CN103548174B - 用于制造图案化层的制造设备和方法以及电学器件 - Google Patents

用于制造图案化层的制造设备和方法以及电学器件 Download PDF

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Publication number
CN103548174B
CN103548174B CN201280024866.5A CN201280024866A CN103548174B CN 103548174 B CN103548174 B CN 103548174B CN 201280024866 A CN201280024866 A CN 201280024866A CN 103548174 B CN103548174 B CN 103548174B
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China
Prior art keywords
layer
substrate
unit
layer material
area
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Expired - Fee Related
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CN201280024866.5A
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English (en)
Chinese (zh)
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CN103548174A (zh
Inventor
C.里克斯
P.G.M.克鲁伊特
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Koninklijke Philips NV
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Koninklijke Philips NV
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
CN201280024866.5A 2011-05-23 2012-05-09 用于制造图案化层的制造设备和方法以及电学器件 Expired - Fee Related CN103548174B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11167070.9 2011-05-23
EP11167070 2011-05-23
PCT/IB2012/052292 WO2012160468A1 (en) 2011-05-23 2012-05-09 Fabrication apparatus for fabricating a patterned layer

Publications (2)

Publication Number Publication Date
CN103548174A CN103548174A (zh) 2014-01-29
CN103548174B true CN103548174B (zh) 2016-09-28

Family

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CN201280024866.5A Expired - Fee Related CN103548174B (zh) 2011-05-23 2012-05-09 用于制造图案化层的制造设备和方法以及电学器件

Country Status (5)

Country Link
US (1) US9472787B2 (cg-RX-API-DMAC10.html)
EP (1) EP2715829B1 (cg-RX-API-DMAC10.html)
JP (1) JP6058640B2 (cg-RX-API-DMAC10.html)
CN (1) CN103548174B (cg-RX-API-DMAC10.html)
WO (1) WO2012160468A1 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103548173B (zh) * 2011-05-23 2016-08-10 Oled工厂有限责任公司 用于制造层结构的制造设备
JP6434029B2 (ja) 2013-09-06 2018-12-05 ソルベイ スペシャルティ ポリマーズ イタリー エス．ピー．エー． 導電性アセンブリ
JP6836908B2 (ja) * 2017-01-10 2021-03-03 住友化学株式会社 有機デバイスの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070259474A1 (en) * 2006-05-03 2007-11-08 Korean Institute Of Machinery & Materials Method for forming high-resolution pattern having desired thickness or high aspect ratio using deep ablation
CN101267702A (zh) * 2007-03-15 2008-09-17 财团法人山形县产业技术振兴机构 有机el发光装置及其制造方法
EP2086033A1 (en) * 2008-01-31 2009-08-05 Applied Materials, Inc. Method of coating a substrate and coating installation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
EP1455985A1 (en) * 2001-12-21 2004-09-15 iFire Technology Inc. Method of laser ablation for patterning thin film layers for electroluminescent displays
KR100778286B1 (ko) * 2001-12-29 2007-11-22 엘지.필립스 엘시디 주식회사 유기전기발광소자의 제조 방법
US7288469B2 (en) 2004-12-03 2007-10-30 Eastman Kodak Company Methods and apparatuses for forming an article
WO2006076612A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
KR100833017B1 (ko) * 2005-05-12 2008-05-27 주식회사 엘지화학 직접 패턴법을 이용한 고해상도 패턴형성방법
US7510951B2 (en) * 2005-05-12 2009-03-31 Lg Chem, Ltd. Method for forming high-resolution pattern with direct writing means
EP1905106B1 (en) * 2005-06-30 2010-12-29 Koninklijke Philips Electronics N.V. Method for generating an electrode layer pattern in an organic functional device
DE102007043182A1 (de) * 2007-09-11 2009-03-12 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung dicker Leiterbahnen auf Halbleiterbauelementen und Halbleiterbauelement
EP2560462B1 (en) * 2010-06-07 2019-02-27 Nec Lighting, Ltd. Organic electroluminescent illumination device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070259474A1 (en) * 2006-05-03 2007-11-08 Korean Institute Of Machinery & Materials Method for forming high-resolution pattern having desired thickness or high aspect ratio using deep ablation
CN101267702A (zh) * 2007-03-15 2008-09-17 财团法人山形县产业技术振兴机构 有机el发光装置及其制造方法
EP2086033A1 (en) * 2008-01-31 2009-08-05 Applied Materials, Inc. Method of coating a substrate and coating installation

Also Published As

Publication number Publication date
JP6058640B2 (ja) 2017-01-11
US20140203250A1 (en) 2014-07-24
JP2014517998A (ja) 2014-07-24
US9472787B2 (en) 2016-10-18
CN103548174A (zh) 2014-01-29
EP2715829A1 (en) 2014-04-09
WO2012160468A1 (en) 2012-11-29
EP2715829B1 (en) 2016-06-29

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Effective date of registration: 20160323

Address after: Aachen

Applicant after: KONINKLIJKE PHILIPS ELECTRONICS N.V.

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Applicant before: Koninkl Philips Electronics NV

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160928

Termination date: 20170509