CN103608920B - 包括位于led上的散射部分的led阵列及其制作方法 - Google Patents

包括位于led上的散射部分的led阵列及其制作方法 Download PDF

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Publication number
CN103608920B
CN103608920B CN201280028382.8A CN201280028382A CN103608920B CN 103608920 B CN103608920 B CN 103608920B CN 201280028382 A CN201280028382 A CN 201280028382A CN 103608920 B CN103608920 B CN 103608920B
Authority
CN
China
Prior art keywords
layer
led
light
light emitting
adhesion layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280028382.8A
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English (en)
Chinese (zh)
Other versions
CN103608920A (zh
Inventor
H.J.科内里斯森
M.H.W.M.范德登
H.H.P.戈姆曼斯
L.W.G.斯托夫米尔
J.于
G.森尼尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN103608920A publication Critical patent/CN103608920A/zh
Application granted granted Critical
Publication of CN103608920B publication Critical patent/CN103608920B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Led Devices (AREA)
CN201280028382.8A 2011-06-10 2012-06-05 包括位于led上的散射部分的led阵列及其制作方法 Expired - Fee Related CN103608920B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11169455 2011-06-10
EP11169455.0 2011-06-10
PCT/IB2012/052821 WO2012168858A2 (en) 2011-06-10 2012-06-05 Light output device and method of manufacture

Publications (2)

Publication Number Publication Date
CN103608920A CN103608920A (zh) 2014-02-26
CN103608920B true CN103608920B (zh) 2016-08-17

Family

ID=46397337

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280028382.8A Expired - Fee Related CN103608920B (zh) 2011-06-10 2012-06-05 包括位于led上的散射部分的led阵列及其制作方法

Country Status (6)

Country Link
US (1) US9470380B2 (enExample)
EP (1) EP2718970A2 (enExample)
JP (1) JP6164656B2 (enExample)
CN (1) CN103608920B (enExample)
RU (1) RU2589338C2 (enExample)
WO (1) WO2012168858A2 (enExample)

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JP6199568B2 (ja) * 2013-01-30 2017-09-20 株式会社小糸製作所 発光モジュール
US10094523B2 (en) * 2013-04-19 2018-10-09 Cree, Inc. LED assembly
DE102013007641A1 (de) * 2013-05-06 2014-11-06 Paulmann Licht Gmbh Beleuchtungsanordnung
CN106063378B (zh) * 2014-03-05 2018-04-03 Lg电子株式会社 使用半导体发光器件的显示器件
KR102309831B1 (ko) * 2015-03-23 2021-10-13 현대모비스 주식회사 조명장치
CN108780830B (zh) 2016-03-16 2020-03-31 亮锐控股有限公司 制造led模块的方法
US10260683B2 (en) 2017-05-10 2019-04-16 Cree, Inc. Solid-state lamp with LED filaments having different CCT's
KR102383302B1 (ko) * 2017-11-08 2022-04-05 엘지디스플레이 주식회사 백라이트 유닛 및 이를 포함한 액정표시장치

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JPH1146019A (ja) * 1997-07-28 1999-02-16 Nichia Chem Ind Ltd 発光ダイオード及びｌｅｄ表示器の形成方法
US6747406B1 (en) * 2000-08-07 2004-06-08 General Electric Company LED cross-linkable phospor coating
CN1713407A (zh) * 2004-06-16 2005-12-28 株式会社东芝 有机半导体元件及其制造方法
CN1813499A (zh) * 2003-07-02 2006-08-02 松下电器产业株式会社 发光元件及显示装置
CN101088140A (zh) * 2004-03-29 2007-12-12 连接技术公司 从卷筒到卷筒制造的发光纸和密封的半导体电路装置
WO2009096057A1 (ja) * 2008-01-29 2009-08-06 Toppan Printing Co., Ltd. 光デバイス、光均一デバイス、光学シート、バックライトユニットおよびディスプレイ装置
TW201015697A (en) * 2008-10-13 2010-04-16 Touch Micro System Tech Light emitting diode package and method of making the same
CN101790700A (zh) * 2007-08-27 2010-07-28 皇家飞利浦电子股份有限公司 光输出设备

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US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
JP2004140185A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
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RU2369943C2 (ru) * 2007-03-19 2009-10-10 Валентин Николаевич Щербаков Светодиодная матрица
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1146019A (ja) * 1997-07-28 1999-02-16 Nichia Chem Ind Ltd 発光ダイオード及びｌｅｄ表示器の形成方法
US6747406B1 (en) * 2000-08-07 2004-06-08 General Electric Company LED cross-linkable phospor coating
CN1813499A (zh) * 2003-07-02 2006-08-02 松下电器产业株式会社 发光元件及显示装置
CN101088140A (zh) * 2004-03-29 2007-12-12 连接技术公司 从卷筒到卷筒制造的发光纸和密封的半导体电路装置
CN1713407A (zh) * 2004-06-16 2005-12-28 株式会社东芝 有机半导体元件及其制造方法
CN101790700A (zh) * 2007-08-27 2010-07-28 皇家飞利浦电子股份有限公司 光输出设备
WO2009096057A1 (ja) * 2008-01-29 2009-08-06 Toppan Printing Co., Ltd. 光デバイス、光均一デバイス、光学シート、バックライトユニットおよびディスプレイ装置
TW201015697A (en) * 2008-10-13 2010-04-16 Touch Micro System Tech Light emitting diode package and method of making the same

Also Published As

Publication number Publication date
US9470380B2 (en) 2016-10-18
CN103608920A (zh) 2014-02-26
RU2013157522A (ru) 2015-07-20
JP2014516198A (ja) 2014-07-07
US20140160752A1 (en) 2014-06-12
JP6164656B2 (ja) 2017-07-19
WO2012168858A2 (en) 2012-12-13
RU2589338C2 (ru) 2016-07-10
WO2012168858A3 (en) 2013-05-23
EP2718970A2 (en) 2014-04-16

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20170314

Address after: Eindhoven

Patentee after: KONINKL PHILIPS N.V.

Address before: Holland Ian Deho Finn

Patentee before: Koninkl Philips Electronics NV

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160817

Termination date: 20190605

CF01 Termination of patent right due to non-payment of annual fee