CN103617978A - Small-power device-used lead frame - Google Patents
Small-power device-used lead frame Download PDFInfo
- Publication number
- CN103617978A CN103617978A CN201310548636.5A CN201310548636A CN103617978A CN 103617978 A CN103617978 A CN 103617978A CN 201310548636 A CN201310548636 A CN 201310548636A CN 103617978 A CN103617978 A CN 103617978A
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- CN
- China
- Prior art keywords
- lead
- lead frame
- power device
- riser
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a small-power device-used lead frame. 24 lead frame units (1) are in single-row connection with one another through connecting ribs (2); each lead frame unit (1) comprises a lead head (3) and lead pins (4); the lead head (3) is corner-rounded rectangular-shaped; two sides of the lead head (3) are provided with lead lugs (5); the lead head (3) is provided with a positioning hole (6) and a chip loading area (7); the area of the positioning hole is larger than that of the chip loading area (7); the length of the chip loading area (7) is 2.0 mm; the width of the chip loading area (7) is 2.0 mm; and the cross section of the lead lugs (5) is L-shaped. The small-power device-used lead frame of the invention has the advantages of simple structure and convenient mould production, and is suitable for being used in small power devices.
Description
Technical field
The present invention is specifically related to lead frame, the lead frame that particularly a kind of low-power device is used.
Background technology
Development along with electron trade, semiconductor device adopts the more and more many of Plastic Package form, this just need to adapt to the lead frame of various different model plastic devices, and lead frame must adapt to the requirement of heat radiation, conduction and the carrying high-power chip of epoxy seal semiconductor device.
Lead frame need redesign and avoid waste when for low-power device.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of mould of being convenient to simple in structure and produces, is suitable for the lead frame that low-power device is used.
For addressing the above problem, technical scheme provided by the invention is: the lead frame that a kind of low-power device is used, by 24 lead frame unit, by dowel is single, connected to form, described lead frame unit comprises lead riser and terminal pin, described lead riser is round rectangle, the both sides of described lead riser are provided with lead-in wire ear, described lead riser is provided with location hole and slide glass district, the area of described location hole is greater than slide glass district, the length in described slide glass district is 2.0mm, width is 2.0mm, and the cross section of described lead-in wire ear is L shaped.
As a further improvement on the present invention, the width of described terminal pin is 0.7-0.77mm.The thickness of described lead riser and terminal pin is 0.035-0.045mm.The aperture of described location hole is 3.68mm.
The present invention compared with prior art has the following advantages.
(1) lead frame that, a kind of low-power device is used, by 24 lead frame unit, by dowel is single, connected to form, described lead frame unit comprises lead riser and terminal pin, described lead riser is round rectangle, the both sides of described lead riser are provided with lead-in wire ear, lead-in wire ear is convenient to heat radiation when low-power device is used, and makes volume little, is convenient to plastic packaging encapsulation and uses.Described lead riser is provided with location hole and slide glass district, and the area of described location hole is greater than slide glass district, make of the present inventionly manufacture to produce time material saving, and the present invention is simple in structure, is suitable for mould one time punching molded.The length in described slide glass district is 2.0mm, and width is 2.0mm, and the cross section of described lead-in wire ear is L shaped, better heat radiation, and L shaped itself and the air contact area of making increases, and makes better heat-radiation effect.
As a further improvement on the present invention, the width of described terminal pin is 0.7-0.77mm.The thickness of described lead riser and terminal pin is 0.035-0.045mm.The aperture of described location hole is 3.68mm.The thickness of terminal pin or lead riser or size be significantly less than general lead frame, saved material, be suitable for low-power device use, slide glass region, makes the demand that bonding die is convenient, attractive in appearance, adapted to mini-plant.
Accompanying drawing explanation
Fig. 1 is the structural representation of the lead frame used of low-power device of the present invention.
In figure: 1-lead frame unit, 2-dowel, 3-lead riser, 4-terminal pin, the 5-ear that goes between, 6-location hole ，7-slide glass district.
Embodiment
Below in conjunction with drawings and Examples, the present invention is improved further to explanation.
As shown in Figure 1, the lead frame that a kind of low-power device is used, by 24 lead frame unit 1, by dowel 2 is single, connected to form, lead frame unit 1 comprises lead riser 3 and terminal pin 4, and lead riser 3 is round rectangle, the both sides of lead riser 3 are provided with lead-in wire ear 5, lead riser 3 is provided with location hole 6 and slide glass district 7, and the area of location hole 6 is greater than slide glass district 7, and the length in slide glass district 7 is 2.0mm, width is 2.0mm, and the cross section of lead-in wire ear 5 is L shaped.The width of terminal pin 4 is 0.7-0.77mm.The thickness of lead riser 3 and terminal pin 4 is 0.035-0.045mm.The aperture of location hole 6 is 3.68mm.
Teachings herein is example of the present invention and explanation; but do not mean that the obtainable advantage of the present invention is so limited, may be to wherein one or more of the advantage realizing in the simple transformation of structure and/or some execution modes all in the application's protection range in every practice process of the present invention.
Claims (4)
1. the lead frame that low-power device is used, it is characterized in that: by 24 lead frame unit (1) by single the connecting to form of dowel (2), described lead frame unit (1) comprises lead riser (3) and terminal pin (4), described lead riser (3) is round rectangle, the both sides of described lead riser (3) are provided with lead-in wire ear (5), described lead riser (3) is provided with location hole (6) and slide glass district (7), the area of described location hole (6) is greater than slide glass district (7), the length in described slide glass district (7) is 2.0mm, width is 2.0mm, the cross section of described lead-in wire ear (5) is L shaped.
2. the lead frame that low-power device according to claim 1 is used, is characterized in that: the width of described terminal pin (4) is 0.7-0.77mm.
3. the lead frame that low-power device according to claim 1 is used, is characterized in that: the thickness of described lead riser (3) and terminal pin (4) is 0.035-0.045mm.
4. the lead frame that low-power device according to claim 1 is used, is characterized in that: the aperture of described location hole (6) is 3.68mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548636.5A CN103617978A (en) | 2013-11-08 | 2013-11-08 | Small-power device-used lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548636.5A CN103617978A (en) | 2013-11-08 | 2013-11-08 | Small-power device-used lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617978A true CN103617978A (en) | 2014-03-05 |
Family
ID=50168681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310548636.5A Pending CN103617978A (en) | 2013-11-08 | 2013-11-08 | Small-power device-used lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617978A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN102034785A (en) * | 2010-11-23 | 2011-04-27 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN203617274U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame for low-power devices |
-
2013
- 2013-11-08 CN CN201310548636.5A patent/CN103617978A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN102034785A (en) * | 2010-11-23 | 2011-04-27 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN203617274U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame for low-power devices |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |