CN103545238A - Tape expanding apparatus - Google Patents
Tape expanding apparatus Download PDFInfo
- Publication number
- CN103545238A CN103545238A CN201310290007.7A CN201310290007A CN103545238A CN 103545238 A CN103545238 A CN 103545238A CN 201310290007 A CN201310290007 A CN 201310290007A CN 103545238 A CN103545238 A CN 103545238A
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- Prior art keywords
- limit
- mentioned
- clamping components
- clamping
- splicing tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Abstract
This utility model discloses a tape expanding apparatus, which can clamp the opposite ends of adhesive tape to stretch. Even the adhesive tape is expanded, two sides are no shrank wherein one side is in a lateral direction and the other side is in a vertical direction. Even the two sides are clamped, the adhesive tape can still be expanded. A tape expanding apparatus for expanding the rectangle tape possesses a first clamping member which clamps the first side of the tape, a second clamping member which clamps the second side opposite to the first side, a third clamping member which clamp the third side vertically crossing with the first side and the second side, a fourth clamping member which clamps the forth side opposite to the third side, and an expanding member which enables the four clamping members to move toward the direction perpendicular to four clamping members. The clamping members respectively have the lower clamping members and the upper clamping members. A plurality of rotary rollers on the surfaces of the lower clamping members are positioned along the sides, and a plurality of rotary rollers on the surfaces of the upper clamping members are positioned along the sides.
Description
Technical field
Thereby the splicing tape that the present invention relates to be pasted with for expanding wafer applies the band extension fixture of external force to wafer.
Background technology
In semiconductor device manufacturing process, marking off a plurality of regions for the surface of the semiconductor wafer of circular plate shape roughly by being arranged as the cancellate preset lines of cutting apart that is called spacing track, in the region marking off at this, form IC(integrated circuit), LSI(large scale integrated circuit) etc. device.Then, thus along spacing track, cutting off semiconductor wafer cuts apart thus the region that is formed with device and produces device one by one.In addition, for the surface at sapphire substrate, be laminated with the optical device wafer of gallium nitride compound semiconductor etc., also along the predetermined preset lines of cutting apart, cut off, thereby be partitioned into the optical device such as light-emitting diode, laser diode one by one, and extensively use electric equipment.
As the method for cutting apart the machined objects such as above-mentioned semiconductor wafer or optical device wafer, following methods is practical: use the pulse laser light with respect to machined object with radioparent wavelength, the inside that focal point is registered to the region that should cut apart is irradiated, inside at this machined object forms modified layer continuously along spacing track, along owing to forming this modified layer, the spacing track of strength decreased applies external force, cut apart thus machined object (for example,, with reference to patent documentation 1).
And, as along owing to being formed with modified layer, the spacing track of strength decreased applies the technology of external force, following technology is recorded in following patent documentation 2: expansion is pasted with the splicing tape of wafer, then, under the state of having expanded splicing tape by the framework of ring-type around be divided into device one by one wafer paste splicing tape.
Prior art document
Patent documentation 1: No. 3408805 communique of Japan Patent
Patent documentation 2: TOHKEMY 2006-229021 communique
Summary of the invention
Yet, there is following problem to being pasted with the technology that the splicing tape of wafer expands in what be recorded in above-mentioned patent documentation 2: owing to being the method that the opposed both sides of clamping splicing tape stretch, so the both sides of quadrature dwindle, thereby the device that sticks on splicing tape and be divided into is one by one sustained damage.And there is following problem: while stretching opposed both sides under the state on both sides that has clamped quadrature, splicing tape is fully expansion not.
The present invention is the invention of making in view of the above fact, its major technique problem is to provide band extension fixture, its opposed both sides that can clamp splicing tape stretch, even expansion splicing tape, the both sides of quadrature can not dwindle yet, even and if can fully expand splicing tape under the state on both sides that has clamped quadrature yet.
