GB2556219A - Dynamic magnetic steel magnetic levitation dual workpiece stage vector arc stage switching method and device based on rotary balance mass - Google Patents
Dynamic magnetic steel magnetic levitation dual workpiece stage vector arc stage switching method and device based on rotary balance mass Download PDFInfo
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- GB2556219A GB2556219A GB1719532.2A GB201719532A GB2556219A GB 2556219 A GB2556219 A GB 2556219A GB 201719532 A GB201719532 A GB 201719532A GB 2556219 A GB2556219 A GB 2556219A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A dynamic-magnetic-steel magnetic-levitation dual-workpiece stage vector arc stage switching method and device based on rotary balance mass, belonging to the technical field of semiconductor manufacturing apparatuses. The device comprises a support frame (1), a balance mass block (2), a rotary shaft (10), magnetic levitation workpiece stages (4a, 4b), a workpiece stage measurement device and a workpiece stage drive device. Two workpiece stages work between a measurement station (11) and an exposure station (12). Plane gratings (5a, 5b) are used to measure positions of the workpiece stages. the workpiece stages are driven using a magnetic-levitation planar motor. during the switching process of dual-workpiece stages, the planer motor is used for driving the two workpiece stages, so as to achieve rapid single-beat arc stage switching. The method and device solve the problem that an existing stage switching scheme relates to many beats, a long track, many start-stop links and a long stabilization time, thereby reducing stage switching links, shortening a stage switching time, and improving the yield of a photoetching machine.
Description
(56) Documents Cited:
CN 105629676 A CN 103592820 A
CN 103543613 A CN 102393613 A
CN 101107571 A
CN1102393611
US2003063289 (58) Field of Search:
INT CL B65D, G03F, H01L Other: VEN, CNABS, CNTXT (71) Applicant(s):
Harbin Institute of Technology
No. 92 Xidazhi Street, Nangang District,
Harbin City 150001, Heilongjiang, China (72) Inventor(s):
Yongmeng Liu Jiubin Tan (74) Agent and/or Address for Service:
Serjeants LLP
Dock, 75 Exploration Drive, Leicester, LE4 5NU, United Kingdom (54) Title of the Invention: Dynamic magnetic steel magnetic levitation dual workpiece stage vector arc stage switching method and device based on rotary balance mass
Abstract Title: Dynamic magnetic steel magnetic levitation dual workpiece stage vector arc stage switching method and device based on rotary balance mass (57) A dynamic-magnetic-steel magnetic-levitation dual-workpiece stage vector arc stage switching method and device based on rotary balance mass, belonging to the technical field of semiconductor manufacturing apparatuses. The device comprises a support frame (1), a balance mass block (2), a rotary shaft (10), magnetic levitation workpiece stages (4a, 4b), a workpiece stage measurement device and a workpiece stage drive device. Two workpiece stages work between a measurement station (11) and an exposure station (12). Plane gratings (5a, 5b) are used to measure positions of the workpiece stages, the workpiece stages are driven using a magnetic-levitation planar motor, during the switching process of dual-workpiece stages, the planer motor is used for driving the two workpiece stages, so as to achieve rapid single-beat arc stage switching. The method and device solve the problem that an existing stage switching scheme relates to many beats, a long track, many start-stop links and a long stabilization time, thereby reducing stage switching links, shortening a stage switching time, and improving the yield of a photoetching machine.
This international application has entered the national phase early.
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FIG. 1
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FIG. 2
FIG 3
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FIG. 7
VECTOR ARC REVOLVE TRANSPOSITION METHOD FOR MOVING MAGNETIC STEEL MAGNETIC LEVITATED DUAL-TABLE SYSTEM BASED ON REVOLVE BALANCE MASS AND DEVICE THEREOF
FIELD OF THE INVENTION
The present invention relates to semiconductor manufacturing equipment, and mainly relates to a vector arc revolve transposition method for moving a magnetic steel levitated dual-table system based on revolve balance mass and device thereof.
BACKGROUND OF THE INVENTION
A lithography machine is one of the most important ultra-precision equipment in nanometer scale integrated circuit manufacturing. A wafer table is one of the key subsystems of the lithography machine and greatly determines the resolution, precision and productivity of the lithography machine.
