CN201537844U - Manual precise grinding polisher for preparing TEM sample - Google Patents

Manual precise grinding polisher for preparing TEM sample Download PDF

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Publication number
CN201537844U
CN201537844U CN2009201096913U CN200920109691U CN201537844U CN 201537844 U CN201537844 U CN 201537844U CN 2009201096913 U CN2009201096913 U CN 2009201096913U CN 200920109691 U CN200920109691 U CN 200920109691U CN 201537844 U CN201537844 U CN 201537844U
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CN
China
Prior art keywords
grinding
polisher
main part
sample
micrometer screw
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Expired - Fee Related
Application number
CN2009201096913U
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Chinese (zh)
Inventor
廖昭亮
李琳
陈东敏
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Institute of Physics of CAS
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Institute of Physics of CAS
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Publication date
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Priority to CN2009201096913U priority Critical patent/CN201537844U/en
Application granted granted Critical
Publication of CN201537844U publication Critical patent/CN201537844U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a grinding polisher that can precisely control the thickness of the grinded sample. The manual grinding polisher comprises a main body, a micrometer screw and three gem balls. The micrometer screw and the gem balls are arranged on the main body. The micrometer screw is extended from a through hole in the middle of the main body. The plane at the top of the micrometer screw can load the sample. The position of the grinded sample can be precisely controlled by adjusting the button of the micrometer screw. Using the tool, the sample thickness to be grinded is preset before grinding. The data including the thickness of the sample grinded and the remaining sample to be grinded are read in the grinding process at any time and the prior grinding strength and the grinding sandpaper are selected according to the resulting data, thus very precisely controlling the grinding process and reducing the affinity between grinding chassis and water sandpaper when grinding, which has the advantage of smooth grinding and good hand feel.

