CN103456392A - Transparent electric conductor and manufacturing method thereof - Google Patents
Transparent electric conductor and manufacturing method thereof Download PDFInfo
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- CN103456392A CN103456392A CN2013103785837A CN201310378583A CN103456392A CN 103456392 A CN103456392 A CN 103456392A CN 2013103785837 A CN2013103785837 A CN 2013103785837A CN 201310378583 A CN201310378583 A CN 201310378583A CN 103456392 A CN103456392 A CN 103456392A
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Abstract
The invention provides a transparent electric conductor and a manufacturing method of the transparent electric conductor. The transparent electric conductor comprises a transparent substrate, a first conducting layer and a second conducting layer, wherein the first conducting layer and the second conducting layer are arranged on the transparent substrate. The first conducting layer and the second conducting layer are respectively composed of a plurality of electrodes arranged at intervals. Every two adjacent electrodes are mutually insulated. The electrodes forming the first conducting layer and the electrodes forming the second conducting layer are arranged in an intersecting mode in space so that mutual inductance capacitors can be formed. The electrodes are of a grid shape and mutually intersect through electric leads located on the same plane. A grid-shaped electrode formed by the electric leads is made of hybrid ink containing a conducting material and a resin material and formed through the exposure development technology. The conducting grid can be made of the hybrid ink having the conductivity and photoresist performance and prepared through exposure, development and drying. Compared with an ITO film, the transparent electric conductor is simple in manufacturing technology, suitable for production in large area and in batches, capable of being used in a device of a large size, high in production efficiency and capable of reducing the production cost.
Description
Technical field
The present invention relates to the touch-screen technology of preparing, relate in particular to a kind of transparent conductive body and manufacture method thereof.
Background technology
Touch-screen is the inductive arrangement that can receive the input signals such as touch.Touch-screen has given information interaction brand-new looks, is extremely attractive brand-new information interaction equipment.The development of touch screen technology has caused the common concern of domestic and international information medium circle, has become the Chaoyang new high-tech industry that the photoelectricity industry is a dark horse.
At present, indium tin oxide (being called for short ITO) layer is vital part in the touch-screen module.Although the develop rapidly at a tremendous pace of the manufacturing technology of touch-screen.But take the projecting type capacitor screen as example, too large change does not occur in the basic manufacturing process of ITO layer in recent years.Always inevitably need the ITO plated film, ITO is graphical.
But the resistivity of ITO is larger, at pad, AIO(All in one), limited its usability on the larger equipment of NoteBook equidimension.
Summary of the invention
The invention provides a kind of transparent conductive body and manufacture method thereof, for overcoming defect of the prior art, simple, the applicable large tracts of land of manufacture craft, production in enormous quantities, and conductivity is better, is applicable to larger-size equipment and uses.
The invention provides a kind of transparent conductive body, comprise by the transparent substrates made of insulation material, be located at the first conductive layer of this transparent substrates upper surface and be fixed on the second conductive layer of this transparent substrates lower surface, described the first conductive layer and the second conductive layer form by a plurality of spaced electrodes of strip that are, insulated from each other between adjacent two described electrodes; The electrode that forms described the first conductive layer is spatially arranged in a crossed manner with the electrode that forms the second conductive layer; Described electrode is latticed, and described grid is by intersected with each other being connected to form of conductor wire be positioned on the same face; The grid electrode that described conductor wire forms adopts the mixed ink that comprises electric conducting material and resin material, based on the exposure imaging technological forming.
Wherein, described conductor wire place intersected with each other forms node, and the distance between adjacent two described nodes is between 50 μ m～500 μ m.
Wherein, the width of described conductor wire is between 0.2 μ m～5.0 μ m, and the thickness of described conductor wire is between 0.5 μ m～10.0 μ m.
Further, on described the first conductive layer and the second conductive layer, all be covered with the shadow layer that disappears, the described shadow layer that disappears covers the hollow region of the grid of described conductor wire and the formation of described conductor wire.