Productivity is a main goal that is pursued in the development of lithography machines. When the resolution, accuracy and efficiency requirements are fulfilled, productivity of the lithography machine is a development direction of the wafer table technology. The most straightforward way to improve operating efficiency is to improve the acceleration and the velocity of the wafer table, however, unlimited increase of the acceleration and the velocity will reduce the original precision. The wafer table was initially designed with only one silicon wafer fixing device. The lithography machine can only manufacture one silicon wafer in a serial process which results in a low productivity. A dual-table system was then proposed, which is so far the prevailing technical means to improve productivity of lithography machine. The dual-table system is equipped with one exposure station, one measurement station and two wafer tables. Exposure and measurement adjustments can be processed in parallel, which can greatly reduce time and improve production efficiency. A representative product is a dualtable technology lithography machines based on Twin scan technology provided by ASML Company in the Netherlands.
Currently, improving the operating efficiency of a dual-table system is one of the technical development goals for lithography machines. Dual-table technology involves transposition of two wafers between the two stations. The transposition efficiency directly affects the operating efficiency of the system and consequently the lithography productivity. How to reduce transposition time of a dual-table system and minimize the interference on other subsystems has always been a focus of study. In conventional dual-table transposition processes, the wafer tables are driven linearly in both the exposure and measurement processes. In US2001/0004105A1 and W098/40791, which are dual-table system related patents, each wafer table has two exchangeable units to achieve the dual-table transposition process. This arrangement can improve productivity of the machine without increasing the operating speed of the wafer table. However due to the coupling connection between the work station and the rail, the wafer tables will temporarily separate from the driving unit in the process of transposition, which will have considerable influence on the positioning accuracy of the wafer table. At the same time, as the movement unit and the guide rail are longer and the mass of the moving parts is greater, it may adversely affect the enhancement of movement speed and acceleration. Chinese Patent No. CN101609265 proposes a multiple wafer table transposition system based on planar motor drive, in which a stator of the planar motor is arranged on the top of a base table and a mover is arranged at the bottom of the wafer table. The wafer table and the driving unit are never separated from the planar motor drive. In Chinese Patent No. CN101694560, a dual-wafer table transposition system driven by airfoil support permanent magnetic steel planar motor is proposed, in which the wafer table is driven by a planar motor and supported by airfoil to avoid the problem that the driving units and the wafer tables may separate during the transposition process. Meanwhile, the running resistance of the wafer tables and the drive current and the heat of the planar motor are reduced.
Compared with the linear transposition strategy of wafer tables mentioned in the above patents, revolving transposition strategy of wafer tables has a unique advantage, and dual-table with the revolving transposition technology emerged. Chinese Patent No. CN101071275 adopts the method of revolving the whole pedestal to realize the transposition of the two wafer tables. This arrangement can simplify the structure of the system, and the movement of the two wafer tables is not overlapping with each other, thereby potential danger such as collision can be avoided. However, when the whole pedestal is revolved to achieve the wafer table transposition, problems such as large revolve inertia, imprecise position of the high-power revolve motor, and the system temperature rising due to greater heat generation may arise. Meanwhile, the larger radius of revolve increases the dimension of the main structure of the lithography machine. In Chinese Patent No. CN102495528, the invention adopts a revolve transposition table in the center of the base station to complete the transposition process of the two wafer tables, which is divided into three steps, but the revolve position accuracy is low.
The position accuracy of the wafer tables directly affects the manufacture accuracy and the minimum line width of the lithography machine. As the movement speed of the wafer table becomes higher, the measurement program must meet the high-speed high-accuracy measurement requirements.
In US Patent No. US6498350B2 and US Patent Application No. US20100279232A1, the inventions adopt several laser interferometers to achieve position measurement of a wafer table; the advantages of laser interferometer measurement are high precision and long working distance, but the measuring light path is too long, so the disadvantages caused by the humidity and air turbulence are very sensitive and costly.
