CN103594810A - Thin-substrate amplitude correction oscillator planar horn antenna - Google Patents
Thin-substrate amplitude correction oscillator planar horn antenna Download PDFInfo
- Publication number
- CN103594810A CN103594810A CN201310617311.8A CN201310617311A CN103594810A CN 103594810 A CN103594810 A CN 103594810A CN 201310617311 A CN201310617311 A CN 201310617311A CN 103594810 A CN103594810 A CN 103594810A
- Authority
- CN
- China
- Prior art keywords
- substrate
- horn antenna
- oscillator
- metal flat
- vias
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 104
- 238000012937 correction Methods 0.000 title claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 43
- 230000005855 radiation Effects 0.000 claims abstract description 32
- 238000001465 metallisation Methods 0.000 claims description 56
- 238000003491 array Methods 0.000 claims description 39
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000010287 polarization Effects 0.000 abstract description 2
- 230000010354 integration Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Landscapes
- Waveguide Aerials (AREA)
Abstract
薄基片幅度校正振子平面喇叭天线涉及一种喇叭天线。该天线包括在介质基板（1）上的微带馈线（2）、喇叭天线（3）和多个振子（4），喇叭天线（3）由第一金属平面（7）、第二金属平面（8）和两排金属化过孔喇叭侧壁（9）组成，喇叭天线（3）中有金属化过孔阵列（11）和介质填充波导（14），在喇叭天线（3）的口径面（10）上，每个介质填充波导（14）的宽度相等，且都接有一个振子（4）。电磁波可等幅到达振子再辐射，辐射场的极化与基板平行。该天线可使用薄基板制造且增益高、成本低和结构紧凑。
The invention relates to a planar horn antenna with thin substrate amplitude correction dipole and relates to a horn antenna. The antenna includes a microstrip feeder (2), a horn antenna (3) and a plurality of dipoles (4) on a dielectric substrate (1). The horn antenna (3) consists of a first metal plane (7), a second metal plane ( 8) and two rows of metallized via hole horn sidewalls (9), the horn antenna (3) has a metallized via hole array (11) and a dielectric filled waveguide (14), on the aperture surface of the horn antenna (3) ( 10), each medium-filled waveguide (14) has the same width and is connected with an oscillator (4). Electromagnetic waves can reach the vibrator with equal amplitude and then radiate, and the polarization of the radiation field is parallel to the substrate. The antenna can be fabricated using a thin substrate and has high gain, low cost and compact structure.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of thin substrate amplitude correction surface of oscillator horn antenna.
Background technology
Horn antenna has a wide range of applications in the systems such as satellite communication, terrestrial microwave link and radio telescope.But the huge physical dimension of three-dimensional horn antenna has restricted its application and development in planar circuit.In recent years, the proposition of substrate integrated waveguide technology and development have well promoted the development of plane horn antenna.Substrate integration wave-guide have size little, lightweight, be easy to the advantages such as integrated and processing and fabricating.The substrate integration wave-guide plane horn antenna of the plane based on substrate integration wave-guide, except having the feature of horn antenna, has also well been realized miniaturization, the lightness of horn antenna, and has been easy to be integrated in microwave and millimeter wave planar circuit.Traditional substrate integration wave-guide plane horn antenna have a restriction, the thickness of antenna horn aperture substrate is greater than 1/10th operation wavelengths, antenna just can have good radiance, not so due to reflection, the energy emission in antenna is not gone out.So just require the thickness of antenna substrate can not be too thin, not only volume and weight be very large at L-band etc., will to meet this requirement very difficult especially, very thick substrate compared with low-frequency range, has offset integrated advantage, but also has increased cost.The polarised direction of these antenna radiation field is generally all perpendicular to medium substrate in addition, and some application needs the polarization of radiation field to be parallel to medium substrate.More existing antennas load the radiation that paster improves thin substrate plane horn antenna before plane horn antenna, but the patch size loading is larger, and working band is narrower.The gain of traditional substrate integration wave-guide plane horn antenna is relatively low in addition, and its reason is because horn mouth constantly opens, and while causing Electromagnetic Wave Propagation to horn mouth diametric plane, the amplitude distribution of electric field strength is inhomogeneous, and radiation directivity and gain reduce.The methods such as existing employing medium loading at present, medium prism, correct loudspeaker aperture field, but these methods all can only be improved the consistency of PHASE DISTRIBUTION, can not improve the uniformity of amplitude distribution, and these phase alignment structures have increased the overall structure size of antenna.
