CN103594815A - Thin-substrate oscillator planar horn antenna - Google Patents
Thin-substrate oscillator planar horn antenna Download PDFInfo
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- CN103594815A CN103594815A CN201310619567.2A CN201310619567A CN103594815A CN 103594815 A CN103594815 A CN 103594815A CN 201310619567 A CN201310619567 A CN 201310619567A CN 103594815 A CN103594815 A CN 103594815A
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Abstract
The invention provides a thin-substrate oscillator planar horn antenna and relates to a horn antenna. The thin-substrate oscillator planar horn antenna comprises a micro-strip feeder line (2), a horn antenna body (3) and multiple oscillators (4) which are located on a dielectric substrate (1), wherein the horn antenna body (3) consists of a first metal plane (7), a second metal plane (8) and two rows of metalized via hole horn side walls (9). The horn antenna body (3) is provided with metalized via hole arrays (11) and multiple dielectric-loaded waveguides (14), and the dielectric-loaded waveguides (14) on the caliber face (10) of the horn antenna body (3) are respectively connected with one of the oscillators (4). The polarization direction of a radiation field is parallel to the substrate. The thin-substrate oscillator planar horn antenna can be manufactured by using the thin substrate and is high in gain, low in cost and compact in structure.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of thin substrate surface of oscillator horn antenna.
Background technology
Horn antenna has a wide range of applications in the systems such as satellite communication, terrestrial microwave link and radio telescope.But the huge physical dimension of three-dimensional horn antenna has restricted its application and development in planar circuit.In recent years, the proposition of substrate integrated waveguide technology and development have well promoted the development of plane horn antenna.Substrate integration wave-guide have size little, lightweight, be easy to the advantages such as integrated and processing and fabricating.The substrate integration wave-guide plane horn antenna of the plane based on substrate integration wave-guide, except having the feature of horn antenna, has also well been realized miniaturization, the lightness of horn antenna, and has been easy to be integrated in microwave and millimeter wave planar circuit.Traditional substrate integration wave-guide plane horn antenna have a restriction, the thickness of antenna horn aperture substrate is greater than 1/10th operation wavelengths, antenna just can have good radiance, not so due to reflection, the energy emission in antenna is not gone out.So just require the thickness of antenna substrate can not be too thin, not only volume and weight be very large at L-band etc., will to meet this requirement very difficult especially, very thick substrate compared with low-frequency range, has offset integrated advantage, but also has increased cost.The polarised direction of these antenna radiation field is generally all perpendicular to medium substrate in addition, and some application needs the polarization of radiation field to be parallel to medium substrate.More existing antennas load the radiation that paster improves thin substrate plane horn antenna before plane horn antenna, but the patch size loading is larger, and working band is narrower.
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Summary of the invention
technical problem:the object of the invention is to propose a kind of thin substrate surface of oscillator horn antenna, the polarised direction of this radiation field of aerial is parallel with medium substrate, can use very thin medium substrate manufacture, in the situation that the electric very thin thickness of substrate still has good radiance.
technical scheme:thin substrate surface of oscillator horn antenna of the present invention, is characterized in that this antenna comprises the integrated horn antenna of microstrip feed line, substrate and a plurality of oscillator being arranged on medium substrate; The first port of described microstrip feed line is the input/output port of this antenna, and the second port of microstrip feed line and the integrated horn antenna of substrate join; The integrated horn antenna of substrate by be positioned at medium substrate one side the first metal flat, be positioned at the second metal flat of medium substrate another side and form with the two row's metallization via hole loudspeaker sidewalls that are connected the first metal flat and the second metal flat through medium substrate, width between two row's metallization via hole loudspeaker sidewalls of the integrated horn antenna of substrate becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face of the integrated horn antenna of substrate; In the integrated horn antenna of substrate, there are a plurality of metallization arrays of vias to connect the first metal flat and the second metal flat, the length of each metallization arrays of vias is the same, the head end of metallization arrays of vias is inner at the integrated horn antenna of substrate, and the tail end of metallization arrays of vias is on the bore face of the integrated horn antenna of substrate; Adjacent two metallization arrays of vias or row's metallization via hole loudspeaker sidewall that metallization arrays of vias is adjacent, form dielectric-filled waveguide with the first metal flat and the second metal flat, outside bore face, each dielectric-filled waveguide is connected to an oscillator.