SUMMARY OF THE INVENTION
To solve the shortcomings of the existing technology, the invention provides a vector arc revolve transposition method based on a revolve balance mass for a moving magnetic steel levitated dual-table system and device thereof. The method and device can realize a single-step and fast arc transposition of two wafer tables, which may reduce wafer transposition time, and increase productivity of the lithography machine.
One objective of the invention is achieved by providing a vector arc revolve transposition method for a moving magnetic steel levitated dual-table system based on a revolve balance mass, the method comprises: in an initial working state, providing a first wafer table in a pre-alignment state in a measurement zone, providing a second wafer table in an exposure state in an exposure zone; in a first step, completing a pre-alignment process of the first wafer table in the measurement zone, driving the first wafer table by a moving magnetic steel to a predetermined pre-transposition position A of the measurement zone, the first wafer table is then charged and hold. Completing an exposure process of the second wafer table in the exposure zone, driving the second wafer table by the moving magnetic steel to a predetermined position C of the exposure zone. In a second step, moving the first wafer table and the second wafer table counterclockwise along a circular arc path through a vector control of a planar motor, during the movement, maintaining the phases of the first and second wafer tables unchanged and measuring the movement positions of the fist and the second wafer tables by planar gratings. Completing the transposition process of the first and the second wafer tables by moving the first wafer table to the predetermined position C in the exposure zone and moving the second wafer table to a predetermined position D in the measurement zone. Then a silicon wafer in the first wafer table is lithographed and exposed in the exposure zone and once the exposure is finished, the finished one is replaced by a new silicon wafer and the new silicon wafer is pre-aligned on the second wafer table in the measurement zone. In a third step, completing a pre-alignment process in the measurement zone, driving the second wafer table to the predetermined position A of the measurement zone, then charging and holding the second wafer table. Completing an exposure process in the exposure zone, driving the first wafer table to the predetermined position C of the exposure zone. In a fourth step, moving the second wafer table and the first wafer table clockwise along the circular arc path through another vector control of the planar motor. When the second wafer table is moved to the predetermined position C in the exposure zone and the first wafer table is moved to the predetermined position D in the measurement zone, the transposition process of wafer tables is completed, the silicon wafer in the second wafer table is lithographed and exposed in the exposure zone and the finished wafer is replaced by another new silicon wafer. The new silicon wafer is pre-aligned on the first wafer table in the measurement zone. At this time, the system returns to the initial working state, an operating cycle of transposition operation of the two wafer tables is completed, and the measurement, exposure, and transposition processes of the two wafer tables are all completed via wireless communication.
The proposed device is a vector arc revolve transposition device for moving a magnetic steel levitated dual-table system based on a revolve balance mass block. The device comprises a support frame, a balance mass block, a first wafer table, a second wafer table and a wireless charging transmitter. The balance mass block is positioned above the support frame, a stator of a macro planar motor is mounted on an upper planar surface of the balance mass block, and a bottom of the balance mass block is connected with a revolve shaft, an airfoil is provided between the balance mass block and the supporting frame and between the revolve shaft and the supporting frame respectively, the balance mass block can revolve around the center of the revolve shaft; the first wafer table and the second wafer table are arranged above the stator of the macro planar motor; the first wafer table and the second wafer table are operatable between a measurement zone and an exposure zone, a measurement zone planar grating and an exposure zone planar grating are installed on a plane above the first wafer table and the second wafer table, respectively; the first wafer table and the second wafer table are both sixDOF (degree of freedom) magnetic steel levitation micro-table, which is comprised of a chuck, a sucker, a micro-motor, an anti-collision frame, a mover of the macro movement planar motor, a planar grating reading head, a leveling focusing sensor, a wireless charging receiver and a wireless communication transceiver; the micro motor is comprised of a mover of the micro-planar motor and a mover of a gravity compensator; the sucker is mounted on the chuck, and four comers of the chuck are provided with four planar grating reading heads and four leveling focusing sensors; the chuck is fixed to the micro motor, and the anti-collision frame is mounted around the micro motor; the mover of the macro movement planar motor is arranged below the anti-collision frame; the mover of the macro movement planar motor is formed by staggered arrangement of magnetic steel arrays. The stator of the macro movement planar motor is arranged in herringbone arrangement of the coil arrays; and air cooling holes are provided between the coil arrays.
