CN103579459A - LED packaging method - Google Patents
LED packaging method Download PDFInfo
- Publication number
- CN103579459A CN103579459A CN201310551604.0A CN201310551604A CN103579459A CN 103579459 A CN103579459 A CN 103579459A CN 201310551604 A CN201310551604 A CN 201310551604A CN 103579459 A CN103579459 A CN 103579459A
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- led
- led chip
- colloid
- transparency carrier
- wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Abstract
The invention relates to an LED packaging method. The LED packaging method comprises the following steps that (1) a transparent substrate and a heat-conducting light-reflecting gasket are manufactured, and a light-reflecting cup is arranged on the transparent substrate; (2) the heat-conducting light-reflecting gasket is arranged at the bottom of the light-reflecting cup of the transparent substrate, and an LED chip is arranged on the heat-conducting light-reflecting gasket; (3) one end of a wire is welded to the LED chip, and the other end of the wire is welded to the bottom of the light-reflecting cup so that the LED chip and the transparent substrate can be in conduction; (4) powder slurry is formed by fluorescent powder and colloid, after stir is carried out, the powder slurry directly coats the LED chip, the transparent substrate is placed into a centrifuge, and the fluorescent powder sinks to the bottom of the colloid through powerful centrifugal force generated through high-speed rotation of a rotor of the centrifuge; (5) an infrared irradiator directly irradiates the LED chip so that the colloid can be solidified. According to the LED packaging method, consistency between the color temperature and the emitting color is ensured, and the time consumed in the process of LED packaging and solidification can be effectively and greatly reduced.
Description
Technical field
The present invention relates to relate to a kind of method for packing semiconductor, be specifically related to a kind of LED method for packing.
Background technology
LED (Light Emitting Diode), light-emitting diode, is a kind of solid-state semiconductor device, it can directly be converted into light electricity, has that volume is little, power consumption is low, long service life, high brightness, environmental protection, a feature such as sturdy and durable.There is many defects in LED method for packing of the prior art, such as fluorescent material skewness in powder slurry, and then cause there will be color aberration when practical application is on light fixture, macula lutea, the phenomenon such as light type is inconsistent; Simultaneously, in package curing step, adopt the mode of heating, consumes energy not only, and heat conduction velocity is also comparatively slow, and need extremely many time of cost can allow this cured layer complete, solidify action, related causing makes the whole manufacturing process time of LED extremely long, allows relatively equally the cost of manufacture of this LED effectively reduce.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of raising fluorescent material uniformity, quick-setting LED method for packing.
1. the technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of LED method for packing, comprise the following steps,
Step 1: make transparency carrier, the reflective pad of heat conduction, described transparency carrier is provided with reflector;
Step 2: the reflective pad of heat conduction is arranged to the reflector bottom of transparency carrier, LED chip is arranged on the reflective pad of heat conduction;
Step 3: one end of wire is welded on LED chip, the other end of wire is welded on the bottom of reflector, thereby LED chip and transparency carrier are conducted;
Step 4: fluorescent material and colloid are made to powder slurry, directly powder slurry is coated on LED chip, and transparency carrier is put into centrifuge after stirring, the powerful centrifugal force that utilizes centrifuge rotor High Rotation Speed to produce, makes fluorescent material be sunken to the bottom of colloid;
Step 5: with infra-red radiator direct irradiation LED chip, thereby solidify colloid.
The invention has the beneficial effects as follows: by adopting centrifuge to make fluorescent material be sunken to the bottom of colloid, can make fluorescent material be sunken to the bottom of colloid and be covered on LED chip, thereby improved fluorescent material uniformity, guaranteed the consistency of colour temperature and glow color; With infra-red radiator direct irradiation, make the infrared heat energy that infra-red radiator sends can directly with radiation mode, import the cured layer inside of LED, the Infrared wavelength that the molecule of this cured layer can send with infra-red radiator produces resonance, accelerate the curing rate of this cured layer, spent time when can effectively significantly reduce LED package curing, relatively can shorten integral LED manufacturing process time, related reduction LED cost of manufacture.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described colloid is epoxy resin.
Further, the Infrared wavelength that described infra-red radiator sends is at 0.8～4um.
Adopt the beneficial effect of above-mentioned further scheme to be: Infrared wavelength, within the scope of 0.8～4um, makes solidification rate maximum, more easily solidifies.
Further, described wire is gold thread.
Adopt the beneficial effect of above-mentioned further scheme to be: to adopt gold thread as wire, can reduce the power consumption loss of resistance in conducting wire, improve the luminous efficiency of LED.
Accompanying drawing explanation
Fig. 1 is the flow chart of a kind of LED method for packing of the present invention.
Embodiment
Below in conjunction with accompanying drawing, principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
As shown in Figure 1, a kind of LED method for packing, first ready work, make transparency carrier, the reflective pad of heat conduction, and described transparency carrier is provided with reflector, then LED chip is placed on described base plate for packaging, base plate for packaging is comprised of transparency carrier and heat-conducting pad, the reflective pad of heat conduction is arranged to the reflector bottom of transparency carrier, and LED chip is arranged on the reflective pad of heat conduction, then, be communicated with LED chip and transparency carrier, one end of wire is welded on LED chip, the other end of wire is welded on the bottom of reflector, thereby LED chip and transparency carrier are conducted, and described wire is gold thread, adopt gold thread as wire, can reduce the power consumption loss of resistance in conducting wire, improve the luminous efficiency of LED, again, on LED chip, apply the colloid with fluorescent material, fluorescent material and colloid are made to powder slurry, after stirring, directly powder slurry is coated on LED chip, and transparency carrier is put into centrifuge, the powerful centrifugal force that utilizes centrifuge rotor High Rotation Speed to produce, make fluorescent material be sunken to the bottom of colloid, adopt centrifuge to make fluorescent material be sunken to the bottom of colloid, can make fluorescent material be sunken to the bottom of colloid and be covered on LED chip, thus improved fluorescent material uniformity, guaranteed the consistency of colour temperature and glow color, finally, solidify, with infra-red radiator direct irradiation LED chip, thereby solidify colloid, the Infrared wavelength that described infra-red radiator sends is at 0.8～4um, described colloid is epoxy resin, with infra-red radiator direct irradiation, make the infrared heat energy that infra-red radiator sends can directly with radiation mode, import the cured layer inside of LED, the Infrared wavelength that the molecule of this cured layer can send with infra-red radiator produces resonance, accelerate the curing rate of this cured layer, spent time when can effectively significantly reduce LED package curing, relatively can shorten integral LED manufacturing process time, related reduction LED cost of manufacture.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (4)
1. a LED method for packing, is characterized in that: comprises the following steps,
Step 1: make transparency carrier, the reflective pad of heat conduction, described transparency carrier is provided with reflector;
Step 2: the reflective pad of heat conduction is arranged to the reflector bottom of transparency carrier, LED chip is arranged on the reflective pad of heat conduction;
Step 3: one end of wire is welded on LED chip, the other end of wire is welded on the bottom of reflector, thereby LED chip and transparency carrier are conducted;
Step 4: fluorescent material and colloid are made to powder slurry, directly powder slurry is coated on LED chip, and transparency carrier is put into centrifuge after stirring, the powerful centrifugal force that utilizes centrifuge rotor High Rotation Speed to produce, makes fluorescent material be sunken to the bottom of colloid;
Step 5: with infra-red radiator direct irradiation LED chip, thereby solidify colloid.
2. a kind of LED method for packing according to claim 1, is characterized in that: described colloid is epoxy resin.
3. a kind of LED method for packing according to claim 1 and 2, is characterized in that: the Infrared wavelength that described infra-red radiator sends is at 0.8～4um.
4. a kind of LED method for packing according to claim 1 and 2, is characterized in that: described wire is gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310551604.0A CN103579459A (en) | 2013-11-08 | 2013-11-08 | LED packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310551604.0A CN103579459A (en) | 2013-11-08 | 2013-11-08 | LED packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103579459A true CN103579459A (en) | 2014-02-12 |
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ID=50050806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310551604.0A Pending CN103579459A (en) | 2013-11-08 | 2013-11-08 | LED packaging method |
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| CN (1) | CN103579459A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447960A (en) * | 2018-02-09 | 2018-08-24 | 永林电子有限公司 | A kind of the centrifugation production method and its LED lamp bead of LED lamp bead |
| US10600664B2 (en) * | 2017-05-03 | 2020-03-24 | Applied Materials, Inc. | Fluorescence based thermometry for packaging applications |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050233485A1 (en) * | 2003-03-20 | 2005-10-20 | Alexander Shishov | Light emitting diode package with self dosing feature and methods of forming same |
| CN102569562A (en) * | 2012-01-20 | 2012-07-11 | 江苏索尔光电科技有限公司 | LED (Light-Emitting Diode) packaging method |
| CN102623622A (en) * | 2011-01-27 | 2012-08-01 | 宸锐实业有限公司 | LED packaging and solidifying method |
| CN103000788A (en) * | 2012-11-30 | 2013-03-27 | 深圳市璨阳光电有限公司 | LED packaging structure and method |
-
2013
- 2013-11-08 CN CN201310551604.0A patent/CN103579459A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050233485A1 (en) * | 2003-03-20 | 2005-10-20 | Alexander Shishov | Light emitting diode package with self dosing feature and methods of forming same |
| CN102623622A (en) * | 2011-01-27 | 2012-08-01 | 宸锐实业有限公司 | LED packaging and solidifying method |
| CN102569562A (en) * | 2012-01-20 | 2012-07-11 | 江苏索尔光电科技有限公司 | LED (Light-Emitting Diode) packaging method |
| CN103000788A (en) * | 2012-11-30 | 2013-03-27 | 深圳市璨阳光电有限公司 | LED packaging structure and method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10600664B2 (en) * | 2017-05-03 | 2020-03-24 | Applied Materials, Inc. | Fluorescence based thermometry for packaging applications |
| US10971383B2 (en) | 2017-05-03 | 2021-04-06 | Applied Materials, Inc. | Fluorescence based thermometry for packaging applications |
| CN108447960A (en) * | 2018-02-09 | 2018-08-24 | 永林电子有限公司 | A kind of the centrifugation production method and its LED lamp bead of LED lamp bead |
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Application publication date: 20140212 |