The conduction band of microstrip feed line and the first metal flat join, and the ground plane of microstrip feed line and the second metal flat join.
The width of dielectric-filled waveguide will make electromagnetic wave can propagate therein and not be cut off, more than the length of dielectric-filled waveguide has half guide wavelength.
Each oscillator has respectively the first radiation arm and the second radiation arm on the two sides that is positioned at medium substrate, the first radiation arm of oscillator is connected with the first metal flat of the integrated horn antenna of substrate, the second radiation arm of oscillator is connected with the second metal flat of the integrated horn antenna of substrate, and the first radiation arm and second radiation arm of each oscillator stretch in the opposite direction.
In metallization via hole loudspeaker sidewall and metallization arrays of vias, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewall and the metallization arrays of vias that form can be equivalent to electric wall.
Electromagnetic wave is from one end input of microstrip feed line, the other end through microstrip feed line enters substrate integration wave-guide horn antenna, propagate after a segment distance, run into metallization arrays of vias, just enter respectively each dielectric-filled waveguide transmission, the electromagnetic wave that enters each dielectric waveguide enters oscillator radiation by antenna opening diametric plane, and the polarised direction of radiation field also becomes with substrate and connects subparallel horizontal direction.
Owing to there being a plurality of metallization arrays of vias that the bore face of antenna is divided into a lot of little bore faces, it is very little that the size of the oscillator connecing on each osculum diametric plane can be done, and the compact conformation of antenna, size also only increase seldom like this.
Antenna, from feed microstrip line to oscillator, be all the substrate integrated wave guide structure of sealing, so feeder loss is less.
beneficial effect:the beneficial effect of the thin substrate surface of oscillator of the present invention horn antenna is that the polarised direction of this radiation field of aerial is parallel with medium substrate; This antenna can use the medium substrate manufacture lower than the thickness of 2 percent wavelength, substrate thickness far below desired 1/10th wavelength of common plane horn antenna, in the situation that the electric very thin thickness of substrate, still there is good radiance, for example, in 6GHz frequency, adopt the thickness of epoxide resin material substrate to be reduced to 0.5mm by 2.5mm, thereby greatly reduce size, weight and cost; Compact conformation, the feeder loss of antenna are little.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is further described.
Fig. 1 is the structural representation of the thin substrate surface of oscillator of the present invention horn antenna.
In figure, have: medium substrate 1, microstrip feed line 2, the integrated horn antenna 3 of substrate, layered transducer elements 4, the first port 5 of microstrip feed line 2, the second port 6 of microstrip feed line 2, the first metal flat 7 of medium substrate 1, the second metal flat 8 of medium substrate 1, metallization via hole loudspeaker sidewall 9, the bore face 10 of antenna 3, metallization arrays of vias 11, the head end 12 of metallization arrays of vias 11, the tail end 13 of metallization arrays of vias 11, dielectric-filled waveguide 14, the conduction band 15 of microstrip feed line 2, the ground plane 16 of microstrip feed line 2, the first radiation arm 17 of oscillator 4 and the second radiation arm 18 of oscillator 4.
