CN103491724A - Uncovering method of rigid-flex combination board - Google Patents
Uncovering method of rigid-flex combination board Download PDFInfo
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- CN103491724A CN103491724A CN201310434393.2A CN201310434393A CN103491724A CN 103491724 A CN103491724 A CN 103491724A CN 201310434393 A CN201310434393 A CN 201310434393A CN 103491724 A CN103491724 A CN 103491724A
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- rigid
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- uncovering
- lid
- flex combined
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Abstract
The invention discloses an uncovering method of a rigid-flex combination board. The method comprises the first step that operation from blanking of the rigid-flex combination board to the surface processing procedure is finished through normal printed wiring board making operation; the second step that when an internal layer circuit of the rigid-flex combination board is manufactured, a protective copper line is reserved at the uncovering position, the length of the copper line is slightly larger than the uncovering length, and the width of the copper line is 5-15mil; the third step that the operation of laser uncovering and belt drilling is finished; the fourth step that the part, between a solder mask layer and a copper protective layer, of a hardboard is burnt out; the fifth step that the rigid-flex combination board is manufactured to be of a design shape through a forming procedure, hard board layers which do not need to be reserved in design paper are removed through an uncovering tool, and then the uncovering operation is finished. According to the rigid-flex combination board obtained through the uncovering method of the rigid-flex combination board, machining on the double faces is achieved, patterns transfer easily, the reliability is high, a soft board layer can be effectively prevented from being burnt by laser, flexibility is good, bending radius is large and bending times are increased.
Description
Technical field
The present invention relates to rigid-flex combined board, particularly relate to a kind of method of lid of taking off of rigid-flex combined board.
Background technology
Existing rigid-flex combined board is taken off and is covered the two-sided processing of action need, the production capacity that greatly waste is produced, and thickness and the shape of processing all have larger restriction, can not realize the processing of thin plate and complicated peel map shape.And existing single-sided process method all exists liquid medicine to infiltrate soft board and hardboard binding site, cause reliability failures abnormal; And cover position and obvious pit occurs taking off, causing figure to shift difficulty increases, and can not meet the making requirement of fine-line.
Summary of the invention
The object of the invention is to provide and a kind ofly realizes that two-sided processing, figure are shifted easily, reliability is high, effectively protects, and but the soft board layer is not good by the laser burn flexility, the deflection radius large, the rigid-flex combined board of deflection increased frequency take off the method for lid.
To achieve these goals, the present invention designs a kind of method of lid of taking off of rigid-flex combined board, comprises the steps:
The first step, by normal printed wiring board making sheet operation, complete the rigid-flex combined board sawing sheet to table
The making of face treatment process;
Second step, when the rigid-flex combined board internal layer circuit is made, cover the reserved protection copper in position taking off
Line, the Length Ratio of copper cash takes off that to cover length slightly long, and the width of copper cash is between 5 ~ 15mil;
The 3rd step, complete laser and take off the making of covering drilling;
The 4th step, partly blow solder mask with the hardboard down to more than copper layer protective layer;
The 5th step, then by molding procedure, rigid-flex combined board is processed into to design shape, cover work by taking off
Tool is removed the hardboard layer that does not need in design drawing to retain, and completes and takes off the lid operation.
The move one's steps technique of bouncing of drilling tool of described employing is treated the ablation that circulated of the hardboard of taking off lid, described moving one's steps
The technique of bouncing of drilling tool comprises following process: the brill cutter in three groups of same apertures is set, and same group of brill cutter adopts tangent mode to make, and every group of starting point of boring cutter need be offset 0.05mm along cut direction, and 0.1501mm, 0.1502mm, the 0.1503mm for aperture that bore cutter identify.
Compared with prior art, the method beneficial effect of lid of taking off of rigid-flex combined board of the present invention is:
1. adopt the CO2 laser drill to realize the lid of taking off of rigid-flex combined board;
2. increase the protection copper cash, the Length Ratio of copper cash takes off that to cover length slightly long, and the width of copper cash is between 5 ~ 15mil;
3. adopt the technique of the bouncing of drilling tool of moving one's steps to treat the ablation that circulated of the hardboard of taking off lid, the uniformity that simultaneously meets ablation depth is controlled and the regularity requirement at ablation edge;
4. when ablation process is carried out, utilize reserved protection copper cash, prevent that overflowing of operation process energy from causing damage to the soft board layer;
5. rigid-flex combined board is before taking off lid, according to normal multi-layer sheet, makes, abnormal without oozing liquid medicine, can effectively avoid oozing liquid medicine and the reliability that occurs is abnormal;
6, can realize the single-sided process of rigid-flex combined board, improve greatly the production efficiency of rigid-flex combined board;
7, when realizing taking off lid processing, can protect the soft board layer of rigid-flex combined board injury-free simultaneously; Can also prevent that the situation of oozing liquid medicine from producing, and improves the reliability of product;
8, cover position can to alleviate greatly the ablated section blackout of causing of hardboard abnormal taking off.
the accompanying drawing explanation:
Fig. 1 is the manufacture method flow chart of taking off the method for lid of existing rigid-flex combined board;
Fig. 2 is the structural representation of the rigid-flex combined board of the inventive method making.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing, structural principle of the present invention is described in further detail:
Take L3 6 layers of rigid-flex combined board of 4 layers of soft board illustrate the implementation procedure of taking off the method for lid of rigid-flex combined board of the present invention as example, it comprises the steps:
The first step, by normal printed wiring board making sheet operation, complete the rigid-flex combined board sawing sheet to table
The making of face treatment process;
Second step, when the rigid-flex combined board internal layer circuit is made, cover the reserved protection copper in position taking off
Line, the Length Ratio of copper cash takes off that to cover length slightly long, and the width of copper cash is between 5 ~ 15mil;
The 3rd step, complete laser and take off the making of covering drilling;
The 4th step, partly blow solder mask with the hardboard down to more than copper layer protective layer;
The 5th step, then by molding procedure, rigid-flex combined board is processed into to design shape, cover work by taking off
Tool is removed the hardboard layer that does not need in design drawing to retain, and completes and takes off the lid operation.
