CN104112691A - Wafer expander allowing even expanding - Google Patents
Wafer expander allowing even expanding Download PDFInfo
- Publication number
- CN104112691A CN104112691A CN201410364441.XA CN201410364441A CN104112691A CN 104112691 A CN104112691 A CN 104112691A CN 201410364441 A CN201410364441 A CN 201410364441A CN 104112691 A CN104112691 A CN 104112691A
- Authority
- CN
- China
- Prior art keywords
- draw unit
- row
- directions
- blue film
- secondary series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
The invention provides a wafer expander used in the semiconductor industry and the light-emitting diode (LED) industry. A blue film is stretched in the direction of a chip cutting channel in the two perpendicular directions to enable cut wafers bonded to the blue film to be evenly expanded, chips on the wafers are separated, the distance between the adjacent chips is identical, the follow-up measurement and sorting process occupies less machine resolution and location time, the requirement for chip scale package or wafer scale package is met, and the follow-up process is facilitated.
Description
Technical field
The present invention relates to the brilliant machine of expansion that a kind of semicon industry and LED industry are used, wafer is evenly expanded, and the distance between adjacent chips equates, reduces machine resolution and positioning time that follow-up measurement and sorting process take, reach the requirement of wafer level encapsulation, be convenient to follow-up technological process.
Background technology
The Cutting Road (cutting street) of the upper square of wafer (wafer) or rectangular dies is along mutually perpendicular both direction: directions X and Y-direction, the flat limit (flat) that wafer is set is capable with flat directions X.The brilliant machine of existing expansion (wafer expander) is all the radial direction expansion along wafer, therefore, distance between adjacent chips (chip) in same Cutting Road direction is unequal, makes the technique of follow-up measurement and sorting take more machine resolution and positioning time.In addition, wafer-level package (chip scale package) or wafer level encapsulation (wafer level package) require the distance between the chip in same Cutting Road direction identical.Chinese patent application 2014102053696 proposes a scheme, adopt quadrangle teleblem structure expand blue film with and on wafer.
But, still need a kind of scheme of control expansion that can be meticulousr, make the distance between the chip of the same Cutting Road direction in the wafer after expansion identical.
Summary of the invention
Primary and foremost purpose of the present invention is to provide a kind of brilliant machine that expands, make in the wafer after expansion the distance between chip adjacent in same Cutting Road direction identical, identical with the distance along Y-direction along the distance of directions X between chip, make the technique of follow-up measurement and sorting take less machine resolution and positioning time, meet the requirement of wafer-level package.Second object is to provide a kind of brilliant machine that expands, make between the adjacent chip of wafer after expansion identical in the distance of directions X, distance in Y-direction between adjacent chip is identical, different from the distance along Y-direction along the distance of directions X between chip, therefore, be applicable to rectangular dies, meet the requirement of wafer-level package.
The operation principle of the brilliant machine of expansion of the present invention: expand brilliant machine and comprise: frame structure, directions X stretching structure, Y-direction stretching structure, press mold structure.Frame structure, directions X stretching structure, Y-direction stretching structure and press mold structure are set, make to expand brilliant machine and can expand blue film, press mold structure makes the blue film after expansion keep expansion state.Wafer and blue film are set, make the direction in the chip cutting road on the both direction of wafer parallel with Y-direction with directions X respectively, wherein, directions X and Y-direction are orthogonal.Directions X stretching structure is along the positive and negative directions X blue film that stretches, Y-direction stretching structure is along the positive and negative Y-direction blue film that stretches, make blue film respectively along positive and negative directions X with along positive and negative Y-direction expansion, the wafer on blue film is along the chip cutting road direction expansion on mutually perpendicular both direction.Press mold structure makes the blue film after expansion keep expansion state.
The embodiment of the brilliant machine of expansion of the present invention: directions X stretching structure comprises first row X draw unit and the secondary series X draw unit of arranging along Y-direction, first row X draw unit and secondary series X draw unit comprise respectively n X draw unit of similar number, be labeled as respectively X draw unit X11, X12 ..., X1n and X draw unit X21, X22 ..., X2n.First row X draw unit and secondary series X draw unit are set, make the X draw unit of first row X draw unit corresponding one by one with the X draw unit of secondary series X draw unit, for example, virtual line between X draw unit X1a and X draw unit X2a is parallel with directions X, by that analogy, virtual line between X draw unit X1n and draw unit X2n is parallel with directions X, make first row X draw unit to the positive directions X blue film that stretches, make secondary series X draw unit to the negative directions X blue film that stretches.Each X draw unit in first row X draw unit and secondary series X draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along directions X back and forth movement.The width of the described first row X draw unit X draw unit corresponding with the chip with in wafer in described secondary series X draw unit is identical along the width in Y-direction with a chip respectively, the width of other X draw unit is equal to, or greater than respectively a chip along the width in Y-direction, and 2 X draw unit have identical width one to one.Y-direction stretching structure comprises first row Y draw unit and the secondary series Y draw unit of arranging along directions X.First row Y draw unit and secondary series Y draw unit comprise respectively m Y draw unit of similar number, be labeled as respectively Y draw unit Y11, Y12 ..., Y1m and Y draw unit Y21, Y22 ..., Y2m.First row Y draw unit and secondary series Y draw unit are set, make the Y draw unit of first row Y draw unit corresponding one by one with the Y draw unit of secondary series Y draw unit, for example, virtual line between Y draw unit Y1d and Y draw unit Y2d is parallel with Y-direction, by that analogy, virtual line between Y draw unit Y1m and draw unit Y2m is parallel with Y-direction, make first row Y draw unit to the positive Y-direction blue film that stretches, make secondary series Y draw unit to the negative Y-direction blue film that stretches.Each Y draw unit in first row Y draw unit and secondary series Y draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along Y-direction back and forth movement.The width of the first row Y draw unit Y draw unit corresponding with the chip with in wafer in secondary series Y draw unit is identical along the width on directions X with a chip respectively, the width of other Y draw unit is equal to, or greater than respectively a chip along the width on directions X, and 2 Y draw unit have identical width one to one.
