CN103576463B - Workbench of lithography machine and method of work thereof - Google Patents
Workbench of lithography machine and method of work thereof Download PDFInfo
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- CN103576463B CN103576463B CN201210254039.7A CN201210254039A CN103576463B CN 103576463 B CN103576463 B CN 103576463B CN 201210254039 A CN201210254039 A CN 201210254039A CN 103576463 B CN103576463 B CN 103576463B
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Abstract
The invention provides a kind of workbench of lithography machine, work stage is driven by wireless signal control plane electric mover, realize wireless stage control and motion, thus replace the Workpiece platform structure of traditional cable framework to design, decrease the interference of cable disturbance to high-accuracy work stage six-freedom motion, improve complete machine kinematic accuracy, reduce control difficulty, improve stability; Workbench of lithography machine provided by the invention can also pass through cooling device, utilize double-workpiece-table at exposure position longevity of service, and measuring position working time short characteristic, by the in return widow time (wait bit time) of the difference between both, during this period of time work stage is moved to and wait for position and it is cooled, making its constant temperature, when not affecting this workbench of lithography machine work efficiency, ensure that the temperature stability of each working cycle of work stage.
Description
Technical field
The present invention relates to semiconductor lithography process, particularly relate to a kind of workbench of lithography machine and method of work thereof.
Background technology
In semicon industry lithographic equipment, work stage precise motion device is epochmaking crucial subsystem, and its positioning precision directly affects the performance of lithographic equipment, and its travelling speed directly affects the production efficiency of lithographic equipment.Along with improving constantly of VLSI (very large scale integrated circuit) device integration, the continuous enhancing of photoetching resolution, to the characteristic line breadth index request of litho machine also in continuous lifting, the travelling speed of corresponding work stage, acceleration and accuracy requirement also improve constantly.
The typical version of workbench of lithography machine system is the structure that thick, fine motion combines, due to planar motor, to have force density high, the features such as high speed, high reliability, and be easy to be integrated in controlled device, there is fast response time, control the advantages such as highly sensitive, physical construction is simple, be applied in semiconductor lithography equipment at present, realized the Long travel coarse motion of work stage.But realize the work stage of Long travel coarse motion without X, Y-direction guide rail owing to adopting planar motor, and for the work stage supporting various communications cables, power cable and the pipeline facility such as tracheae, water pipe to need to follow work stage at XY move in plane, therefore need to arrange cable support guide piece.Common work stage cable facility be passive work stage of following at XY move in plane, when work stage carries out high-speed motion and nanoscale is accurately located, the pipeline facility of dragging will be can not ignore the disturbance that work stage produces.
With the development of work stage coarse motion platform Driving technique levitation planar motor, the technical scheme of its planar motor is made the transition by " moving winding " to " moving magnet ", really to realize the 6DOF motion of micropositioner " freely ", " without caring for ", wherein for the controlled in wireless scheme existing application in the prior art of coarse motion platform (planar motor), and the high precision of micropositioner (work stage), little stroke are not yet realized without cable scheme.
Be in the patent of US2011/0194085A1 in the patent No. disclosed in 11 days Augusts in 2011, propose a kind of supply water and water descharging type cooling motor for the scheme in litho machine field, but in short cycle circulation, both exchanged without extraneous heat eliminating medium, under its own system does not possess the prerequisite of refrigerating capacity again, the problem how solving temperature rise is not solved in that patent, and does not also take in the process problem of the remaining water droplet of interface.
Summary of the invention
The object of this invention is to provide a kind of workbench of lithography machine and method of work thereof, to realize control without cable work stage and motion, and ensure that work stage long-term temperature is stablized by cooling device.
For reaching above-mentioned technique effect, the invention provides a kind of workbench of lithography machine, described workbench of lithography machine comprises planar motor, work stage, cooling device and control system, described work stage is arranged on described planar motor, described control system and described planar motor, worktable is connected by wireless signal with cooling device, described planar motor can drive described work stage to do Long travel motion, described work stage can do six-freedom motion on described planar motor, it is inner that described cooling device is arranged at described work stage, described cooling device is used for providing cooling medium to ensure the stability of its temperature to work stage.
Further, described planar motor comprises coarse motion planar motor stator, coarse motion planar motor rotor and the first wireless signal receiver, described coarse motion planar motor rotor is installed on the bottom of described work stage, described coarse motion planar motor rotor is arranged at described first wireless signal receiver on described coarse motion plane electronics stator and is arranged on described coarse motion planar motor stator, and described control system controls described coarse motion planar motor rotor by described first wireless signal receiver and drives described work stage to do six-freedom motion on coarse motion planar motor stator.
Further, described work stage comprises wafer-supporting platform, brace table, water inlet, freeing port, Fang Jing and the second wireless signal receiver, described brace table is arranged on described planar motor stator by planar motor rotor, described wafer-supporting platform is arranged on described brace table, described water inlet is arranged at the side of described brace table, described freeing port is arranged at the opposite side of described brace table, described Fang Jing is arranged at the relative both sides of described wafer-supporting platform, described second wireless signal receiver is arranged on described wafer-supporting platform, described control system carries out the cooling temperature control work of this work stage by the cooling device that described second wireless signal receiver controls in described work stage.
