CN103596352A - 软性电路板装置及相机模组 - Google Patents

软性电路板装置及相机模组 Download PDF

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CN103596352A
CN103596352A CN201210289930.4A CN201210289930A CN103596352A CN 103596352 A CN103596352 A CN 103596352A CN 201210289930 A CN201210289930 A CN 201210289930A CN 103596352 A CN103596352 A CN 103596352A
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soft board
flexible circuit
sheet metal
camera module
panel assembly
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CN103596352B (zh
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郑谕灿
陈文章
陈信文
陈文雄
彭书胜
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Shenzhen Xinshijia Electronic Technology Co ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN201810092086.3A priority patent/CN108391366B/zh
Priority to CN201711123348.XA priority patent/CN107889344A/zh
Priority to TW101129835A priority patent/TWI600213B/zh
Priority to US13/727,467 priority patent/US8917340B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

一种软性电路板装置，其包括一软板基材。所述软板基材包括一第一表面、一背对所述第一表面的第二表面。所述第一表面上设置有多个软板焊垫。所述第一表面用于涂布异方性导电胶以使所述异方性导电胶覆盖所述多个软板焊垫。所述软性电路板装置进一步包括多个金属片。所述多个金属片固设在所述第二表面上，且所述多个金属片与多个软板焊垫一一对应设置。所述多个金属片用于加强所述软性电路板装置的硬度并接地。本发明还涉及一种应用上述软性电路板装置的相机模组。

Description

软性电路板装置及相机模组
技术领域
本发明涉及一种软性电路板装置及相机模组。
背景技术
现有的相机模组，其包括一成像装置及一软性电路板。所述软性电路板具有一承载面及一与承载面相背离的底面。所述成像装置承载于所述承载面上并通过打线方式与所述软性电路板电性连接。然而，由于软性电路板容易发生变形，所述成像装置也易于变形弯折，受到损坏。
发明内容
有鉴于此，有必要提供一种可保护成像装置不易受力弯折受到损坏的电路板装置及其应用的相机模组。
一种软性电路板装置，其包括一软板基材。所述软板基材包括一第一表面、一背对所述第一表面的第二表面。所述第一表面上设置有多个软板焊垫。所述第一表面用于涂布异方性导电胶以使所述异方性导电胶覆盖所述多个软板焊垫。所述软性电路板装置进一步包括多个金属片。所述多个金属片固设在所述第二表面上，且所述多个金属片与多个软板焊垫一一对应设置。所述多个金属片用于加强所述软性电路板装置的硬度并接地。
一种相机模组，其包括一软性电路板装置、一异方性导电胶及一成像装置。所述软性电路板装置包括一软板基材。所述软板基材包括一第一表面、一背对所述第一表面的第二表面。所述第一表面上设置有多个软板焊垫。所述异方性导电胶涂布在所述软板基材的第一表面且覆盖所述多个软板焊垫。所述成像装置通过所述异方性导电胶封装在所述软性电路板装置上。所述软性电路板装置进一步包括多个金属片，所述多个金属片固设在所述第二表面上，且所述多个金属片与多个软板焊垫一一对应设置。所述金属片用于加强所述电路板装置的硬度并接地。
相对于现有技术，本发明的相机模组由于所述软板基材的第一表面与第二表面上分别与所述基板及多个所述金属片连接，加强了所述电路板装置硬度，因此，当所述成像装置固设在所述电路板装置时，可保护所述成像装置不易受力弯折而受到损坏。
附图说明
图1为本发明第一实施方式提供的相机模组的立体组装示意图；
图2为图1中的相机模组立体分解示意图；
图3为图1中的相机模组沿III-III线的剖面示意图；
图4为本发明第二实施方式的相机模组的示意图。
主要元件符号说明
相机模组 100、200
软性电路板装置 10
成像装置 20
软板基材 11、61
金属片 12
异方性导电胶 14、64
第一表面 111、611
第二表面 112
软板焊垫 110、610
基板 21
影像感测器 22、51
第三表面 211
第四表面 212
基板焊垫 210
焊片 214
成像面 221
连接面 222
感测区 220
焊球 230
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请一并参阅图1至图3，本发明第一实施方式所提供的相机模组100，其包括一软性电路板装置10、一异方性导电胶14及一成像装置20。
所述软性电路板装置10包括一软板基材11及多个金属片12。
所述软板基材11包括一第一表面111、一背对所述第一表面111的第二表面112。所述第一表面111上设置有多个软板焊垫110。
所述多个金属片12固设在所述第二表面112上，且所述多个金属片12与所述多个软板焊垫110一一对应设置。所述多个金属片12用于加强所述软性电路板装置10的硬度并接地。本实施方式中，每个所述金属片12的尺寸大于其对应的所述软板焊垫110的尺寸；所述金属片12为铜片。
本实施方式中，所述异方性导电胶14涂布在所述第一表面111上且覆盖所述软板焊垫110。
所述成像装置20包括一基板21及一影像感测器22。
本实施方式中，所述基板21为一陶瓷基板，其通过所述异方性导电胶14与所述软板基材11的第一表面111固设在一起。所述基板21包括一面向所述第一表面111的第三表面211及一背对所述第三表面211的第四表面212。所述第三表面211上对应多个所述软板焊垫110位置设置多个基板焊垫210。所述多个基板焊垫210与多个软板焊垫110一一对应设置。所述基板焊垫210通过所述异方性导电胶14与所述软板焊垫110电性连接。所述第四表面212上设置有多个焊片214。
所述影像感测器22为CCD（Charge Coupled Device，电荷耦合组件传感器）或CMOS（Complementary Metal Oxide Semiconductor，互补性金属氧化物传感器）。所述影像感测器22成像装置包括一成像面221及一背对所述成像面221的连接面222。所述成像面221上设置有感测区220。所述连接面222上对应所述多个焊片214位置设置有多个焊球230。所述多个焊球230与多个所述焊片214一一对应设置。所述焊球230通过热熔方式与所述焊片214连接，以使所述成像装置20与所述软性电路板装置10机械性及电性连接。
实际应用中，也可以用覆晶形式、内引脚贴合、自动载带贴合等连接方式使所述影像感测器22机械性及电性连接于所述软性电路板装置10，并不限于本实施方式。
本发明的相机模组100由于所述软板基材11的第一表面111与第二表面112上分别与所述基板21及多个所述金属片12连接，加强了所述软性电路板装置10硬度，因此，当所述成像装置20固设在所述软性电路板装置10上时，可保护所述成像装置20不易受力弯折而受到损坏。
另外，仅在所述软板基材11的第二表面112对应所述软板焊垫110的位置处设置所述金属片12，所述异方性导电胶14涂布在所述软板基材11与所述基板21之间，因此，当所述成像装置20固设在所述第一表面111上时，在压合推压所述金属片12的过程中，所述软板基材11只有对应所述金属片12设置有所述软板焊垫110的焊垫区受力，而无软板焊垫110的非焊垫区不受力，如此，可防止压力释放后，所述软板基材11的无软板焊垫110的非焊垫区回弹，提高了产品的良率。
请参阅图4，本发明第二实施方式所提供的相机模组200。所述相机模组200的结构与所述相机模组100的结构大体相同，所述相机模组200的结构与相机模组100的结构主要差异在于：所述成像装置仅包括一影像感测器51，所述异方性导电胶64涂布在所述软板基材61的第一表面611上且覆盖所述软板垫焊610。所述影像感测器51的连接面52上的多个焊球520通过热压合的方式直接与所述软板基材61的第一表面611上的软板焊垫610电性连接。由于第二实施方式的相机模组200省去所述基板21，可节省生产成本。
虽然本发明已以较佳实施方式披露如上，但是，其并非用以限定本发明，另外，本领域技术人员还可以在本发明精神内做其它变化等。当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (10)