In order to solve above-mentioned major technique problem, according to the present invention, provide a kind of band extension fixture of expanding the band of rectangular shape, above-mentionedly with extension fixture, be characterised in that, it has: the 1st clamping components, it is for the 1st limit of clamping band, the 2nd clamping components, its for clamping band with opposed the 2nd limit, above-mentioned the 1st limit, the 3rd clamping components, it is for clamping band and the 3rd limit above-mentioned the 1st limit and above-mentioned the 2nd limit quadrature, the 4th clamping components, its for clamping band with opposed the 4th limit, above-mentioned the 3rd limit, and expansion, it is for making above-mentioned the 1st clamping components, above-mentioned the 2nd clamping components, above-mentioned the 3rd clamping components, and above-mentioned the 4th clamping components moves in the direction of each limit quadrature with respect to clamping respectively, above-mentioned the 1st clamping components, above-mentioned the 2nd clamping components, above-mentioned the 3rd clamping components, and above-mentioned the 4th clamping components has respectively downside hold assembly and upside hold assembly, upper surface at above-mentioned downside hold assembly is equipped with a plurality of rollers at the direction rotation on the limit along clamping, lower surface at above-mentioned upside hold assembly is equipped with a plurality of rollers at the direction rotation on the limit along clamping.
Invention effect
In the band extension fixture forming according to the present invention, due to the 1st clamping components, the 2nd clamping components, the 3rd clamping components, and the 4th clamping components there is respectively downside hold assembly and upside hold assembly, upper surface at downside hold assembly is equipped with a plurality of rollers at the direction rotation on the limit along clamping, lower surface at upside hold assembly is equipped with a plurality of rollers at the direction rotation on the limit along clamping, so for example on clamping the 3rd limit of splicing tape and when the 4th limit expands, even if utilize clamping and downside hold assembly and the upside hold assembly of the 3rd limit and the 1st limit of the 4th limit quadrature and the 1st clamping components on the 2nd limit and the 2nd clamping components to clamp, owing to being equipped on a plurality of roller rotations of downside hold assembly and upside hold assembly, so can expand fully splicing tape.In addition, on clamping the 1st limit of splicing tape and when the 2nd limit expands, even if utilize clamping and downside hold assembly and the upside hold assembly of the 1st limit and the 3rd limit of the 2nd limit quadrature and the 3rd clamping components on the 4th limit and the 4th clamping components to clamp, owing to being equipped on a plurality of roller rotations of downside hold assembly and upside hold assembly, so can expand fully splicing tape.
Accompanying drawing explanation
Fig. 1 is the stereogram with extension fixture forming according to the present invention.
Fig. 2 amplifies to represent the downside hold assembly of the clamping components with extension fixture shown in pie graph 1 and the front elevation of the major part of upside hold assembly.
Fig. 3 is the key diagram by the band of implementing with the extension fixture clamping operation shown in Fig. 1.
Fig. 4 is with the 1st key diagram with expansion process of implementing with extension fixture shown in Fig. 1.
Fig. 5 is with the 2nd key diagram with expansion process of implementing with extension fixture shown in Fig. 1.
Fig. 6 means to stick on and has implemented the 1st with expansion process and the 2nd key diagram with the state that is divided into device one by one on the splicing tape of expansion process.
Fig. 7 is the key diagram by the frame installation operation of implementing with extension fixture shown in Fig. 1.
Fig. 8 means the frame installation operation of having implemented shown in Fig. 7, and the wafer 10 that is formed with interval (s) between splicing tape is by the device being divided into is one by one supported on the cutaway view of the state of ring-shaped frame.
Fig. 9 is the vertical view of the splicing tape by being expanded with extension fixture.
Label declaration
1: splicing tape
2: band extension fixture
20: fixed pedestal
3: circular holding table
4a: the 1st clamping components
4b: the 2nd clamping components
4c: the 3rd clamping components
4d: the 4th clamping components
41: movable base
42: downside fixture
422: downside hold assembly
423: roller
43: upside fixture
432: upside hold assembly
433: roller
44: the 1 travel mechanisms
45: the 2 travel mechanisms
5a: the 1st band expansion
5b: the 2nd band expansion
5c: the 3rd band expansion
5d: the 4th band expansion
7: ring-shaped frame
10: wafer.
Embodiment
Below, preferred embodiment at length the describing with extension fixture to the formation according to the present invention with reference to accompanying drawing.
