CN210104115U - Composite anode plate for electro-coppering - Google Patents
Composite anode plate for electro-coppering Download PDFInfo
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- CN210104115U CN210104115U CN201920586754.8U CN201920586754U CN210104115U CN 210104115 U CN210104115 U CN 210104115U CN 201920586754 U CN201920586754 U CN 201920586754U CN 210104115 U CN210104115 U CN 210104115U
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Abstract
The utility model relates to a composite anode plate for electro-coppering, which comprises an electrode active layer and an inert metal layer, and a conductive adhesive layer is arranged between the electrode active layer and the inert metal layer; the electrode active layer is a graphite or carbon felt layer, and the inert metal layer is a titanium plate. The utility model discloses utilize the mode of thinner electrode active layer and inertia metal level complex, obtained a composite anode plate who is applicable to the electro-coppering usefulness, both strengthened the mechanical strength of carbon electrode, the inertia metal sheet can play better electrically conductive effect again simultaneously, compares in titanium coating electrode, and this kind of electrode adopts low price's high density graphite or carbon felt, greatly reduced the cost. The composite anode plate has the advantages that the electrode active layer is preferentially lost in the working process, and after the graphite or carbon felt layer is lost, the titanium plate can be recycled and used for processing the electrode again, so that the composite anode plate has good economic benefit and application prospect.
Description
Technical Field
The utility model relates to an electroplate the field, concretely relates to compound anode plate for electro-coppering.
Background
On Printed Circuit Boards (PCBs), copper is used to interconnect components on a substrate, and although it is a good conductor material for forming a pattern on the conductive path surface of a printed circuit board, it is also susceptible to tarnishing by oxidation and solderability by corrosion if exposed to air for a long period of time. Therefore, copper tracks, vias and plated through holes must be protected using various techniques, including organic painting, oxide film and electroplating techniques. Among them, the metal plating layer has the characteristics of enhancing the corrosion resistance of the metal, increasing the hardness, preventing abrasion, improving the conductivity, smoothness, heat resistance and beautiful surface, etc., and the electroplating technology is widely applied to the preparation of the PCB.
The traditional PCB electroplating system is divided into two types, one type adopts a soluble anode, namely, preplated metal is used as the anode, the anode metal is dissolved during electroplating, and then the anode metal is deposited on the cathode in a metal form; the other method adopts an insoluble anode, and supplements the consumed metal ions by supplementing metal salt or metal oxide. The insoluble anode is usually a titanium-coated electrode, but the electrode is very expensive, occupies a considerable part of the cost of the whole set of equipment, increases the investment of enterprises, and is not favorable for cost control.
Carbon is a chemically inert substance, has low density and light weight, has good conductivity, processability and thermal stability, is made into a carbon electrode, and is widely applied to the fields of metallurgy, chemical engineering and the like. However, the conventional carbon anode plate is brittle and easy to break, and has higher resistivity compared with the metal electrode, so that the application of the carbon anode plate in the electroplating field is limited.
SUMMERY OF THE UTILITY MODEL
In view of the problems existing in the prior art, the object of the utility model is to provide a compound anode plate for electro-coppering utilizes the conducting resin to glue high-density graphite or carbon felt and metal titanium plate, has solved the problem that the graphite plate material is more fragile, easy fracture. Meanwhile, the titanium plate is used as a current collecting plate to be connected with an anode lead, so that the defect of high resistivity of graphite and carbon felt is overcome. The obtained composite anode plate can be well applied to copper electroplating, greatly reduces the production cost and has good economic benefit and application prospect.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a composite anode plate for electro-coppering, which comprises an electrode active layer and an inert metal layer, and a conductive adhesive layer is arranged between the electrode active layer and the inert metal layer;
the electrode active layer is a graphite layer or a carbon felt layer, and the inert metal layer is a titanium plate.
Preferably, an anode mesh frame is arranged around the anode plate outside the composite anode plate.
Preferably, the anode mesh frame is a supporting structure and is made of at least one of nylon cloth, PP or PVC.
Preferably, the mesh size on the anode frame is 200-400 meshes.
Preferably, the conductive adhesive layer is a medium-temperature curing conductive adhesive.
Preferably, the thickness of the conductive adhesive layer is 1-2 mm.
Preferably, the conductive medium in the conductive adhesive layer is graphite powder.
Preferably, the thickness of the electrode active layer is 1 to 5 cm.
Preferably, the thickness of the inert metal layer is 0.1-1 cm.
Compared with the prior art, the utility model discloses following beneficial effect has at least:
(1) the utility model discloses utilize thin electrode active layer (graphite layer or carbon felt layer) and the compound mode of inert metal level (titanium board), obtained a compound anode plate who is applicable to the copper electroplating usefulness, both strengthened the mechanical strength of carbon electrode, inert metal plate can play better electrically conductive effect again simultaneously, compares in titanium coating electrode, and this kind of electrode adopts low price's high density graphite or carbon felt, greatly reduced the cost.