Further, described cooling device comprises micro pump, internal temperature sensor, the first solenoid valve and the second solenoid valve, described micro pump and internal temperature sensor serial connection form loop, this loop is arranged at the inside of described work stage, described first solenoid valve is all connected with described loop with the second solenoid valve, described water inlet is connected with described first solenoid valve, and described freeing port is connected with described second solenoid valve.
Further, describedly also comprise charging device without cable workbench of lithography machine, in described work stage, the side of brace table is also provided with charging inlet, and described charging device can be charged to work stage by described charging inlet.
Further, described also comprising without cable workbench of lithography machine changes water mechanical arm, described in change water mechanical arm work stage need cooling time connect with described water inlet.
Further, describedly also comprise charging set mechanical arm without cable workbench of lithography machine, described charging set mechanical arm needs to connect with described charging inlet during charging in work stage.
Further, the using method of described cooling device is:
Step one: conducting second solenoid valve, the cooling medium after using in finding time loop from freeing port;
Step 2: close the second solenoid valve, conducting first solenoid valve, pumps into cooling medium from water inlet;
Step 3: close the first solenoid valve, and extract residual cooling medium out from water inlet and freeing port;
Step 4: cooling medium is circulated in the loop by the driving of micro pump.
Further, described cooling medium is solid-liquid two-phase mixture.
Further, the mode of the blending ratio of the cold medium of solid and fluid in regulation and control solid-liquid two-phase mixture is adopted to control the temperature of work stage.
Further, when cooling medium does not reach cooling effect, when namely the temperature of cooling medium measured of internal temperature sensor is for a long time higher than setting value, repeat step one to step 4.
Further, described cooling medium is the water of 22 DEG C and the two-phase mixture of ice, and the ice in described potpourri can not hinder the flowing of described water.
Further, described cooling medium can 22 DEG C time solid-liquid.
Further, also comprise silicon wafer sucking disc device, described silicon wafer sucking disc device is arranged in described work stage, and described silicon wafer sucking disc device is for being adsorbed in described work stage by silicon chip.
The present invention also provides a kind of method of work of above-mentioned workbench of lithography machine, and it applies to two workbench of lithography machine system, and this system is used for the exposure work of silicon chip, and be provided with the first work stage and second workpiece platform in this system, described method of work comprises:
Step one: control system controls the first work stage and waits for that position moves to measurement position from first, complete upper and lower and surveying work, then the first work stage is moved to exposure position from measurement position, carry out exposure work, from second, second workpiece platform is waited for that position moves to simultaneously and measure position, carry out upper and lower and surveying work;
Step 2: when the first work stage carries out exposure work, control system controls second workpiece platform and moves to the second wait position from measurement position, and changes water cooling work by cooling device to it;
From second, step 3: control system controls the first work stage and moves to measurement position from exposure position, carries out upper and lower and surveying work, waits for that position moves to exposure position by second workpiece platform simultaneously, carries out exposure work;
Step 4: when second workpiece platform carries out exposure work, control system controls the first work stage and moves to the first wait position from measurement position, and changes water cooling work by cooling device to it;
From first, step 5: control system controls second workpiece platform and moves to measurement position from exposure position, carries out upper and lower and surveying work, waits for that position moves to exposure position by the first worktable simultaneously, carries out exposure work;
Step 6: repeat step 2 to step 5, until complete exposure and the bottom sheet work of all silicon chips.
Further, in step 2 and step 4, wait for that on position, second workpiece platform or the first work stage carry out charging work to being in.
Compared with prior art, the present invention has following beneficial effect:
The invention provides a kind of workbench of lithography machine, work stage is driven by wireless signal control plane electric mover, realize wireless stage control and motion, thus replace the Workpiece platform structure of traditional cable framework to design, decrease the interference of cable disturbance to high-accuracy work stage six-freedom motion, improve complete machine kinematic accuracy, reduce control difficulty, improve stability; Workbench of lithography machine provided by the invention can also pass through cooling device, utilize double-workpiece-table at exposure position longevity of service, and measuring position working time short characteristic, by the in return widow time (wait bit time) of the difference between both, during this period of time work stage is moved to and wait for position and it is cooled, making its constant temperature, when not affecting this workbench of lithography machine work efficiency, ensure that the temperature stability of each working cycle of work stage.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described:
The structural representation of the workbench of lithography machine that Fig. 1 provides for the embodiment of the present invention;
The front view of work stage in the workbench of lithography machine that Fig. 2 provides for the embodiment of the present invention;
The structural representation of cooling device in the workbench of lithography machine that Fig. 3 provides for the embodiment of the present invention;
The using method process flow diagram of cooling device in the workbench of lithography machine that Fig. 4 provides for the embodiment of the present invention;
The method of work process flow diagram of the workbench of lithography machine that Fig. 5 provides for the embodiment of the present invention;
The workflow schematic diagram (the first work stage is positioned at exposure position, and second workpiece platform is positioned at measures position) of the workbench of lithography machine that Fig. 6 provides for the embodiment of the present invention;
The workflow schematic diagram (the first work stage is positioned at exposure position, and second workpiece platform is positioned at the second wait position) of the workbench of lithography machine that Fig. 7 provides for the embodiment of the present invention;
The workflow schematic diagram (the first work stage is positioned at and measures position, and second workpiece platform is positioned at exposure position) of the workbench of lithography machine that Fig. 8 provides for the embodiment of the present invention;
The workflow schematic diagram (the first work stage is positioned at the first wait position, and second workpiece platform is positioned at exposure position) of the workbench of lithography machine that Fig. 9 provides for the embodiment of the present invention;
Figure 10 for the workbench of lithography machine cooling medium used that the embodiment of the present invention provides be the time dependent schematic diagram of temperature in cooling device time single-phase medium (chilled water) measured by internal temperature sensor;
Figure 11 for the workbench of lithography machine cooling medium used that the embodiment of the present invention provides be the time dependent schematic diagram of temperature in cooling device time two-phase media (chilled water adds a small amount of ice) measured by internal temperature sensor;
The structural representation of the preparation control device of the workbench of lithography machine cooling medium used that Figure 12 provides for the embodiment of the present invention;
The control system FB(flow block) of cooling device internal cooling circulation in the workbench of lithography machine that Figure 13 provides for the embodiment of the present invention;
The control system FB(flow block) of cooling device external refrigeration circulation in the workbench of lithography machine that Figure 14 provides for the embodiment of the present invention.