The embodiment of the brilliant machine of expansion of the present invention: directions X stretching structure comprises first row X draw unit and the secondary series X draw unit of arranging along Y-direction, first row X draw unit and secondary series X draw unit comprise respectively p X draw unit of similar number, be labeled as respectively X draw unit X31 ..., X3p and X draw unit X41 ..., X4p.First row X draw unit and secondary series X draw unit are set, make the X draw unit of first row X draw unit corresponding one by one with the X draw unit of secondary series X draw unit, for example, virtual line between X draw unit X31 and X draw unit X41 is parallel with directions X, by that analogy, virtual line between X draw unit X3p and draw unit X4p is parallel with directions X, make first row X draw unit to the positive directions X blue film that stretches, make secondary series X draw unit to the negative directions X blue film that stretches.Each X draw unit in first row X draw unit and secondary series X draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along directions X back and forth movement.The width of the first row X draw unit X draw unit corresponding with the chip with in wafer in secondary series X draw unit respectively with wafer at least two chips identical along the width sum in Y-direction, the width of other X draw unit is equal to, or greater than respectively two chips along the width sum in Y-direction, and 2 X draw unit have identical width one to one.
Y-direction stretching structure comprises first row Y draw unit and the secondary series Y draw unit of arranging along directions X.First row Y draw unit and secondary series Y draw unit comprise respectively q Y draw unit of similar number, be labeled as respectively Y draw unit Y31 ..., Y3q and Y draw unit Y41 ..., Y4q.First row Y draw unit and secondary series Y draw unit are set, make the Y draw unit of first row Y draw unit corresponding one by one with the Y draw unit of secondary series Y draw unit, for example, virtual line between Y draw unit Y31 and Y draw unit Y41 is parallel with Y-direction, by that analogy, virtual line between Y draw unit Y3q and draw unit Y4q is parallel with Y-direction, make first row Y draw unit to the positive Y-direction blue film that stretches, make secondary series Y draw unit to the negative Y-direction blue film that stretches.Each Y draw unit in first row Y draw unit and secondary series Y draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along Y-direction back and forth movement.The width of the first row Y draw unit Y draw unit corresponding with the chip with in wafer in secondary series Y draw unit respectively with wafer at least two chips identical along the width sum in Y-direction, the width of other Y draw unit is equal to, or greater than respectively two chips along the width sum on directions X, and 2 Y draw unit have identical width one to one.
The embodiment of the brilliant machine of expansion of the present invention: expand brilliant machine and further comprise visual identifying system (not showing) and blue film rotary system (not showing) in Figure of description in Figure of description, the blue film rotary system of visual identifying system control.The function of visual identifying system comprises: the direction of measuring the flat limit of chip cutting road on the mutually perpendicular both direction in the wafer before the expansion of blue film or wafer, metrical information is passed to blue film rotary system, blue film rotary system is adjusted the direction of blue film, makes the direction in the chip cutting road on the both direction of the wafer on blue film parallel with Y-direction with directions X respectively.
The embodiment of the brilliant machine of expansion of the present invention: expand brilliant machine and further comprise visual identifying system, visual identifying system control directions X stretching structure.Visual identifying system is measured the distance between the chip of arranging along directions X in the wafer after blue film expansion, according to test result, in needs, the corresponding X draw unit of the visual identifying system control blue film that stretches, adjust the distance on the directions X between chip, obtain distance on the directions X between chip identical.
The embodiment of the brilliant machine of expansion of the present invention: expand brilliant machine and further comprise visual identifying system, Y-direction stretching structure described in visual identifying system control.Visual identifying system is measured the distance between the chip of arranging along Y-direction in the wafer after blue film expansion, according to test result, in needs, the corresponding Y draw unit of the visual identifying system control blue film that stretches, adjust the distance in the Y-direction between chip, obtain distance in the Y-direction between chip identical.
The embodiment of the brilliant machine of expansion of the present invention: the each draw unit in first row X draw unit and secondary series X draw unit can be free to slide respectively in the Y direction, make in the time that blue film is expanded in the Y direction, along Y-direction arrange first row X draw unit and secondary series X draw unit in each X draw unit in the Y direction mutually away from, keep clamping blue film simultaneously, make in the time that blue film is expanded in the Y direction, the two row X draw unit of arranging along Y-direction in the Y direction mutually away from, and can not hinder the expansion in the Y direction of blue film.
The embodiment of the brilliant machine of expansion of the present invention: the each draw unit in first row Y draw unit and secondary series Y draw unit can be free to slide respectively on directions X, make in the time that blue film is expanded on directions X, along directions X arrange first row Y draw unit and secondary series Y draw unit in each Y draw unit on directions X mutually away from.Keep clamping blue film simultaneously, make when blue film is expanded on directions X, arrange along directions X two be listed as Y draw unit on directions X mutually away from, and can not hinder the expansion of blue film on directions X.
Item below is all suitable for the embodiment of the brilliant machine of all expansions of the present invention:
1). the size in accompanying drawing is disproportionate;
2) .X direction stretching structure and the Y-direction stretching structure blue film (for example, shown in Fig. 3 a, 3b, 3c, 3d, Fig. 4 a, 4b) that both can successively stretch successively, the blue film that also can simultaneously stretch (for example,, shown in Fig. 5, Fig. 6 a, Fig. 6 b);
3). blue film shape is square or rectangle (for example, shown in Fig. 3 a, 3b, 3c, 3d, Fig. 4 a, 4b, Fig. 6 a, 6b), or cross (for example,, shown in Fig. 5).
