CN103545301A - LED component - Google Patents
LED component Download PDFInfo
- Publication number
- CN103545301A CN103545301A CN201310458556.0A CN201310458556A CN103545301A CN 103545301 A CN103545301 A CN 103545301A CN 201310458556 A CN201310458556 A CN 201310458556A CN 103545301 A CN103545301 A CN 103545301A
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- CN
- China
- Prior art keywords
- bowl cup
- pin
- led
- bowl
- monomer members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The invention relates to the technical field of LEDs and LED display screens, discloses an LED component and solves the problem that conventional LEDs are large in size, poor in heat radiation and low in stability. The LED component comprises a single-body component which comprises a bowl cup, a connecting member, connecting glue and fixing glue arranged inside the bowl cup or inside and at the top of the bowl cup, a bowl cup notch in the shape of a vertical through hole is arranged at the bottom of the bowl cup, the connecting member comprises a vertical connecting pin with the top positioned at the bowl cup notch and the lower portion positioned below the external bottom of the bowl cup, the connecting pin is fixedly connected with the bottom of the bowl cup through the connecting glue, and a crystal is placed at the internal bottom of the bowl cup and electrically connected with the connecting pin through a bonded metal wire. No conductive pin and encapsulating and fixing glue are arranged on the outer side of the LED bowl cup, so that LED size is substantially reduced, LED heat-dissipating effect and LED stability are improved, and LED light-emitting pixel, heat-dissipating effect and stability of an LED display screen are improved.
Description
Technical field
The present invention relates to LED and LED display technical field.
Background technology
LED is the light-emitting diode that LED bowl cup, conductive feet and the encapsulation fixing glue of LED chip, chip placement forms, LED display is to be installed in the circuit board and by the direct luminous display screen forming of LED lamp (also having other to control the electronic component of LED lamp on wiring board), the particularly three-in-one full color display of RGB by a plurality of LED.Existing LED bowl cup bottom is not breach for placing the vertical perforation of vertical conductive feet, be no less than 1 conductive feet in LED bowl cup outside or through LED bowl cup arranged outside, vertically the conductive feet of form is not in LED bowl cup bottom, to arrange or do not have the conductive feet of vertical form, LED volume is larger, can not meet the demand of the little high density display screen of LED spacing; The packed fixing glue of LED bowl cup of existing metal material encases, weak heat-dissipating, poor stability, the LED bowl cup of existing non-metallic material consists of the very poor colloid of thermal conductivity, weak heat-dissipating, poor stability, so the LED display weak heat-dissipating and the poor stability that adopt existing LED to make.Such as adopting existing straight cutting LED to do outdoor LED display screen, because being no less than 1 conductive feet, existing straight cutting LED wraps in the packed fixing glue of LED bowl cup of LED bowl cup outside and whole metal material, encapsulation fixing glue thermal conductivity is very poor, so existing straight cutting LED volume is large and dispel the heat very poorly, cannot adopt existing straight cutting LED to do outdoor high definition and stable LED display; Such as adopting existing paster LED, do outdoor LED display screen, because the brightness of existing paster LED is low, conductive feet is all passed through LED bowl cup outside, so need the existing paster LED that volume is larger, do outdoor LED display screen (the existing paster LED that the low required power larger volume of brightness is larger), and existing paster LED volume is large and weak heat-dissipating, cannot adopt existing paster LED to do outdoor high definition and stable LED display; Such as adopting existing straight cutting LED to do indoor LED display, because existing straight cutting LED is no less than 1 conductive feet in LED bowl cup outside and existing straight cutting LED lighting angle is little and perverse eye, so cannot adopt existing straight cutting LED to do indoor high definition and good LED display; Such as adopting existing paster LED to do indoor LED display, conductive feet is all passed through LED bowl cup outside, and weak heat-dissipating, so existing paster LED volume is larger, cannot adopt existing paster LED to do indoor high definition and stable LED display.