Fig. 9 represents by the vertical view of the splicing tape with extension fixture expansion.Illustrated splicing tape 1 forms square (rectangle), and has: the 1st limit 1a, with opposed the 2nd limit 1b of the 1st limit 1a, with the 3rd limit 1c of the 1st limit 1a and the 2nd limit 1b quadrature and with opposed the 4th limit 1d of the 3rd limit 1c.Surface-coated at the splicing tape 1 forming like this has adhesive linkage, at this surperficial central portion, is pasted with wafer 10.In addition, in the illustrated embodiment, wafer 10 consists of such semiconductor wafer: surperficial 10a clathrate be formed with a plurality of spacing tracks 101, and in a plurality of regions that mark off by the plurality of spacing track 101, be formed with respectively device 102, wafer 10 is divided into device 102 one by one along spacing track 101.
Next, with reference to Fig. 1 and Fig. 2, the band extension fixture of expansion splicing tape 1 is described, on above-mentioned splicing tape 1, be pasted with the above-mentioned wafer 10 of device 102 one by one that is divided into.Fig. 1 represents according to the present invention and the stereogram of the execution mode with extension fixture that forms.Band extension fixture 2 in execution mode shown in Fig. 1 has: fixed pedestal 20; Circular holding table 3, it is equipped on the central portion upper surface of this fixed pedestal 20, for loading above-mentioned splicing tape 1; The 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d, it is for clamping the above-mentioned splicing tape 1 that is loaded into this holding table 3; And the 1st band expansion 5a, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion 5d, it is for making the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c, the 4th clamping components 4d moving radially at circular holding table 3 respectively.
Above-mentioned fixed pedestal 20 forms rectangular shape, and surface is formed with each other with the angle of 90 degree and the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d that are formed centrally in the holding table 3 of above-mentioned circle thereon.In addition, the peripheral part that is formed with above-mentioned the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d of fixed pedestal 20 forms towards foreign side outstanding.
By supporting member 30, the holding table of above-mentioned circle 3 is supported on to the upper surface of fixed pedestal 20.In the illustrated embodiment, this supporting member 30 is configured to, and holding table 3 can be moved at above-below direction.
Respectively above-mentioned the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d are equipped on above the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d forming at above-mentioned fixed pedestal 20.That is, 4 clamping components 4a, 4b, 4c, 4d Zhou Fangxiang each other with equal angles set.In the illustrated embodiment, the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d that are equipped on like this on fixed pedestal 20 are identical structure, and they have separately: movable base 41, and it forms L word shape; Downside fixture 42 and upside fixture 43, it can be arranged on this movable base 41 movably at above-below direction; He 1 travel mechanism 44 and the 2nd travel mechanism 45, it makes respectively this downside fixture 42 and upside fixture 43 move at above-below direction.Movable base 41 consists of following part: moving part 411 and from the vertical support portion 412 forming of establishing of the upper surface of this moving part 411.Lower surface at moving part 411 is respectively arranged with the directed track 411a coordinating with above-mentioned the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d, this directed track 411a coordinates with above-mentioned the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d respectively, movable base 41 is configured to thus, can along above-mentioned the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d, at fixed pedestal 20, move respectively.In addition, in moving part 411, be formed through internal thread 411b.The medial surface of above-mentioned support portion 412 (side opposite each other) is provided with the guide rail 412a extending at above-below direction, and the lateral surface of above-mentioned support portion 412 is formed with the elongated slot 412b extending at above-below direction.In addition, at guide rail 412a, be formed with the slotted hole 412c that arrives above-mentioned elongated slot 412b and extend at above-below direction from medial surface.
Above-mentioned downside fixture 42 consists of following part: support arm 421, and it is adapted to and can moves along the guide rail 412a that is arranged at the support portion 412 of above-mentioned movable base 41; And downside hold assembly 422, it is installed on this support arm 421.Cardinal extremity at support arm 421 is provided with the directed groove 421a coordinating with above-mentioned guide rail 412a, by this directed groove 421a is coordinated with guide rail 412a, support arm 421 is configured to and can along guide rail 412a, at above-below direction, moves in the support portion 412 of movable base 41.In addition, at the base portion of support arm 421, be provided with the internal thread piece 421c with internal thread 421b, this internal thread piece 421c runs through above-mentioned slotted hole 412c and sets.In the illustrated embodiment, above-mentioned downside hold assembly 422 forms rectangular-shaped, and towards setting long side direction with the direction of directed track 411a quadrature.The upper surface of the clamping face of the downside hold assembly 422 forming like this in conduct, is equipped with a plurality of rollers 423 in the long side direction rotation of downside hold assembly 422.
