CN103618143B - Thin substrate oscillator difference beam plane horn antenna - Google Patents
Thin substrate oscillator difference beam plane horn antenna Download PDFInfo
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- CN103618143B CN103618143B CN201310619347.XA CN201310619347A CN103618143B CN 103618143 B CN103618143 B CN 103618143B CN 201310619347 A CN201310619347 A CN 201310619347A CN 103618143 B CN103618143 B CN 103618143B
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Abstract
Thin substrate oscillator difference beam plane horn antenna relates to a kind of electromagnetic horn. this antenna is included in the microstrip feed line (2) on medium substrate (1), electromagnetic horn (3) and oscillator (4), electromagnetic horn (3) is by the first metal flat (7), the second metal flat (8) and two row's metallization via hole loudspeaker sidewalls (9) compositions, in electromagnetic horn (3), there are odd number metallization arrays of vias (11) and even number dielectric-filled waveguide (17), be connected to an oscillator (4) at the upper each dielectric-filled waveguide (17) of electromagnetic horn (3) bore face (10), left half antenna (15) and institute's oscillator that connects (4) and right half antenna (16) and the institute's oscillator that connects (4) symmetry. radiation field of aerial polarised direction is parallel with substrate, and this antenna can use thin Substrate manufacture and gain that high, large zero is dark, cost is low and compact conformation.
Description
Technical field
The present invention relates to a kind of electromagnetic horn, especially a kind of thin substrate oscillator difference beam plane horn antenna.
Background technology
Electromagnetic horn has a wide range of applications in the systems such as satellite communication, terrestrial microwave link and radio telescope. But the huge physical dimension of three-dimensional electromagnetic horn has restricted its application and development in planar circuit. In recent years, the proposition of substrate integrated waveguide technology and development have well promoted the development of plane horn antenna. Substrate integration wave-guide have size little, lightweight, be easy to the advantages such as integrated and processing and fabricating. The substrate integration wave-guide plane horn antenna of the plane based on substrate integration wave-guide, except having the feature of electromagnetic horn, has also well been realized miniaturization, the lightness of electromagnetic horn, and has been easy to be integrated in microwave and millimeter wave planar circuit. Traditional substrate integration wave-guide plane horn antenna have a restriction, the thickness of antenna horn aperture substrate is greater than 1/10th operation wavelengths, antenna just can have good radiance, not so due to reflection, the energy emission in antenna is not gone out. So just require the thickness of antenna substrate can not be too thin, will meet this requirement very difficult especially, very thick substrate not only volume and weight be very large at L-band etc. compared with low-frequency range, has offset integrated advantage, but also has increased cost. The polarised direction of these antenna radiation field is generally all perpendicular to medium substrate in addition, and some application needs the polarization of radiation field to be parallel to medium substrate. More existing antennas load paster before plane horn antenna improves the radiation of thin substrate plane electromagnetic horn, but the patch size loading is larger, and working band is narrower. Conventionally in order to realize difference beam, need to adopt special feeder equipment, these feeder equipments or difficult realization in planar circuit, or the phase-shift circuit of arrowband.
Summary of the invention
Technical problem:The object of the invention is to propose a kind of thin substrate oscillator difference beam plane horn antenna, the polarised direction of this radiation field of aerial is parallel with medium substrate, can use very thin medium substrate manufacture, in the case of the electric very thin thickness of substrate, still there is good radiance, increase the zero dark and improve the slope of antenna difference beam of antenna difference beam.