Summary of the invention
The present invention exists in order to solve existing LED that volume is large, the problem of weak heat-dissipating and poor stability, proposes a kind of LED member, and the technical solution used in the present invention is:
A member, includes luminescence component, and described luminescence component includes monomer members; Described monomer members includes the connection glue of bowl cup, connector, insulation and is arranged at bowl cup inside or is arranged at bowl cup inside and the fixing glue at bowl glass top; Described bowl cup bottom is provided with the bowl cup breach of vertical through holes shape, and described connector includes top and is positioned at the vertical connecting pin that bowl cup indentation, there bottom is positioned at bowl cup outer bottom below, and connecting pin is fixedly connected with bowl cup bottom by connecting glue; Described monomer members also includes the crystal of being placed by colloid by bowl cup inner bottom part, and crystal is electrically connected by bonding wire and connecting pin.
Described connecting pin includes 3 independent pins of a row, and it is the chip of 3 that described crystal includes quantity, and the pin described in 3 is electrically connected with the chip described in 3 respectively.
Described connecting pin also includes 1 public pin be arrangeding in parallel with pin, and public pin end face is placed described chip by colloid, and public pin and chip are electrically connected.
Described bowl cup is metal material, connector also includes 1 condominium pin be arrangeding in parallel with pin, condominium pin is connected with a bowl cup outer bottom by welding or electroplating technology, condominium pin by bottom described connection glue and bowl cup and described pin be fixedly connected with.
Described bowl cup be connected glue and be structure as a whole.
Described luminescence component also includes complex member.
Described complex member is the form that a plurality of described monomer members become a line or row to arrange by bowl cup level connection joint, and the public pin that is arranged in all described monomer members is structure as a whole.
Described complex member is the form that a plurality of described monomer members become a line or row to arrange by bowl cup level connection joint, and the condominium pin that is arranged in all described monomer members is structure as a whole.
Described complex member is the form that a plurality of described monomer members have the matrix of row to arrange by bowl cup level connection joint Cheng Youhang, and the public pin that is arranged in the monomer members of a line or row is structure as a whole.
Described complex member is the form that a plurality of described monomer members have the matrix of row to arrange by bowl cup level connection joint Cheng Youhang, and the condominium pin that is arranged in the monomer members of a line or row is structure as a whole.
Beneficial effect of the present invention and the reason that produces this effect are: the present invention is in a kind of LED member, bowl cup inner bottom part is provided with bowl cup breach, there is top to be positioned at the vertical connecting pin that bowl cup indentation, there bottom is positioned at bowl cup outer bottom below, connecting pin is fixedly connected with bowl cup bottom by connecting glue, fixing glue is arranged at bowl cup inside or is arranged at a bowl glass inner and bowl glass top, there is no conductive feet in LED bowl cup outside or through LED bowl cup outside, LED bowl cup outside does not encapsulate fixing glue, so can significantly reduce LED volume, significantly improve LED radiating effect, improve LED stability.And connecting pin includes 3 independent pins of a row, it is the chip of 3 that crystal includes quantity, pin described in 3 is electrically connected with the chip described in 3 respectively, connecting pin also includes 1 public pin be arrangeding in parallel with pin, public pin end face is by colloid chip placement, public pin and chip are electrically connected, public pin has enough spaces below bowl cup inner bottom part and bowl cup outer bottom, public pin strengthens to be more beneficial to and improves LED radiating effect, and reduced LED conductive feet quantity, be more beneficial to and reduce LED volume.When bowl cup is metal material, connector also includes 1 condominium pin be arrangeding in parallel with pin, condominium pin is connected with described bowl cup outer bottom by welding or electroplating technology, condominium pin is fixedly connected with bowl cup bottom and pin by connecting glue, the bowl cup of metal material has exposed part to be conducive to improve LED radiating effect, condominium pin has enough spaces below bowl cup outer bottom, and condominium pin strengthens to be more beneficial to and improves LED radiating effect.Generally speaking can significantly reduce LED volume, significantly improve LED radiating effect, significantly improve LED stability, can significantly improve the LED light emitting pixel of LED display unit are, significantly improve resolution and the definition of LED display, be conducive to significantly improve LED display radiating effect, significantly improve LED display stability, be conducive to adopt LED to do outdoor or indoor high definition and stable LED display.
