CN103531658A - 一种三氧化二铝薄膜的原子层沉积制备方法 - Google Patents
一种三氧化二铝薄膜的原子层沉积制备方法 Download PDFInfo
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- CN103531658A CN103531658A CN201310450417.3A CN201310450417A CN103531658A CN 103531658 A CN103531658 A CN 103531658A CN 201310450417 A CN201310450417 A CN 201310450417A CN 103531658 A CN103531658 A CN 103531658A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 238000000231 atomic layer deposition Methods 0.000 title abstract description 8
- 239000010409 thin film Substances 0.000 title abstract 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 title abstract 2
- 238000006243 chemical reaction Methods 0.000 claims abstract description 42
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 23
- 239000010703 silicon Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 6
- 239000001301 oxygen Substances 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 229910021419 crystalline silicon Inorganic materials 0.000 claims abstract description 5
- 239000012159 carrier gas Substances 0.000 claims description 13
- 230000004907 flux Effects 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 6
- 230000035484 reaction time Effects 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 34
- 238000005516 engineering process Methods 0.000 abstract description 14
- 229910004205 SiNX Inorganic materials 0.000 abstract description 11
- 238000005245 sintering Methods 0.000 abstract description 5
- 238000005137 deposition process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000001257 hydrogen Substances 0.000 abstract description 2
- 229910052593 corundum Inorganic materials 0.000 abstract 6
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 6
- 238000009825 accumulation Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 230000008569 process Effects 0.000 description 17
- 239000013078 crystal Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 15
- 238000000151 deposition Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000005001 laminate film Substances 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000002510 pyrogen Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (10)
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CN201310450417.3A CN103531658B (zh) | 2013-09-25 | 2013-09-25 | 一种三氧化二铝薄膜的原子层沉积制备方法 |
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CN201310450417.3A CN103531658B (zh) | 2013-09-25 | 2013-09-25 | 一种三氧化二铝薄膜的原子层沉积制备方法 |
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CN103531658A true CN103531658A (zh) | 2014-01-22 |
CN103531658B CN103531658B (zh) | 2015-11-18 |
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CN201310450417.3A Active CN103531658B (zh) | 2013-09-25 | 2013-09-25 | 一种三氧化二铝薄膜的原子层沉积制备方法 |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104557999A (zh) * | 2015-02-09 | 2015-04-29 | 江南大学 | 一种新型薄膜沉积铝前驱体及其制备方法 |
CN105349962A (zh) * | 2015-11-20 | 2016-02-24 | 浙江大学 | 提高微通道板软x射线-极紫外线成像性能的方法及产品 |
CN106058071A (zh) * | 2016-07-01 | 2016-10-26 | 沈阳拓荆科技有限公司 | Oled器件的阻挡层结构及其制备方法 |
CN107130228A (zh) * | 2017-04-24 | 2017-09-05 | 美的集团股份有限公司 | 三氧化二铝薄膜及其制备方法 |
CN107240648A (zh) * | 2017-05-22 | 2017-10-10 | 茆胜 | 复合封装薄膜及其制备方法 |
CN109457235A (zh) * | 2018-11-15 | 2019-03-12 | 盐城阿特斯协鑫阳光电力科技有限公司 | 一种氧化铝薄膜及其制备方法和应用 |
CN109545424A (zh) * | 2018-11-30 | 2019-03-29 | 苏州晶银新材料股份有限公司 | 一种导电银浆及其制备方法和应用 |
CN109728104A (zh) * | 2018-12-19 | 2019-05-07 | 盐城阿特斯协鑫阳光电力科技有限公司 | 电池片钝化层中间体、太阳能电池片及其制备方法 |
CN110042365A (zh) * | 2019-03-04 | 2019-07-23 | 中国科学院物理研究所 | 一种在二维材料表面生长氧化铝的原子层沉积方法 |
CN110473769A (zh) * | 2018-05-11 | 2019-11-19 | 圆益Ips股份有限公司 | 薄膜形成方法 |
CN110724933A (zh) * | 2019-11-07 | 2020-01-24 | 中国电子科技集团公司第三十八研究所 | 一种铝合金表面热控涂层的制备方法 |
CN111952010A (zh) * | 2020-07-06 | 2020-11-17 | 陕西科技大学 | 一种柔性金属有机骨架化合物薄膜及其制备方法和应用 |
CN114420790A (zh) * | 2022-01-19 | 2022-04-29 | 普乐新能源科技(徐州)有限公司 | 一种基于ald工艺制备叠层氧化铝膜层的方法 |
CN114959646A (zh) * | 2022-04-08 | 2022-08-30 | 普乐新能源科技(徐州)有限公司 | 一种优异的ald镀膜工艺 |
CN115261821A (zh) * | 2022-08-08 | 2022-11-01 | 中国科学院上海高等研究院 | 一种氢化ald薄膜的方法 |
CN116815165A (zh) * | 2023-08-24 | 2023-09-29 | 无锡松煜科技有限公司 | 一种低反射率的氧化铝钝化膜的制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN220543924U (zh) * | 2023-06-25 | 2024-02-27 | 天合光能股份有限公司 | 太阳能电池、光伏组件和光伏系统 |
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CN102064237A (zh) * | 2010-11-29 | 2011-05-18 | 奥特斯维能源(太仓)有限公司 | 一种用于晶体硅太阳电池的双层钝化方法 |
CN102637585A (zh) * | 2012-04-09 | 2012-08-15 | 北京七星华创电子股份有限公司 | 一种应用原子层沉积技术制备三氧化二铝钝化薄膜的方法 |
EP2557198A1 (en) * | 2011-08-10 | 2013-02-13 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
US20130157409A1 (en) * | 2011-12-16 | 2013-06-20 | Kaushik Vaidya | Selective atomic layer deposition of passivation layers for silicon-based photovoltaic devices |
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- 2013-09-25 CN CN201310450417.3A patent/CN103531658B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102064237A (zh) * | 2010-11-29 | 2011-05-18 | 奥特斯维能源(太仓)有限公司 | 一种用于晶体硅太阳电池的双层钝化方法 |
EP2557198A1 (en) * | 2011-08-10 | 2013-02-13 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
US20130157409A1 (en) * | 2011-12-16 | 2013-06-20 | Kaushik Vaidya | Selective atomic layer deposition of passivation layers for silicon-based photovoltaic devices |
CN102637585A (zh) * | 2012-04-09 | 2012-08-15 | 北京七星华创电子股份有限公司 | 一种应用原子层沉积技术制备三氧化二铝钝化薄膜的方法 |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104557999B (zh) * | 2015-02-09 | 2019-06-25 | 江南大学 | 一种新型薄膜沉积铝前驱体及其制备方法 |
CN104557999A (zh) * | 2015-02-09 | 2015-04-29 | 江南大学 | 一种新型薄膜沉积铝前驱体及其制备方法 |
CN105349962A (zh) * | 2015-11-20 | 2016-02-24 | 浙江大学 | 提高微通道板软x射线-极紫外线成像性能的方法及产品 |
CN106058071A (zh) * | 2016-07-01 | 2016-10-26 | 沈阳拓荆科技有限公司 | Oled器件的阻挡层结构及其制备方法 |
CN107130228A (zh) * | 2017-04-24 | 2017-09-05 | 美的集团股份有限公司 | 三氧化二铝薄膜及其制备方法 |
CN107130228B (zh) * | 2017-04-24 | 2019-07-02 | 美的集团股份有限公司 | 三氧化二铝薄膜及其制备方法 |
CN107240648A (zh) * | 2017-05-22 | 2017-10-10 | 茆胜 | 复合封装薄膜及其制备方法 |
CN110473769A (zh) * | 2018-05-11 | 2019-11-19 | 圆益Ips股份有限公司 | 薄膜形成方法 |
CN109457235A (zh) * | 2018-11-15 | 2019-03-12 | 盐城阿特斯协鑫阳光电力科技有限公司 | 一种氧化铝薄膜及其制备方法和应用 |
CN109545424B (zh) * | 2018-11-30 | 2020-09-15 | 苏州晶银新材料股份有限公司 | 一种导电银浆及其制备方法和应用 |
CN109545424A (zh) * | 2018-11-30 | 2019-03-29 | 苏州晶银新材料股份有限公司 | 一种导电银浆及其制备方法和应用 |
CN109728104A (zh) * | 2018-12-19 | 2019-05-07 | 盐城阿特斯协鑫阳光电力科技有限公司 | 电池片钝化层中间体、太阳能电池片及其制备方法 |
CN110042365A (zh) * | 2019-03-04 | 2019-07-23 | 中国科学院物理研究所 | 一种在二维材料表面生长氧化铝的原子层沉积方法 |
CN110724933A (zh) * | 2019-11-07 | 2020-01-24 | 中国电子科技集团公司第三十八研究所 | 一种铝合金表面热控涂层的制备方法 |
CN111952010A (zh) * | 2020-07-06 | 2020-11-17 | 陕西科技大学 | 一种柔性金属有机骨架化合物薄膜及其制备方法和应用 |
CN111952010B (zh) * | 2020-07-06 | 2022-06-17 | 陕西科技大学 | 一种柔性金属有机骨架化合物薄膜及其制备方法和应用 |
CN114420790A (zh) * | 2022-01-19 | 2022-04-29 | 普乐新能源科技(徐州)有限公司 | 一种基于ald工艺制备叠层氧化铝膜层的方法 |
CN114959646A (zh) * | 2022-04-08 | 2022-08-30 | 普乐新能源科技(徐州)有限公司 | 一种优异的ald镀膜工艺 |
CN115261821A (zh) * | 2022-08-08 | 2022-11-01 | 中国科学院上海高等研究院 | 一种氢化ald薄膜的方法 |
CN116815165A (zh) * | 2023-08-24 | 2023-09-29 | 无锡松煜科技有限公司 | 一种低反射率的氧化铝钝化膜的制备方法 |
CN116815165B (zh) * | 2023-08-24 | 2023-11-28 | 无锡松煜科技有限公司 | 一种低反射率的氧化铝钝化膜的制备方法 |
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