Wherein, all be covered with protective layer on the described shadow layer that disappears.
Wherein, all be covered with protective layer on described the first conductive layer and the second conductive layer.
Particularly, described electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust.
Particularly, described resin material comprises the film-forming resin that weight content is 30～50 parts, the emulsion of 1～10 part, the solvent of 10～40 parts, the stabilizer of 0.1～5 part, the levelling agent of 0.1～5 part and the defoamer of 0.1～5 part;
Described film-forming resin is at least one in polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ethers and M Cr;
Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, fragrant salt compounded of iodine and ferrocene salt;
Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1, at least one in 6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester;
Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine and anthraquinone;
Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
The present invention also provides a kind of manufacture method of above-mentioned transparent conductive body, comprises the following steps:
Step 3, carry out development treatment by the product after above-mentioned exposure, makes described ink layer form the waffle-like pattern of hollow out; Cover in the ink layer of the waffle-like pattern of transparent substrates upper surface and form the first conductive layer, cover in the ink layer of the waffle-like pattern of transparent substrates lower surface and form the second conductive layer.
In such scheme, between step 1 and step 2, also comprise:
Step 1S, the transparent substrates that two sides in step 1 is all scribbled to mixed ink is carried out preliminary drying.
Preferably, the dominant wavelength of the light that the described ultraviolet lamp in step 2 sends is 300～400nm, and exposure energy is at 50～500mJ/cm
2between.
After described step 3, also comprise:
Step 4, the product after step 3 is developed is dried.
As the optimal way of above-described embodiment, after step 4, also comprise:
Step 5a covers respectively insulating resin on described the first conductive layer and the second conductive layer, and the refractive index of this insulating resin, between 1.6～2.8, and is cured above-mentioned insulating resin, and the insulating resin after solidifying forms the described shadow layer that disappears.Further; can also after step 5a, also comprise: step 6; cover respectively heat reactive resin or UV-cured resin on the above-mentioned shadow layer that disappears; and by heating or UV-irradiation, described heat reactive resin or UV-cured resin are cured, described heat reactive resin or ultraviolet resin are cured rear formation protective layer.
A kind of execution mode arranged side by side for above-described embodiment also comprises after step 4:
Step 5b; cover respectively heat reactive resin or ultraviolet resin on described the first conductive layer and the second conductive layer; and by heating or UV-irradiation, described heat reactive resin or ultraviolet resin are cured, described heat reactive resin or ultraviolet resin are cured rear formation protective layer.
In above-described embodiment, the preliminary drying temperature in described step 1S is 60～120 ℃, and the preliminary drying time is 10～60 minutes.
Bake out temperature in described step 4 is 100～150 ℃, and drying time is 10～60 minutes.
Exposure-processed in wherein said step 2 comprises:
Step 21, be placed on the first mask plate on the ink layer of transparent substrates upper surface, the second mask plate is placed on the ink layer of transparent substrates lower surface, and the first mask plate and the second mask plate form by shading light part and light transmission part;
Step 22, irradiated the first mask plate and the second mask plate by ultraviolet lamp;
Step 23, take off the first mask plate and the second mask plate respectively from ink layer.
Development treatment in described step 3 is specially: above-mentioned ink layer is positioned in developer solution, described ink layer and light transmission part or with shading light part over against be partially dissolved in developing solution, the undissolved part of ink layer that is positioned at the transparent substrates upper surface forms the first conductive layer, and the undissolved part of ink layer that is positioned at the transparent substrates lower surface forms the second conductive layer.
Particularly, the mixture that described mixed ink is electric conducting material and resin material, described electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust, and described resin material comprises the film-forming resin that weight content is 30～50 parts, the emulsion of 1～10 part, the solvent of 10～40 parts, the stabilizer of 0.1～5 part, the levelling agent of 0.1～5 part and the defoamer of 0.1～5 part.
Wherein, described electric conducting material can be nano particle, and the granularity of described nano particle is between 100nm～1000nm.
