- hot plate
- sucking core
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of preparation methods of ultra-thin hot plate liquid-sucking core, it is characterized in that, the following steps are included: (1), for the first time plating, bath solution I includes cupric sulfate pentahydrate 5-50g/L, 98% concentrated sulfuric acid 100-500ml/L, 10-60 DEG C of I temperature of bath solution, using phosphor-copper or fine copper as anode, workpiece is as cathode, current density 0.5-5A/dm2, electroplating time 0.01-15min；(2), it is electroplated for second, bath solution II includes cupric sulfate pentahydrate 225-350g/L, 98% concentrated sulfuric acid 50-100ml/L, 10-60 DEG C of II temperature of bath solution takes out the sample by plating for the first time, is put into bath solution II as cathode, phosphor-copper is as anode, current density 5-20A/dm2, electroplating time 0.01-45min.Porous particle layers of copper is prepared in plating to the present invention for the first time, wick thickness is controlled simultaneously, liquid-sucking core is reinforced in second of plating, it is bad to solve the liquid-sucking core binding force that plating generates for the first time, problem cannot be used for a long time, the wick thickness produced is thin, and capillary structure is abundant, heat transfer property is good, can be used for the preparation of ultra-thin hot plate.
Description
Technical field
The present invention relates to the manufactures of hot plate liquid-sucking core, and in particular to a kind of preparation method of ultra-thin hot plate liquid-sucking core.
Background technique
Hot plate is widely used as a kind of Thermal Conduction Equipment of electronic product, and wherein the liquid-sucking core inside hot plate contains abundant
Capillary structure plays heat-transfer effect highly important.With hot plate on electronic product with more and more extensive, especially
As close products in spaces such as mobile phones, very high, the production of ultra-thin hot plate (overall thickness is less than 0.6mm) is required the size of hot plate
As each hot plate factory technical problem.The method for preparing liquid-sucking core at present mainly has: copper powder sintering, copper mesh attachment.Copper powder sintering
After form capillary structure abundant, this hot plate excellent heat transfer properties, but this method production efficiency is low, generally more than 8 hours, system
Standby liquid-sucking core is thicker, is not used to the preparation of ultra-thin hot plate.The liquid-sucking core of copper mesh adherence method preparation, capillary structure are not rich enough
Richness, the ultra-thin hot plate heat transfer property produced are not ideal enough.
The technique that a kind of galvanoplastic prepare ultra-thin hot plate liquid-sucking core has been invented by our company, can obtain thickness using the method
10-200 microns of liquid-sucking core solves ultra-thin hot plate and prepares problem.
Summary of the invention
In view of the deficiencies of the prior art, the present invention is intended to provide a kind of preparation method of ultra-thin hot plate liquid-sucking core, first time
Porous particle layers of copper is prepared in plating, while controlling wick thickness, but liquid-sucking core binding force is bad, cannot make for a long time
With the present invention reinforces liquid-sucking core by second of plating, solves the liquid-sucking core binding force of plating generation for the first time not
It is good, problem cannot be used for a long time, the wick thickness produced is thin, and capillary structure is abundant, and heat transfer property is good, can be used for ultra-thin
The preparation of hot plate.
Of the invention is achieved through the following technical solutions.
A kind of preparation method of ultra-thin hot plate liquid-sucking core, which comprises the following steps:
(1), it being electroplated for the first time, bath solution I includes cupric sulfate pentahydrate 5-50g/L, 98% concentrated sulfuric acid 100-500ml/L,
10-60 DEG C of I temperature of bath solution, using phosphor-copper or fine copper as anode, workpiece is as cathode, current density 0.5-5A/dm2,
Electroplating time 0.01-15min；First time electroplating time influence liquid-sucking core thickness, by control first time electroplating time to
The liquid-sucking core of different-thickness is produced to meet actual needs；
(2), it is electroplated for second, bath solution II includes cupric sulfate pentahydrate 225-350g/L, 98% concentrated sulfuric acid 50-100ml/
L, 10-60 DEG C of II temperature of bath solution take out the sample by plating for the first time, are put into bath solution II as cathode, phosphorus
Copper is as anode, current density 5-20A/dm2, electroplating time 0.01-45min；Second of electroplating current density is big, accelerates electricity
The time is plated, production efficiency is improved.