4). the width of each Y draw unit of same row Y draw unit both can be identical (for example, shown in Fig. 3 a, Fig. 3 b, Fig. 3 c, Fig. 3 d, Fig. 4 a, Fig. 4 b, Fig. 5), also can not identical (for example,, shown in the Y91 in the Y71 in Fig. 6 a and Y7a and Fig. 6 b and Y9a shown in).
5). the width of the Y draw unit of the Y draw unit of first row Y draw unit and corresponding secondary series Y draw unit is identical (for example,, shown in the Y71 in Fig. 6 a and Y81 and Y7a and Y8a) respectively.
6). the width of each X draw unit of same row X draw unit both can be identical (for example, shown in Fig. 3 a, Fig. 3 b, Fig. 3 c, Fig. 3 d, Fig. 4 a, Fig. 4 b, Fig. 5), also can not identical (for example,, shown in the X71 and X7a in Fig. 6 a).
7). the width identical (for example,, shown in the X71 in Fig. 6 a and X81 and X7a and X8a) of the X draw unit of the X draw unit of first row X draw unit and corresponding secondary series X draw unit.
Brief description of the drawings
Fig. 1 tradition expands the vertical view of the operation principle of the blue film of expansion of brilliant machine.
Fig. 2 shows object, operation principle and the technical scheme of the brilliant machine of expansion of the present invention.
Fig. 3 a to Fig. 3 d is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.
Fig. 4 a and Fig. 4 b are the schematic diagrames of an embodiment of the brilliant machine of expansion of the present invention.
Fig. 5 is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.
Fig. 6 a is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.
Fig. 6 b is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.
Fig. 7 a and Fig. 7 b are the fundamental diagrams of an embodiment of the brilliant machine of expansion of the present invention.
The implication of the numerical chracter representative in figure is as follows:
10 represent traditional teleblem structure,
20a, 20b and 20c represent respectively to expand before expansion, for the first time the blue film after rear and expansion for the second time,
22a, 22b represent respectively two relative limits of blue film,
23a, 23b represent respectively two other relative limit of blue film,
31,32,33,41,42,43 represent respectively X or Y draw unit
X11, X12, X1a, X1b, X1c, X1d, X1e, X1g, X1n, X31, X3g, X3h, X3k, X3p, X51, X52, X5a, X5b, X5c, X5d, X5r, X71, X7a, X7b, X7c, X7d, X7u, X91, X9a, X9b, X9c, X9d, X9t and X21, X22, X2a, X2b, X2c, X2d, X2e, X2g, X2n, X41, X4g, X4h, X4k, X4p, X61, X62, X6a, X6b, X6c, X6d, X6r, X81, X8a, X8b, X8c, X8d, X8u, X101, X10a, X10b, X10c, X10d, X10t represents respectively first row and secondary series X draw unit,
Y11, Y12, Y1a, Y1b, Y1c, Y1d, Y1m, Y31, Y3a, Y3b, Y3c, Y3q, Y51, Y52, Y5a, Y5b, Y5c, Y5d, Y5s, Y71, Y7a, Y7b, Y7c, Y7d, Y7v, Y91, Y9a, Y9b, Y9w and Y21, Y22, Y2a, Y2b, Y2c, Y2d, Y2m, Y41, Y4a, Y4b, Y4c, Y4q, Y61, Y62, Y6a, Y6b, Y6c, Y6d, Y6s, Y81, Y8a, Y8b, Y8c, Y8d, Y8v, Y101, Y10a, Y10b, Y10w represent respectively first row and secondary series Y draw unit
100 represent wafer,
101 represent the X chip cutting road along directions X,
102 represent the Y chip cutting road along Y-direction, and directions X is perpendicular to Y-direction, and Y chip cutting road 102, limit 22a and limit 22b are parallel to each other,
103 represent the flat limit (f1at) of wafers, and flat limit 103, X chip cutting road 101, limit 23a, 23b are parallel to each other,
105a, 105b, 105c, 105d, 105e, 105u, 105v, 105w, 105z, 106a, 106b, 106c, 106d, 106e, 106f, 106g, 106h, 106i, 106j, 106k, 106m, 106n, 106p, 106q, 106r, 106s, 106t, 106u, 106v represent respectively the chip after blue film expansion.
Embodiment
For making object, operation principle, technical scheme and the advantage of embodiment of the present invention clearer, below in conjunction with the accompanying drawing in embodiment of the present invention, technical scheme in embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Fig. 1 is the vertical view of the teleblem structure of the brilliant machine of traditional expansion.Blue film 20a is placed on the top of teleblem structure 10 of cylindrical shape.Wafer 100 is pasted the center at blue film 20a.Wafer 100 has flat limit 103, along multiple X chip cutting road 101 of directions X, along multiple Y chip cutting road 102 of Y-direction.Directions X is perpendicular to Y-direction, and directions X is parallel to the flat limit 103 of wafer 100.In the time that teleblem structure moves upward, blue film 20a is by circular teleblem structure jack-up expansion.Blue film 20a is the radius expansion along circular teleblem structure, so, not identical along the distance between X chip cutting road 101 and the adjacent chips of Y chip cutting road 102 directions separation, the machine that has increased follow-up measurement and sorting process is differentiated and positioning time, can not do the encapsulation of wafer level.
Fig. 2 shows object, operation principle and the technical scheme of the brilliant machine of expansion of the present invention.
Object: make between the adjacent chips after expansion the distance that separates identical.
Operation principle: only along the X chip cutting road 101 of directions X with expand blue film along Y chip cutting road 102 both directions of Y-direction.Directions X and Y-direction are orthogonal.