Summary of the invention
technical problem:the object of the invention is to propose a kind of thin substrate amplitude correction surface of oscillator horn antenna, the polarised direction of this radiation field of aerial is parallel with medium substrate, can use very thin medium substrate manufacture, in the situation that the electric very thin thickness of substrate, still there is good radiance, and this plane horn antenna can RECTIFYING ANTENNA bore face on electromagnetic wave amplitude distribution inconsistent.
technical scheme:thin substrate amplitude correction surface of oscillator horn antenna of the present invention, is characterized in that this antenna comprises the integrated horn antenna of microstrip feed line, substrate and a plurality of oscillator being arranged on medium substrate; The first port of described microstrip feed line is the input/output port of this antenna, and the second port of microstrip feed line and the integrated horn antenna of substrate join; The integrated horn antenna of substrate by be positioned at medium substrate one side the first metal flat, be positioned at the second metal flat of medium substrate another side and form with the two row's metallization via hole loudspeaker sidewalls that are connected the first metal flat and the second metal flat through medium substrate, width between two row's metallization via hole loudspeaker sidewalls of the integrated horn antenna of substrate becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face of the integrated horn antenna of substrate; In the integrated horn antenna of substrate, have metallization arrays of vias to connect the first metal flat and the second metal flat, the head end of metallization arrays of vias is inner at the integrated horn antenna of substrate, and the tail end of metallization arrays of vias is on the bore face of the integrated horn antenna of substrate; Adjacent two metallization arrays of vias or row's metallization via hole loudspeaker sidewall that metallization arrays of vias is adjacent, form dielectric-filled waveguide with the first metal flat and the second metal flat; On the bore face of the integrated horn antenna of substrate, the width of each dielectric-filled waveguide is equal, and outside bore face, each dielectric-filled waveguide is connected to an oscillator.
The conduction band of microstrip feed line and the first metal flat join, and the ground plane of microstrip feed line and the second metal flat join.
The broken line that the shape of described metallization arrays of vias consists of one or more curve, the common summit of two adjacent curve negotiatings connects, and the shape of a curve of broken line can be straight line, camber line or other curve.
The width of dielectric-filled waveguide will make electromagnetic wave can propagate therein and not be cut off.
The head end of selection metallization arrays of vias and summit, in the position of the integrated horn antenna of substrate inside, equate the electromagnetic wave power transmitting in each dielectric-filled waveguide.
Each oscillator has respectively the first radiation arm and the second radiation arm on the two sides that is positioned at medium substrate, the first radiation arm of oscillator is connected with the first metal flat of the integrated horn antenna of substrate, the second radiation arm of oscillator is connected with the second metal flat of the integrated horn antenna of substrate, and the first radiation arm and second radiation arm of each oscillator stretch in the opposite direction.
In metallization via hole loudspeaker sidewall and metallization arrays of vias, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewall and the metallization arrays of vias that form can be equivalent to electric wall.
Electromagnetic wave is from one end input of microstrip feed line, and the other end of process microstrip feed line enters substrate integration wave-guide horn antenna, propagates after a segment distance, runs into metallization arrays of vias, just enters respectively each dielectric-filled waveguide transmission.Enter the electromagnetic relative power of each dielectric-filled waveguide mainly by the head end broken line of metallization arrays of vias and the determining positions of polygon vertex, the head end of adjustment metallization arrays of vias and summit are in the position of the integrated horn antenna of substrate inside, can adjust the electromagnetic relative power through each dielectric-filled waveguide transmission, and then can guarantee that the power transmitting equates in each dielectric-filled waveguide, because each dielectric-filled waveguide on bore face is connected to the oscillator of a same caliber size, the power that enters like this each oscillator radiation also equates, namely guarantee that whole antenna is that constant amplitude width is penetrated, this has just improved the gain of antenna.