Preferably, second of electroplating time is 0.01-30min in step (2).
Preferably, step (1) copper facing under the conditions of electrochemistry/diffusion-controlled step or pure diffusion-controlled step.
Preferably, step (2) carries out copper facing under the conditions of electrochemical control step.
Compared with prior art, the invention has the advantages that the present invention is electroplated for the first time prepares porous particle layers of copper, together
When control wick thickness, but liquid-sucking core binding force is bad, cannot be used for a long time, and the present invention is by second of plating to imbibition
Core is reinforced, and the liquid-sucking core binding force for solving plating generation for the first time is bad, problem cannot be used for a long time, the suction produced
Wick-containing thickness is thin, and capillary structure is abundant, and heat transfer property is good, can be used for the preparation of ultra-thin hot plate；The present invention improves production effect
Rate reduces production cost.
Specific embodiment
The present invention is further explained in the light of specific embodiments, but not as the limitation of the invention.
Embodiment 1
A kind of preparation method of ultra-thin hot plate liquid-sucking core, which comprises the following steps:
(1), it is equipped with bath solution I, the ingredient of bath solution I is copper sulphate 50g/L, 98% concentrated sulfuric acid 100ml/L, temperature
Degree is 20-30 DEG C；
(2), it is equipped with bath solution II, the ingredient of bath solution II is copper sulphate 250g/L, concentrated sulfuric acid 75ml/L, and temperature is
20-30℃；
(3), it is electroplated, is electroplated under the conditions of electrochemistry/diffusion-controlled step using bath solution I, using phosphor-copper for the first time
As anode, for workpiece as cathode, electroplating technological parameter is current density 2A/dm2, electroplating time 5min.Workpiece is copper sheet, is led to
When electric, since current density is larger, when copper deposition, is uneven, and the particle copper plating with abundant capillary structure is formed on copper sheet surface
Layer.
(4), it is electroplated for second, is electroplated under the conditions of electrochemical control step using bath solution II, take out and pass through first
The sample of secondary plating is put into bath solution II as cathode, and for phosphor-copper as anode, electroplating technological parameter is current density 10A/
dm2, electroplating time 45min.When energization, copper is between copper particle and copper sheet, copper particle deposits between gap, improves copper particle and copper
The binding force of plate.
Embodiment 2
A kind of preparation method of ultra-thin hot plate liquid-sucking core, which comprises the following steps:
(1), it is equipped with bath solution I, the ingredient of bath solution I is copper sulphate 50g/L, 98% concentrated sulfuric acid 200ml/L, temperature
Degree is 50-60 DEG C；
(2), it is equipped with bath solution II, the ingredient of bath solution II is copper sulphate 300g/L, concentrated sulfuric acid 100ml/L, temperature
It is 50-60 DEG C；
(3), it is electroplated, is electroplated under the conditions of pure diffusion-controlled step using bath solution I for the first time, using phosphor-copper as sun
Pole, for workpiece as cathode, electroplating technological parameter is current density 4A/dm2, electroplating time 5min.Workpiece is copper sheet, when energization,
Since current density is larger, when copper deposition, is uneven, and the particle copper coating with abundant capillary structure is formed on copper sheet surface.
(4), it is electroplated for second, is electroplated under the conditions of electrochemical control step using bath solution II, take out and pass through first
The sample of secondary plating is put into bath solution II as cathode, and for phosphor-copper as anode, electroplating technological parameter is current density 20A/
dm2, electroplating time 30min.When energization, copper is between copper particle and copper sheet, copper particle deposits between gap, improves copper particle and copper
The binding force of plate.