Technical scheme: (1) adopts blue film 20a; (2) place the center position of wafer 100 at blue film 20a, make the flat limit 103 of wafer 100 and the limit 23a of blue film 20a and limit 23b substantially parallel; (3) place blue film 20a, make the flat limit 103 of wafer 100 substantially parallel with directions X stretching structure, the direction on the X in visual identifying system identification wafer and the flat limit of Y chip cutting road or wafer, blue film rotary system is adjusted the direction of blue film, makes the X chip cutting road of the wafer on blue film and the direction in Y chip cutting road parallel with Y-direction with directions X respectively; (4) respectively along X chip cutting road 101 and the Y chip cutting road 102 directions blue film 20a that stretches; Therefore, (5) blue film 20a is only along X chip cutting road 101 and the 102 direction expansions of Y chip cutting road, the adjacent chips of the upper directions X of blue film 20b after expansion (for example, in Fig. 3 d, between chip 105a and chip 105b and between chip 105b and chip 105c) separate distance identical, Y-direction adjacent chips (for example, in Fig. 3 d, between chip 105a and chip 105d and between chip 105a and chip 105e) separate distance identical, reduce the machine of follow-up measurement and sorting process and differentiated and positioning time, can directly carry out the encapsulation of wafer level.
Fig. 3 a to Fig. 3 d is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.Expanding brilliant machine comprises: frame structure (not showing in the drawings), directions X stretching structure, Y-direction stretching structure and press mold structure (not showing in the drawings).Frame structure, directions X stretching structure, Y-direction stretching structure and press mold structure are set, make directions X stretching structure and Y-direction stretching structure can be respectively along positive and negative directions X with along the positive and negative Y-direction blue film that stretches, make blue film respectively along positive and negative directions X with along positive and negative Y-direction expansion, press mold structure makes the blue film after expansion keep expansion state.
Directions X stretching structure comprises first row X draw unit and the secondary series X draw unit of arranging along Y-direction.First row X draw unit comprises n X draw unit, be labeled as respectively X draw unit X11, X12 ..., X1a, X1b, X1c, X1d ..., X1n.Dotted line between X draw unit X12 and X1a is illustrated in and between X draw unit X12 and X1a, has at least one X draw unit.Secondary series X draw unit comprises n X draw unit of similar number, be labeled as respectively X draw unit X21, X22 ..., X2a, X2b, X2c, X2d ..., X2n.Dotted line between X draw unit X22 and X2a is illustrated in and between X draw unit X22 and X2a, has at least one X draw unit.First row X draw unit and secondary series X draw unit are set, make the X draw unit of first row X draw unit corresponding one by one with the X draw unit of secondary series X draw unit, for example, the X draw unit X1a of first row X draw unit is corresponding one by one with the X draw unit X2a of secondary series X draw unit,, the virtual line between X draw unit X1a and X draw unit X2a is parallel with directions X.
Each X draw unit in first row X draw unit and secondary series X draw unit is controlled respectively, can clamp respectively and loosen blue film, first row X draw unit is to the positive directions X blue film that stretches, and secondary series X draw unit is to the negative directions X blue film that stretches, respectively along directions X back and forth movement.First row X draw unit is identical along the width in Y-direction with a chip in wafer with the width of the each X draw unit in secondary series X draw unit, and the blue film at any a line chip place can be expanded along directions X under the stretching of X draw unit corresponding thereto.For example, width and the chip 105d of the X draw unit X1a corresponding with chip 105d in wafer and X2a are identical along the width in Y-direction; The blue film that comprises a line chip place of chip 105d, 105u, 105v is expanded to positive directions X under the stretching of X draw unit X1a corresponding thereto, under the stretching of X draw unit X2a corresponding thereto, expands to negative directions X; The blue film that comprises a line chip place of chip 105a, 105b, 105c is expanded to positive directions X under the stretching of X draw unit X1b corresponding thereto, under the stretching of X draw unit X2b corresponding thereto, expands to negative directions X.The distance along directions X between chip after expanding along directions X is identical, for example, the distance along directions X between distance between chip 105a and 105b and chip 105c and 105b is identical, and the distance along directions X between the distance between chip 105d and 105u and chip 105u and 105v is identical.
Y-direction stretching structure comprises first row Y draw unit and the secondary series Y draw unit of arranging along directions X.First row Y draw unit comprises m Y draw unit, be labeled as respectively Y draw unit Y11, Y12 ..., Y1a, Y1b, Y1c, Y1d ..., Y1m.Dotted line between two Y draw unit of first row Y draw unit is illustrated between these two Y draw unit and has at least one Y draw unit, for example, the dotted line between Y draw unit Y12 and Y1a is illustrated in and between Y draw unit Y12 and Y1a, has at least one Y draw unit.Secondary series Y draw unit comprises m Y draw unit of similar number, be labeled as respectively Y draw unit Y21, Y22 ..., Y2a, Y2b, Y2c, Y2d ..., Y2m.Dotted line between two Y draw unit of secondary series Y draw unit is illustrated between these two Y draw unit and has at least one Y draw unit, for example, the dotted line between Y draw unit Y22 and Y2a is illustrated in and between Y draw unit Y22 and Y2a, has at least one Y draw unit.First row Y draw unit and secondary series Y draw unit are set, make the Y draw unit of first row Y draw unit corresponding one by one with the Y draw unit of secondary series Y draw unit, for example, the Y draw unit Y1a of first row Y draw unit is corresponding one by one with the Y draw unit Y2a of secondary series Y draw unit,, the virtual line between Y draw unit Y1d and Y draw unit Y2d is parallel with Y-direction.