In Fig. 1 to Figure 14,
1: planar motor; 11: coarse motion planar motor stator; 12: coarse motion planar motor rotor; 2: work stage; WS1: the first work stage; WS2: second workpiece platform; 21: wafer-supporting platform; 22: brace table; 23: water inlet; 24: freeing port; 25: Fang Jing; 26: charging inlet; 3: cooling device; 31: micro pump; 32: internal temperature sensor; 33: the first solenoid valves; 34: the second solenoid valves; 35: radiating module; 36: heat eliminating medium storage box; 4: control system; 51: the first wireless signal receivers; 52: the second wireless signal receivers; 6: charging device; 7: change water mechanical arm; 8: charging set mechanical arm; 9: preparation control device; 91: measuring control valve; 92: external temperature sensor; 93: liquid coolant; 94: solid-state cooling medium.
Embodiment
The workbench of lithography machine proposed the present invention below in conjunction with the drawings and specific embodiments and method of work thereof are described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
Core concept of the present invention is, a kind of workbench of lithography machine is provided, work stage is driven by wireless signal control plane electric mover, realize wireless stage control and motion, thus replace the Workpiece platform structure of traditional cable framework to design, decrease the interference of cable disturbance to high-accuracy work stage six-freedom motion, improve complete machine kinematic accuracy, reduce control difficulty, improve stability; Workbench of lithography machine provided by the invention can also pass through cooling device, utilize double-workpiece-table at exposure position longevity of service, and measuring position working time short characteristic, by the in return widow time (wait bit time) of the difference between both, during this period of time work stage is moved to and wait for position and it is cooled, making its constant temperature, when not affecting this workbench of lithography machine work efficiency, ensure that the temperature stability of each working cycle of work stage.
Please refer to Fig. 1 to Figure 14, the structural representation of the workbench of lithography machine that Fig. 1 provides for the embodiment of the present invention; The front view of work stage in the workbench of lithography machine that Fig. 2 provides for the embodiment of the present invention; The structural representation of cooling device in the workbench of lithography machine that Fig. 3 provides for the embodiment of the present invention; The using method process flow diagram of cooling device in the workbench of lithography machine that Fig. 4 provides for the embodiment of the present invention; The method of work process flow diagram of the workbench of lithography machine that Fig. 5 provides for the embodiment of the present invention; The workflow schematic diagram (the first work stage is positioned at exposure position, and second workpiece platform is positioned at measures position) of the workbench of lithography machine that Fig. 6 provides for the embodiment of the present invention; The workflow schematic diagram (the first work stage is positioned at exposure position, and second workpiece platform is positioned at the second wait position) of the workbench of lithography machine that Fig. 7 provides for the embodiment of the present invention; The workflow schematic diagram (the first work stage is positioned at and measures position, and second workpiece platform is positioned at exposure position) of the workbench of lithography machine that Fig. 8 provides for the embodiment of the present invention; The workflow schematic diagram (the first work stage is positioned at the first wait position, and second workpiece platform is positioned at exposure position) of the workbench of lithography machine that Fig. 9 provides for the embodiment of the present invention; Figure 10 for the workbench of lithography machine cooling medium used that the embodiment of the present invention provides be the time dependent schematic diagram of temperature in cooling device time single-phase medium (chilled water) measured by internal temperature sensor; Figure 11 for the workbench of lithography machine cooling medium used that the embodiment of the present invention provides be the time dependent schematic diagram of temperature in cooling device time two-phase media (chilled water adds a small amount of ice) measured by internal temperature sensor; The structural representation of the preparation control device of the workbench of lithography machine cooling medium used that Figure 12 provides for the embodiment of the present invention; The control system FB(flow block) of cooling device internal cooling circulation in the workbench of lithography machine that Figure 13 provides for the embodiment of the present invention; The control system FB(flow block) of cooling device external refrigeration circulation in the workbench of lithography machine that Figure 14 provides for the embodiment of the present invention.