Above-mentioned upside fixture 43 consists of following part: support arm 431, and it is adapted to and can moves along the guide rail 412a that is arranged at the support portion 412 of above-mentioned movable base 41; And upside hold assembly 432, it is installed on this support arm 431.Cardinal extremity at support arm 431 is provided with the directed groove 431a coordinating with above-mentioned guide rail 412a, by this directed groove 431a is coordinated with guide rail 412a, support arm 431 is configured to and can along guide rail 412a, at above-below direction, moves in the support portion 412 of movable base 41.In addition, at the base portion of support arm 431, be provided with the internal thread piece 431c with internal thread 431b, this internal thread piece 431c runs through above-mentioned slotted hole 412c and sets.In the illustrated embodiment, above-mentioned upside hold assembly 432 forms rectangular-shaped, and towards setting long side direction with the direction of directed track 411a quadrature.At the lower surface of the clamping face side of the upside hold assembly 432 as forming like this, a plurality of roller 433(that are equipped with in the long side direction rotation of upside hold assembly 432 are with reference to Fig. 2).As shown in Figure 2, the plurality of roller 433 sets opposed to each other with a plurality of rollers 423 that are equipped on the downside hold assembly 422 of above-mentioned downside fixture 42.
The 1st travel mechanism 44 that above-mentioned downside fixture 42 moves at above-below direction is consisted of: external thread rod 441 following part, itself and guide rail 412a are equipped in the elongated slot 412b forming in the support portion 412 of above-mentioned movable base 41 abreast, and screw togather with the internal thread 421b of internal thread piece 421c that is arranged at the base portion of above-mentioned support arm 421; Bearing 442, it is equipped on the support portion 412 of movable base 41, and an end of external thread rod 441 is supported for and can be rotated; And impulse motor 443, it is connected with the other end of external thread rod 441, and for rotariling actuate external thread rod 441.The 1st travel mechanism 44 forming like this makes external thread rod 441 rotate to a direction or other direction by driving pulse motor 443, and downside fixture 42 is moved at above-below direction along guide rail 412a.
Making the 2nd travel mechanism 45 that above-mentioned upside fixture 43 moves at above-below direction is structures same with above-mentioned the 1st travel mechanism 44, and it is equipped on the upside of the 1st travel mechanism 44.; the 2nd travel mechanism 45 consists of following part: external thread rod 451; itself and guide rail 412a are equipped in the elongated slot 412b of the support portion 412 that is formed on above-mentioned movable base 41 abreast, and screw togather with the internal thread 431b of internal thread piece 431c that is arranged at the base portion of above-mentioned support arm 431; Bearing 452, it is equipped on the support portion 412 of movable base 41, and an end of external thread rod 451 is supported for and can be rotated; And impulse motor 453, it is connected with the other end of external thread rod 451, and for rotariling actuate external thread rod 451.The 2nd travel mechanism 45 forming like this makes external thread rod 451 rotate to a direction or other direction by driving pulse motor 453, and upside fixture 43 is moved at above-below direction along guide rail 412a.
Along above-mentioned the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d that are formed at above-mentioned fixed pedestal 20, set and make respectively above-mentioned the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d at the 1st band expansion 5a moving radially, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion 5d of circular holding table 3 respectively.The 1st band expansion 5a, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion 5d consist of following part: external thread rod 51, it sets abreast with the 1st guiding groove 201a, the 2nd guiding groove 201b, the 3rd guiding groove 201c and the 4th guiding groove 201d respectively, and screws togather with the internal thread 411b that is formed on the moving part 411 of above-mentioned movable base 41; Bearing 52, it is equipped on above-mentioned fixed pedestal 20, and an end of external thread rod 51 is supported for and can be rotated; And impulse motor 53, it is connected with the other end of external thread rod 51, and for rotariling actuate external thread rod 51.The 1st band expansion 5a forming like this, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion 5d respectively driving pulse motor 53 make external thread rod 51 rotate to a direction or other direction, make respectively thus the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d moving radially at circular holding table 3.