(2) The utility model provides a composite anode plate is in the course of the work, and the preferential loss of electrode active layer after graphite or carbon felt layer loss, the titanium plate can be used for processing the electrode after retrieving once more, has good economic benefits.
Drawings
Fig. 1 is a schematic structural diagram of a composite anode plate according to an embodiment of the present invention;
in the figure: 1-anode screen frame, 2-electrode active layer, 3-conductive adhesive layer, 4-inert metal layer.
The present invention will be described in further detail below. However, the following examples are only simple examples of the present invention, and do not represent or limit the scope of the present invention, which is defined by the appended claims.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
The utility model provides a composite anode plate for copper electroplating in the detailed implementation part, as shown in figure 1, the composite anode plate comprises an electrode active layer 2 and an inert metal layer 4, and a conductive adhesive layer 3 is arranged between the electrode active layer and the inert metal layer;
the electrode active layer 2 is a graphite layer or a carbon felt layer, and the inert metal layer 4 is a titanium plate.
The composite anode plate also comprises an anode mesh frame 1 arranged around the anode plate.
The anode screen frame 1 surrounds the composite anode plate, is mainly used for preventing electrode falling objects from polluting tank liquor and simultaneously realizes internal and external exchange of electrolyte. The anode mesh frame 1 is not in contact with the composite anode plate, and the mesh frame is composed of nylon cloth and a supporting structure made of PP or PVC materials with electroplating solution corrosion resistance.
Preferably, the mesh size on the anode frame 1 is 200-400 meshes, and the mesh with the mesh number can realize good exchange between the inside and the outside of the electrolyte on the basis of ensuring collection of the counter electrode falling objects.
Preferably, the conductive adhesive layer 3 is a medium-temperature-curing conductive adhesive, which is mainly used to bond the electrode active layer 2 (graphite layer or carbon felt layer) and the inert metal layer 4 (titanium plate) together and achieve good electrical conduction between the two materials.
Preferably, the thickness of the conductive adhesive layer 3 is 1-2mm, and may be, for example, 1mm, 1.3mm, 1.5mm, 1.8mm, 2mm, or the like, but is not limited thereto. Theoretically, after the electrode active layer and the inert metal layer are firmly bonded together, the smaller the thickness of the conductive adhesive layer, the better.
Preferably, the conductive medium in the conductive adhesive layer 3 is graphite powder, but is not limited thereto.
Preferably, the thickness of the electrode active layer 2 is 1-5cm, and may be, for example, 1cm, 2cm, 3cm, 4cm, or 5cm, but is not limited thereto.
Preferably, the thickness of the inert metal layer 4 is 0.1-1cm, and may be, for example, 0.1cm, 0.2cm, 0.3cm, 0.4cm, 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm, 1cm, or the like, but is not limited thereto.
For the utility model discloses, the thickness of electrode active layer 2 and inert metal layer 4 should realize good matching, and the thickness relation of the two can carry out concrete regulation according to the production needs.
The thickness of each layer in the above-mentioned composite anode plate is just enumerated, and is not the restriction of the utility model. The thickness of the electrode active layer 2, the inert metal layer 4 and the conductive adhesive layer 3 can be arbitrarily selected by those skilled in the art according to the working conditions in the actual production, and all of them should fall within the protection scope of the present invention.
The utility model discloses in the area of composite anode plate should be confirmed according to the size of plating bath, the utility model discloses do not specially prescribe a limit to it.
In the utility model, the inert metal layer 4 in the composite anode plate is connected with the anode lead through the anode mesh frame.
To better illustrate the present invention, facilitating the understanding of the technical solutions of the present invention, typical but not limiting embodiments of the present invention are as follows:
example 1
The embodiment provides a composite anode plate for copper electroplating, which comprises an anode plate and an anode mesh frame arranged around the anode plate;
the anode plate comprises an electrode active layer and an inert metal layer, a conductive adhesive layer is arranged between the electrode active layer and the inert metal layer, and the anode plate is obtained by pressing;
the electrode active layer is a carbon felt layer, and the inert metal layer is a titanium plate.
The anode frame is a supporting structure made of nylon cloth, and the size of meshes on the anode frame is 200-400 meshes.
The conductive adhesive layer is a medium-temperature cured conductive adhesive, and the conductive medium is graphite powder; the thickness of the conductive adhesive layer is 3 mm.
The thickness of the electrode active layer is 3cm, and the thickness of the inert metal layer is 0.5 cm.
Example 2
The embodiment provides a composite anode plate for copper electroplating, which comprises an anode plate and an anode mesh frame arranged around the anode plate;
the anode plate comprises an electrode active layer and an inert metal layer, a conductive adhesive layer is arranged between the electrode active layer and the inert metal layer, and the anode plate is obtained by pressing;
the electrode active layer is a graphite layer, and the inert metal layer is a titanium plate.