Wherein, described electric conducting material can also be nano wire, and the diameter of described nano wire is between 20nm～200nm, and the length of described nano wire is between 100nm～10000nm.
Preferably, described film-forming resin is at least one in polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ethers and M Cr; Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, fragrant salt compounded of iodine and ferrocene salt; Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1, at least one in 6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester; Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine and anthraquinone; Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
Transparent conductive body provided by the invention and preparation method thereof, the first conductive layer and the second conductive layer all adopt the conductive grid structure, can through exposure, development and oven dry, prepare by the mixed ink that has electric conductivity and photoresist performance concurrently by conductive grid, with respect to the ITO film, manufacture craft is simple, be applicable to large tracts of land, production in enormous quantities, and the electric conductivity of conductive layer is better than the ITO layer, can be applicable to pad, AIO(All in one), on the larger equipment of NoteBook equidimension; Above-mentioned transparent conductive body is two-sided conductive structure, can realize that two sides carries out process operations simultaneously, has improved production efficiency, has reduced production cost.
The accompanying drawing explanation
The perspective exploded view of the transparent conductive body that Fig. 1 provides for the embodiment of the present invention one;
The partial sectional view that in the transparent conductive body that Fig. 2 provides for the embodiment of the present invention one, in the first conductive layer and the second conductive layer, single electrode crossing arranges;
The local enlarged diagram one of electrode in the transparent conductive body that Fig. 3 provides for the embodiment of the present invention one;
The local enlarged diagram two of electrode in the transparent conductive body that Fig. 4 provides for the embodiment of the present invention one;
The local enlarged diagram three of electrode in the transparent conductive body that Fig. 5 provides for the embodiment of the present invention one;
The local enlarged diagram four of electrode in the transparent conductive body that Fig. 6 provides for the embodiment of the present invention one;
The manufacture method schematic diagram of the transparent conductive body that Fig. 7 provides for the embodiment of the present invention one;
The local enlarged diagram of electrode in the transparent conductive body that Fig. 8 provides for the embodiment of the present invention two;
The partial sectional view of the transparent conductive body that Fig. 9 provides for the embodiment of the present invention three
The partial sectional view of a kind of transparent conductive body that Figure 10 provides for the embodiment of the present invention four;
The partial sectional view of the another kind of transparent conductive body that Figure 11 provides for the embodiment of the present invention four.
Embodiment
Embodiment mono-
As shown in Fig. 1-6, the embodiment of the present invention one provides a kind of transparent conductive body, comprise by the transparent substrates 1 made of insulation material, be located at the first conductive layer 10 on this transparent substrates upper surface 1a and be fixed on the second conductive layer 20 on this transparent substrates lower surface 1b, the first conductive layer 10 and the second conductive layer 20 form by a plurality of spaced electrodes 100, insulated from each other between adjacent two electrodes 100.In the present embodiment, electrode 100 is strip, and in other embodiments, each electrode 100 also can be comprised of a plurality of linear array the conductive unit connected successively; The electrode that forms the first conductive layer 10 is spatially arranged in a crossed manner with the electrode that forms the second conductive layer 30; It is latticed that electrode 100 all is, and described grid is by intersected with each other being connected to form of conductor wire 101 be positioned on the same face; The grid electrode that conductor wire 101 forms adopts the mixed ink that comprises electric conducting material and resin material, based on the exposure imaging technological forming.The electrode that forms the first conductive layer 10 and the electrode that forms the second conductive layer 30 be the Inductance and Capacitance that forms arranged in a crossed manner spatially.
As shown in Figure 7, this present invention also provides a kind of manufacture method of above-mentioned transparent conductive body, comprises the following steps:
Step 3, carry out development treatment by the product after above-mentioned exposure, makes ink layer form the waffle-like pattern of hollow out; Cover in the ink layer of the waffle-like pattern of transparent substrates upper surface and form the first conductive layer 10, cover in the ink layer of the waffle-like pattern of transparent substrates lower surface and form the second conductive layer 20.