Technical scheme:Thin substrate oscillator difference beam plane horn antenna of the present invention, is characterized in that this antenna comprises the integrated electromagnetic horn of microstrip feed line, substrate and the multiple oscillator being arranged on medium substrate; The first port of described microstrip feed line is the input/output port of this antenna, and the second port of microstrip feed line and the integrated electromagnetic horn of substrate join; The integrated electromagnetic horn of substrate by be positioned at medium substrate one side the first metal flat, be positioned at the second metal flat of medium substrate another side and form with the two row's metallization via hole loudspeaker sidewalls that are connected the first metal flat and the second metal flat through medium substrate, width between two row's metallization via hole loudspeaker sidewalls of the integrated electromagnetic horn of substrate becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face of the integrated electromagnetic horn of substrate; In the integrated electromagnetic horn of substrate, there is odd number metallization arrays of vias to connect the first metal flat and the second metal flat, the length of each metallization arrays of vias is the same, the head end of metallization arrays of vias is in the integrated electromagnetic horn of substrate inside, and the tail end of metallization arrays of vias is on the bore face of the integrated electromagnetic horn of substrate; In metallization arrays of vias, there is an intermediate metallization arrays of vias that integrated substrate electromagnetic horn is divided into a symmetrical left side half antenna and right half antenna two parts; Adjacent two metallization arrays of vias or row's metallization via hole loudspeaker sidewall that metallization arrays of vias is adjacent, form dielectric-filled waveguide with the first metal flat and the second metal flat, outside bore face, each dielectric-filled waveguide is connected to an oscillator.
The conduction band of microstrip feed line and the first metal flat join, and the ground plane of microstrip feed line and the second metal flat join.
The width of dielectric-filled waveguide will make electromagnetic wave can propagate therein and not be cut off, more than the length of dielectric-filled waveguide has half waveguide wavelength.
Each oscillator has respectively the first radiation arm and the second radiation arm on the two sides that is positioned at medium substrate, the first radiation arm of oscillator is connected with the first metal flat of the integrated electromagnetic horn of substrate, the second radiation arm of oscillator is connected with the second metal flat of the integrated electromagnetic horn of substrate, and the first radiation arm and second radiation arm of each oscillator stretch in the opposite direction.
The direction of extension of the first radiation arm of all oscillators that left half antenna connects is all identical, and the direction of extension of the second radiation arm of all oscillators that left half antenna connects is all identical; The direction of extension of the first radiation arm of all oscillators that right half antenna connects is all identical, and the direction of extension of the second radiation arm of all oscillators that right half antenna connects is all identical; The direction of extension of the second radiation arm of the oscillator that the direction of extension of the first radiation arm of the oscillator that left half antenna connects connects with right half antenna is identical, and the direction of extension of the first radiation arm of the oscillator that the direction of extension of the second radiation arm of the oscillator that left half antenna connects connects with right half antenna is identical.
In metallization via hole loudspeaker sidewall and metallization arrays of vias, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewall and the metallization arrays of vias that form can be equivalent to electric wall.
Electromagnetic wave is from one end input of microstrip feed line, the other end through microstrip feed line enters substrate integration wave-guide electromagnetic horn, propagate after a segment distance, run into metallization arrays of vias, just enter respectively each dielectric-filled waveguide transmission, the electromagnetic wave that enters each Medium Wave Guide enters oscillator radiation by antenna opening diametric plane, the polarised direction of radiation field also becomes with substrate and connects subparallel horizontal direction, because the radiation arm of left half antenna oscillator and the radiation arm of right half antenna oscillator are symmetrical, therefore the polarised direction of left half antenna oscillator radiation field is contrary with the polarised direction of right half antenna oscillator radiation field, so just form difference beam in the direction of parallel medium substrate.
Owing to there being multiple metallization arrays of vias that the bore face of antenna is divided into a lot of little bore faces, it is very little that the size of the oscillator connecing on each osculum diametric plane can be done, and the compact conformation of antenna, size also only increase seldom like this.
Antenna, from feed microstrip line to oscillator, is all the substrate integrated wave guide structure of sealing, and therefore feeder loss is less.
Beneficial effect:The beneficial effect of the thin substrate oscillator of the present invention difference beam plane horn antenna is that the polarised direction of this radiation field of aerial is parallel with medium substrate; This antenna can use the medium substrate manufacture lower than the thickness of 2 percent wavelength, far below the substrate thickness of desired 1/10th wavelength of common plane horn antenna, in the case of the electric very thin thickness of substrate, still there is good radiance, for example, in 6GHz frequency, adopt the thickness of epoxide resin material substrate to be reduced to 0.5mm by 2.5mm, thereby greatly reduce size, weight and cost; Antenna can increase the zero dark and improve the slope of antenna difference beam of difference beam, and compact conformation, the feeder loss of antenna are little.