Just can be controlled in the above described manner the power on amplitude distribution of magnetic wave of antenna opening diametric plane, if remaining on the port width of each dielectric-filled waveguide on antenna opening diametric plane equates, and adjust the head end of metallization arrays of vias and summit in the position of the integrated horn antenna of substrate inside, make to arrive antenna opening diametric plane by the electromagnetic same width of each dielectric-filled waveguide transmission, and then enter each oscillator radiation with width, the polarised direction of radiation field also becomes with substrate and connects subparallel horizontal direction, so not only can be so that the in the situation that of the thin substrate of electricity, whole antenna has good radiance, and reach and improve the aperture efficiency of antenna and the object of gain.
Owing to there being a plurality of metallization arrays of vias that the bore face of antenna is divided into a lot of little bore faces, it is very little that the size of the oscillator connecing on each osculum diametric plane can be done, and the compact conformation of antenna, size also only increase seldom like this.
Antenna, from feed microstrip line to oscillator, be all the substrate integrated wave guide structure of sealing, so feeder loss is less.
In like manner also can on the bore face of antenna, realize as required specific field intensity amplitude distribution.
beneficial effect:the beneficial effect of the thin substrate amplitude correction of the present invention surface of oscillator horn antenna is that the polarised direction of this radiation field of aerial is parallel with medium substrate; This antenna can use the medium substrate manufacture lower than the thickness of 2 percent wavelength, substrate thickness far below desired 1/10th wavelength of common plane horn antenna, in the situation that the electric very thin thickness of substrate, still there is good radiance, for example, in 6GHz frequency, adopt the thickness of epoxide resin material substrate to be reduced to 0.5mm by 2.5mm, thereby greatly reduce size, weight and cost; And this plane horn antenna inside be embedded with metallization arrays of vias can RECTIFYING ANTENNA bore face on electromagnetic wave amplitude distribution inconsistent, compact conformation, the feeder loss of antenna are little.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is further described.
Fig. 1 is the structural representation of the thin substrate amplitude correction of the present invention surface of oscillator horn antenna.
In figure, have: medium substrate 1, microstrip feed line 2, the integrated horn antenna 3 of substrate, layered transducer elements 4, the first port 5 of microstrip feed line 2, the second port 6 of microstrip feed line 2, the first metal flat 7 of medium substrate 1, the second metal flat 8 of medium substrate 1, metallization via hole loudspeaker sidewall 9, the bore face 10 of antenna 3, metallization arrays of vias 11, the head end 12 of metallization arrays of vias 11, the tail end 13 of metallization arrays of vias 11, dielectric-filled waveguide 14, the conduction band 15 of microstrip feed line 2, the ground plane 16 of microstrip feed line 2, summit 17, the first radiation arm 18 of oscillator 4 and the second radiation arm 19 of oscillator 4.
Embodiment
Embodiment of the present invention is: thin substrate amplitude correction surface of oscillator horn antenna comprises the integrated horn antenna 3 of the microstrip feed line 2, the substrate that are arranged on medium substrate 1 and a plurality of oscillator 4; The first port 5 of described microstrip feed line 2 is input/output ports of this antenna, and the second port 6 of microstrip feed line 2 joins with the integrated horn antenna 3 of substrate; The integrated horn antenna 3 of substrate by be positioned at medium substrate 1 one side the first metal flat 7, be positioned at the second metal flat 8 of medium substrate 1 another side and two rows that are connected the first metal flat 7 and the second metal flat 8 through the medium substrate 1 via hole loudspeaker sidewalls 9 that metallize and form, width between two row's metallization via hole loudspeaker sidewalls 9 of the integrated horn antenna 3 of substrate becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face 10 of the integrated horn antenna 3 of substrate; In the integrated horn antenna 3 of substrate, there is metallization arrays of vias 11 to connect the first metal flat 7 and the second metal flat 8, the head end 12 of metallization arrays of vias 11 is in the integrated horn antenna of substrate 3 inside, and the tail end 13 of metallization arrays of vias 11 is on the bore face 10 of the integrated horn antenna 3 of substrate; Adjacent two metallization arrays of vias 11 or row's metallization via hole loudspeaker sidewall 9 that metallization arrays of vias 11 is adjacent, form dielectric-filled waveguide 14 with the first metal flat 7 and the second metal flat 8; On the bore face 10 of the integrated horn antenna 3 of substrate, the width of each dielectric-filled waveguide 14 is equal, and outside bore face 10, each dielectric-filled waveguide 14 is connected to an oscillator 4.