Accompanying drawing explanation
Fig. 1 is the sectional structure schematic diagram of the embodiment of the present invention 1;
Fig. 2 is the bowl cup of embodiment 1 and the plan structure simplified schematic diagram that bowl cup indentation, there is provided with pin;
Fig. 3 is the sectional structure schematic diagram of the embodiment of the present invention 2;
Fig. 4 is the bowl cup of embodiment 2 and the plan structure simplified schematic diagram that bowl cup indentation, there is provided with pin.
Embodiment
The present embodiment is the preferred embodiment of the present invention, and other every its principle is identical with the present embodiment or approximate with basic structure, all within protection range of the present invention.
Shown in seeing figures.1.and.2, the present invention includes luminescence component, described luminescence component includes monomer members, described monomer members includes the connection glue of bowl cup 1, connector, insulation and is arranged at bowl cup 1 inner or be arranged at the fixing glue 5 at inner and bowl cup 1 top of bowl cup 1, it is bowl cup breach 12 that bowl cup 1 bottom is provided with for placing the vertical through holes of vertical connecting pin, connector includes top and is positioned at the vertical connecting pin that bowl cup breach 12 bottoms, place are positioned at bowl cup 1 outer bottom below, and connecting pin is fixedly connected with bowl cup 1 bottom by connecting glue; Described monomer members also includes the crystal 4 of being placed by colloid by bowl cup 1 inner bottom part, and crystal 4 is electrically connected by bonding wire and connecting pin.
Described connecting pin includes 3 independent pins 22 of a row, and it is the chip of 3 that crystal 4 includes quantity, and the pin 22 described in 3 is electrically connected with the chip described in 3 respectively.
Described connecting pin also includes 1 public pin 23 be arrangeding in parallel with pin 22, and described public pin 23 end faces are placed described chip by colloid, and public pin 23 is electrically connected by least one and chip in conducting resinl and two kinds of modes of bonding wire.
Described bowl cup 1 is metal material or nonmetallic colloid, and when bowl cup 1 nonmetallic colloid, bowl cup 1 is structure as a whole with the described glue that is connected.
The bowl cup breach 12 of the present embodiment 1 has two, and one of them places pin 22, and another places public pin 23.
Described luminescence component also includes complex member.
Described complex member is the form that a plurality of described monomer members become a line or row to arrange by bowl cup 1 level connection joint, and the public pin 23 that is arranged in all described monomer members is structure as a whole.
Described complex member is the form that a plurality of described monomer members have the matrix of row to arrange by bowl cup 1 level connection joint Cheng Youhang, and the public pin 23 that is arranged in the monomer members of a line or row is structure as a whole.
Embodiment 2
Shown in Fig. 3 and Fig. 4, the present invention includes luminescence component, described luminescence component includes monomer members, monomer members includes the connection glue of bowl cup 1, connector, insulation and is arranged at bowl cup 1 inner or be arranged at the fixing glue 5 at inner and bowl cup 1 top of bowl cup 1, it is described bowl cup breach 12 that bowl cup 1 bottom is provided with for placing the vertical through holes of vertical connecting pin, connector includes top and is positioned at the vertical connecting pin that bowl cup breach 12 bottoms, place are positioned at bowl cup 1 outer bottom below, and connecting pin is fixedly connected with bowl cup 1 bottom by described connection glue; Described monomer members also includes the crystal 4 of being placed by colloid by bowl cup 1 inner bottom part, and crystal 4 is electrically connected by bonding wire and connecting pin.
Described connecting pin includes 3 independent pins 22 of a row, and it is the chip of 3 that crystal 4 includes quantity, and the pin 22 described in 3 is electrically connected with the chip described in 3 respectively.
Described bowl cup 1 is metal material, connector also includes 1 condominium pin 3 be arrangeding in parallel with described pin, condominium pin 3 is connected with bowl cup 1 outer bottom by welding or electroplating technology, and condominium pin 3 is fixedly connected with bowl cup 1 bottom and pin 22 by connecting glue.
The bowl cup breach 12 of the present embodiment 2 is one, and bowl cup breach 12 is placed pin 22.
Described luminescence component also includes complex member.