As shown in Figure 1, printed wiring board making sheet operation comprises CAM making, MI making, sawing sheet and several large processes of pressing, specifically describes equally with existing circuit board operation, is not described in detail in this.
As shown in Figure 2; the rigid-flex combined board of making by the inventive method; it comprises the solder mask 1 of upper surface and lower surface, the soft board layer 7 in the middle of being positioned at; be provided with hardboard line pattern copper layer 2 between upper surface solder mask and lower surface solder mask; be provided with insulating barrier 3, copper layer protective layer 5 between hardboard line pattern copper layer 2; the surface of upper surface solder mask and lower surface solder mask be provided with a plurality of take off lid window in advance the position 4, the top and bottom of soft board layer 7 are respectively equipped with soft board line pattern copper layer 6.The surface of described upper surface solder mask, lower surface solder mask to take off the lid position of windowing in advance 4 concentric.The described lid position of windowing in advance of taking off is 4 corresponding with the center of copper layer protective layer 5.When the rigid-flex combined board internal layer circuit is made, cover the reserved copper layer protective layer in position taking off, the Length Ratio of copper layer protective layer takes off that to cover length slightly long.
The design of the protection copper cash that the present invention increases, can prevent the damage that the soft board layer is caused of overflowing of laser energy; The application of the bouncing of drilling tool of moving one's steps method, avoid the laser energy concentrations to cause hardboard section blackout.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment, the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (2)
- A rigid-flex combined board take off the method for lid, it is characterized in that, comprise the steps:The first step, by normal printed wiring board making sheet operation, complete the making of rigid-flex combined board sawing sheet to surface treatment procedure;Second step, when the rigid-flex combined board internal layer circuit is made, cover the reserved protection copper cash in position taking off, and the Length Ratio of copper cash takes off that to cover length slightly long, and the width of copper cash is between 5 ~ 15mil;The 3rd step, complete laser and take off the making of covering drilling;The 4th step, partly blow solder mask with the hardboard down to more than copper layer protective layer;The 5th step, then by molding procedure, rigid-flex combined board is processed into to design shape, by taking off the instrument of lid, the hardboard layer that does not need in design drawing to retain is removed, complete and take off the lid operation.
- 2. rigid-flex combined board according to claim 1 takes off the method for lid, it is characterized in that: the move one's steps technique of bouncing of drilling tool of described employing is treated the ablation that circulated of the hardboard of taking off lid, the technique of the described bouncing of drilling tool of moving one's steps comprises following process: the brill cutter that three groups of same apertures are set, same group is bored cutter and adopts tangent mode to make, every group of starting point of boring cutter need be offset 0.05mm along cut direction, and 0.1501mm, 0.1502mm, the 0.1503mm for aperture that bore cutter identify.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310434393.2A CN103491724A (en) | 2013-09-23 | 2013-09-23 | Uncovering method of rigid-flex combination board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310434393.2A CN103491724A (en) | 2013-09-23 | 2013-09-23 | Uncovering method of rigid-flex combination board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103491724A true CN103491724A (en) | 2014-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310434393.2A Pending CN103491724A (en) | 2013-09-23 | 2013-09-23 | Uncovering method of rigid-flex combination board |
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| CN (1) | CN103491724A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684147A (en) * | 2018-06-04 | 2018-10-19 | 广州美维电子有限公司 | The foolproof method that a kind of UV laser for PCB is uncapped |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016482A (en) * | 2006-07-03 | 2008-01-24 | Nippon Mektron Ltd | Manufacturing method of multilayer printed wiring board |
| CN102573328A (en) * | 2012-01-08 | 2012-07-11 | 上海美维电子有限公司 | Manufacturing method for flexible and hard combined thin PCB |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN102711392A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Manufacturing method of flexible-rigid circuit board |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
-
2013
- 2013-09-23 CN CN201310434393.2A patent/CN103491724A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016482A (en) * | 2006-07-03 | 2008-01-24 | Nippon Mektron Ltd | Manufacturing method of multilayer printed wiring board |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
| CN102573328A (en) * | 2012-01-08 | 2012-07-11 | 上海美维电子有限公司 | Manufacturing method for flexible and hard combined thin PCB |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN102711392A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Manufacturing method of flexible-rigid circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 林映生 等: "二氧化碳激光钻孔机新技术应用的探究", 《印制电路信息》, 10 April 2013 (2013-04-10), pages 144 - 153 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684147A (en) * | 2018-06-04 | 2018-10-19 | 广州美维电子有限公司 | The foolproof method that a kind of UV laser for PCB is uncapped |
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Application publication date: 20140101 |