The invention has following innovative points and outstanding advantages:
1) A vector arc revolve wafer table transposition method is proposed and a corresponding device is designed. The invention adopts vector wafer table transposition strategy to optimize the existing multistep linear transposition of the dual-wafer as a single-step quick transposition with less starting and stopping times and less stabilizing links. Meanwhile, the arc trajectory planning is adopted to shorten the trajectory of the table transposition, the impact of the revolve transposition force is small and the setting time is short. At the same time, real-time measurement system monitoring of transposition process can ensure macro / micro positioning precision and direct trace to laser wavelength, and finally realize high efficiency and high precision of both sides. This is the first innovation and outstanding advantage of the invention.
2) It proposes a momentum balance compensation method based on a revolve balance mass and a design of the corresponding device with a revolve balance mass. The device can realize the X, Y, Z and Rz movement compensation based on the revolve balance mass and reduce the complexity and the difficulty of control. This is the second innovation and outstanding advantage of the invention.
3) It proposes a wireless charging and wireless communication wafer table transposition method without cable interference and design the corresponding device. The magnetic steel levitation, magnetic steel driving, wireless charging and communication are used to realize the wireless transmission and control for power supply and communication signals of two wafer tables. The device makes the overall construction compact. More importantly, it eliminates the cable and signal cable disturbance on the positioning accuracy of dual wafer table, which achieves the wireless power supply, wireless communication data transmission and cable-free bondage. This is the third innovation and outstanding advantage of the invention.
4) It proposes a long stroke driving method based on a moving magnetic steel levitated planar motor, and a design of the corresponding vector planar motor device. The composite current drives have the advantages of high power density, good dynamic performance, high winding utilization rate, uniform temperature distribution, small thermal deformation, etc. It can realize high-efficiency vector control and the synthesis and decomposition of six-degree-of-freedom vector force. Meanwhile, this invention adopts dynamic magnetic steel driving, wireless communication data transmission, no binding cable, simple structure and high positioning accuracy. This is the fourth innovation and outstanding advantage of the invention.
5) It propose a measurement method based on planar grating and a design of the corresponding planar grating measuring device. Compared with the laser interferometer system, the planar grating measuring system can meet the measuring demand of the lithography system at high speed. At the same time, the measurement accuracy is higher than the laser interferometer because of its small measurement noise. Particularly, the method avoids the risk of manufacturing difficulty, high cost, low quality, excessive inertia of 45°reflection mirror of chuck. This is the fifth innovation and outstanding advantage of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG.l is a schematic diagram of arc quick transposition method with one step optimization.
FIG.2 is a schematic diagram of the overall structure of a vector arc transposition device based on revolve balance mass for the moving magnetic steel levitated dual-table system.
FIG.3 is a sectional view of a dual-table system.
FIG.4 is a diagram of six freedom degree magnet levitated micro wafer table.
FIG.5 is a structural diagram of the micro planar motor and the gravity compensator.
FIG.6 is a schematic diagram of magnetic steel array arrangement of the mover of the macro planar motor.
FIG.7 is a schematic diagram of stator coil array arrangement of the macro planar motor.
The part numbers in the above figures:
support frame 1;
balance mass block 2;
macro planar motor 3;
first wafer table 4a;
second wafer table 4b;
wireless charging transmitter 30;
revolve shaft 10;
measurement zone 11;
exposure zone 12;
measurement zone planar grating 5a;
exposure zone planar grating 5b;
chuck 401;
sucker 402;
micro-motor 403;
anti-collision frame 404;
mover of macro movement planar motor 405;
planar grating reading head 406;
leveling focusing sensor 407;
micro-planar motor 408;
mover of gravity compensator 409;
magnetic steel array 411;
coil array 412;
wireless charging receiver 413;
wireless communication transceiver 414.