Each Y draw unit in first row Y draw unit and secondary series Y draw unit is controlled respectively, can clamp respectively and loosen blue film, first row Y draw unit is to the positive Y-direction blue film that stretches, and secondary series Y draw unit is to the negative Y-direction blue film that stretches, respectively along Y-direction back and forth movement.The width of the first row Y draw unit each Y draw unit corresponding with the chip with in wafer in secondary series Y draw unit is identical along the width on directions X with a chip, the blue film at any a line chip place can be expanded along Y-direction under the stretching of Y draw unit corresponding thereto, for example, the width of Y draw unit Y1b and Y2b is identical along the width on directions X with the chip 105d in wafer, comprise chip 105d, 105a, the blue film at a line chip place of 105e is expanded to positive directions X under the stretching of Y draw unit Y1b corresponding thereto, under the stretching of X draw unit Y2b corresponding thereto, expand to negative Y-direction.The distance along Y-direction between chip after expanding along Y-direction is identical, for example, the distance along Y-direction between distance between chip 105a and 105d and chip 105a and 105e is identical, and the distance along Y-direction between the distance between chip 105u and 105b and chip 105w and 105b is identical.
The operation sequence of the brilliant machine of expansion of this embodiment is as follows:
The first step, arranges first row X draw unit and secondary series X draw unit respectively along the both sides 22a of blue film with 22b arranges until edge 23a and the 23b of blue film, and clamps blue film.X draw unit X11 and X21 arrange along the edge 23b of blue film, and X draw unit X1n and X2n arrange along the edge 23a of blue film, and wafer 100 is arranged between first row X draw unit and secondary series X draw unit.First row X draw unit and secondary series X draw unit are respectively to the positive and negative directions X blue film that stretches.
Second step, after blue film is expanded along directions X, unclamp blue film near at least one pair of corresponding X draw unit in the edge 23a of blue film and the first row X draw unit of 23b and secondary series X draw unit respectively, and return to home position (home position), for example, X11 and X21 and X1n and X2n unclamp blue film, and return to home position, make first row Y draw unit and secondary series Y draw unit respectively along the both sides 23a of blue film with 23b arranges until edge 22a and the 22b of blue film, and clamp blue film.Y draw unit Y11 and Y21 arrange along the edge 22a of blue film, and Y draw unit Y1m and Y2m arrange along the edge 22b of blue film.
The 3rd step, first row Y draw unit is to the positive Y-direction blue film that stretches, and meanwhile, secondary series Y draw unit is to the negative Y-direction blue film that stretches; Each X draw unit in first row X draw unit and secondary series X draw unit can be free to slide respectively in the Y direction, make in the time that blue film is expanded in the Y direction, along Y-direction arrange first row X draw unit and secondary series X draw unit in X draw unit in the Y direction mutually away from, do not hinder the expansion of blue film 20b along Y-direction.
The 4th step, press mold structure (not showing in the drawings) makes the blue film after expansion keep expansion state.
Fig. 4 a and Fig. 4 b are the schematic diagrames of an embodiment of the brilliant machine of expansion of the present invention.The embodiment that Fig. 4 a shows with Fig. 4 b is similar to the embodiment that Fig. 3 a to Fig. 3 d shows, difference is: (1) first row X draw unit is identical along the width in Y-direction with two chips in wafer with the width of the each X draw unit in secondary series X draw unit; The X draw unit blue film at two row chip places corresponding thereto that stretches one to one, expand along directions X, for example, the width of X draw unit X3b and X4b is corresponding thereto identical along the width sum in Y-direction with chip 105a and 105d in wafer respectively, the blue film that comprises the two row chip places of chip 105d, 105u, 105v and chip 105a, 105b, 105c is expanded to positive directions X under the stretching of X draw unit X3b, under the stretching of X draw unit X4b, expands to negative Y-direction.(2) first row Y draw unit is identical along the width sum on directions X with two chips in wafer with the width of the each Y draw unit in secondary series Y draw unit, the blue film at two row chip places corresponding thereto of Y draw unit stretching one to one, expand along Y-direction, for example, the width of Y draw unit Y3b and Y4b is corresponding thereto identical along the width sum on directions X with chip 105b and 105c in wafer respectively, comprise chip 105u, 105b, 105w and chip 105v, 105c, the blue film at the two row chip places of 105z is expanded to positive directions X under the stretching of Y draw unit Y3b, under the stretching of Y draw unit Y4b, expand to negative Y-direction.
Each X draw unit in first row X draw unit and secondary series X draw unit has identical width.Each Y draw unit in first row Y draw unit and secondary series Y draw unit has identical width.
X draw unit X31, X3a, X3b, X3c, X3p, X3h, X3g, Y draw unit Y31, Y3a, Y3b, Y3c, Y3q are corresponding one by one with X41, X4a, X4b, X4c, X4p, X4h, X4g, Y draw unit Y41, Y4a, Y4b, Y4c, Y4q respectively.
Fig. 5 is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.The embodiment that Fig. 5 shows is similar to the embodiment that Fig. 3 a to Fig. 3 d shows, difference is: (1) blue film has cross shape; (2) X draw unit (comprising X51 to X5r and X61 to X6r) and Y draw unit (comprising Y51 to Y5s and Y61 to Y6s) the blue film that simultaneously stretches.Each X draw unit in first row X draw unit and secondary series X draw unit can be free to slide respectively in the Y direction, make in the time that blue film is expanded in the Y direction, along Y-direction arrange first row X draw unit and secondary series X draw unit in X draw unit in the Y direction mutually away from, do not hinder the expansion of blue film 20b along Y-direction.Each Y draw unit in first row Y draw unit and secondary series Y draw unit can be free to slide respectively on directions X, make in the time that blue film is expanded on directions X, along directions X arrange first row Y draw unit and secondary series Y draw unit in Y draw unit on directions X mutually away from, do not hinder the expansion of blue film 20b along directions X.