The first conductive layer and the second conductive layer on transparent conductive body provided by the invention all adopt the conductive grid structure, this conductive grid can obtain through exposure, development, oven dry by the mixed ink that has electric conductivity and photoresist performance concurrently, with respect to the ITO film, manufacture craft is simple, be applicable to large tracts of land, production in enormous quantities, and the electric conductivity of conductive layer is better than ITO, can be applicable on equipment that panel computer, computer all-in-one machine, notebook computer equidimension are larger; Above-mentioned transparent conductive body is two-sided conductive structure, can realize that two sides carries out process operations simultaneously, has improved production efficiency, has reduced production cost.
Because the mixed ink surface viscosity is larger, be unfavorable for the operation of exposure, between step 1 and step 2, also comprise:
Step 1S, the transparent substrates that two sides in step 1 is all scribbled to mixed ink is carried out preliminary drying.
Preferably, the dominant wavelength of the light that the described ultraviolet lamp in step 2 sends is 300～400nm, and exposure energy is at 50～500mJ/cm
2between.
For the grid line that makes mixed ink form more firmly is arranged on transparent substrates, after step 3, also comprise:
Step 4, the product after step 3 is developed is dried.
Wherein, the exposure-processed in step 2 comprises:
Step 21, the first mask plate 1d is placed on the mixed ink 1c of transparent substrates 1 upper surface, the mixed ink layer 1c that the second mask plate 2d is placed on to transparent substrates 1 lower surface is upper, and the first mask plate 1d and the second mask plate 2d form by shading light part and light transmission part;
Step 22, irradiated by 2 couples of the first mask plate 1d of uviol lamp and the second mask plate 2d;
Step 23, take off the first mask plate 1d and the second mask plate 2d respectively from two ink layer 1c.
Development treatment in step 3 is specially: above-mentioned ink layer is dipped in developer solution, ink layer and light transmission part over against be partially dissolved in developing solution or ink layer and shading light part over against be partially dissolved in developing solution, the ink layer that is positioned at the transparent substrates upper surface forms the first conductive layer 10, and the ink layer that is positioned at the transparent substrates lower surface forms the second conductive layer 20.
The material of transparent substrates 1 is the optically transparent materials such as glass, polymethyl methacrylate (PMMA) or PETG (PET).The thickness of transparent base is 0.02mm～1.2mm, is preferably 0.05mm～0.5mm.The basic grid 102 that conductor wire intersects to form mutually can be regular polygon, as square, rhombus, regular hexagon; Perhaps random grid, and grid is processed the gap 200 formed between electrode 100 by broken string; Basic grid shown in Fig. 3 102 is regular hexagons, and the basic grid 102 shown in Fig. 4 is squares, and basic grid shown in Fig. 5 102 is rhombuses, and basic grid shown in Fig. 6 102 is random grid; The basic grid here refers to the independent grid of the minimum that forms lattice, and basic grid is foursquare grid, and the implication of representative is exactly to cross each other to form by conductor wire the pattern be combined to form by square net; Insulation between electrode is processed and is formed by breaking at the grid ad-hoc location.
The mixture that mixed ink is electric conducting material and resin material, electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust, and resin material comprises the film-forming resin that weight content is 30～50 parts, the emulsion of 1～10 part, the solvent of 10～40 parts, the stabilizer of 0.1～5 part, the levelling agent of 0.1～5 part and the defoamer of 0.1～5 part.Electric conducting material can be also nano wire for nano particle, and when electric conducting material is nano particle, the granularity of nano particle is between 100nm～1000nm; When electric conducting material is nano wire, the diameter of nano wire is between 20nm～200nm, and the length of nano wire is between 100nm～10000nm.