DESCRIPTION OF THE EMBODIMENTS
Detailed implementations of the presented invention will be described with reference to the appended drawings. The proposed method comprises: in an initial working state, providing a first wafer table in a pre-alignment state in a measurement zone, providing a second wafer table in an exposure state in an exposure zone; in a first step, completing a pre-alignment process of the first wafer table in the measurement zone, driving the first wafer table by a moving magnetic steel to a predetermined pretransposition position A of the measurement zone, the first wafer table is then charged and held. Completing an exposure process of the second wafer table in the exposure zone, driving the second wafer table by the moving magnetic steel to a predetermined position C of the exposure zone. In a second step, moving the first wafer table and the second wafer table counterclockwise along a circular arc path through a vector control of a planar motor, during the movement, maintaining the phases of the first and second wafer tables unchanged and measuring the movement positions of the fist and the second wafer tables by planar gratings. Completing the transposition process of the first and the second wafer tables by moving the first wafer table to the predetermined position C in the exposure zone and moving the second wafer table to a predetermined position D in the measurement zone. Then a silicon wafer in the first wafer table is lithographed and exposed in the exposure zone and once the exposure is finished, the finished one is replaced by a new silicon wafer and the new silicon wafer is pre-aligned on the second wafer table in the measurement zone. In a third step, completing a pre-alignment process in the measurement zone, driving the second wafer table to the predetermined position A of the measurement zone, then charging and holding the second wafer table. Completing an exposure process in the exposure zone, driving the first wafer table to the predetermined position C of the exposure zone. In a fourth step, moving the second wafer table and the first wafer table clockwise along the circular arc path through another vector control of the planar motor. When the second wafer table is moved to the predetermined position C in the exposure zone and the first wafer table is moved to the predetermined position D in the measurement zone, the transposition process of wafer tables is completed, the silicon wafer in the second wafer table is lithographed and exposed in the exposure zone and the finished wafer is replaced by another new silicon wafer. The new silicon wafer is prealigned on the first wafer table in the measurement zone. At this time, the system returns to the initial working state, an operating cycle of transposition operation of the two wafer tables is completed, and the measurement, exposure, and transposition processes of the two wafer tables are all completed via wireless communication.
The proposed device is a vector arc revolve transposition device for moving a magnet levitated dualtable system based on a revolve balance mass block. The device comprises a support frame 1, a balance mass block 2, a first wafer table 4a, a second wafer table 4b and a wireless charging transmitter 30. The balance mass block 2 is positioned above the support frame 1, a stator of a macro planar motor 3 is mounted on an upper planar surface of the balance mass block 2, and a bottom of the balance mass block 2 is connected with a revolve shaft 10, an airfoil is provided between the balance mass block 2 and the supporting frame 1 and between the revolve shaft and the supporting frame 2 respectively, the balance mass block 2 can revolve around the center of the revolve shaft 10; the first wafer table 4a and the second wafer table 4b are arranged above the stator of the macro planar motor 3; the first wafer table 4a and the second wafer table 4b are operated between a measurement zone 11 and an exposure zone 12, a measurement zone planar grating 5a and an exposure zone planar grating 5b are installed on a plane above the first wafer table 4a and the second wafer table 4b, respectively; the first wafer table 4a and the second wafer table 4b are both six-DOF (degree of freedom) magnetic steelilevitation micro-tables, which are each comprised of a chuck 401, a sucker 402, a micro-motor 403, an anticollision frame 404, a mover of the macro movement planar motor 405, a planar grating reading head 406, a leveling focusing sensor 407, a wireless charging receiver 413 and a wireless communication transceiver 414; the micro motor 403 is comprised of a mover of the micro-planar motor 408 and a mover of a gravity compensator 409; the sucker 402 is mounted on the chuck 401, and four comers of the chuck 401 are provided with four planar grating reading heads 406 and four leveling focusing sensors 407; the chuck 401 is fixed to the micro motor 403, and the anti-collision frame 404 is mounted around the micro motor 403; the mover of the macro movement planar motor 405 is arranged below the anti-collision frame 404; the mover of the macro movement planar motor 405 is formed by staggered arrangement of magnetic steel arrays 411. The stator of the macro movement planar motor 3 is arranged in herringbone arrangement of the coil arrays 412; and air cooling holes 9 are provided between the coil arrays 412.