Brief description of the drawings
Below in conjunction with accompanying drawing, the present invention is further described.
Fig. 1 is the structural representation of the thin substrate oscillator of the present invention difference beam plane horn antenna.
In figure, have: medium substrate 1, microstrip feed line 2, the integrated electromagnetic horn 3 of substrate, layered transducer elements 4, the first port 5 of microstrip feed line 2, the second port 6 of microstrip feed line 2, the first metal flat 7 of medium substrate 1, the second metal flat 8 of medium substrate 1, metallization via hole loudspeaker sidewall 9, the bore face 10 of antenna 3, metallization arrays of vias 11, the head end 12 of metallization arrays of vias 11, the tail end 13 of metallization arrays of vias 11, intermediate metallization arrays of vias 14, left half antenna 15, right half antenna 16, dielectric-filled waveguide 17, the conduction band 18 of microstrip feed line 2, the ground plane 19 of microstrip feed line 2, the first radiation arm 20 of oscillator 4 and the second radiation arm 21 of oscillator 4.
Detailed description of the invention
Embodiment of the present invention is: thin substrate oscillator difference beam plane horn antenna comprises the integrated electromagnetic horn 3 of the microstrip feed line 2, the substrate that are arranged on medium substrate 1 and multiple oscillator 4; The first port 5 of described microstrip feed line 2 is input/output ports of this antenna, and the second port 6 of microstrip feed line 2 joins with the integrated electromagnetic horn 3 of substrate; The integrated electromagnetic horn 3 of substrate by be positioned at medium substrate 1 one side the first metal flat 7, be positioned at the second metal flat 8 of medium substrate 1 another side and form with the two row's metallization via hole loudspeaker sidewalls 9 that are connected the first metal flat 7 and the second metal flat 8 through medium substrate 1, width between two row's metallization via hole loudspeaker sidewalls 9 of the integrated electromagnetic horn 3 of substrate becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face 10 of the integrated electromagnetic horn 3 of substrate; In the integrated electromagnetic horn 3 of substrate, there is odd number metallization arrays of vias 11 to connect the first metal flat 7 and the second metal flat 8, the length of each metallization arrays of vias 11 is the same, the head end 12 of metallization arrays of vias 11 is in the integrated electromagnetic horn of substrate 3 inside, and the tail end 13 of metallization arrays of vias 11 is on the bore face 10 of the integrated electromagnetic horn 3 of substrate; In metallization arrays of vias 11, there is an intermediate metallization arrays of vias 14 that integrated substrate electromagnetic horn 3 is divided into a symmetrical left side half antenna 15 and right half antenna 16 two parts; Adjacent two metallization arrays of vias 11 or row's metallization via hole loudspeaker sidewall 9 that metallization arrays of vias 11 is adjacent, form dielectric-filled waveguide 17 with the first metal flat 7 and the second metal flat 8, be connected to an oscillator 4 at the outer each dielectric-filled waveguide 17 of bore face 10.
The conduction band 18 of microstrip feed line 2 and the first metal flat 7 join, and the ground plane 19 of microstrip feed line 2 and the second metal flat 8 join.
The width of dielectric-filled waveguide 17 will make electromagnetic wave can propagate therein and not be cut off, more than the length of dielectric-filled waveguide 17 has half waveguide wavelength.
Each oscillator 4 has respectively the first radiation arm 20 and the second radiation arm 21 on the two sides that is positioned at medium substrate 1, the first radiation arm 20 of oscillator 4 is connected with the first metal flat 7 of the integrated electromagnetic horn 3 of substrate, the second radiation arm 21 of oscillator 4 is connected with the second metal flat 8 of the integrated electromagnetic horn 3 of substrate, and the first radiation arm 20 and second radiation arm 21 of each oscillator 4 stretch in the opposite direction.
The direction of extension of the first radiation arm 20 of all oscillators 4 that left half antenna 15 connects is all identical, and the direction of extension of the second radiation arm 21 of all oscillators 4 that left half antenna 15 connects is all identical; The direction of extension of the first radiation arm 20 of all oscillators 4 that right half antenna 16 connects is all identical, and the direction of extension of the second radiation arm 21 of all oscillators 4 that right half antenna 16 connects is all identical; The direction of extension of the second radiation arm 21 of the oscillator 4 that the direction of extension of the first radiation arm 20 of the oscillator 4 that left half antenna 15 connects connects with right half antenna 16 is identical, and the direction of extension of the first radiation arm 20 of the oscillator 4 that the direction of extension of the second radiation arm 21 of the oscillator 4 that left half antenna 15 connects connects with right half antenna 16 is identical.
In metallization via hole loudspeaker sidewall 9 and metallization arrays of vias 11, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewall 9 and the metallization arrays of vias 11 that form can be equivalent to electric wall.
In the time of design, the length of metallization arrays of vias 11 generally will make the length of dielectric-filled waveguide 17 have half waveguide wavelength just can make above antenna have larger gain.
In technique, thin substrate oscillator difference beam plane horn antenna both can adopt common printed circuit board (PCB) (PCB) technique, also can adopt the integrated circuit technologies such as LTCC (LTCC) technique or CMOS, Si substrate to realize. The via hole that wherein metallizes can be that hollow metal through hole can be also solid metal hole, can be also continuous metallization wall, and the shape of metal throuth hole can be circular, can be also square or other shapes.
Structurally, according to same principle, can increase or reduce the quantity of metallization arrays of vias 11, and then change quantity and the size of oscillator 4, as long as ensure that dielectric-filled waveguide 17 can transmit main mould.
According to the above, just can realize the present invention.
Claims (4)
1. thin substrate oscillator difference beam plane horn antenna, is characterized in that this antenna comprises microstrip feed line (2), the integrated electromagnetic horn of substrate (3) and the multiple oscillator (4) being arranged on medium substrate (1); First port (5) of described microstrip feed line (2) is the input/output port of this antenna, and second port (6) of microstrip feed line (2) joins with the integrated electromagnetic horn of substrate (3); The integrated electromagnetic horn of substrate (3) by be positioned at medium substrate (1) one side the first metal flat (7), be positioned at second metal flat (8) of medium substrate (1) another side with is connected the first metal flat (7) and the second metal flat (8) through medium substrate (1) two arrange the via hole loudspeaker sidewalls (9) that metallize and form, width between two row's metallization via hole loudspeaker sidewalls (9) of the integrated electromagnetic horn of substrate (3) becomes large gradually, form tubaeform dehiscing, the end of dehiscing is the bore face (10) of the integrated electromagnetic horn of substrate (3); In the integrated electromagnetic horn of substrate (3), there is odd number metallization arrays of vias (11) to connect the first metal flat (7) and the second metal flat (8), the length of each metallization arrays of vias (11) is the same, the head end (12) of metallization arrays of vias (11) is in the integrated electromagnetic horn of substrate (3) inside, and the tail end (13) of metallization arrays of vias (11) is on the bore face (10) of the integrated electromagnetic horn of substrate (3); In metallization arrays of vias (11), there is an intermediate metallization arrays of vias (14) that integrated substrate electromagnetic horn (3) is divided into a symmetrical left side half antenna (15) and right half antenna (16) two parts; Row's metallization via hole loudspeaker sidewalls (9) that adjacent two metallization arrays of vias (11) or a metallization arrays of vias (11) are adjacent, form dielectric-filled waveguide (17) with the first metal flat (7) and the second metal flat (8), outside bore face (10), each dielectric-filled waveguide (17) is connected to an oscillator (4);
The thickness of medium substrate (1) is lower than 2 percent wavelength;
Each oscillator (4) has respectively the first radiation arm (20) and the second radiation arm (21) on the two sides that is positioned at medium substrate (1), first radiation arm (20) of oscillator (4) is connected with first metal flat (7) of the integrated electromagnetic horn of substrate (3), second radiation arm (21) of oscillator (4) is connected with second metal flat (8) of the integrated electromagnetic horn of substrate (3), and the first radiation arm (20) and second radiation arm (21) of each oscillator (4) stretch in the opposite direction;
The direction of extension of first radiation arm (20) of all oscillators (4) that left half antenna (15) connects is all identical, and the direction of extension of second radiation arm (21) of all oscillators (4) that left half antenna (15) connects is all identical; The direction of extension of first radiation arm (20) of all oscillators (4) that right half antenna (16) connects is all identical, and the direction of extension of second radiation arm (21) of all oscillators (4) that right half antenna (16) connects is all identical; The direction of extension of second radiation arm (21) of the oscillator (4) that the direction of extension of first radiation arm (20) of the oscillator (4) that left half antenna (15) connects connects with right half antenna (16) is identical, and the direction of extension of first radiation arm (20) of the oscillator (4) that the direction of extension of second radiation arm (21) of the oscillator (4) that left half antenna (15) connects connects with right half antenna (16) is identical.
2. thin substrate oscillator difference beam plane horn antenna according to claim 1, the conduction band (18) that it is characterized in that microstrip feed line (2) joins with the first metal flat (7), and the ground plane (19) of microstrip feed line (2) joins with the second metal flat (8).
3. thin substrate oscillator difference beam plane horn antenna according to claim 1, the width that it is characterized in that dielectric-filled waveguide (17) will make electromagnetic wave can propagate therein and not be cut off, more than the length of dielectric-filled waveguide (17) has half waveguide wavelength.
4. thin substrate oscillator difference beam plane horn antenna according to claim 1, it is characterized in that in described metallization via hole loudspeaker sidewalls (9) and metallization arrays of vias (11), the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole loudspeaker sidewalls (9) and the metallization arrays of vias (11) that form can be equivalent to electric wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310619347.XA CN103618143B (en) | 2013-11-29 | 2013-11-29 | Thin substrate oscillator difference beam plane horn antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310619347.XA CN103618143B (en) | 2013-11-29 | 2013-11-29 | Thin substrate oscillator difference beam plane horn antenna |
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| CN103618143A CN103618143A (en) | 2014-03-05 |
| CN103618143B true CN103618143B (en) | 2016-05-11 |
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| CN201310619347.XA Expired - Fee Related CN103618143B (en) | 2013-11-29 | 2013-11-29 | Thin substrate oscillator difference beam plane horn antenna |
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| CN111755810A (en) * | 2019-03-27 | 2020-10-09 | 北京小米移动软件有限公司 | Antenna module, terminal and manufacturing method of antenna module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075702A (en) * | 2007-06-19 | 2007-11-21 | 东南大学 | Printing antenna with baseplate integrated waveguide feeder |
| CN103022708A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Phase-calibrated SIW (substrate integrated waveguide) antenna with embedded plated through holes |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7808439B2 (en) * | 2007-09-07 | 2010-10-05 | University Of Tennessee Reserch Foundation | Substrate integrated waveguide antenna array |
| US20130300602A1 (en) * | 2012-05-08 | 2013-11-14 | Samsung Electronics Co., Ltd. | Antenna arrays with configurable polarizations and devices including such antenna arrays |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075702A (en) * | 2007-06-19 | 2007-11-21 | 东南大学 | Printing antenna with baseplate integrated waveguide feeder |
| CN103022708A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Phase-calibrated SIW (substrate integrated waveguide) antenna with embedded plated through holes |
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Inventor after: Yin Xiaoxing Inventor after: Hu Jiaming Inventor after: Zhao Hongxin Inventor after: Ni Rui Inventor before: Yin Xiaoxing Inventor before: Zhao Hongxin Inventor before: Ni Rui |
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Granted publication date: 20160511 Termination date: 20181129 |