1.一种软性电路板装置，其包括一软板基材，所述软板基材包括一第一表面、一背对所述第一表面的第二表面，所述第一表面上设置有多个软板焊垫，所述第一表面用于涂布异方性导电胶以使所述异方性导电胶覆盖所述多个软板焊垫，其特征在于：所述软性电路板装置进一步包括多个金属片，所述多个金属片固设在所述第二表面上，且所述多个金属片与多个软板焊垫一一对应设置，所述多个金属片用于加强所述软性电路板装置的硬度并接地。
2.如权利要求1所述的软性电路板装置，其特征在于，每个所述金属片的尺寸大于其对应的软板焊垫的尺寸。
3.如权利要求1所述的软性电路板装置，其特征在于，所述金属片为铜片。
4.一种相机模组，其包括一软性电路板装置、一异方性导电胶及一成像装置，所述软性电路板装置包括一软板基材，所述软板基材包括一第一表面、一背对所述第一表面的第二表面，所述第一表面上设置有多个软板焊垫，所述异方性导电胶涂布在所述软板基材的第一表面且覆盖所述多个软板焊垫，所述成像装置通过所述异方性导电胶封装在所述软性电路板装置上，其特征在于：所述软性电路板装置进一步包括多个金属片，所述多个金属片固设在所述第二表面上，且所述多个金属片与多个软板焊垫一一对应设置，所述金属片用于加强所述电路板装置的硬度并接地。
5.如权利要求4所述的相机模组，其特征在于，所述成像装置包括一基板及一影像感测器，所述基板通过所述异方性导电胶与所述软板基材的第一表面固设在一起，所述基板包括一面向所述第一表面的第三表面及一背对所述第三表面的第四表面，所述第三表面上对应多个所述软板焊垫位置设置多个基板焊垫，所述基板焊垫通过所述异方性导电胶与所述软板焊垫电性连接，所述第四表面上设置有多个焊片，所述影像感测器包括一成像面及一背离所述成像面的连接面，所述成像面上设置有感测区，所述连接面上对应多个所述焊片位置设置有多个焊球，所述焊球与所述焊片连接。
6.如权利要求5所述的相机模组，其特征在于，所述基板为一陶瓷基板。
7.如权利要求5所述的相机模组，其特征在于，所述成像装置包括一影像感测器，所述影像感测器的连接面上的多个焊球直接与所述软板基材的第一表面上的软板焊垫电性连接。
8.如权利要求4或5所述的相机模组，其特征在于，每个所述金属片的尺寸大于其对应的软板焊垫的尺寸。
9.如权利要求5所述的相机模组，其特征在于，所述金属片为铜片。
10.如权利要求5或7所述的相机模组，其特征在于，所述影像感测器为CCD或CMOS。
CN201210289930.4A 2012-08-15 2012-08-15 软性电路板装置及相机模组 Active CN103596352B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201210289930.4A CN103596352B (zh) 2012-08-15 2012-08-15 软性电路板装置及相机模组
CN201810092086.3A CN108391366B (zh) 2012-08-15 2012-08-15 一种成像装置
CN201711123348.XA CN107889344A (zh) 2012-08-15 2012-08-15 软性电路板装置
TW101129835A TWI600213B (zh) 2012-08-15 2012-08-17 軟性電路板裝置及相機模組
US13/727,467 US8917340B2 (en) 2012-08-15 2012-12-26 Circuit board assembly and camera module using same

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CN201210289930.4A CN103596352B (zh) 2012-08-15 2012-08-15 软性电路板装置及相机模组

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