CN103531567A - Flat-belt lead frame - Google Patents
Flat-belt lead frame Download PDFInfo
- Publication number
- CN103531567A CN103531567A CN201310515027.XA CN201310515027A CN103531567A CN 103531567 A CN103531567 A CN 103531567A CN 201310515027 A CN201310515027 A CN 201310515027A CN 103531567 A CN103531567 A CN 103531567A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- flat
- flat rubber
- rubber belting
- terminal pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a flat-belt lead frame which comprises ten lead frame units arranged in a single row, wherein the lead frame units are connected through connecting ribs, each lead frame unit comprises a base body and lead pins, the connection part of the base body and each lead pin is bent, a locating hole is formed between every two adjacent lead frame units, and the width of each lead frame unit is 11.5 mm. The flat-belt lead frame meets the requirements of heat dissipation and electric conduction of a flat-belt plastic semiconductor device and the requirement of bearing of a flat belt chip, and the flat-belt lead frame is simple in structure, convenient to manufacture and applicable to mass production.
Description
Technical field
The present invention relates to a kind of lead frame, refer more particularly to a kind of lead frame of flat rubber belting.
Background technology
along with the development of electron trade, semiconductor device adopts the more and more many of Plastic Package form, the lead frame meeting the market requirement that needs a kind of flat rubber belting to bend.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of lead frame of flat rubber belting.
In order to solve the problems of the technologies described above, the invention provides a kind of lead frame of flat rubber belting, by ten lead frame unit single compositions, described lead frame connects by dowel between unit, described lead frame unit comprises matrix and terminal pin, bend in described matrix and terminal pin junction, lead frame is provided with location hole between unit, and the width of described lead frame unit is 11.5mm.
As a further improvement on the present invention, the bend angle of bending at place of described matrix and terminal pin is 15 °, and the plane of matrix and terminal pin is at a distance of 2.15mm.
As a further improvement on the present invention, be also provided with the place of bending in described base panel, the angle of bending is 20 °, and dislocation distance is 1.15mm.
As a further improvement on the present invention, described matrix is provided with Liang Chu pressure-sizing district.
As a further improvement on the present invention, described location hole diameter is 2mm.
As a further improvement on the present invention, described terminal pin thickness is 0.6mm.
The lead frame of flat rubber belting of the present invention meets encapsulation requirement, can meet market demand.
Accompanying drawing explanation
Fig. 1 is the structural representation of the lead frame of flat rubber belting of the present invention.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-location hole ，5-pressure-sizing district.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of lead frame of flat rubber belting, by ten lead frame unit 1 single compositions, between described lead frame unit 1, by dowel, connect, described lead frame unit 1 comprises matrix 2 and terminal pin 3, bending in described matrix 2 and terminal pin 3 junctions, is provided with location hole 4 between lead frame unit 1, and the width of described lead frame unit 1 is 11.5mm; Described matrix 2 and terminal pin 3 bend place the angle of bending be 15 °, the plane of matrix 2 and terminal pin 3 is at a distance of 2.15mm, on described matrix 2 panels, be also provided with the place of bending, the angle of bending is 20 °, dislocation distance is 1.15mm, described matrix 2 is provided with Liang Chu pressure-sizing district 5, and described location hole 4 diameters are 2mm, and described terminal pin 3 thickness are 0.6mm.
The present invention adapts to the requirement of chip of heat radiation, conduction and the carrying flat rubber belting of the epoxy seal semiconductor device of flat rubber belting, simple in structure, easily manufactured, is suitable for a large amount of production.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (6)
1. the lead frame of a flat rubber belting, by ten lead frame unit (1) single composition, between described lead frame unit (1), by dowel, connect, it is characterized in that: described lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in described matrix (2) and terminal pin (3) junction, between lead frame unit (1), be provided with location hole (4), the width of described lead frame unit (1) is 11.5mm.
2. the lead frame of a kind of flat rubber belting according to claim 1, is characterized in that: the bend angle of bending at place of described matrix (2) and terminal pin (3) is 15 °, and the plane of matrix (2) and terminal pin (3) is 2.15mm apart.
3. the lead frame of a kind of flat rubber belting according to claim 1, is characterized in that: on described matrix (2) panel, be also provided with the place of bending, the angle of bending is 20 °, and dislocation distance is 1.15mm.
4. the lead frame of a kind of flat rubber belting according to claim 1, is characterized in that: described matrix (2) is provided with Liang Chu pressure-sizing district (5).
5. the lead frame of a kind of flat rubber belting according to claim 1, is characterized in that: described location hole (4) diameter is 2mm.
6. the lead frame of a kind of flat rubber belting according to claim 1, is characterized in that: described terminal pin (3) thickness is 0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310515027.XA CN103531567A (en) | 2013-10-28 | 2013-10-28 | Flat-belt lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310515027.XA CN103531567A (en) | 2013-10-28 | 2013-10-28 | Flat-belt lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103531567A true CN103531567A (en) | 2014-01-22 |
Family
ID=49933452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310515027.XA Pending CN103531567A (en) | 2013-10-28 | 2013-10-28 | Flat-belt lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103531567A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN102332444A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Semiconductor lead frame of whole matrix surface |
-
2013
- 2013-10-28 CN CN201310515027.XA patent/CN103531567A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
| CN102332444A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Semiconductor lead frame of whole matrix surface |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140122 |