Fig. 6 a is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.The embodiment that Fig. 6 a shows is similar to the embodiment that Fig. 3 a to Fig. 3 d shows, difference is, in the embodiment that Fig. 6 a shows: the X draw unit in (one) first row X draw unit has different width: the width of (1) X draw unit X7a corresponding with the chip of wafer, X7b, X7c, X7d is identical along the width of Y-direction with a chip respectively; (2) width of other X draw unit X71, X7u is greater than respectively the width of a chip along Y-direction.(2) the X draw unit in secondary series X draw unit has different width: the width of (1) X draw unit X8a corresponding with the chip of wafer, X8b, X8c, X8d is identical along the width of Y-direction with a chip respectively; (2) width of other X draw unit X81, X8u is greater than respectively the width of a chip along Y-direction.(3) the Y draw unit in first row Y draw unit has different width: the width of (1) Y draw unit Y7a to X7d corresponding with the chip of wafer is identical along the width of directions X with a chip respectively; (2) width of other Y draw unit Y71, Y7v is greater than respectively the width of a chip along directions X.(4) the Y draw unit in secondary series Y draw unit has different width: the width of (1) Y draw unit Y8a corresponding with the chip of wafer, Y8b, Y8c, Y8d is identical along the width of directions X with a chip respectively; (2) width of other Y draw unit Y81, Y8v is greater than respectively the width of a chip along directions X.(5) the blue film that simultaneously stretches of the Y draw unit in X draw unit and first row and the secondary series Y draw unit in first row and secondary series X draw unit.
X draw unit X71, X7a, X7b, X7c, X7d, X7u, Y draw unit Y71, Y7a, Y7b, Y7c, Y7d, Y7v are corresponding one by one with X81, X8a, X8b, X8c, X8d, X8u, Y draw unit Y81, Y8a, Y8b, Y8c, Y8d, Y8v respectively.
Fig. 6 b is the schematic diagram of an embodiment of the brilliant machine of expansion of the present invention.The embodiment that Fig. 6 b shows is similar to the embodiment that Fig. 6 a shows, difference is, in the embodiment that Fig. 6 b shows: the X draw unit in (one) first row X draw unit has different width: the width of (1) X draw unit X9a to X9d corresponding with the chip of wafer equals respectively the width of a chip along Y-direction; (2) width of other X draw unit X91 and X9t is greater than respectively the width of a chip along Y-direction.(2) the X draw unit in secondary series X draw unit has different width: the width of (1) X draw unit X10a to X10d corresponding with the chip of wafer equals respectively the width of a chip along Y-direction; (2) width of other X draw unit X101, X10t is greater than respectively the width of a chip along Y-direction.(3) the Y draw unit in first row Y draw unit has different width: the Y draw unit Y9a that (1) is corresponding with wafer and the width of Y9b equal respectively the width sum of three chips along directions X; (2) width of other Y draw unit Y91 and Y9w is greater than respectively the width of a chip along directions X.(4) the Y draw unit in secondary series Y draw unit has different width: the Y draw unit Y10a that (1) is corresponding with chip in wafer and the width of Y10b equal respectively the width sum of three chips along directions X; (2) width of other Y draw unit Y101 and Y10w is greater than respectively the width of a chip along directions X.
X draw unit X91, X9a, X9b, X9c, X9d, X9t, Y draw unit Y91, Y9a, Y9b, Y9w are corresponding one by one with X101, X10a, X10b, X10c, X10d, X10t, Y draw unit Y101, Y10a, Y10b, Y10w respectively.
Fig. 7 a and Fig. 7 b are the fundamental diagrams of an embodiment of the brilliant machine of expansion of the present invention.Expand brilliant machine and comprise visual identifying system (not showing), visual identifying system control directions X stretching structure and Y-direction stretching structure in Fig. 7 a and 7b.Visual identifying system is measured the distance between the chip of arranging along X and Y-direction in the wafer after the expansion of blue film, according to test result, visual identifying system is handled corresponding X and the Y draw unit blue film that stretches, and makes the X between chip identical with the distance in Y-direction.In Fig. 7 a, visual identifying system measurement result: the distance between chip 106i and 106j is less than the distance between chip 106e and 106f, distance between chip 106e and 106f is less than the distance between chip 106a and 106b, distance between chip 106k and 106m is less than the distance between chip 106g and 106h, and the distance between chip 106g and 106h is less than the distance between chip 106c and 106d.
According to above-mentioned measurement result, visual identifying system is handled corresponding draw unit 31 and 41, draw unit 32 and 42, the draw unit 33 and 43 different distance of blue film that stretches respectively, make the distance identical (as shown in Figure 7b) between chip: the distance between chip 106i and 106j, distance between chip 106e and 106f, distance between chip 106a and 106b, distance between chip 106k and 106m, distance between chip 106g and 106h, distance between chip 106c and 106d, distance between chip 106n and 106p, distance between chip 106q and 106r, distance between chip 106s and 106t, distance between chip 106u and 106v equates.
Note: draw unit 31 and 41, draw unit 32 and 42, draw unit 33 and 43 can be X draw unit or Y draw unit.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to aforementioned embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of the each embodiment technical scheme of the present invention.
Claims (8)
1. expand a brilliant machine, comprising: frame structure, directions X stretching structure, Y-direction stretching structure, press mold structure; Frame structure, directions X stretching structure, Y-direction stretching structure and press mold structure are set, make described directions X stretching structure and described Y-direction stretching structure can expand blue film, described press mold structure makes the blue film after expansion keep expansion state; It is characterized in that, described directions X stretching structure is along the positive and negative directions X blue film that stretches, and described Y-direction stretching structure, along the positive and negative Y-direction blue film that stretches, makes blue film respectively along positive and negative directions X with along positive and negative Y-direction expansion; Wherein, described directions X and described Y-direction are orthogonal.