Described complex member is the form that a plurality of described monomer members become a line or row to arrange by bowl cup 1 level connection joint, and the condominium pin 3 that is arranged in all described monomer members is structure as a whole.
Described complex member is the form that a plurality of described monomer members have the matrix of row to arrange by bowl cup 1 level connection joint Cheng Youhang, and the condominium pin 3 that is arranged in the monomer members of a line or row is structure as a whole.
Described bowl cup 1 lateral surface main body and bowl cup 1 inside subject are circular or square, also can be circular and square synthesis, such as bowl cup 1 lateral surface main body is square, four jiaos of place's roundings, for convenient for production, for the performance of product is good, can be also the combination of other various forms, such as bowl cup 1 medial surface main body is truncated cone-shaped, bowl cup 1 bottom is square.The fixing glue 5 of described bowl cup 1 can be at the plane place of bowl cup 1 end face, also can above bowl cup 1 end face or below locate, in the time of above bowl cup 1 end face, can have at middle part circular arc projection.
For the ease of welded wire, can be crooked or strengthen in pin 22 tops; For the ease of placing crystal 4 and welded wire, and for better heat radiation, can be crooked or strengthen in public pin 23 tops; For the ease of condominium pin 3, be connected with bowl cup 1 outer bottom, and for condominium pin 3 is beneficial to heat radiation, 3 tops bending or the increasings of condominium pin; For luminescence component easy for installation in the circuit board, pin 22, public pin 23 and condominium pin 3 can be in its underpart or lower end place reduce, also can also polish at its lower end place, the pin that can make straight cutting also can be made the pin of energy paster, can make longer pin and also can make shorter pin.
For the ease of the production of LED display, the spacing between the monomer members in described complex member is identical with the spacing of the LED light emitting pixel point of LED display.
For the ease of the production of described luminescence component, adopt a plurality of luminescence components by plane link, to connect into the LED support of flat state.
Adopt the punching press of book sheet metal to be formed with the pin 22 that crossbeam bar connects, adopt the punching press of book sheet metal to be formed with public pin 23 or the condominium pin 3 that crossbeam bar connects, pin 22 needs to electroplate, and public pin 23 or condominium pin 3 need to electroplate.
When described bowl cup 1 is metal material, adopt the punching press of book sheet metal to be formed with the bowl cup 1 of bowl cup breach 12, bowl cup 1 needs to electroplate, and condominium pin 3 is connected with described bowl cup 1 outer bottom by welding or electroplating technology, and pin 22, condominium pin 3, bowl cup 1 and link encapsulating form LED support.
When described bowl cup 1 is non-metallic material, pin 22, public pin 23 and link encapsulating are formed with the LED support of bowl cup 1.
In order to facilitate the production of LED, 100 millimeters to 200 millimeters of LED support length, in order to reduce the production cost of luminescence component and to improve the efficiency of producing luminescence component, can adopt following methods: plane link adopts book iron plate to be stamped to form and plane link need not be electroplated; When bowl cup 1 is metal material, punching press bowl cup 1 and plane link adopt same book sheet metal; In die bond machine, adopt a plurality of suction crystal-tippeds and each suction crystal-tipped corresponding a slice LED support respectively, adopt a plurality of Glue dripping heads and each Glue dripping head corresponding a slice LED support respectively; In bonding equipment, adopt a plurality of soldering tips and each soldering tip corresponding a slice LED support or two corresponding a slice LED supports of soldering tip respectively; Point gum machine adopts a plurality of Glue dripping heads and each Glue dripping head corresponding a slice LED support respectively; LED support horizontal positioned in more than producing, between two LED supports, can there is certain spacing, be convenient to a binder block web beam that front and back are moved towards is set between two LED supports and in the corresponding position that there is no LED support, or be convenient to have sufficient space that two binder blocks are set, adopt two binder blocks to compress respectively two LED supports, binder block is the binder parts of the LED support of elastic compression up and down in the material workbench of LED production equipment, and LED production equipment has bonding equipment, die bond machine and point gum machine etc.; For in LED production equipment to the quick pickup image of the element in LED support, the video camera in LED production equipment is connected with the shockproof box that loose element is housed for video camera damping by contiguous block; In order in bonding equipment, LED support better to be heated, binder block can be installed heat-generating pipe or contact with heater elastic tight by metal derby.