Embodiment one
Please emphasis with reference to figure 1, as shown in Figure 1, the embodiment of the present invention provides a kind of workbench of lithography machine, described workbench of lithography machine comprises planar motor 1, work stage 2, cooling device 3 and control system 4, described work stage 2 is arranged on described planar motor 1, described control system 4 and described planar motor 1, worktable 2 is connected by wireless signal with cooling device 3, described planar motor 1 can drive described work stage 2 to do Long travel motion, described work stage 2 can do six-freedom motion on described planar motor 1, it is inner that described cooling device 3 is arranged at described work stage 2, described cooling device 3 provides cooling medium to ensure the stability of its temperature for giving work stage 2.
The workbench of lithography machine that the embodiment of the present invention provides, work stage 2 is driven by wireless signal control plane electric mover 12, realize control and the motion of wireless work stage 2, thus replace the Workpiece platform structure of traditional cable framework to design, decrease the interference of cable disturbance to high-accuracy work stage 2 six-freedom motion, improve complete machine kinematic accuracy, reduce control difficulty, improve stability; This workbench of lithography machine also uses cooling device 3 pairs of work stage 2 to cool, with the constant temperature of holding workpiece platform 2.
Described planar motor comprises coarse motion planar motor stator 11, coarse motion planar motor rotor 12 and the first wireless signal receiver 51, described coarse motion planar motor rotor 12 is installed on the bottom of described work stage 2, described coarse motion planar motor rotor 12 is arranged at described first wireless signal receiver 51 on described coarse motion plane electronics stator 11 and is arranged on described coarse motion planar motor stator 11, described control system 4 controls described coarse motion planar motor rotor 12 by described first wireless signal receiver 51 and drives described work stage 2 to do six-freedom motion on coarse motion planar motor stator 11.
Please emphasis with reference to figure 2, as shown in Figure 2, described work stage 2 comprises wafer-supporting platform 21, brace table 22, water inlet 23, freeing port 24, side's mirror 25 and the second wireless signal receiver 52, described brace table 22 is arranged on described planar motor stator 11 by planar motor rotor 12, described wafer-supporting platform 21 is arranged on described brace table 22, described water inlet 23 is arranged at the side of described brace table 22, described freeing port 24 is arranged at the opposite side of described brace table 22, described side's mirror 25 is arranged at the relative both sides of described wafer-supporting platform 21, described second wireless signal receiver 52 is arranged on described wafer-supporting platform 21, described control system 4 carries out the cooling temperature control work of this work stage 2 by the cooling device 3 that described second wireless signal receiver 52 controls in described work stage 2.
Please emphasis with reference to figure 3, as shown in Figure 3, described cooling device comprises micro pump 31, internal temperature sensor 32, first solenoid valve 33, second solenoid valve 34, radiating module 35 and heat eliminating medium storage box 36, described micro pump 31, radiating module 35, heat eliminating medium storage box 36 and internal temperature sensor 32 are connected in series and form loop, this loop is arranged at the inside of described work stage 22, described first solenoid valve 33 is all connected with described loop with the second solenoid valve 34, described water inlet 23 is connected with described first solenoid valve 33, described freeing port 24 is connected with described second solenoid valve 34, described radiating module 35 is for reducing the temperature of cooling medium in loop, described coolant media storage box 36 is for storing cooling medium, liquid efficiency is changed to improve.
Further, describedly also comprise charging device 6 without cable workbench of lithography machine, in described work stage, the side of brace table 22 is also provided with charging inlet 26, described charging device 6 can be charged by described charging inlet 26 pairs of work stage 2, described charging device 6, under the prerequisite not reducing work stage 2 work efficiency, utilizes the stand-by period to charge to work stage 2.
Further, described also comprising without cable workbench of lithography machine changes water mechanical arm 7, the described water mechanical arm 7 that changes needs to connect with described water inlet 23 during cooling in work stage 2, change water mechanical arm 7 described in cooling medium water source can pass through to flow at a distance in cooling device 3, and cooling medium directly need not be filled with in water inlet 23.
Further, describedly also comprise charging set mechanical arm 8 without cable workbench of lithography machine, described charging set mechanical arm 8 needs to connect with described charging inlet 26 during charging in work stage 2, the use of charging set mechanical arm 8 makes charging device 6 to be connected with charging inlet 26 by charging set mechanical arm 8 at a distance, and without the need to direct-connected with charging inlet 26.
Please emphasis with reference to figure 4, as shown in Figure 4, the using method of described cooling device is:
Step one: conducting second solenoid valve 34, the cooling medium after using in finding time loop from freeing port 24;
Step 2: close the second solenoid valve 34, conducting first solenoid valve 33, pumps into cooling medium from water inlet 23;
Step 3: close the first solenoid valve 33, and extract residual cooling medium out from water inlet 23 and freeing port 24;
Step 4: cooling medium is circulated in the loop by the driving of micro pump 31.