The conduction band 15 of microstrip feed line 2 and the first metal flat 7 join, and the ground plane 16 of microstrip feed line 2 and the second metal flat 8 join.
The broken line that the shape of described metallization arrays of vias 11 consists of one or more curve, the common summit 17 of two adjacent curve negotiatings connects, and the shape of a curve of broken line can be straight line, camber line or other curve.
The width of dielectric-filled waveguide 14 will make electromagnetic wave can propagate therein and not be cut off.
The head end 12 of selection metallization arrays of vias 11 and summit 17, in the position of the integrated horn antenna of substrate 3 inside, equate the electromagnetic wave power of transmission in each dielectric-filled waveguide 14.
Each oscillator 4 has respectively the first radiation arm 18 and the second radiation arm 19 on the two sides that is positioned at medium substrate 1, the first radiation arm 18 of oscillator 4 is connected with the first metal flat 7 of the integrated horn antenna 3 of substrate, the second radiation arm 19 of oscillator 4 is connected with the second metal flat 8 of the integrated horn antenna 3 of substrate, and the first radiation arm 18 and second radiation arm 19 of each oscillator 4 stretch in the opposite direction.
In described metallization via hole loudspeaker sidewall 9 and metallization arrays of vias 11, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewall 9 and the metallization arrays of vias 11 that form can be equivalent to electric wall.
When design, in metallization arrays of vias 11, head end 12 and summit 17 relative position in the integrated horn antenna 3 of substrate is to determine that electromagnetic wave enters the principal element of the relative power size in each dielectric-filled waveguide 14.In adjusting metallization arrays of vias 11, head end 12 and summit 17 relative position in the integrated horn antenna 3 of substrate just can be the same so that enter the power of each dielectric-filled waveguide 14, because the width of each dielectric-filled waveguide 14 on antenna opening diametric plane 10 is the same, enter like this power of each oscillator 4 radiation too, thereby reached the object of constant amplitude radiation.
In technique, thin substrate amplitude correction surface of oscillator horn antenna both can adopt common printed circuit board (PCB) (PCB) technique, also can adopt the integrated circuit technologies such as LTCC (LTCC) technique or CMOS, Si substrate to realize.The via hole that wherein metallizes can be that hollow metal through hole can be also solid metal hole, can be also continuous metallization wall, and the shape of metal throuth hole can be circular, can be also square or other shapes.
Structurally, according to same principle, can increase or reduce the quantity of metallization arrays of vias 11, and then change quantity and the size of oscillator 4, as long as guarantee that dielectric-filled waveguide 15 can transmit main mould.
According to the above, just can realize the present invention.