The workflow of the presented invention is as follows. After the pre-alignment is completed in the measurement zone 11, the first wafer table 4a is driven by moving magnetic steel to the transposition position A and waits the exposure of the second wafer table 4b in the exposure zone 12. After the exposure is completed in the exposure zone, the second wafer table 4b is driven by moving magnetic steel to the table transposition position B, the first wafer table 4a and the second wafer table 4b are moved counterclockwise along the circular arc path by the planar motor vector control to complete the table transposition operation. After the table transposition is completed, the first wafer table 4a is moved to the exposure zone 12 to be exposed, and the second wafer table 4b is moved to the measurement zone 11 to change and pre-align the silicon wafer. After the wafer pre-alignment is completed, the second wafer table 4b is moved to the table transposition position A’ in the measurement zone, and waiting the first wafer table 4a is moved to the table transposition position B’ after the completion of the exposure. Then, the second wafer table 4b and the first wafer table 4a are moved clockwise along the arc path by the planar motor vector control to complete the second table transposition process. After the table transposition completed, the first wafer table 4a moves toward the measurement zone 11 and the second wafer table 4b moves toward the exposure zone 12, thus an integrated working cycle is completed.
Claims (2)
1. A vector arc revolve transposition method based on a revolve balance mass for moving magnet levitated dual-table system; comprising: in an initial working state, providing a first wafer table in a pre-alignment state in a measurement zone, providing a second wafer table in an exposure state in an exposure zone;
in a first step, driving the first wafer table to a predetermined pre-transposition position A in the measurement zone by a moving magnetic steel after pre-alignment of the first wafer table in the measurement zone is completed, the first wafer table is then charged and held;
driving the second wafer table to a predetermined position C in the exposure zone by the moving magnetic steel after exposure of the second wafer table in the exposure zone is completed;
in a second step, moving the first wafer table and the second wafer table counterclockwise along a circular arc path through a vector control of a planar motor; wherein, phases of the first and second wafer tables is maintained unchanged and movement positions of the first wafer table and the second wafer table are measured by planar gratings;
wherein a transposition process of the first wafer table and the second wafer table is completed when the first wafer table is moved to the predetermined position C in the exposure zone by a moving magnetic steel and the second wafer table is moved to a predetermined position D in the measurement zone by a moving magnetic steel;
a silicon wafer on the first wafer table is lithographed and exposed in the exposure zone; and another silicon wafer is loaded onto the second wafer table and is pre-aligned in the measurement zone;
in a third step, driving the second wafer table to the predetermined position A' in the measurement zone by the moving magnetic steel after the pre-alignment process of the second wafer table in the measurement zone is completed, then the second wafer table is charged and held;
driving the first wafer table to the predetermined position C of the exposure zone by the moving magnetic steel after an exposure process of the first wafer table in the exposure zone is completed;
in a fourth step, moving the second wafer table and the first wafer table clockwise along the circular arc path through another vector control of the planar motor;
when the second wafer table is moved to the predetermined position C in the exposure zone and the first wafer table is moved to the predetermined position D in the measurement zone, a transposition process of first and second wafer tables is completed, the second wafer table in the exposure zone enters the exposure state;
the wafer on the first wafer table is unloaded and a new wafer is loaded onto the first wafer table and is then pre-aligned whereby the system returns to the initial working state, an operating cycle including two transposition operations of the first and second wafer tables is completed, wherein the measurement, exposure, and transposition of the first and the second wafer tables are all completed via wireless communication.