Next, make the 1st band expansion 5a, the 2nd band expansion 5b, the 3rd band expansion 5c and the 4th band expansion 5d work, downside fixture 42 and the upside fixture 43 of the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d are navigated to the position that can clamp splicing tape 1.Then, make to form the 1st travel mechanism 44 and 45 work of the 2nd travel mechanism of the 1st clamping components 4a, the 2nd clamping components 4b, the 3rd clamping components 4c and the 4th clamping components 4d, as shown in FIG. 2 and 3, by the downside hold assembly 422 of downside fixture 42 and the upside hold assembly 432 of upside fixture 43, clamp each limit (band clamping operation) of splicing tape 1.
After having clamped each limit of splicing tape 1 by the downside hold assembly 422 of downside fixture 42 and the upside hold assembly 432 of upside fixture 43 as shown in FIG. 2 and 3, for example make the 3rd band expansion 5c and the 4th band expansion 5d work, make as shown in Figure 4 to form the downside fixture 42 of the 3rd clamping components 4c and the 4th clamping components 4d and upside fixture 43 direction (being left and right directions in Fig. 4) shown in arrow A 1 and A2 in Fig. 4 mobile.Its result is that splicing tape 1 is stretched in the direction shown in arrow A 1 and A2 (being left and right directions in Fig. 4) and expands (the 1st band expansion process).At this moment, the 3rd limit 1c of splicing tape 1 and the 4th limit 1d are configured downside fixture 42 and 43 clampings of upside fixture of the 3rd clamping components 4c and the 4th clamping components 4d, the 1st limit 1a of splicing tape 1 and the 2nd limit 1b and the 3rd limit 1c and the 4th limit 1d quadrature, forming clamping the 1st limit 1a of splicing tape 1 and the 1st clamping components 4a of the 2nd limit 1b and the downside fixture 42 of the 2nd clamping components 4b and the downside hold assembly 422 of upside fixture 43 and upside hold assembly 432, be equipped with a plurality of rollers 423 and 433 in long side direction (along the direction of the 1st limit 1a and the 2nd limit 1b) rotation, so when splicing tape 1 is stretched while expanding in the direction shown in arrow A 1 and A2 (being left and right directions in Fig. 4), be equipped on a plurality of rollers 423 and 433 rotations of downside hold assembly 422 and upside hold assembly 432.Therefore, when clamping the 3rd limit 1c of splicing tape 1 and the 4th limit 1d expand, even if utilize clamping and downside fixture 42 and the upside fixture 43 of the 3rd limit 1c and the 1st limit 1a of the 4th limit 1d quadrature and the 1st clamping components 4a of the 2nd limit 1b and the 2nd clamping components 4b to clamp, owing to being equipped on the downside hold assembly 422 of downside fixture 42 and upside fixture 43 and a plurality of rollers 423 of upside hold assembly 432 and 433 rotations, so can expand fully splicing tape 1.
Next, the 3rd limit 1c and the 4th limit 1d at the splicing tape 1 shown in the above-mentioned Fig. 4 of clamping have carried out under the state of expansion, as shown in Figure 5, make to form the downside fixture 42 of the 1st clamping components 4a and the 2nd clamping components 4b and upside fixture 43 direction (being above-below direction in Fig. 5) shown in arrow B 1 and B2 in Fig. 5 mobile.Its result is that splicing tape 1 is stretched in the direction shown in arrow B 1 and B2 (being above-below direction in Fig. 5) and expands (the 2nd band expansion process).At this moment, the 1st limit 1a of splicing tape 1 and the 2nd limit 1b are configured downside fixture 42 and 43 clampings of upside fixture of the 1st clamping components 4a and the 2nd clamping components 4b, the 3rd limit 1c of splicing tape 1 and the 4th limit 1d and the 1st limit 1a and the 2nd limit 1b quadrature, forming clamping the 3rd limit 1c of splicing tape 1 and the 3rd clamping components 4c of the 4th limit 1d and the downside fixture 42 of the 4th clamping components 4d and the downside hold assembly 422 of upside fixture 43 and upside hold assembly 432, be equipped with a plurality of rollers 423 and 433 in long side direction (along the direction of the 3rd limit 1c and the 4th limit 1d) rotation, so when splicing tape 1 is stretched while expanding in the direction shown in arrow B 1 and B2 (being above-below direction in Fig. 5), be equipped on a plurality of rollers 423 and 433 rotations of downside hold assembly 422 and upside hold assembly 432.Therefore, when clamping the 1st limit 1a of splicing tape 1 and the 2nd limit 1b expand, even if utilize clamping and downside fixture 42 and the upside fixture 43 of the 1st limit 1a and the 3rd limit 1c of the 2nd limit 1b quadrature and the 3rd clamping components 4c of the 4th limit 1d and the 4th clamping components 4d to clamp, owing to being equipped on the downside hold assembly 422 of downside fixture 42 and upside fixture 43 and a plurality of rollers 423 of upside hold assembly 432 and 433 rotations, so can expand fully splicing tape 1.