Embodiment 3
A kind of preparation method of ultra-thin hot plate liquid-sucking core, which comprises the following steps:
(1), it is equipped with bath solution I, the ingredient of bath solution I is copper sulphate 20g/L, 98% concentrated sulfuric acid 300ml/L, temperature
It is 20-30 DEG C；
(2), it is equipped with bath solution II, the ingredient of bath solution II is copper sulphate 300g/L, concentrated sulfuric acid 120ml/L, temperature
It is 20-30 DEG C；
(3), it is electroplated, is electroplated under the conditions of pure diffusion-controlled step using bath solution I for the first time, using fine copper as sun
Pole, for workpiece as cathode, electroplating technological parameter is current density 1A/dm2, electroplating time 10min.Workpiece is copper sheet, when energization,
Since current density is larger, when copper deposition, is uneven, and the particle copper coating with abundant capillary structure is formed on copper sheet surface.
(4), it is electroplated for second, is electroplated under the conditions of electrochemical control step using bath solution II, take out and pass through first
The sample of secondary plating is put into bath solution II as cathode, and for phosphor-copper as anode, electroplating technological parameter is current density 8A/
dm2, electroplating time 30min.When energization, copper is between copper particle and copper sheet, copper particle deposits between gap, improves copper particle and copper
The binding force of plate.
Embodiment 4
A kind of preparation method of ultra-thin hot plate liquid-sucking core, which comprises the following steps:
(1), it is equipped with bath solution I, the ingredient of bath solution I is copper sulphate 20g/L, 98% concentrated sulfuric acid 150ml/L, temperature
Degree is 20-30 DEG C；
(2), it is equipped with bath solution II, the ingredient of bath solution II is copper sulphate 250g/L, concentrated sulfuric acid 100ml/L, temperature
It is 40-60 DEG C；
(3), it is electroplated, is electroplated under the conditions of pure diffusion-controlled step using bath solution I for the first time, using fine copper as sun
Pole, for workpiece as cathode, electroplating technological parameter is current density 1A/dm2, electroplating time 5min.Workpiece is copper sheet, when energization,
Since current density is larger, when copper deposition, is uneven, and the particle copper coating with abundant capillary structure is formed on copper sheet surface.
(4), it is electroplated for second, is electroplated under the conditions of electrochemical control step using bath solution II, take out and pass through first
The sample of secondary plating is put into bath solution II as cathode, and for phosphor-copper as anode, electroplating technological parameter is current density 10A/
dm2, electroplating time 30min.When energization, copper is between copper particle and copper sheet, copper particle deposits between gap, improves copper particle and copper
The binding force of plate.
Embodiment 5
A kind of preparation method of ultra-thin hot plate liquid-sucking core, which comprises the following steps:
(1), it is equipped with bath solution I, the ingredient of bath solution I is copper sulphate 5g/L, 98% concentrated sulfuric acid 500ml/L, temperature
It is 40-50 DEG C；
(2), it is equipped with bath solution II, the ingredient of bath solution II is copper sulphate 350g/L, concentrated sulfuric acid 50ml/L, temperature
It is 40-50 DEG C；
(3), it is electroplated, is electroplated under the conditions of pure diffusion-controlled step using bath solution I for the first time, using fine copper as sun
Pole, for workpiece as cathode, electroplating technological parameter is current density 1A/dm2, electroplating time 3min.Workpiece is copper sheet, when energization,
Since current density is larger, when copper deposition, is uneven, and the particle copper coating with abundant capillary structure is formed on copper sheet surface.
(4), it is electroplated for second, is electroplated under the conditions of electrochemical control step using bath solution II, take out and pass through first
The sample of secondary plating is put into bath solution II as cathode, and for phosphor-copper as anode, electroplating technological parameter is current density 5A/
dm2, electroplating time 15min.When energization, copper is between copper particle and copper sheet, copper particle deposits between gap, improves copper particle and copper
The binding force of plate.