2. A vector arc revolve transposition device based on a revolve balance mass for moving magnetic steel levitated dual wafer-table system; comprising a support frame (1), a balance mass block (2), a first wafer table (4a), a second wafer table (4b) and a wireless charging transmitter (30);
the balance mass block (2) is positioned above the support frame (1), a stator of a macro planar motor (3) is mounted on an upper planar surface of the balance mass block (2), and a bottom of the balance mass block (2) is connected to a revolve shaft (10), an airfoil is provided between the balance mass block (2) and the supporting frame (1) and between the revolve shaft (10) and the supporting frame (2) respectively, the balance mass block (2) is revolvable around the center of the revolve shaft (io);
the first wafer table (4a) and the second wafer table (4b) are arranged above the stator of the macro planar motor (3);
the first wafer table (4a) and the second wafer table (4b) are movable between a measurement zone (11) and an exposure zone (12), a measurement zone planar grating (5a) and an exposure zone planar grating (5b) are installed on a plane above the first wafer table (4a) and the second wafer table (4b), respectively;
the first wafer table (4a) and the second wafer table (4b) are both six-degree of freedom magnetic steel levitation micro-table, which is comprised of a chuck (401), a sucker (402), a micro-motor (403), an anti-collision frame (404), a mover of the macro movement planar motor (405), a plurality of planar grating reading heads (406), a plurality of leveling focusing sensor (407), a wireless charging receiver (413) and a wireless communication transceiver (414);
the micro motor (403) is comprised of a mover of the micro-planar motor (408) and a mover of a gravity compensator (409) integrated with the mover of the micro-planar motor (408); the sucker (402) is mounted on the chuck (401), and each of the four comers of the chuck (401) is provided with a planar grating reading head (406) and a leveling focusing sensor (407);
the chuck (401) is fixed to the micro-motor (403), and the anti-collision frame (404) is mounted around the micro-motor (403); the mover of the macro movement planar motor (405) is arranged below the anti-collision frame (404); the mover of the macro movement planar motor (405) is formed by magnetic steel arrays (411) arranged in stagger pattern;
the stator of the macro planar motor (3) is formed by a plurality of coil arrays (412) arranged in herringbone pattern; and air cooling holes are provided between the coil arrays (412).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610023027.1A CN105629676A (en) | 2016-01-14 | 2016-01-14 | Vector arc stage switching method and device for double rotary balance mass-based dynamic magnetic steel type magnetic levitation workpiece stages |
| PCT/CN2016/097504 WO2017121128A1 (en) | 2016-01-14 | 2016-08-31 | Dynamic magnetic steel magnetic levitation dual workpiece stage vector arc stage switching method and device based on rotary balance mass |
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| Publication Number | Publication Date |
|---|---|
| GB201719532D0 GB201719532D0 (en) | 2018-01-10 |
| GB2556219A true GB2556219A (en) | 2018-05-23 |
| GB2556219B GB2556219B (en) | 2021-03-17 |
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| GB1719532.2A Active GB2556219B (en) | 2016-01-14 | 2016-08-31 | Vector arc revolve transposition method for moving magnetic steel magnetic levitated dual-table system based on revolve balance mass and device thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN105629676A (en) |
| GB (1) | GB2556219B (en) |
| WO (1) | WO2017121128A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105629676A (en) * | 2016-01-14 | 2016-06-01 | 哈尔滨工业大学 | Vector arc stage switching method and device for double rotary balance mass-based dynamic magnetic steel type magnetic levitation workpiece stages |
| CN109254502B (en) * | 2018-11-14 | 2019-07-16 | 哈尔滨工业大学 | Scanning-exposure apparatus based on gas magnetic suspension and dynamic magnet steel |
| CN109870881B (en) * | 2019-03-20 | 2021-06-15 | 哈尔滨工业大学 | Macro-micro combined long-stroke precision motion platform |
| CN111830789B (en) * | 2019-04-17 | 2021-07-02 | 上海微电子装备（集团）股份有限公司 | Balance mass device and photoetching equipment |
| CN112130425B (en) * | 2020-09-30 | 2022-10-14 | 上海集成电路研发中心有限公司 | Photoetching device |
| CN112902832B (en) * | 2021-01-19 | 2023-08-25 | 上海集成电路装备材料产业创新中心有限公司 | Cylindrical grating interferometer and reading head assembly device |
| CN113745138B (en) * | 2021-09-03 | 2024-03-22 | 上海隐冠半导体技术有限公司 | Magnetic levitation device and micro-motion platform |
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|---|---|
| WO2017121128A1 (en) | 2017-07-20 |
| GB201719532D0 (en) | 2018-01-10 |
| GB2556219B (en) | 2021-03-17 |
| CN105629676A (en) | 2016-06-01 |
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