The anode frame is a support structure made of PP, and the size of meshes on the anode frame is 200-400 meshes.
The conductive adhesive layer is a medium-temperature cured conductive adhesive, and the conductive medium is graphite powder; the thickness of the conductive adhesive layer is 1 mm.
The thickness of the electrode active layer is 1cm, and the thickness of the inert metal layer is 0.2 cm.
Example 3
In this embodiment, the composite anode plate for electrolytic copper plating provided in embodiment 1 is applied to a PCB electrolytic copper plating process, and the specific process is as follows:
electroplating solution: copper sulfate pentahydrate: 140g/L, sulfuric acid: 210g/L, chloride ion: 80ppm, ferrous sulfate heptahydrate: 175g/L, plating leveler Skyplate Cu 657L: 15mL/L, plating brightener Skyplate Cu 650B: 9 mL/L.
The electroplating mode is as follows: bidirectional pulse plating, forward current density 6ASD, forward pulse time 80ms, reaction current density 18ASD, reverse pulse time 4ms, plating time: and (4) 40 min.
The PCB testing plate is 2400um thick and 300um in diameter of the through hole.
After the electroplating is finished, the appearance of the electroplated copper of the obtained sample plate is matte and has uniform color. The average thickness of the obtained electroplated surface copper is 18.1um, the average thickness of the middle position of the inner wall of the through hole is 31.8um, and the TP value is 175 percent.
The applicant states that the present invention is described by the above embodiments, but the present invention is not limited to the above detailed structural features, i.e. the present invention can be implemented only by relying on the above detailed structural features. It should be clear to those skilled in the art that any modifications to the present invention, to the equivalent replacement of selected parts and the addition of auxiliary parts, the selection of specific modes, etc., all fall within the scope of protection and disclosure of the present invention.
The above detailed description describes the preferred embodiments of the present invention, but the present invention is not limited to the details of the above embodiments, and the technical idea of the present invention can be within the scope of the present invention, and can be right to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and in order to avoid unnecessary repetition, the present invention does not need to describe any combination of the features.
In addition, various embodiments of the present invention can be combined arbitrarily, and the disclosed content should be regarded as the present invention as long as it does not violate the idea of the present invention.
Claims (9)
1. The composite anode plate for the electro-coppering is characterized by comprising an electrode active layer and an inert metal layer, wherein a conductive adhesive layer is arranged between the electrode active layer and the inert metal layer;
the electrode active layer is a graphite layer or a carbon felt layer, and the inert metal layer is a titanium plate.
2. The composite anode plate of claim 1, wherein an anode mesh frame is disposed about the composite anode plate.
3. The composite anode plate of claim 2, wherein the anode mesh frame is a support structure made of at least one of nylon cloth, PP, or PVC.
4. The composite anode plate of claim 2, wherein the mesh size on the anode frame is 200-400 mesh.
5. The composite anode plate of claim 1, wherein the conductive glue layer is a medium temperature curing conductive glue.
6. The composite anode plate of claim 1, wherein the conductive glue layer has a thickness of 1-2 mm.
7. The composite anode plate of claim 1, wherein the conductive media in the conductive paste layer is graphite powder.
8. The composite anode plate of claim 1, wherein the electrode active layer has a thickness of 1-5 cm.
9. The composite anode plate of claim 1, wherein the inert metal layer has a thickness of 0.1-1 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920586754.8U CN210104115U (en) | 2019-04-26 | 2019-04-26 | Composite anode plate for electro-coppering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920586754.8U CN210104115U (en) | 2019-04-26 | 2019-04-26 | Composite anode plate for electro-coppering |
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| Publication Number | Publication Date |
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| CN210104115U true CN210104115U (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920586754.8U Active CN210104115U (en) | 2019-04-26 | 2019-04-26 | Composite anode plate for electro-coppering |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114808039A (en) * | 2021-12-02 | 2022-07-29 | 广州合凯环保科技有限公司 | Acid etching solution regeneration system with chlorine-free gas evolution and low cost |
| CN115132399A (en) * | 2022-03-18 | 2022-09-30 | 广州合凯环保科技有限公司 | Composite anode material and application |
-
2019
- 2019-04-26 CN CN201920586754.8U patent/CN210104115U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114808039A (en) * | 2021-12-02 | 2022-07-29 | 广州合凯环保科技有限公司 | Acid etching solution regeneration system with chlorine-free gas evolution and low cost |
| CN114808039B (en) * | 2021-12-02 | 2024-01-02 | 广州合凯环保科技有限公司 | Acid etching solution regeneration system without chlorine precipitation and low in cost |
| CN115132399A (en) * | 2022-03-18 | 2022-09-30 | 广州合凯环保科技有限公司 | Composite anode material and application |
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Address after: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Patentee after: Guangdong Tiancheng Technology Co.,Ltd. Address before: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Patentee before: GUANGZHOU SKYCHEM TECHNOLOGIES Ltd. |