Further, when cooling medium does not reach cooling effect, when namely the temperature of cooling medium measured of internal temperature sensor 32 is for a long time higher than setting value, repeat step one to step 4.
When there is temperature difference with projection objective in the wafer-supporting platform 22 (E-Chuck) of worktable 2, can make bottom projection objective and formation temperature gradient between wafer-supporting platform 22 (E-Chuck), uneven hot crosstalk, thus cause focal plane drift and aim at drift, simultaneously, when wafer-supporting platform 22 (E-Chuck) temperature and set point temperatures have difference, the repeatability precision of leveling sensor can be deteriorated, therefore, the temperature difference between projection objective and wafer-supporting platform 22 (E-Chuck) should meet | TE-chuck-Tlens|<0.1 ° of C.In addition, the square mirror 25 of work stage 2 is 360mm (Y-direction) to the ultimate range of silicon chip edge, if produce 1nm thermal expansion, the square mirror 25 of work stage 2 and the Material selec-tion devitrified glass of wafer-supporting platform 22 (E-Chuck), its thermal expansivity is 0.15ppm/K, calculates the temperature index of work stage side's mirror 25 for being less than 18 × 10
-3° C/360mm.Drift can be produced due to temperature difference between silicon chip and wafer-supporting platform 22 (E-Chuck), therefore the initial temperature difference between silicon chip and wafer-supporting platform 22 (E-Chuck) should be less than 0.1 ° of C (300mm silicon chip), and silicon chip temperature in deviation is 22 ± 2 ° of C.For meeting above design objective, considering to adopt work stage 2 outside to provide refrigerant, in the middle of work stage 2, changing the technical tactic of liquid and structure platform internal heat exchange.In addition adopt the scheme of temperature sensor strategy and inside and outside pair of FEEDBACK CONTROL, and then ensure the temperature constant of work stage and silicon chip.
After work stage arrives wait position, change water mechanical arm 7 and connect water inlet 23 and freeing port 24 respectively, charging set mechanical arm 8 connects charging inlet 26, conducting second solenoid valve 34, the high-temperature water of finding time in loop, close the second solenoid valve 34, conducting first solenoid valve 33, pump into cooling medium, close the first solenoid valve 33, the residual water droplet (affecting work stage 2 internal environment to avoid residual water droplet) of water inlet 23 and the freeing port 24 of then finding time, carry out charging work to work stage 2, after completing, water mechanical arm 7 and charging set mechanical arm 8 are changed in disconnection simultaneously.Water in closed circuit circulates under the driving effect of micro pump 31, cools work stage 2 inside, and internal temperature sensor 32 is used for the water temperature in monitoring circuit, and does to control system 4 and feed back, to control the temperature of whole work stage 2.
Please emphasis with reference to Figure 13, as shown in figure 13, internal cooling circulating temperature control system is the close loop negative feedback control system be made up of each branch road.First the internal reference temperature of work stage 2 is set by control system 4, detected the actual temperature of work stage 2 inside by internal temperature sensor 32 simultaneously, transmit control signal by comparing two temperature values, controlling unit carrys out the temperature in regulating loop by driving actuating unit (motor of micro pump 41).
Further, described cooling medium is solid-liquid two-phase mixture.
Further, the mode of the blending ratio of the cold medium of solid and fluid in regulation and control solid-liquid two-phase mixture is adopted to control the temperature of work stage 2.
Further, described cooling medium is the water of 22 DEG C and the two-phase mixture of ice, and the ice in described potpourri can not hinder the flowing of described water.
Please emphasis with reference to Figure 10 and Figure 11, as shown in Figure 10 and Figure 11, because the constant temperature effect of the ratio single-phase medium of two-phase media is obvious, again because the environment temperature of litho machine complete machine inside (work stage 2 and object lens) generally all controls at 22 DEG C, when considering the cooling medium selecting work stage 2, the two-phase mixture of the water of such as 22 DEG C and a small amount of ice cube should be adopted as cooling medium, as shown in table 1, option one.On the one hand because specific heat of water is large, cause the heat of temperature variation than large, on the other hand because ice can't melt in the water of 22 DEG C at once, in the process that ice melts, work stage 2 is also in work, cooling medium absorbs external heat, it is roughly equal that the external heat that its cooling medium absorbs melts required heat with ice, heat absorption is melted by ice, the temperature of cooling medium is made to control the interior among a small circle fluctuation of 22 DEG C, importantly control the dosage that ice is mixed into chilled water, its liquid-solid two-phase refrigerant join the scope of proportional range between 1/100 to 1/10, too great fluctuation process is not had to make the temperature of cooling medium.
In addition also can select and prepare some special cooling mediums, the cooling medium selected has the fusing point less than or equal to working temperature (as about 22C), can coexist 22C is liquid-solid, as shown in table 1, option 3 to 5 (cetyl iodide, heptadecane and triphenyl phosphite).They possess good mobility, with the feature meeting operating mode necessary requirement, the solid-state physical efficiency of these cooling mediums is melted gradually in the liquid body of 22C, in the process that solid bodies is melted, work stage 2 is also in work, cooling medium absorbs external heat, it is roughly equal that the external heat that its cooling medium absorbs melts required heat with solid bodies, heat absorption is melted by solid bodies, make the temperature control 22C of cooling medium among a small circle in fluctuation, the fusing point be mixed at about 22 DEG C specific to the dosage of chilled water and this medium by controlling solid bodies carries out thermostatic control.
