CN203553144U - Leading-wire frame - Google Patents

Leading-wire frame Download PDF

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Publication number
CN203553144U
CN203553144U CN201320667231.9U CN201320667231U CN203553144U CN 203553144 U CN203553144 U CN 203553144U CN 201320667231 U CN201320667231 U CN 201320667231U CN 203553144 U CN203553144 U CN 203553144U
Authority
CN
China
Prior art keywords
lead frame
leading
wire
wire frame
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320667231.9U
Other languages
Chinese (zh)
Inventor
沈健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taizhou Dongtian Electronics Co., Ltd.
Original Assignee
沈健
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沈健 filed Critical 沈健
Priority to CN201320667231.9U priority Critical patent/CN203553144U/en
Application granted granted Critical
Publication of CN203553144U publication Critical patent/CN203553144U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model discloses a leading-wire frame which is formed by ten leading-wire units arrayed in a single row. The leading-wire frame units are connected through splice bars. Each leading-wire frame unit includes a basal body and leading-wire pins. The connection positions of the basal bodies and the leading-wire pins are bent. Positioning holes are arranged among the leading-wire frames. Head-part openings of the basal bodies are semicircular and the radiuses of the semicircles are 2.5mm. The leading-wire frame solves a problem of package of the head-part openings and at the same time, ensures accurate precision so that the leading-wire frame is adaptive to market demands.

Description

A kind of lead frame
Technical field
The utility model relates to a kind of lead frame, refers more particularly to a kind of Full-plastics sealed lead frame of head opening.
Background technology
Along with the development of electron trade, large power semiconductor device adopts the more and more many of Plastic Package form, needs in the market a kind of Full-plastics sealed lead frame of head opening.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of Full-plastics sealed lead frame of head opening.
In order to solve the problems of the technologies described above, the utility model provides a kind of lead frame, by ten lead frame unit single compositions, described lead frame connects by dowel between unit, described lead frame unit comprises matrix and terminal pin, bends in described matrix and terminal pin junction, and lead frame is provided with location hole between unit, described matrix head opening semicircular in shape, half radius of a circle is 2.5mm.
As further improvement of the utility model, the width of described lead frame unit is 11.4mm.
As further improvement of the utility model, described matrix and terminal pin institute out-of-plane are at a distance of 1.4mm.
As further improvement of the utility model, described location hole diameter is 1.55mm.
As further improvement of the utility model, described terminal pin thickness is 0.6mm.
As further improvement of the utility model, described matrix thickness is 0.6mm.
Adopt said structure, its beneficial effect is: when the utility model lead frame has solved the encapsulation of head opening, guarantee that precision is accurate, adapt to market demand.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model lead frame.
In figure: 1-lead frame unit, 2-matrix, 3-terminal pin, 4-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Figure 1, a kind of lead frame, by ten lead frame unit 1 single compositions, between described lead frame unit 1, by dowel, connect, described lead frame unit 1 comprises matrix 2 and terminal pin 3, bend in described matrix 2 and terminal pin 3 junctions, between lead frame unit 1, be provided with location hole 4, described matrix 2 head opening semicirculars in shape, half radius of a circle is 2.5mm, the width of described lead frame unit 1 is 11.4mm, 3 out-of-planes of described matrix 2 and terminal pin are at a distance of 1.4mm, described location hole 4 diameters are 1.55mm, described terminal pin 3 thickness are 0.6mm, described matrix 2 thickness are 0.6mm.
When the utility model lead frame has solved the encapsulation of head opening, guarantee that precision is accurate, adapt to market demand.
Within the similar designed lead frame of technical characterictic of any employing and the utility model will fall into protection range of the present utility model.

Claims (6)

1. a lead frame, by ten lead frame unit (1) single composition, between described lead frame unit (1), by dowel, connect, it is characterized in that: described lead frame unit (1) comprises matrix (2) and terminal pin (3), bend in described matrix (2) and terminal pin (3) junction, between lead frame unit (1), be provided with location hole (4), described matrix (2) head opening semicircular in shape, half radius of a circle is 2.5mm.
2. a kind of lead frame according to claim 1, is characterized in that: the width of described lead frame unit (1) is 11.4mm.
3. a kind of lead frame according to claim 1, is characterized in that: described matrix (2) and terminal pin (3) institute out-of-plane are at a distance of 1.4mm.
4. a kind of lead frame according to claim 1, is characterized in that: described location hole (4) diameter is 1.55mm.
5. a kind of lead frame according to claim 1, is characterized in that: described terminal pin (3) thickness is 0.6mm.
6. a kind of lead frame according to claim 1, is characterized in that: described matrix (2) thickness is 0.6mm.
CN201320667231.9U 2013-10-28 2013-10-28 Leading-wire frame Expired - Fee Related CN203553144U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320667231.9U CN203553144U (en) 2013-10-28 2013-10-28 Leading-wire frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320667231.9U CN203553144U (en) 2013-10-28 2013-10-28 Leading-wire frame

Publications (1)

Publication Number Publication Date
CN203553144U true CN203553144U (en) 2014-04-16

Family

ID=50471224

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320667231.9U Expired - Fee Related CN203553144U (en) 2013-10-28 2013-10-28 Leading-wire frame

Country Status (1)

Country Link
CN (1) CN203553144U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531568A (en) * 2013-10-28 2014-01-22 沈健 Full-plastic package lead frame with top opening

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531568A (en) * 2013-10-28 2014-01-22 沈健 Full-plastic package lead frame with top opening

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20170419

Address after: 225300 Taizhou province high Port District Xu Zhuang prosperous road east side

Patentee after: Taizhou Dongtian Electronics Co., Ltd.

Address before: 225324 Taizhou, Jiangsu high port Xu Zhuang Road, East Yongfeng Road, No. 9

Patentee before: Shen Jian

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140416

Termination date: 20171028