Description

The manual precise finiss polisher that is used for the TEM sample preparation
Technical field
The present invention relates to a kind of frame for movement design of hand-ground polisher.
Background technology
Material science plays very enormous function to current technical development, and it directly promotes the development of new technology, is the most basic also subject the most widely in the industrial circle.And the research of material depends on the sign of various rerum naturas, and wherein its structural characterization is an important component part.The structural characterization of material is mainly realized by X-ray diffraction (XRD), neutron diffraction and transmission electron microscope (TEM).Transmission electron microscope is as one of a kind of structural research and characterization method, have its very big advantage, the trickle structure of local observation sample that can high power, its spatial resolution can reach inferior dust magnitude, carrying out the imaging of atom level, is big sharp weapon of material science research.But than XRD and neutron diffraction, TEM is to the sample requirement harshness, and it needs thickness of sample to be thinned to the littler yardstick of 100nm, and this causes certain difficulty to sample preparation.To bulk material and film sample, generally adopt grinding, pit and ion milling technology at present.The grinding stage is hand lapping, need be by finishing manually.This step is very time-consuming and physical, therefore needs a good grinding and polishing device to reduce the manpower time, allows the TEM sample preparation become easier.Traditional TEM sample grinding and polishing device can't accurately read thickness of sample, just judges thickness by printing opacity, for the printing opacity sample, this method will be greatly limited, and for opaque sample, when sample is thicker, can't judge thickness because of light tight fully, this is unfavorable for adjusting the grinding dynamics.
The utility model content
The invention provides a kind of grinding and polishing device that can accurately control ground sample thickness, this instrument can be read thickness of sample on the one hand, so that current grinding dynamics of good control and sandpaper selection, thereby control process of lapping very finely; Reduce the affinity of grinding when grinding between chassis and the water sandpaper on the one hand, make the more suitable cunning of grinding, feel is better.
A kind of manual precise finiss polisher comprises main part, jewel ball and micrometer screw mandrel, and the jewel ball is fixedly set in the pit of main part lower surface, and whole jewel ball balls top is in one and parallelly with the main part lower surface decides on the ground flat; The micrometer screw mandrel is arranged in the through hole at main part center; During use, the dismountable end that is fixed on the micrometer screw mandrel of sample.
Further, described jewel nodule number amount is at least 3.
Further, the pit depth L of main part lower surface of jewel ball and the pass between the jewel radius of a ball r being set is r 〉=L 〉=0.5r.
Further, described jewel ball is fixed in the described pit by glue.
Further, the material of described jewel ball be mohs hardness greater than the material more than 7, be preferably SiC.
Further, described manual precise finiss polisher also comprises fixture, is used for fixing the bar portion of micrometer screw mandrel, makes its fixed-site in process of lapping.
Further, described main part, its side is provided with along the equally distributed screw of its circumference.
Further, described fixture is to pass the screw of described main part side screw.
Further, described screw quantity is more than or equal to 3, is preferably 3.
Description of drawings
With reference to the accompanying drawings, by describing its one exemplary embodiment in detail, above and other features and advantages of the present invention will become more apparent, in the accompanying drawings:
Fig. 1 is the stereogram of grinding and polishing device.
Fig. 2 is a grinding and polishing device profile.
Fig. 3 is the bonding grinding and polishing device schematic diagram for the treatment of behind the grind away product.
The specific embodiment
As shown in Figure 1: the grinding and polishing device is assembled by three parts, and these three parts are: main part 1, micrometer screw mandrel 2 and jewel ball 3.As shown in Figure 2: main part 1 is stainless steel or other hard metal materials, for cross sectional shape is circular, square, rectangle, wait the column of other shapes, the through hole of the core band vertical body parts lower surface of main part 1, the bar head of micrometer screw mandrel passes from through hole.The material of jewel ball 3 require for mohs hardness greater than the material 7 or more, preferred SiC jewel ball.Three jewel ball 3 usefulness glue are fixed in the pit 6 of agent structure part bottom in the close-fitting mode, and the degree of depth L of this pit 6 is r 〉=L 〉=0.5r, and wherein r is the jewel radius of a ball.The degree of depth of this pit 6 is dark 3mm in the present embodiment, diameter is 5.8mm, with glue with ball fixing after, ball is calibrated, its top is on the plane parallel with the main part lower surface, the concrete grammar of calibration is: the main part that is stained with behind the ball is lain on the smooth big glass plate, this time is by the effect calibration jewel ball between glass and the ball top, its top is on the same plane parallel with the main part lower surface, calibration back all jewel ball balls is pushed up residing plane and is called and decides ground flat 7, as shown in Figure 3.
Micrometer screw mandrel 1 is arranged on the central through hole position that is indicated among agent structure such as Fig. 2, can fix by mode such as gluing.
Main part also has the fixture of micrometer screw mandrel bull stick, and the fixture in the present embodiment is.Pass the hold-down screw 5 of main part side screw 4, the quantity of screw 4 is preferably three, but also can increase according to actual conditions.Fixture also can adopt other device.
Jewel ball 3 and micrometer screw mandrel 1 are bonded in glue EPOXY glue preferably on the main part 2.
In use, as shown in Figure 3, use PUR with to be ground 8 head that is arranged on micrometer screw mandrel 1, then the axial location of abrasive article is calibrated, calibration steps is: the grinding and polishing device is placed on the smooth glass plate, gently revolves the knob of micrometer screw mandrel downwards, when sample touches glass plate, show that promptly sample is in deciding on the ground flat 7 of three jewel ball places, reads reading and record on the micrometer screw mandrel 1.So far grinding preparation finishes.When grinding, at first, rotate micrometer screw mandrel 1, its downward push-in stroke, difference during rotation back reading and calibration just between the reading, to be ground 8 amount of grinding that should equal to preset, and use hold-down screw 5 that the bull stick of micrometer screw mandrel is fixed, in case dog link in process of lapping rotation and rock.Next, treating abrasive article 8 grinds.After to be ground quilt ground off the setting amount of grinding, grinding work can stop.We can be ground to sample about 20 microns within two hours in this way in the test of reality with in using.
After disclosed grinding and polishing device reaches the amount of grinding that sets at process of lapping in use the utility model, even continuation grinding step, since to be ground be in by the jewel ball determined decide to be lower than on the ground flat or slightly decide ground flat, milling apparatus can't touch to be ground also just can't be continued to treat abrasive article and grind.Can well protect to be ground, make it can over-lapping.
Grinding and polishing device in the utility model also can be used for determining of the amount of grinding that grinds at random.The i.e. i.e. amount of grinding as can be known of reading by grinding back micrometer screw mandrel and the difference between the default micrometer screw mandrel reading.
Though specifically show and described the present invention with reference to its exemplary embodiment, yet those having ordinary skill in the art will appreciate that under the situation that does not break away from the spirit and scope of the present invention that the requirement of having the right defines, can carry out the different variations on form and the details.