Please emphasis with reference to Figure 12, as shown in figure 12, the preparation control device 9 of worktable cooling medium used comprises measuring control valve 91, external temperature sensor 92, liquid coolant 93 and solid-state cooling medium 94, described preparation control device 9 is controlled by described control system 4, liquid coolant 93 mixes with solid-state cooling medium 94 and forms solid-liquid two-phase mixture cooling medium, the function of this device regulates the coolant temperature before entering the circulation of work stage 2 home loop, and the solid-state cooling medium 94 of doses and the potpourri of liquid coolant 93 are injected in the loop of work stage 2 by changing water mechanical arm 7, promote that the coolant temperature in work stage 2 loop controls.In addition, can also pass through the preparation control device 9 shown in Figure 12, by the two-phase cooling medium of liquid-solid mixing, the form exchanged with partially liq, injects in the heat eliminating medium storage box 36 of work stage 2, to improve the efficiency of changing liquid, and ensures the stability of work stage 2 temperature.There is the physical attribute of the cooling medium should considering selection in the mutual course of work to avoid the generation of condensate water in the course of work of the refrigerating device inside of work stage 2, the course of work of outside preparation control device 9, inside and outside system.
Please emphasis with reference to Figure 14, as shown in figure 14, external refrigeration circulating temperature control system is the close loop negative feedback control system be made up of each branch road.First the external reference temperature of work stage 2 is set, detected the actual temperature of work stage 2 outside and water inlet 23 by external temperature sensor 92 simultaneously, then compare two temperature values by control system 4 to transmit control signal, the ratio of controlling unit by driving actuating unit (dosage operation valve) to come solid-state cooling medium 94 and liquid coolant 93 in regulating loop, thus reach the object of controlled cooling model agent temperature.
Further, also comprise silicon wafer sucking disc device, described silicon wafer sucking disc device is arranged in described work stage 2, this silicon wafer sucking disc device adopt Electrostatic Absorption or other do not use the technical scheme of source of the gas will be adsorbed in work stage 2 to sheet, avoid using source of the gas and tracheae to pass into work stage 2, to avoid source of the gas to the interference of work stage 2 precision.
Please emphasis with reference to figure 5 to Fig. 9, as shown in Figures 5 to 9, the embodiment of the present invention also provides a kind of method of work of above-mentioned workbench of lithography machine 2, it applies to two workbench of lithography machine system, this system is used for the exposure work of silicon chip, be provided with the first work stage WS1 and second workpiece platform WS2 in this system, described method of work comprises:
Step one: control system 4 controls the first work stage WS1 and waits for that position moves to measurement position from first, complete upper and lower and surveying work, then the first work stage WS1 is moved to exposure position from measurement position, carry out exposure work, from second, second workpiece platform WS2 is waited for that position moves to simultaneously and measure position, carry out upper and lower and surveying work;
Step 2: when the first work stage WS1 carries out exposure work, control system 4 controls second workpiece platform WS2 and moves to the second wait position from measurement position, and changes water cooling work by cooling device 3 to it;
From second, step 3: control system 4 controls the first work stage WS1 and moves to measurement position from exposure position, carries out upper and lower and surveying work, waits for that position moves to exposure position by second workpiece platform WS2 simultaneously, carries out exposure work;
Step 4: when second workpiece platform WS2 carries out exposure work, control system 4 controls the first work stage WS1 and moves to the first wait position from measurement position, and changes water cooling work by cooling device 3 to it;
From first, step 5: control system 4 controls second workpiece platform WS2 and moves to measurement position from exposure position, carries out upper and lower and surveying work, waits for that position moves to exposure position by the first worktable WS1 simultaneously, carries out exposure work;
Step 6: repeat step 2 to step 5, until complete exposure and the bottom sheet work of all silicon chips.
Further, in step 2 and step 4, wait for that on position, second workpiece platform WS2 or the first work stage WS1 carries out charging work to being in.
Workbench of lithography machine provided by the invention can pass through cooling device 3, utilize double-workpiece-table WS1, WS2 at exposure position longevity of service, and measuring position working time short characteristic, by the in return widow time (wait bit time) of the difference between both, during this period of time work stage WS1, WS2 are moved to and wait for position and it is cooled, make its constant temperature, under the prerequisite not affecting this workbench of lithography machine 2 work efficiency, ensure that the temperature stability of each working cycle of work stage 2.