Because bowl cup inner bottom part is provided with bowl cup breach, there is top to be positioned at the vertical connecting pin that bowl cup indentation, there bottom is positioned at bowl cup outer bottom below, connecting pin is fixedly connected with bowl cup bottom by connecting glue, fixing glue is arranged at bowl cup inside or is arranged at a bowl glass inner and bowl glass top, so there is no conductive feet in LED bowl cup outside or through LED bowl cup outside, LED bowl cup outside does not encapsulate fixing glue, so can significantly reduce LED volume, significantly improve LED radiating effect, improve LED stability.And adopt described public pin or common pins method, and be more beneficial to and improve LED radiating effect, and reduced LED conductive feet quantity, be more beneficial to and reduce LED volume.
Claims (10)
1. a LED member, is characterized in that: include luminescence component, described luminescence component includes monomer members; Described monomer members includes the connection glue of bowl cup, connector, insulation and is arranged at bowl cup inside or is arranged at bowl cup inside and the fixing glue at bowl glass top; Described bowl cup bottom is provided with the bowl cup breach of vertical through holes shape, and described connector includes top and is positioned at the vertical connecting pin that bowl cup indentation, there bottom is positioned at bowl cup outer bottom below, and connecting pin is fixedly connected with bowl cup bottom by connecting glue; Described monomer members also includes the crystal of being placed by colloid by bowl cup inner bottom part, and crystal is electrically connected by bonding wire and connecting pin.
2. a kind of LED member according to claim 1, is characterized in that: described connecting pin includes 3 independent pins of a row, and it is the chip of 3 that described crystal includes quantity, and the pin described in 3 is electrically connected with the chip described in 3 respectively.
3. a kind of LED member according to claim 2, is characterized in that: described connecting pin also includes 1 public pin be arrangeding in parallel with pin, and public pin end face is placed described chip by colloid, and public pin and chip are electrically connected.
4. a kind of LED member according to claim 2, it is characterized in that: described bowl cup is metal material, connector also includes 1 condominium pin be arrangeding in parallel with pin, condominium pin is connected with a bowl cup outer bottom by welding or electroplating technology, and condominium pin is by connecting bottom glue and bowl cup and described pin is fixedly connected with.
5. a kind of LED member according to claim 2, is characterized in that: described bowl cup be connected glue and be structure as a whole.
6. a kind of LED member according to claim 1, is characterized in that: described luminescence component also includes complex member.
7. according to claim 6 and a kind of LED member claimed in claim 3, it is characterized in that: described complex member is the form that a plurality of described monomer members become a line or row to arrange by bowl cup level connection joint, and the public pin that is arranged in whole described monomer members is structure as a whole.
8. according to claim 6 and a kind of LED member claimed in claim 4, it is characterized in that: described complex member is the form that a plurality of described monomer members become a line or row to arrange by bowl cup level connection joint, and the condominium pin that is arranged in whole described monomer members is structure as a whole.
9. according to claim 6 and a kind of LED member claimed in claim 3, it is characterized in that: described complex member is the form that a plurality of described monomer members have the matrix of row to arrange by bowl cup level connection joint Cheng Youhang, the public pin that is arranged in the monomer members of a line or row is structure as a whole.
10. according to claim 6 and a kind of LED member claimed in claim 4, it is characterized in that: described complex member is the form that a plurality of described monomer members have the matrix of row to arrange by bowl cup level connection joint Cheng Youhang, the condominium pin that is arranged in the monomer members of a line or row is structure as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310458556.0A CN103545301A (en) | 2013-10-03 | 2013-10-03 | LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310458556.0A CN103545301A (en) | 2013-10-03 | 2013-10-03 | LED component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103545301A true CN103545301A (en) | 2014-01-29 |
Family
ID=49968610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310458556.0A Pending CN103545301A (en) | 2013-10-03 | 2013-10-03 | LED component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103545301A (en) |
-
2013
- 2013-10-03 CN CN201310458556.0A patent/CN103545301A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140129 |
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| WD01 | Invention patent application deemed withdrawn after publication |