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Embodiment
Embodiment of the present invention is: thin substrate surface of oscillator horn antenna comprises the integrated horn antenna 3 of the microstrip feed line 2, the substrate that are arranged on medium substrate 1 and a plurality of oscillator 4; The first port 5 of described microstrip feed line 2 is input/output ports of this antenna, and the second port 6 of microstrip feed line 2 joins with the integrated horn antenna 3 of substrate; The integrated horn antenna 3 of substrate by be positioned at medium substrate 1 one side the first metal flat 7, be positioned at the second metal flat 8 of medium substrate 1 another side and two rows that are connected the first metal flat 7 and the second metal flat 8 through the medium substrate 1 via hole loudspeaker sidewalls 9 that metallize and form, width between two row's metallization via hole loudspeaker sidewalls 9 of the integrated horn antenna 3 of substrate becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face 10 of the integrated horn antenna 3 of substrate; In the integrated horn antenna 3 of substrate, there are a plurality of metallization arrays of vias 11 to connect the first metal flat 7 and the second metal flat 8, the length of each metallization arrays of vias 11 is the same, the head end 12 of metallization arrays of vias 11 is in the integrated horn antenna of substrate 3 inside, and the tail end 13 of metallization arrays of vias 11 is on the bore face 10 of the integrated horn antenna 3 of substrate; Adjacent two metallization arrays of vias 11 or row's metallization via hole loudspeaker sidewall 9 that metallization arrays of vias 11 is adjacent, form dielectric-filled waveguide 14 with the first metal flat 7 and the second metal flat 8, outside bore face 10, each dielectric-filled waveguide 14 is connected to an oscillator 4.
The conduction band 15 of microstrip feed line 2 and the first metal flat 7 join, and the ground plane 16 of microstrip feed line 2 and the second metal flat 8 join.
The width of dielectric-filled waveguide 14 will make electromagnetic wave can propagate therein and not be cut off, more than the length of dielectric-filled waveguide 14 has half guide wavelength.
Each oscillator 4 has respectively the first radiation arm 17 and the second radiation arm 18 on the two sides that is positioned at medium substrate 1, the first radiation arm 17 of oscillator 4 is connected with the first metal flat 7 of the integrated horn antenna 3 of substrate, the second radiation arm 18 of oscillator 4 is connected with the second metal flat 8 of the integrated horn antenna 3 of substrate, and the first radiation arm 17 and second radiation arm 18 of each oscillator 4 stretch in the opposite direction.
In metallization via hole loudspeaker sidewall 9 and metallization arrays of vias 11, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewall 9 and the metallization arrays of vias 11 that form can be equivalent to electric wall.
When design, the length of metallization arrays of vias 11 generally will make the length of dielectric-filled waveguide 14 have half guide wavelength just can make above antenna have larger gain.
In technique, thin substrate surface of oscillator horn antenna both can adopt common printed circuit board (PCB) (PCB) technique, also can adopt the integrated circuit technologies such as LTCC (LTCC) technique or CMOS, Si substrate to realize.The via hole that wherein metallizes can be that hollow metal through hole can be also solid metal hole, can be also continuous metallization wall, and the shape of metal throuth hole can be circular, can be also square or other shapes.
Structurally, according to same principle, can increase or reduce the quantity of metallization arrays of vias 11, and then change quantity and the size of oscillator 4, as long as guarantee that dielectric-filled waveguide 14 can transmit main mould.
According to the above, just can realize the present invention.
Claims (5)
1. thin substrate surface of oscillator horn antenna, is characterized in that this antenna comprises microstrip feed line (2), the integrated horn antenna of substrate (3) and a plurality of oscillator (4) being arranged on medium substrate (1); First port (5) of described microstrip feed line (2) is the input/output port of this antenna, and second port (6) of microstrip feed line (2) joins with the integrated horn antenna of substrate (3); The integrated horn antenna of substrate (3) by be positioned at medium substrate (1) one side the first metal flat (7), be positioned at second metal flat (8) of medium substrate (1) another side and two rows that are connected the first metal flat (7) and the second metal flat (8) through medium substrate (1) the via hole loudspeaker sidewalls (9) that metallize and form, width between two row's metallization via hole loudspeaker sidewalls (9) of the integrated horn antenna of substrate (3) becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face (10) of the integrated horn antenna of substrate (3); In the integrated horn antenna of substrate (3), there are a plurality of metallization arrays of vias (11) to connect the first metal flat (7) and the second metal flat (8), the length of each metallization arrays of vias (11) is the same, the head end (12) of metallization arrays of vias (11) is in the integrated horn antenna of substrate (3) inside, and the tail end (13) of metallization arrays of vias (11) is on the bore face (10) of the integrated horn antenna of substrate (3); Adjacent two metallization arrays of vias (11) or row's metallization via hole loudspeaker sidewalls (9) that the arrays of vias (11) that metallizes is adjacent, form dielectric-filled waveguide (14) with the first metal flat (7) and the second metal flat (8), outside bore face (10), each dielectric-filled waveguide (14) is connected to an oscillator (4).