Wherein, the first time electroplating time in each embodiment can require appropriate shortening according to copper layer thickness or extend, reason
It is not less than 0.01min by electroplating time of upper first time, it is general when being electroplated for the first time for the thickness ultrathin for achieving the effect that liquid-sucking core
Between be not more than 15min, first time electroplating time influence copper layer thickness；Second of electroplating time in each embodiment can also basis
Copper layer thickness requires and first time electroplating time is suitably shortened or extended, and theoretically second of electroplating time is not less than
0.01min, general second of electroplating time are not more than 45min, and second of electroplating time influences the binding force of copper particle and copper sheet.
Wherein, a small amount of additive can be added on the basis of above-mentioned bath solution I and bath solution II.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that and all replace with being equal made by present specification
It changes and obviously changes obtained scheme, should all be included within the scope of the present invention.
Claims (4)
1. a kind of preparation method of ultra-thin hot plate liquid-sucking core, which comprises the following steps:
(1), it is electroplated for the first time, bath solution I includes cupric sulfate pentahydrate 5-50g/L, 98% concentrated sulfuric acid 100-500ml/L, plating
10-60 DEG C of I temperature of tank liquor, using phosphor-copper or fine copper as anode, workpiece is as cathode, current density 0.5-5A/dm2, plating
Time 0.01-15min；
(2), it is electroplated for second, bath solution II includes cupric sulfate pentahydrate 225-350g/L, 98% concentrated sulfuric acid 50-100ml/L, electricity
10-60 DEG C of II temperature of tank liquor is plated, the sample by plating for the first time is taken out, is put into bath solution II as cathode, phosphor-copper is made
For anode, current density 5-20A/dm2, electroplating time 0.01-45min.
2. the preparation method of ultra-thin hot plate liquid-sucking core according to claim 1, which is characterized in that second in step (2)
Electroplating time is 0.01-30min.
3. the preparation method of ultra-thin hot plate liquid-sucking core according to claim 1, which is characterized in that step (1) electrochemistry/
Copper facing under the conditions of diffusion-controlled step or pure diffusion-controlled step.
4. the preparation method of ultra-thin hot plate liquid-sucking core according to claim 1, which is characterized in that step (2) is in electrochemistry
Copper facing is carried out under the conditions of rate-determining steps.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811090984.1A CN109234771A (en) | 2018-09-19 | 2018-09-19 | A kind of preparation method of ultra-thin hot plate liquid-sucking core |
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| CN201811090984.1A CN109234771A (en) | 2018-09-19 | 2018-09-19 | A kind of preparation method of ultra-thin hot plate liquid-sucking core |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110514045A (en) * | 2019-07-18 | 2019-11-29 | 得意精密电子(苏州)有限公司 | The production method of temperature-uniforming plate and temperature-uniforming plate |
| CN110763060A (en) * | 2019-10-29 | 2020-02-07 | 深圳大学 | Preparation method of ultrathin heat pipe |
| CN110769645A (en) * | 2019-10-11 | 2020-02-07 | 大连理工大学 | Ultrathin flat plate heat pipe liquid absorption core and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110514045A (en) * | 2019-07-18 | 2019-11-29 | 得意精密电子(苏州)有限公司 | The production method of temperature-uniforming plate and temperature-uniforming plate |
| CN110769645A (en) * | 2019-10-11 | 2020-02-07 | 大连理工大学 | Ultrathin flat plate heat pipe liquid absorption core and manufacturing method thereof |
| CN110763060A (en) * | 2019-10-29 | 2020-02-07 | 深圳大学 | Preparation method of ultrathin heat pipe |
| CN110763060B (en) * | 2019-10-29 | 2021-04-20 | 深圳大学 | Preparation method of ultrathin heat pipe |
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