2. the brilliant machine of expansion according to claim 1, it is characterized in that, described directions X stretching structure comprises first row X draw unit and the secondary series X draw unit of arranging along Y-direction, described first row X draw unit is to the positive directions X blue film that stretches, and described secondary series X draw unit is to the negative directions X blue film that stretches; Described first row X draw unit and described secondary series X draw unit comprise respectively the same number of multiple X draw unit; Described first row X draw unit and described secondary series X draw unit are set, make the X draw unit of described first row X draw unit corresponding one by one with the X draw unit of secondary series X draw unit; 2 described X draw unit have identical width one to one; Each X draw unit in described first row X draw unit and described secondary series X draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along directions X back and forth movement; The width of the described first row X draw unit X draw unit corresponding with the chip with in wafer in described secondary series X draw unit is identical along the width in Y-direction with a chip respectively, and the width of other X draw unit is equal to, or greater than respectively a chip along the width in Y-direction; Described Y-direction stretching structure comprises first row Y draw unit and the secondary series Y draw unit of arranging along directions X, and described first row Y draw unit is to the positive Y-direction blue film that stretches, and described secondary series Y draw unit is to the negative Y-direction blue film that stretches; Described first row Y draw unit and described secondary series Y draw unit comprise respectively the same number of multiple Y draw unit; Described first row Y draw unit and described secondary series Y draw unit are set, make the Y draw unit of described first row Y draw unit corresponding one by one with the Y draw unit of secondary series Y draw unit; 2 described Y draw unit have identical width one to one; Each Y draw unit in described first row Y draw unit and described secondary series Y draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along directions X back and forth movement; The width of the described first row Y draw unit Y draw unit corresponding with the chip with in wafer in described secondary series Y draw unit is identical along the width on directions X with a chip respectively, and the width of other Y draw unit is equal to, or greater than respectively a chip along the width on directions X.
3. the brilliant machine of expansion according to claim 1, it is characterized in that, described directions X stretching structure comprises first row X draw unit and the secondary series X draw unit of arranging along Y-direction, described first row X draw unit is to the positive directions X blue film that stretches, and described secondary series X draw unit is to the negative directions X blue film that stretches; Described first row X draw unit and described secondary series X draw unit comprise respectively the same number of multiple X draw unit; Described first row X draw unit and described secondary series X draw unit are set, make the X draw unit of described first row X draw unit corresponding one by one with the X draw unit of secondary series X draw unit; 2 described X draw unit have identical width one to one; Each X draw unit in described first row X draw unit and described secondary series X draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along directions X back and forth movement; The width of the described first row X draw unit X draw unit corresponding with the chip with in wafer in described secondary series X draw unit is identical along the width sum in Y-direction with at least two chips respectively, and the width of other X draw unit is equal to, or greater than respectively at least two chips along the width sum in Y-direction; Described Y-direction stretching structure comprises first row Y draw unit and the secondary series Y draw unit of arranging along directions X, and described first row Y draw unit is to the positive Y-direction blue film that stretches, and described secondary series Y draw unit is to the negative Y-direction blue film that stretches; Described first row Y draw unit and described secondary series Y draw unit comprise respectively the same number of multiple Y draw unit; Described first row Y draw unit and described secondary series Y draw unit are set, make the Y draw unit of described first row Y draw unit corresponding one by one with the Y draw unit of secondary series Y draw unit; 2 described Y draw unit have identical width one to one; Each Y draw unit in described first row Y draw unit and described secondary series Y draw unit is controlled respectively, can clamp respectively and loosen blue film, respectively along directions X back and forth movement; The width of the described first row Y draw unit Y draw unit corresponding with the chip with in wafer in described secondary series Y draw unit is identical along the width sum on directions X with at least two chips respectively, and the width of other Y draw unit is equal to, or greater than respectively at least two chips along the width sum on directions X.
4. the brilliant machine of expansion according to claim 1, is characterized in that, the brilliant machine of described expansion further comprises the visual recognition line blue film rotary system of unifying, blue film rotary system described in described visual identifying system control; Described visual identifying system is identified the direction on the flat limit of two chip cutting roads in the wafer before the expansion of blue film or wafer, described blue film rotary system is adjusted the direction of blue film, makes the X chip cutting road of the wafer on blue film and the direction in Y chip cutting road parallel with Y-direction with directions X respectively.
5. the brilliant machine of expansion according to claim 1, is characterized in that, the brilliant machine of described expansion further comprises visual identifying system, directions X stretching structure described in described visual identifying system control; Described visual identifying system is measured the distance between the chip of arranging along directions X in the wafer after blue film expansion, according to test result, described visual identifying system is handled the corresponding X draw unit blue film that stretches, and makes the distance on the directions X between chip identical.
6. the brilliant machine of expansion according to claim 1, is characterized in that, the brilliant machine of described expansion further comprises visual identifying system, Y-direction stretching structure described in described visual identifying system control; Described visual identifying system is measured the distance between the chip of arranging along Y-direction in the wafer after blue film expansion, according to test result, described visual identifying system is handled the corresponding Y draw unit blue film that stretches, and makes the distance in the Y-direction between chip identical.
7. the brilliant machine of expansion according to claim 1, it is characterized in that, each X draw unit in described first row X draw unit and described secondary series X draw unit can be free to slide respectively in the Y direction, make in the time that blue film is expanded in the Y direction, along Y-direction arrange described first row X draw unit and described secondary series X draw unit in X draw unit in the Y direction mutually away from.
