CN103503123A - 串联式热处理装置 - Google Patents

串联式热处理装置 Download PDF

Info

Publication number
CN103503123A
CN103503123A CN201280020758.0A CN201280020758A CN103503123A CN 103503123 A CN103503123 A CN 103503123A CN 201280020758 A CN201280020758 A CN 201280020758A CN 103503123 A CN103503123 A CN 103503123A
Authority
CN
China
Prior art keywords
substrate
take
plate
heating furnace
tandem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280020758.0A
Other languages
English (en)
Chinese (zh)
Inventor
李炳一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tera Semicon Corp
Terra Semiconductor Inc
Original Assignee
Terra Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110041935A external-priority patent/KR20120124192A/ko
Priority claimed from KR1020110050943A external-priority patent/KR101258629B1/ko
Application filed by Terra Semiconductor Inc filed Critical Terra Semiconductor Inc
Publication of CN103503123A publication Critical patent/CN103503123A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tunnel Furnaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
CN201280020758.0A 2011-05-03 2012-05-02 串联式热处理装置 Pending CN103503123A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR1020110041935A KR20120124192A (ko) 2011-05-03 2011-05-03 인라인 열처리 장치 및 그 온도 제어 방법
KR10-2011-0041935 2011-05-03
KR1020110050943A KR101258629B1 (ko) 2011-05-27 2011-05-27 인라인 열처리 장치 및 그 기판 이송 방법
KR10-2011-0050943 2011-05-27
PCT/KR2012/003408 WO2012150798A2 (ko) 2011-05-03 2012-05-02 인라인 열처리 장치

Publications (1)

Publication Number Publication Date
CN103503123A true CN103503123A (zh) 2014-01-08

Family

ID=47108124

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280020758.0A Pending CN103503123A (zh) 2011-05-03 2012-05-02 串联式热处理装置

Country Status (4)

Country Link
JP (1) JP2014519187A (ja)
CN (1) CN103503123A (ja)
TW (1) TW201310498A (ja)
WO (1) WO2012150798A2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107256841A (zh) * 2017-05-31 2017-10-17 武汉华星光电技术有限公司 快速热退火机
CN107887308A (zh) * 2017-12-01 2018-04-06 合肥芯欣智能科技有限公司 全自动多功能处理设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1461726A (zh) * 2002-05-30 2003-12-17 东京毅力科创株式会社 基板搬运装置和基板处理装置
US20080308039A1 (en) * 2007-06-18 2008-12-18 Chang-Suk Oh Apparatus for processing a substrate
CN100479117C (zh) * 2004-05-12 2009-04-15 微传科技有限公司 半导体器件的热处理系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3663674B2 (ja) * 1995-05-15 2005-06-22 日本電池株式会社 紫外線処理装置
JP3202929B2 (ja) * 1996-09-13 2001-08-27 東京エレクトロン株式会社 処理システム
KR101015596B1 (ko) * 2005-02-28 2011-02-17 주식회사 비아트론 반도체 소자의 열처리 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1461726A (zh) * 2002-05-30 2003-12-17 东京毅力科创株式会社 基板搬运装置和基板处理装置
CN100479117C (zh) * 2004-05-12 2009-04-15 微传科技有限公司 半导体器件的热处理系统
US20080308039A1 (en) * 2007-06-18 2008-12-18 Chang-Suk Oh Apparatus for processing a substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107256841A (zh) * 2017-05-31 2017-10-17 武汉华星光电技术有限公司 快速热退火机
CN107256841B (zh) * 2017-05-31 2020-07-03 武汉华星光电技术有限公司 快速热退火机
CN107887308A (zh) * 2017-12-01 2018-04-06 合肥芯欣智能科技有限公司 全自动多功能处理设备

Also Published As

Publication number Publication date
WO2012150798A3 (ko) 2013-03-21
WO2012150798A2 (ko) 2012-11-08
JP2014519187A (ja) 2014-08-07
TW201310498A (zh) 2013-03-01

Similar Documents

Publication Publication Date Title
CN104986950B (zh) 用于热处理多个玻璃基材的设备
US20130047673A1 (en) Glass Tempering Method And Apparatus
JP5561664B2 (ja) リフトピン機構
CN103503123A (zh) 串联式热处理装置
CN105140153B (zh) 加热器区块及利用所述加热器区块的基板热处理装置
KR101199954B1 (ko) 기판 처리용 보트
CN104078384A (zh) 直列式热处理装置
CN101748386A (zh) 一种等离子体加工设备
KR100829927B1 (ko) 반도체 소자 로딩 모듈 및 이를 이용한 반도체 소자 열처리시스템
TW201232604A (en) Substrate processing device and substrate processing method
KR20120126268A (ko) 인라인 열처리 장치
KR101258615B1 (ko) 인라인 열처리 장치
KR101284065B1 (ko) 인라인 열처리 장치
KR101258620B1 (ko) 인라인 열처리 장치
KR101258629B1 (ko) 인라인 열처리 장치 및 그 기판 이송 방법
KR101167989B1 (ko) 기판 처리 장치
KR101445685B1 (ko) 인라인 열처리 장치
KR101243949B1 (ko) 인라인 열처리 장치
KR101258982B1 (ko) 인라인 열처리 장치
KR101188270B1 (ko) 인라인 열처리 장치
KR101258621B1 (ko) 인라인 열처리 장치
KR100731318B1 (ko) 유리성형장치
KR20140125205A (ko) 인라인 열처리 장치
KR20130032349A (ko) 인라인 열처리 장치 및 그 온도 제어 방법
KR102170150B1 (ko) 분리형 기판 열처리 장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140108