In addition, in the above-described embodiment, the example that has represented such enforcement: clamping under the 1st limit 1a of splicing tape 1 and the state of the 2nd limit 1b and the 3rd limit 1c and the 4th limit 1d, be divided into expand the 3rd limit 1c of splicing tape 1 and the 4th limit 1d the 1st with expansion process, with the 1st limit 1a of expansion splicing tape 1 and the 2nd band expansion process of the 2nd limit 1b, but also can implement the 1st band expansion process simultaneously, be with expansion process with the 2nd.
By expanding as mentioned above the 3rd limit 1c and the 4th limit 1d and the 1st limit 1a and the 2nd limit 1b of splicing tape 1, as shown in Figure 6, at the wafer 10 that is pasted on splicing tape 1, be divided between the device 102 obtaining one by one, be formed with gap S.
In addition, even if longitudinal size and lateral dimension at device are different, be equipped on the file of device of wafer when different with the quantity of line, by the number of devices with setting, adjust accordingly the 1st limit 1a of splicing tape 1 and the expansion amount of the 2nd limit 1b and the 3rd limit 1c and the 4th limit 1d expansion amount, the gap S that can make to be divided between device is one by one constant, and can make gap form point-blank.
Next, at the wafer 10 that is pasted on above-mentioned splicing tape 1, be divided into one by one and be formed with under the state of gap S between the device 102 that forms, as shown in Figure 7, the ring-shaped frame 7 with the big or small peristome 70 of taking in wafer 10 is installed to the surface that is coated with adhesive linkage (frame installation operation) of splicing tape 1.Its result is that as shown in Figure 8, the wafer 10 that is formed with interval (s) between the device 102 being divided into is one by one received to the peristome 70 of ring-shaped frame 7, and is supported by ring-shaped frame 7 through splicing tape 1.Like this, ring-shaped frame 7 is being installed to behind the surface of splicing tape 1, along the periphery of ring-shaped frame 7, is cutting off splicing tape 1.Then, the wafer 10(that is supported on ring-shaped frame 7 through splicing tape 1 being formed with to interval (s) between device 102) conveyance is to the operation of picking up of pickup device.
Claims (1)
1. extension fixture, it is for expanding the band of rectangular shape,
Above-mentionedly with extension fixture, be characterised in that, it has:
The 1st clamping components, it is for the 1st limit of clamping band;
The 2nd clamping components, its for clamping band with opposed the 2nd limit, above-mentioned the 1st limit;
The 3rd clamping components, it is for clamping band and the 3rd limit above-mentioned the 1st limit and above-mentioned the 2nd limit quadrature;
The 4th clamping components, its for clamping band with opposed the 4th limit, above-mentioned the 3rd limit; And
Expansion, it is for above-mentioned the 1st clamping components, above-mentioned the 2nd clamping components, above-mentioned the 3rd clamping components and above-mentioned the 4th clamping components are moved in the direction of each limit quadrature with respect to clamping respectively,
Above-mentioned the 1st clamping components, above-mentioned the 2nd clamping components, above-mentioned the 3rd clamping components and above-mentioned the 4th clamping components have respectively downside hold assembly and upside hold assembly, at the upper surface of above-mentioned downside hold assembly, be equipped with a plurality of rollers at the direction rotation on the limit along clamping, at the lower surface of above-mentioned upside hold assembly, be equipped with a plurality of rollers at the direction rotation on the limit along clamping.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-156298 | 2012-07-12 | ||