Claims (9)

1. a manual precise finiss polisher comprises main part, jewel ball and micrometer screw mandrel, and the jewel ball is fixedly set in the pit of main part lower surface, and whole jewel ball balls top is in one and parallelly with the main part lower surface decides on the ground flat; The micrometer screw mandrel is arranged in the through hole at main part center; During use, the dismountable end that is fixed on the micrometer screw mandrel of sample.
2. according to the manual precise finiss polisher described in the claim 1, it is characterized in that described jewel nodule number amount is at least 3.
3. according to the manual precise finiss polisher described in the claim 1, it is characterized in that it is r 〉=L 〉=0.5r that the pit depth L of main part lower surface of jewel ball and the pass between the jewel radius of a ball r are set.
4. according to the manual precise finiss polisher described in the claim 1, it is characterized in that described jewel ball is fixed in the described pit by glue.
5. according to the manual precise finiss polisher described in the claim 1, it is characterized in that, the material of described jewel ball be mohs hardness greater than the material more than 7, be preferably SiC.
6. according to the manual precise finiss polisher described in the claim 1, it is characterized in that described manual precise finiss polisher also comprises fixture, is used for fixing the bar portion of micrometer screw mandrel, makes its fixed-site in process of lapping.
7. according to the manual precise finiss polisher described in the claim 1, it is characterized in that, described main part, its side is provided with along the equally distributed screw of its circumference.
8. according to the manual precise finiss polisher described in the claim 7, it is characterized in that described fixture is to pass the screw of described main part side screw.
9. according to the manual precise finiss polisher described in the claim 7, it is characterized in that described screw quantity is more than or equal to 3.
CN2009201096913U 2009-07-01 2009-07-01 Manual precise grinding polisher for preparing TEM sample Expired - Fee Related CN201537844U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201096913U CN201537844U (en) 2009-07-01 2009-07-01 Manual precise grinding polisher for preparing TEM sample

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Application Number Priority Date Filing Date Title
CN2009201096913U CN201537844U (en) 2009-07-01 2009-07-01 Manual precise grinding polisher for preparing TEM sample

Publications (1)

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CN201537844U true CN201537844U (en) 2010-08-04

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101692024B (en) * 2009-10-28 2011-06-08 中国航空工业集团公司北京航空制造工程研究所 Manual sample grinding tool with welding line structure for transmission electron microscope sample
CN103506927A (en) * 2013-10-28 2014-01-15 中国科学院地球化学研究所 Polisher loading block
CN104990783A (en) * 2015-06-01 2015-10-21 南京大学 High precision transmission electron microscope sample mill

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101692024B (en) * 2009-10-28 2011-06-08 中国航空工业集团公司北京航空制造工程研究所 Manual sample grinding tool with welding line structure for transmission electron microscope sample
CN103506927A (en) * 2013-10-28 2014-01-15 中国科学院地球化学研究所 Polisher loading block
CN103506927B (en) * 2013-10-28 2015-12-02 中国科学院地球化学研究所 A kind of polishing machine material containing block
CN104990783A (en) * 2015-06-01 2015-10-21 南京大学 High precision transmission electron microscope sample mill
CN104990783B (en) * 2015-06-01 2017-12-29 南京大学 High-precision transmission electron microscope sample mill

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100804

Termination date: 20120701