Claims (7)
1. thin substrate amplitude correction surface of oscillator horn antenna, is characterized in that this antenna comprises microstrip feed line (2), the integrated horn antenna of substrate (3) and a plurality of oscillator (4) being arranged on medium substrate (1); First port (5) of described microstrip feed line (2) is the input/output port of this antenna, and second port (6) of microstrip feed line (2) joins with the integrated horn antenna of substrate (3); The integrated horn antenna of substrate (3) by be positioned at medium substrate (1) one side the first metal flat (7), be positioned at second metal flat (8) of medium substrate (1) another side and two rows that are connected the first metal flat (7) and the second metal flat (8) through medium substrate (1) the via hole loudspeaker sidewalls (9) that metallize and form, width between two row's metallization via hole loudspeaker sidewalls (9) of the integrated horn antenna of substrate (3) becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face (10) of the integrated horn antenna of substrate (3); In the integrated horn antenna of substrate (3), there is metallization arrays of vias (11) to connect the first metal flat (7) and the second metal flat (8), the head end (12) of metallization arrays of vias (11) is in the integrated horn antenna of substrate (3) inside, and the tail end (13) of metallization arrays of vias (11) is on the bore face (10) of the integrated horn antenna of substrate (3); Adjacent two metallization arrays of vias (11) or row's metallization via hole loudspeaker sidewalls (9) that the arrays of vias (11) that metallizes is adjacent, form dielectric-filled waveguide (14) with the first metal flat (7) and the second metal flat (8); Bore face (10) at the integrated horn antenna of substrate (3) is upper, and the width of each dielectric-filled waveguide (14) is equal, and outside bore face (10), each dielectric-filled waveguide (14) is connected to an oscillator (4).
2. thin substrate amplitude correction surface of oscillator horn antenna according to claim 1, the conduction band (15) that it is characterized in that microstrip feed line (2) joins with the first metal flat (7), and the ground plane (16) of microstrip feed line (2) joins with the second metal flat (8).
3. thin substrate amplitude correction surface of oscillator horn antenna according to claim 1, the broken line that the shape of the metallization arrays of vias (11) described in it is characterized in that consists of one or more curve, the common summit (17) of two adjacent curve negotiatings connects, and the shape of a curve of broken line can be straight line, camber line or other curve.
4. according to the thin substrate amplitude correction surface of oscillator horn antenna described in claim 1 or 3, it is characterized in that the width of dielectric-filled waveguide (14) will make electromagnetic wave can propagate therein and not be cut off.
5. according to the thin substrate amplitude correction surface of oscillator horn antenna described in claim 1 or 3 or 4, it is characterized in that selecting the head end (12) of metallization arrays of vias (11) and summit (17) in the inner position of the integrated horn antenna of substrate (3), make the electromagnetic wave power of transmission in each dielectric-filled waveguide (14) equal.
6. thin substrate amplitude correction surface of oscillator horn antenna according to claim 1, it is characterized in that each oscillator (4) has respectively the first radiation arm (18) and the second radiation arm (19) on the two sides that is positioned at medium substrate (1), first radiation arm (18) of oscillator (4) is connected with first metal flat (7) of the integrated horn antenna of substrate (3), second radiation arm (19) of oscillator (4) is connected with second metal flat (8) of the integrated horn antenna of substrate (3), the first radiation arm (18) and second radiation arm (19) of each oscillator (4) stretch in the opposite direction.
7. thin substrate amplitude correction surface of oscillator horn antenna according to claim 1, it is characterized in that in described metallization via hole loudspeaker sidewalls (9) and metallization arrays of vias (11), the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewalls (9) and the metallization arrays of vias (11) that form can be equivalent to electric wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617311.8A CN103594810B (en) | 2013-11-29 | 2013-11-29 | Thin substrate amplitude correction surface of oscillator horn antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617311.8A CN103594810B (en) | 2013-11-29 | 2013-11-29 | Thin substrate amplitude correction surface of oscillator horn antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103594810A true CN103594810A (en) | 2014-02-19 |