Embodiment two
The structure division of the workbench of lithography machine in the present embodiment does not change compared with embodiment one, and its method of work slightly changes compared with embodiment one, specifically comprises:
Step one: control system 4 controls the first work stage WS1 and waits for that position moves to measurement position from first, complete upper and lower and surveying work, then the first work stage WS1 is moved to exposure position from measurement position, carry out exposure work, from second, second workpiece platform WS2 is waited for that position moves to simultaneously and measure position, carry out upper and lower and surveying work;
Step 2: after the first work stage WS1 has carried out exposure work, control system 4 controls the first work stage WS1 and moves to the first wait position from exposure position, and by cooling device 3, water cooling work is changed to it, control system 4 controls second workpiece platform WS2 and moves to exposure position from measurement position simultaneously, carries out exposure work;
Step 3: when second workpiece platform WS2 carries out exposure work, control system 4 controls the first work stage WS1 and waits for that position moves to measurement position from first, carries out upper and lower and surveying work;
Step 4: control system 4 controls second workpiece platform WS2 and moves to the second wait position from exposure position, and by cooling device 3, water cooling work is changed to it, control system 4 controls the first work stage WS1 and moves to exposure position from measurement position simultaneously, carries out exposure work;
Step 5: control system 4 controls second workpiece platform WS2 and moves to measurement position from exposure position, carries out upper and lower and surveying work;
Step 6: repeat step 2 to step 5, until complete exposure and the bottom sheet work of all silicon chips.
Further, in step 2 and step 4, wait for that on position, the first work stage WS1 or second workpiece platform WS2 carries out charging work to being in.
In the present embodiment, the method for work of workbench of lithography machine is compared to the method for work in embodiment one, has exchanged the time sequencing waiting for position, and after waiting for that position has been placed on exposure position, time of charging, cooling is by after having changed into before original exposure and exposing.Doing so avoids the interference to previous surveying work brought by charging, cooling procedure, further ensure the precision of measurement.
Obviously, those skilled in the art can carry out various change and distortion to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (19)
1. a workbench of lithography machine, it is characterized in that, comprise planar motor, work stage, cooling device and control system, described work stage is arranged on described planar motor, described control system is connected by wireless signal with described planar motor, worktable and cooling device respectively, described planar motor drives described work stage to do Long travel motion, described work stage does six-freedom motion on described planar motor, it is inner that described cooling device is arranged at described work stage, and described cooling device is used for providing cooling medium to ensure the stability of its temperature to work stage; Described planar motor comprises coarse motion planar motor stator, coarse motion planar motor rotor and the first wireless signal receiver, and described control system controls described coarse motion planar motor rotor by described first wireless signal receiver and drives described work stage to do six-freedom motion on coarse motion planar motor stator; Described work stage comprises wafer-supporting platform, brace table, water inlet, freeing port, Fang Jing and the second wireless signal receiver, and described control system carries out the cooling temperature control work of this work stage by the cooling device that described second wireless signal receiver controls in described work stage; Described cooling device comprises micro pump, internal temperature sensor, the first solenoid valve, the second solenoid valve, radiating module and heat eliminating medium storage box.
2. workbench of lithography machine according to claim 1, it is characterized in that, described coarse motion planar motor rotor is installed on the bottom of described work stage, described coarse motion planar motor rotor is arranged on described coarse motion plane electronics stator, and described first wireless signal receiver is arranged on described coarse motion planar motor stator.
3. workbench of lithography machine according to claim 1, it is characterized in that, described brace table is arranged on described coarse motion planar motor stator by described coarse motion planar motor rotor, described wafer-supporting platform is arranged on described brace table, described water inlet is arranged at the side of described brace table, described freeing port is arranged at the opposite side of described brace table, and described Fang Jing is arranged at the relative both sides of described wafer-supporting platform, and described second wireless signal receiver is arranged on described wafer-supporting platform.
4. workbench of lithography machine according to claim 3, it is characterized in that, described micro pump and internal temperature sensor serial connection form loop, this loop is arranged at the inside of described work stage, described first solenoid valve is all connected with described loop with the second solenoid valve, described water inlet is connected with described first solenoid valve, and described freeing port is connected with described second solenoid valve.
5. workbench of lithography machine according to claim 3, it is characterized in that, also comprise charging device, in described work stage, the side of brace table is also provided with charging inlet, and described charging device can be charged to work stage by described charging inlet.
6. workbench of lithography machine according to claim 4, is characterized in that, also comprise and change water mechanical arm, described in change water mechanical arm and need to connect with described water inlet during cooling in work stage.
7. workbench of lithography machine according to claim 5, is characterized in that, also comprise charging set mechanical arm, and described charging set mechanical arm needs to connect with described charging inlet during charging in work stage.
8. workbench of lithography machine according to claim 4, it is characterized in that, the using method of described cooling device is:
Step one: conducting second solenoid valve, the cooling medium after using in finding time loop from freeing port;
Step 2: close the second solenoid valve, conducting first solenoid valve, pumps into cooling medium from water inlet;
Step 3: close the first solenoid valve, and extract residual cooling medium out from water inlet and freeing port;
Step 4: cooling medium is circulated in the loop by the driving of micro pump.
9. workbench of lithography machine according to claim 8, it is characterized in that, described cooling medium is solid-liquid two-phase mixture.
10. workbench of lithography machine according to claim 9, is characterized in that, adopts the mode of the blending ratio of the cold medium of solid and fluid in regulation and control solid-liquid two-phase mixture to control the temperature of work stage.