8. the brilliant machine of expansion according to claim 1, it is characterized in that, each Y draw unit in described first row Y draw unit and described secondary series Y draw unit can be free to slide respectively on directions X, make in the time that blue film is expanded on directions X, along directions X arrange described first row Y draw unit and described secondary series Y draw unit in Y draw unit on directions X mutually away from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410364441.XA CN104112691A (en) | 2014-07-26 | 2014-07-26 | Wafer expander allowing even expanding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410364441.XA CN104112691A (en) | 2014-07-26 | 2014-07-26 | Wafer expander allowing even expanding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104112691A true CN104112691A (en) | 2014-10-22 |
Family
ID=51709433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410364441.XA Pending CN104112691A (en) | 2014-07-26 | 2014-07-26 | Wafer expander allowing even expanding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104112691A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277345A (en) * | 2019-05-15 | 2019-09-24 | 福建省福联集成电路有限公司 | A kind of manufacturing method and sensor of sensor |
| CN112509949A (en) * | 2020-12-18 | 2021-03-16 | 深圳市思坦科技有限公司 | One-way film expanding machine and film expanding method |
| WO2021108942A1 (en) * | 2019-12-02 | 2021-06-10 | 重庆康佳光电技术研究院有限公司 | Method for automatically expanding film, and storage medium and device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249346A (en) * | 1984-05-24 | 1985-12-10 | Nec Kansai Ltd | Method of elongating semiconductor wafer |
| US20060012020A1 (en) * | 2004-07-14 | 2006-01-19 | Gilleo Kenneth B | Wafer-level assembly method for semiconductor devices |
| CN102714188A (en) * | 2010-01-22 | 2012-10-03 | 三洋电机株式会社 | Semiconductor module manufacturing method |
| JP2013026544A (en) * | 2011-07-25 | 2013-02-04 | Disco Abrasive Syst Ltd | Wafer extension device |
| CN103545238A (en) * | 2012-07-12 | 2014-01-29 | 株式会社迪思科 | Tape expanding apparatus |
| CN204011374U (en) * | 2014-07-26 | 2014-12-10 | 佛山市南海区联合广东新光源产业创新中心 | The evenly brilliant machine of the expansion of expansion |
-
2014
- 2014-07-26 CN CN201410364441.XA patent/CN104112691A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60249346A (en) * | 1984-05-24 | 1985-12-10 | Nec Kansai Ltd | Method of elongating semiconductor wafer |
| US20060012020A1 (en) * | 2004-07-14 | 2006-01-19 | Gilleo Kenneth B | Wafer-level assembly method for semiconductor devices |
| CN102714188A (en) * | 2010-01-22 | 2012-10-03 | 三洋电机株式会社 | Semiconductor module manufacturing method |
| JP2013026544A (en) * | 2011-07-25 | 2013-02-04 | Disco Abrasive Syst Ltd | Wafer extension device |
| CN103545238A (en) * | 2012-07-12 | 2014-01-29 | 株式会社迪思科 | Tape expanding apparatus |
| CN204011374U (en) * | 2014-07-26 | 2014-12-10 | 佛山市南海区联合广东新光源产业创新中心 | The evenly brilliant machine of the expansion of expansion |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277345A (en) * | 2019-05-15 | 2019-09-24 | 福建省福联集成电路有限公司 | A kind of manufacturing method and sensor of sensor |
| CN110277345B (en) * | 2019-05-15 | 2021-11-19 | 福建省福联集成电路有限公司 | Sensor manufacturing method and sensor |
| WO2021108942A1 (en) * | 2019-12-02 | 2021-06-10 | 重庆康佳光电技术研究院有限公司 | Method for automatically expanding film, and storage medium and device |
| US11594655B2 (en) | 2019-12-02 | 2023-02-28 | Chongqing Konka Photoelectric Technology Research Institute Co., Ltd. | Method for automatic film expansion, storage medium, and device |
| CN112509949A (en) * | 2020-12-18 | 2021-03-16 | 深圳市思坦科技有限公司 | One-way film expanding machine and film expanding method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204011374U (en) | The evenly brilliant machine of the expansion of expansion | |
| CN104112691A (en) | Wafer expander allowing even expanding | |
| CN104384358B (en) | Diel mold changing systems and method | |
| CN106179976A (en) | Halved belt sorter information transmitting methods | |
| CN105980076A (en) | Method and device for machining a substrate | |
| CN102656668B (en) | Offset field grid for efficient wafer layout | |
| CN103295930A (en) | Quick efficient wafer back defect identification method | |
| CN105225225A (en) | A kind of leather system for automatic marker making method and apparatus based on machine vision | |
| CN107437085A (en) | A kind of method, apparatus and readable storage medium storing program for executing of lifting OCR discriminations | |
| CN104483616A (en) | Classification method of chip bin maps in wafer circuit probing | |
| CN105157563A (en) | Beer bottleneck positioning method based on visual sense of machine | |
| CN103646899A (en) | Wafer defect detection method | |
| CN104925741A (en) | MEMS device cutting method | |
| CN107186359A (en) | A kind of intelligent high-speed laser cutting machine control system | |
| CN110689005A (en) | Commodity identification method based on deep learning fusion position and shape information | |
| CN206411239U (en) | A kind of characteristic automatic detection device of motor | |
| CN204204904U (en) | Expand epitaxial | |
| CN106843158B (en) | CAM system of stamping frame connecting plate equipment and processing method | |
| CN105334227A (en) | Chip detection system provided with light source | |
| CN105975696B (en) | Rule-based three-dimensional process dimension layout method | |
| CN204332927U (en) | Expand the teleblem structure of brilliant machine | |
| CN102130031B (en) | Method for detecting wafer | |
| CN113873423B (en) | Terminal positioning method, device and system | |
| CN103746208A (en) | Contact elastic piece and high-precision manufacturing method thereof | |
| CN203774271U (en) | Wafer arrangement frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141022 |