| CN103594810B CN103594810B (en) | 2016-03-23 |
Family
ID=50084852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310617311.8A Expired - Fee Related CN103594810B (en) | 2013-11-29 | 2013-11-29 | Thin substrate amplitude correction surface of oscillator horn antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103594810B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112952357A (en) * | 2021-01-22 | 2021-06-11 | 西安交通大学 | Plane combined pulse radiation antenna |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075702A (en) * | 2007-06-19 | 2007-11-21 | 东南大学 | Printing antenna with baseplate integrated waveguide feeder |
| US20090066597A1 (en) * | 2007-09-07 | 2009-03-12 | Songnan Yang | Substrate Integrated Waveguide Antenna Array |
| CN201229981Y (en) * | 2008-07-18 | 2009-04-29 | 东南大学 | Multiple mode beam forming network for millimeter wave frequency band |
| US20110018657A1 (en) * | 2008-03-18 | 2011-01-27 | Shi Cheng | Substrate Integrated Waveguide |
| CN102324627A (en) * | 2011-09-06 | 2012-01-18 | 电子科技大学 | Miniaturized Substrate Integrated Multi-beam Antenna |
| CN103022716A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Planar horn antenna for phase amplitude calibration |
-
2013
- 2013-11-29 CN CN201310617311.8A patent/CN103594810B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075702A (en) * | 2007-06-19 | 2007-11-21 | 东南大学 | Printing antenna with baseplate integrated waveguide feeder |
| US20090066597A1 (en) * | 2007-09-07 | 2009-03-12 | Songnan Yang | Substrate Integrated Waveguide Antenna Array |
| US20110018657A1 (en) * | 2008-03-18 | 2011-01-27 | Shi Cheng | Substrate Integrated Waveguide |
| CN201229981Y (en) * | 2008-07-18 | 2009-04-29 | 东南大学 | Multiple mode beam forming network for millimeter wave frequency band |
| CN102324627A (en) * | 2011-09-06 | 2012-01-18 | 电子科技大学 | Miniaturized Substrate Integrated Multi-beam Antenna |
| CN103022716A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Planar horn antenna for phase amplitude calibration |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112952357A (en) * | 2021-01-22 | 2021-06-11 | 西安交通大学 | Plane combined pulse radiation antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103594810B (en) | 2016-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103594807B (en) | Thin substrate amplitude correction broadband difference-beam planar horn antenna | |
| CN103594806B (en) | Thin substrate amplitude correction slot-line planar horn antenna | |
| CN103594816B (en) | Thin substrate phasing slot-line planar horn antenna | |
| CN103594812A (en) | Thin-substrate broadband difference-beam planar horn antenna | |
| CN103594819B (en) | Thin substrate phase amplitude corrects broadband planar horn antenna | |
| CN103594804A (en) | Thin-substrate slot-line planar horn antenna | |
| CN103606752B (en) | Thin substrate phasing broadband difference-beam planar horn antenna | |
| CN103606754B (en) | Thin substrate phase amplitude corrects accurate Yagi spark gap difference beam planar horn antenna | |
| CN103606732B (en) | Thin substrate phase amplitude corrects surface of oscillator horn antenna | |
| CN103606750B (en) | The accurate Yagi spark gap planar horn antenna of thin substrate phasing | |
| CN103594810A (en) | Thin-substrate amplitude correction oscillator planar horn antenna | |
| CN103594813B (en) | thin substrate amplitude correction quasi-Yagi planar horn antenna | |
| CN103594809B (en) | Thin substrate amplitude correction broadband planar horn antenna | |
| CN103606747A (en) | Thin-substrate phase amplitude correction slot line difference beam planar horn antenna | |
| CN103594805B (en) | Thin substrate amplitude correction slot-line difference-beam planar horn antenna | |
| CN103594814A (en) | Thin-substrate phase correction oscillator planar horn antenna | |
| CN103606753B (en) | Thin substrate phase amplitude corrects oscillator difference-beam planar horn antenna | |
| CN103618146B (en) | Thin substrate phasing broadband planar horn antenna | |
| CN103022666A (en) | Planar horn antenna for phase amplitude impedance calibration | |
| CN103594811B (en) | Thin substrate amplitude correction oscillator difference-beam planar horn antenna | |
| CN103618147A (en) | Thin-substrate phase amplitude correction slot line plane horn antenna | |
| CN103618142B (en) | thin substrate amplitude correction quasi-Yagi difference beam planar horn antenna | |
| CN103594822B (en) | Thin substrate phase amplitude corrects accurate Yagi spark gap planar horn antenna | |
| CN103594818B (en) | Thin substrate phasing slot-line difference-beam planar horn antenna | |
| CN103618144B (en) | Thin substrate phasing oscillator difference-beam planar horn antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160323 Termination date: 20181129 |