2. thin substrate surface of oscillator horn antenna according to claim 1, is characterized in that the conduction band (15) of microstrip feed line (2) and the first metal flat (7) join, and the ground plane (16) of microstrip feed line (2) joins with the second metal flat (8).
3. thin substrate surface of oscillator horn antenna according to claim 1, is characterized in that the width of dielectric-filled waveguide (14) will make electromagnetic wave can propagate therein and not be cut off, more than the length of dielectric-filled waveguide (14) has half guide wavelength.
4. thin substrate surface of oscillator horn antenna according to claim 1, it is characterized in that each oscillator (4) has respectively the first radiation arm (17) and the second radiation arm (18) on the two sides that is positioned at medium substrate (1), first radiation arm (17) of oscillator (4) is connected with first metal flat (7) of the integrated horn antenna of substrate (3), second radiation arm (18) of oscillator (4) is connected with second metal flat (8) of the integrated horn antenna of substrate (3), the first radiation arm (17) and second radiation arm (18) of each oscillator (4) stretch in the opposite direction.
5. thin substrate surface of oscillator horn antenna according to claim 1, it is characterized in that in described metallization via hole loudspeaker sidewalls (9) and metallization arrays of vias (11), the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewalls (9) and the metallization arrays of vias (11) that form can be equivalent to electric wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310619567.2A CN103594815B (en) | 2013-11-29 | 2013-11-29 | Thin substrate surface of oscillator horn antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310619567.2A CN103594815B (en) | 2013-11-29 | 2013-11-29 | Thin substrate surface of oscillator horn antenna |
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| CN103594815A true CN103594815A (en) | 2014-02-19 |
| CN103594815B CN103594815B (en) | 2015-10-28 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050219126A1 (en) * | 2004-03-26 | 2005-10-06 | Automotive Systems Laboratory, Inc. | Multi-beam antenna |
| CN101075702A (en) * | 2007-06-19 | 2007-11-21 | 东南大学 | Printing antenna with baseplate integrated waveguide feeder |
| CN201498598U (en) * | 2009-06-10 | 2010-06-02 | 东南大学 | Printing log-periodic dipole array antenna |
| US20110018657A1 (en) * | 2008-03-18 | 2011-01-27 | Shi Cheng | Substrate Integrated Waveguide |
| CN102324627A (en) * | 2011-09-06 | 2012-01-18 | 电子科技大学 | Miniaturization substrate integrated multi-beam antenna |
| CN103022715A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Planar horn antenna for phase calibration |
-
2013
- 2013-11-29 CN CN201310619567.2A patent/CN103594815B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050219126A1 (en) * | 2004-03-26 | 2005-10-06 | Automotive Systems Laboratory, Inc. | Multi-beam antenna |
| CN101075702A (en) * | 2007-06-19 | 2007-11-21 | 东南大学 | Printing antenna with baseplate integrated waveguide feeder |
| US20110018657A1 (en) * | 2008-03-18 | 2011-01-27 | Shi Cheng | Substrate Integrated Waveguide |
| CN201498598U (en) * | 2009-06-10 | 2010-06-02 | 东南大学 | Printing log-periodic dipole array antenna |
| CN102324627A (en) * | 2011-09-06 | 2012-01-18 | 电子科技大学 | Miniaturization substrate integrated multi-beam antenna |
| CN103022715A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Planar horn antenna for phase calibration |
Non-Patent Citations (1)
| Title |
|---|
| GUOHUA ZHAI等: "Super High Gain Substrate Integrated Clamped-Mode Printed Log-Periodic Dipole Array Antenna", 《IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION》, vol. 61, no. 6, 29 March 2013 (2013-03-29) * |
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