| JP2012156298A JP5980600B2 (en) | 2012-07-12 | 2012-07-12 | Tape expansion unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103545238A true CN103545238A (en) | 2014-01-29 |
| CN103545238B CN103545238B (en) | 2017-08-11 |
Family
ID=49968576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310290007.7A Active CN103545238B (en) | 2012-07-12 | 2013-07-11 | Band extension fixture |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5980600B2 (en) |
| KR (1) | KR101942108B1 (en) |
| CN (1) | CN103545238B (en) |
| TW (1) | TWI585835B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104112691A (en) * | 2014-07-26 | 2014-10-22 | 佛山市南海区联合广东新光源产业创新中心 | Wafer expander allowing even expanding |
| CN107275256A (en) * | 2016-04-01 | 2017-10-20 | 株式会社迪思科 | Expanding unit |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6468789B2 (en) * | 2014-10-20 | 2019-02-13 | リンテック株式会社 | Spacing device |
| JP6723644B2 (en) | 2016-05-16 | 2020-07-15 | 株式会社ディスコ | Expandable seat |
| JP6710457B2 (en) | 2016-06-01 | 2020-06-17 | 株式会社ディスコ | Expanded sheet, method for manufacturing expanded sheet, and method for expanding expanded sheet |
| JP6951124B2 (en) * | 2017-05-23 | 2021-10-20 | 株式会社ディスコ | Processing method |
| JP6848151B2 (en) * | 2017-05-29 | 2021-03-24 | リンテック株式会社 | Separation device and separation method |
| JP7157527B2 (en) | 2017-12-18 | 2022-10-20 | 株式会社ディスコ | expansion unit |
| JP7377671B2 (en) | 2019-10-18 | 2023-11-10 | 株式会社ディスコ | How to expand the sheet |
| JP2022128756A (en) | 2021-02-24 | 2022-09-05 | 株式会社ディスコ | Pasting method |
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| CN1681082A (en) * | 2004-03-31 | 2005-10-12 | 株式会社迪斯科 | Band extending device |
| WO2006064714A1 (en) * | 2004-12-14 | 2006-06-22 | Hamamatsu Photonics K.K. | Substrate processing method and film stretching apparatus |
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| CN102054681A (en) * | 2009-10-02 | 2011-05-11 | 株式会社迪思科 | Band expanding device |
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| JP3408805B2 (en) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | Cutting origin region forming method and workpiece cutting method |
| US9199409B2 (en) * | 2010-03-31 | 2015-12-01 | Ube Industries, Ltd. | Stretching apparatus and method of manufacturing polyimide film using the same |
| JP5770446B2 (en) * | 2010-09-30 | 2015-08-26 | 株式会社ディスコ | Split method |
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| JPH0212944A (en) * | 1988-06-30 | 1990-01-17 | Nec Corp | Sheet enlarging apparatus for manufacture of semiconductor device |
| CN1681082A (en) * | 2004-03-31 | 2005-10-12 | 株式会社迪斯科 | Band extending device |
| WO2006064714A1 (en) * | 2004-12-14 | 2006-06-22 | Hamamatsu Photonics K.K. | Substrate processing method and film stretching apparatus |
| JP2006229021A (en) * | 2005-02-18 | 2006-08-31 | Disco Abrasive Syst Ltd | Wafer dividing method |
| CN102054681A (en) * | 2009-10-02 | 2011-05-11 | 株式会社迪思科 | Band expanding device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104112691A (en) * | 2014-07-26 | 2014-10-22 | 佛山市南海区联合广东新光源产业创新中心 | Wafer expander allowing even expanding |
| CN107275256A (en) * | 2016-04-01 | 2017-10-20 | 株式会社迪思科 | Expanding unit |
| CN107275256B (en) * | 2016-04-01 | 2022-02-22 | 株式会社迪思科 | Expansion device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201411707A (en) | 2014-03-16 |
| KR20140009033A (en) | 2014-01-22 |
| KR101942108B1 (en) | 2019-01-24 |
| TWI585835B (en) | 2017-06-01 |
| CN103545238B (en) | 2017-08-11 |
| JP5980600B2 (en) | 2016-08-31 |
| JP2014022382A (en) | 2014-02-03 |
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