11. workbench of lithography machine according to claim 8, is characterized in that, when cooling medium does not reach cooling effect, when namely the temperature of cooling medium measured of internal temperature sensor is for a long time higher than setting value, repeat step one to step 4.
12. workbench of lithography machine according to claim 10, it is characterized in that, described cooling medium is the water of 22 DEG C and the two-phase mixture of ice, and the ice in described potpourri can not hinder the flowing of described water.
13. workbench of lithography machine according to claim 10, is characterized in that, described cooling medium can 22 DEG C time solid-liquid.
14. according to any one of claim 1 to 13 workbench of lithography machine, it is characterized in that, also comprise silicon wafer sucking disc device, described silicon wafer sucking disc device is arranged in described work stage, and described silicon wafer sucking disc device is for being adsorbed in described work stage by silicon chip.
The method of work of 15. 1 kinds of workbench of lithography machine as described in the appended claim 1, it applies to two workbench of lithography machine system, and this system is used for the exposure work of silicon chip, is provided with the first work stage and second workpiece platform, it is characterized in that, comprising in this system:
Step one: control system controls the first work stage and waits for that position moves to measurement position from first, complete upper and lower and surveying work, then the first work stage is moved to exposure position from measurement position, carry out exposure work, from second, second workpiece platform is waited for that position moves to simultaneously and measure position, carry out upper and lower and surveying work;
Step 2: when the first work stage carries out exposure work, control system controls second workpiece platform and moves to the second wait position from measurement position, and changes water cooling work by cooling device to it;
From second, step 3: control system controls the first work stage and moves to measurement position from exposure position, carries out upper and lower and surveying work, waits for that position moves to exposure position by second workpiece platform simultaneously, carries out exposure work;
Step 4: when second workpiece platform carries out exposure work, control system controls the first work stage and moves to the first wait position from measurement position, and changes water cooling work by cooling device to it;
From first, step 5: control system controls second workpiece platform and moves to measurement position from exposure position, carries out upper and lower and surveying work, waits for that position moves to exposure position by the first worktable simultaneously, carries out exposure work;
Step 6: repeat step 2 to step 5, until complete exposure and the bottom sheet work of all silicon chips.
16. according to the method for work of workbench of lithography machine described in claim 15, it is characterized in that, described first work stage and the second worktable comprise wafer-supporting platform respectively, brace table, water inlet, freeing port, Fang Jing and the second wireless signal receiver, described brace table is arranged on planar motor stator by planar motor rotor, described wafer-supporting platform is arranged on described brace table, described water inlet is arranged at the side of described brace table, described freeing port is arranged at the opposite side of described brace table, described Fang Jing is arranged at the relative both sides of described wafer-supporting platform, described second wireless signal receiver is arranged on described wafer-supporting platform, described control system carries out the cooling temperature control work of this work stage by the cooling device that described second wireless signal receiver controls in described work stage.
17. according to the method for work of workbench of lithography machine described in claim 16, it is characterized in that, described cooling device comprises micro pump, internal temperature sensor, the first solenoid valve and the second solenoid valve, described micro pump and internal temperature sensor serial connection form loop, this loop is arranged at the inside of described work stage, described first solenoid valve is all connected with described loop with the second solenoid valve, and described water inlet is connected with described first solenoid valve, and described freeing port is connected with described second solenoid valve.
18. according to the method for work of workbench of lithography machine described in claim 17, and it is characterized in that, the using method of described cooling device is:
Step one: conducting second solenoid valve, the cooling medium after using in finding time loop from freeing port;
Step 2: close the second solenoid valve, conducting first solenoid valve, pumps into cooling medium from water inlet;
Step 3: close the first solenoid valve, and extract residual cooling medium out from water inlet and freeing port;
Step 4: cooling medium is circulated in the loop by the driving of micro pump.
The method of work of 19. workbench of lithography machine according to claim 15, is characterized in that, in step 2 and step 4, waits for that on position, second workpiece platform or the first work stage carry out charging work to being in.
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| CN105322831B (en) * | 2014-07-11 | 2018-01-19 | 上海微电子装备（集团）股份有限公司 | A kind of six degree of freedom cable actuator |
| CN104375389A (en) * | 2014-10-13 | 2015-02-25 | 江苏影速光电技术有限公司 | Multi-workpiece table collaboration direct-writing photoetching method |
| CN104375388B (en) * | 2014-10-13 | 2016-09-14 | 江苏影速光电技术有限公司 | A kind of multi-work piece platform direct-write photoetching system |
| DE102014222422A1 (en) * | 2014-11-03 | 2016-05-04 | Homag Holzbearbeitungssysteme Gmbh | Processing device for workpieces and method thereof |
| CN108240681A (en) * | 2018-01-22 | 2018-07-03 | 德淮半导体有限公司 | Humidity conditioner and its temperature control system and photoetching equipment |
| CN113311670A (en) * | 2021-04-25 | 2021-08-27 | 上海图双精密装备有限公司 | Temperature variable frequency regulating system of photoetching machine |
| CN115877665A (en) | 2021-09-29 | 2023-03-31 | 长鑫存储技术有限公司 | Temperature control device and temperature control method |
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Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |