CN103506927B - A kind of polishing machine material containing block - Google Patents
A kind of polishing machine material containing block Download PDFInfo
- Publication number
- CN103506927B CN103506927B CN201310516196.5A CN201310516196A CN103506927B CN 103506927 B CN103506927 B CN 103506927B CN 201310516196 A CN201310516196 A CN 201310516196A CN 103506927 B CN103506927 B CN 103506927B
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- CN
- China
- Prior art keywords
- material containing
- containing block
- sample
- block
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses a kind of polishing machine material containing block, comprise interconnective material containing block main body and thickness adjusting apparatus, described thickness adjusting apparatus is used for the thickness that quantitative adjusting sample stretches out relative to described material containing block main body.The thickness that the present invention utilizes thickness adjusting apparatus quantitative adjusting sample to stretch out relative to material containing block main body, to reach the sample of the different-thickness of polishing simultaneously, and quantitatively can regulate the object of polishing thickness, simultaneously, simple in sample polishing pre-treatment, do not need heating and cooling, save the time, improve efficiency.
Description
Technical field
The present invention relates to precise polished technical field, particularly relate to a kind of polishing machine material containing block.
Background technology
Precise grinding polisher, as machine glazed finish, is a kind of process technology that in various finishing method, machining accuracy is higher.Precise finiss polishing adopts special material containing block, be pressed on workpiece in containing the polishing fluid of abrasive material, workpiece is made to do high speed rotary motion on grinding block surface, workpiece is driven by workbench and does traverse motion, makes the polished surface of workpiece form extremely complicated, evenly fine and closely woven again movement locus.But, in process of lapping, due to the effect of tonnage and frictional force, easily produce workpiece positioning, even cause disengaging grinding block.For this reason, need a kind of motive power when can bear work, and the fixture of workpiece can be fixed, to improve polishing stable, improve crudy further.On the other hand, in research work, the workpiece of the polished processing of many needs or the character such as shape, hardness, thickness of sample are all had any different, and this just requires more meticulous to the material containing block of polishing machine.
Conventional precise polished airborne material block is cylindrical metal block, and upper bottom surface is plane.Need material containing block and polished sample to be heated to about 80 DEG C during use simultaneously, then paraffin rod be coated in material containing block surface and polished sample sticked together on its surface.Be cooled to can be placed on polishing machine abrasive disk after room temperature until sample and fixture and polishing is carried out to sample.Existing this material containing block has following major defect: need heating and cooling material containing block before (1), polishing, bothers and loses time.(2), this material containing block can only process the identical sample of thickness, otherwise because of bottom surface not steadily, sample will be caused to be separated with material containing block and even depart from grinding block.(3) quantitative adjusting of polishing thickness can not, be realized.
Summary of the invention
The present invention is directed to the complicated operation existed in prior art, the technical problem that can not process and regulate the sample of different-thickness, thus a kind of polishing machine material containing block is provided.
Above-mentioned technical problem of the present invention is mainly solved by following technical proposals:
Polishing machine material containing block of the present invention, comprises interconnective material containing block main body and thickness adjusting apparatus, and described thickness adjusting apparatus is used for the thickness that quantitative adjusting sample stretches out relative to described material containing block main body.
Further, described material containing block main body comprises with the material containing block base of middle guide hole and the solid block of sample cell, being connected in described material containing block base of the solid block activity of described sample cell, and forms the first sample cell with described material containing block base.
Further, described material containing block base side wall is also provided with the first adjustment fixing hole.
Further, described material containing block base is made up of a stainless steel substrates and an aluminium flake, and described stainless steel substrates and aluminium flake are mutually permanently connected.
Further, the solid block of described sample cell comprises the solid block of large sample groove and the solid block of small sample groove, and block is inner admittedly for the described large sample groove that is connected to of the solid block activity of described small sample groove, and forms the second sample cell with the solid block of described large sample groove.
Further, the solid block top of described large sample groove has depth adjustment hole, its sidewall has the second adjustment fixing hole.
Further, described thickness adjusting apparatus comprises trimmer, connecting rod and micrometer, described connecting rod is also connected with described trimmer, micrometer respectively through the middle guide hole of described material containing block base, and wherein, described micrometer is fixed on described material containing block base.
Further, the connected mode of described trimmer and connecting rod is detachable.
Further, the material of described trimmer is lucite, and its shape is circular.
Compared with prior art, the invention has the advantages that: utilize the thickness that thickness adjusting apparatus quantitative adjusting sample stretches out relative to material containing block main body, to reach the sample of the different-thickness of polishing simultaneously, and quantitatively can regulate the object of polishing thickness, meanwhile, simple in sample polishing pre-treatment, do not need heating and cooling, save the time, improve efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of polishing machine material containing block of the present invention;
Fig. 2 is the structural representation of the material containing block main body of polishing machine material containing block of the present invention;
Fig. 3 be the material containing block base of polishing machine material containing block of the present invention partly cut open figure;
Fig. 4 is the structural representation of the solid block of sample cell of polishing machine material containing block of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Consult shown in Fig. 1-3, polishing machine material containing block provided by the invention, comprises interconnective material containing block main body and thickness adjusting apparatus, and thickness adjusting apparatus is used for the thickness that quantitative adjusting sample stretches out relative to material containing block main body.Wherein, material containing block main body comprises with the material containing block base 3 of middle guide hole 32 and the solid block 2 of sample cell, being connected in described material containing block base 3 of solid block 2 activity of sample cell, and forms the first sample cell 31 with material containing block base 3.For the ease of quick adjustment and increasing work efficiency, preferably, the quantity of the first sample cell 31 is four, and is uniformly distributed in a circumferential direction.Material containing block base 3 sidewall is also provided with the first adjustment fixing hole 34.Its quantity is with the quantity one_to_one corresponding of the first sample cell 31.After the solid block 2 of sample cell adjusts position in material containing block base 3, the solid block 2 of fixing hole 34 pairs of sample cells is regulated to be fixed by a screw through first.Material containing block base 3 is made up of a stainless steel substrates and an aluminium flake, and stainless steel substrates and aluminium flake are fixed connection by Bolt through holes 33.
Consult shown in Fig. 4, the solid block 2 of sample cell comprises the solid block 21 of large sample groove and the solid block 22 of small sample groove, and block 21 is inner admittedly for the large sample groove that is connected to of solid block 22 activity of small sample groove.Preferably, the solid block 21 crown center position of large sample groove has depth adjustment hole 24, its sidewall has the second adjustment fixing hole 23.Utilize iron wire or screw etc. to adjust the height of the solid block 22 of small sample groove relative to the solid block 21 of large sample groove by depth adjustment hole 24, and regulate the solid block 22 of fixing hole 23 pairs of small sample grooves to carry out fastening by a screw through second.Arranging the solid block 21 of large sample groove with the solid block 22 of small sample groove is to form the second different sample cell 25 of another diameter, is applicable to the polishing grinding of different size sample.
Thickness adjusting apparatus of the present invention comprises trimmer 4, connecting rod 5 and micrometer 1, and connecting rod 5 is also connected with trimmer 4, micrometer 1 respectively through the middle guide hole 32 of material containing block base 3, and wherein, micrometer 1 is fixed on material containing block base 3.The connected mode of trimmer 4 and connecting rod 5 is detachable.Preferably, connecting rod 5 and trimmer 4 are threaded connection.For the ease of observing the state of sample, the material of trimmer 4 is lucite, and the matching form of its shape and material containing block base 3 closes, and all adopts circle.
The course of work below in conjunction with polishing machine material containing block is further introduced the present invention:
First the sample sheet epoxy resin of well cutting or other cementing agent are fixed on glass wafer (conform to the first sample cell 31 size, can buy) surface, and are placed on one of the mother glass sheet n.s prepared in the first sample cell 31.Trimmer 4 is screwed in the screwed side of connecting rod 5, regulate trimmer 4 apart from the distance of material containing block base 3 by micrometer 1 afterwards, this distance is the thickness of sample polishing.The lucite adopted due to trimmer 4 is transparent, whether naked eyes can contact plexiglass cover by confirmatory sample, thus, control the consistency of thickness that the sample in four the first sample cells 31 exposes, effectively prevent material containing block shakiness and sample positioning in polishing process, because the first sample cell 31 itself has certain depth, the sheet glass being stained with sample only just can be attached in the first sample cell 31 with water, can not come off.
Adjust after sample exposes thickness, tighten the screw in the first adjustment fixing hole 34, the solid block 2 of fixtured specimen groove.And back out trimmer 4, by regulating micrometer 1, connecting rod 5 is screwed back in material containing block base 1 and can carry out polishing.During the sample utilizing the second sample cell 25 polishing diameter different, its work process is substantially identical with the mode of employing the first sample cell 31, repeats no more herein.
In sum, this material containing block can realize processing 4 samples simultaneously, substantially increases the operating efficiency of polishing machine.Its adjustable sample exposes the function of material containing block body thickness, can not only realize the sample simultaneously processing different physical properties, and substantially increase the stability of polishing.Meanwhile, two kinds of sample cell internal diameters can realize the polishing grinding of the different different size sample needed.
The above, be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (5)
1. a polishing machine material containing block, is characterized in that: comprise interconnective material containing block main body and thickness adjusting apparatus, and described thickness adjusting apparatus is used for the thickness that quantitative adjusting sample stretches out relative to described material containing block main body;
Described material containing block main body comprises with the material containing block base (3) of middle guide hole (32) and the solid block (2) of sample cell, movable being connected in described material containing block base (3) of the solid block (2) of described sample cell, and form the first sample cell (31) with described material containing block base (3);
The solid block (2) of described sample cell comprises the solid block (21) of large sample groove and the solid block (22) of small sample groove, what the solid block (22) of described small sample groove was movable is connected to solid block (21) inside of described large sample groove, and forms the second sample cell (25) with the solid block (21) of described large sample groove;
Described thickness adjusting apparatus comprises trimmer (4), connecting rod (5) and micrometer (1), described connecting rod (5) through described material containing block base (3) middle guide hole (32) and be connected with described trimmer (4), micrometer (1) respectively, wherein, described micrometer (1) is fixed on described material containing block base (3), and the connected mode of described trimmer (4) and connecting rod (5) is detachable.
2. polishing machine material containing block according to claim 1, is characterized in that: described material containing block base (3) sidewall is also provided with the first adjustment fixing hole (34).
3. the polishing machine material containing block according to any one of claim 1 or 2, is characterized in that: described material containing block base (3) is made up of a stainless steel substrates and an aluminium flake, and described stainless steel substrates and aluminium flake are mutually permanently connected.
4. polishing machine material containing block according to claim 1, is characterized in that: solid block (21) top of described large sample groove has depth adjustment hole (24), its sidewall has the second adjustment fixing hole (23).
5. polishing machine material containing block according to claim 1, is characterized in that: the material of described trimmer (4) is lucite, and its shape is circular.
Priority Applications (1)
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CN201310516196.5A CN103506927B (en) | 2013-10-28 | 2013-10-28 | A kind of polishing machine material containing block |
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CN201310516196.5A CN103506927B (en) | 2013-10-28 | 2013-10-28 | A kind of polishing machine material containing block |
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CN103506927A CN103506927A (en) | 2014-01-15 |
CN103506927B true CN103506927B (en) | 2015-12-02 |
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CN201310516196.5A Expired - Fee Related CN103506927B (en) | 2013-10-28 | 2013-10-28 | A kind of polishing machine material containing block |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105223060B (en) * | 2015-10-29 | 2018-01-09 | 西北工业大学 | A kind of simple grinding tool |
CN105606422A (en) * | 2016-01-26 | 2016-05-25 | 西北工业大学 | Multifunctional grinding tool |
CN109822450A (en) * | 2017-11-23 | 2019-05-31 | 北京创昱科技有限公司 | Single-sided polishing multi-wafer thickness compensation device and milling apparatus and grinding method |
Citations (7)
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JPH02131864A (en) * | 1988-11-14 | 1990-05-21 | Toshiba Corp | Fitting jig for polishing work |
CN201237566Y (en) * | 2008-06-20 | 2009-05-13 | 北京科技大学 | Metallographic specimen clamper capable of saving polishing liquid |
CN201537844U (en) * | 2009-07-01 | 2010-08-04 | 中国科学院物理研究所 | Manual precise grinding polisher for preparing TEM sample |
CN102519778A (en) * | 2011-12-26 | 2012-06-27 | 北京工业大学 | Device convenient for grinding and polishing transmission electron microscope sample |
CN202770690U (en) * | 2012-09-02 | 2013-03-06 | 大连理工大学 | Grinding clamp controllable in grinding amount |
CN103231305A (en) * | 2013-05-09 | 2013-08-07 | 苏州金牛精密机械有限公司 | Plunger grinding fixture |
CN203696722U (en) * | 2013-10-28 | 2014-07-09 | 中国科学院地球化学研究所 | Loading block of polishing machine |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8696816B2 (en) * | 2005-01-11 | 2014-04-15 | Mitsubishi Electric Corporation | Semiconductor manufacturing apparatus |
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2013
- 2013-10-28 CN CN201310516196.5A patent/CN103506927B/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02131864A (en) * | 1988-11-14 | 1990-05-21 | Toshiba Corp | Fitting jig for polishing work |
CN201237566Y (en) * | 2008-06-20 | 2009-05-13 | 北京科技大学 | Metallographic specimen clamper capable of saving polishing liquid |
CN201537844U (en) * | 2009-07-01 | 2010-08-04 | 中国科学院物理研究所 | Manual precise grinding polisher for preparing TEM sample |
CN102519778A (en) * | 2011-12-26 | 2012-06-27 | 北京工业大学 | Device convenient for grinding and polishing transmission electron microscope sample |
CN202770690U (en) * | 2012-09-02 | 2013-03-06 | 大连理工大学 | Grinding clamp controllable in grinding amount |
CN103231305A (en) * | 2013-05-09 | 2013-08-07 | 苏州金牛精密机械有限公司 | Plunger grinding fixture |
CN203696722U (en) * | 2013-10-28 | 2014-07-09 | 中国科学院地球化学研究所 | Loading block of polishing machine |
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