Film-forming resin is at least one in polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ethers and M Cr; Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, fragrant salt compounded of iodine and ferrocene salt; Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1, at least one in 6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester; Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine and anthraquinone; Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
The viscosity of mixed ink is 1000cps～50000cps.When it uses, first carry out preliminary drying, preliminary drying temperature 60-120 ℃, drying time is at 10-60min; Then carry out exposure-processed, Exposure mode is: it is 300nm～400nm that above-mentioned mixed ink is positioned over to dominant wavelength, under the ultraviolet lamp of 800～1200W, is exposed, and exposure energy is 50～1000mJ/cm
2; Product after exposure is carried out to development treatment, and developer solution is weak base salt solution, as sodium carbonate, potash, and sodium acid carbonate, saleratus, sodium phosphate, phosphoric acid hydrogen is received etc., and the mass concentration of the solution of weak base salt is 0.1% – 3%; Product after developing is admittedly baked under 100-150 ℃, admittedly roasting time 10-60min.
Mixed ink in the present embodiment has conducting function and photoresist function concurrently, conducting metal is realized conducting function, resin material is realized the function of photoresist, adopt above-mentioned mixed ink, can greatly simplify the manufacturing process of transparent conductive body, and can meet large tracts of land, production in enormous quantities making, the electric conductivity of conductive layer is better, simultaneously two-sidedly can carry out operation simultaneously, improve production efficiency, reduce production cost.
Optimization execution mode as such scheme, preliminary drying temperature, preliminary drying time, bake out temperature and drying time are all with the composition of mixed ink with to be coated in the thickness of mixed ink on the upper and lower surface of transparent substrates relevant, preliminary drying temperature in step 1 is 60～120 ℃, and the preliminary drying time is 10～60 minutes.Optimized preliminary drying temperature is 80 ℃, and the optimized preliminary drying time is 10 minutes; Bake out temperature in step 4 is 100～150 ℃, and drying time is 10～60 minutes, and optimized bake out temperature is 130 ℃, and the optimized preliminary drying time is 30 minutes.
In step 2, the first mask plate and the second mask plate are by the conductive pattern on electrode that is combined to form of shading light part and light transmission part, again by step 3, by the conductive pattern on last formation electrode that is partly dissolved below ink layer 1c light transmission part or below shading light part, as for what finally dissolve, be that ink layer 1c is positioned under mask plate 1d light transmission part or the composition that depends in part on mixed ink under shading light part;
Resin material in mixed ink is photoresist, and in embodiment, this photoresist is the eurymeric photoresistance therein, and its component comprises: film-forming resin, emulsion, solvent, stabilizer, levelling agent and defoamer; Film-forming resin is selected from least one in PMMA, linear phenolic resin; The emulsion material is selected from least one in diazonium benzoquinones, the same hydroxy compounds of diazonium sulfonic acid chloride, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester; The solvent material is selected from least one in oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, DMF, ethyl cellosolve acetate, ethyl acetate, butyl acetate; The stabilizer material is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine, anthraquinone; The levelling agent material is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester or organosilicon; The weight ratio of each component is: film-forming resin: 30-50 part; Emulsion: 1-10 part; Solvent: 10-40 part; Stabilizer: 0.1-5 part; Levelling agent: 0.1-5 part; Defoamer: 0.1-5 part; The above component sum is 100 parts; 60～120 ℃ of above-mentioned eurymeric photoresist preliminary drying temperature, 10～60 minutes preliminary drying time; Exposure wavelength 200nm-400nm, exposure energy 50～1000mJ/cm
2, viscosity is 200cps-20000cps.
In this embodiment, resin material in mixed ink under light transmission part can become mono-crystalline structures after ultra violet lamp, meeting developing solution in development step 3 will dissolve, therefore the mixed ink under light transmission part can be dissolved falls, the mixed ink stayed under shading light part forms conductive pattern, during the elected mixed ink with above-mentioned composition, the shading light part on the first mask plate and the second mask plate need to be designed to the shape of the conductive pattern on electrode.
In another embodiment, this photoresist is the minus photoresistance therein, and its component comprises: film-forming resin, emulsion, solvent, stabilizer, levelling agent and defoamer; Film-forming resin is selected from least one in methacrylic acid, crotonic acid, acrylate, epoxy resin, vinyl ethers, M Cr; The emulsion material is at least one in aromatic diazo salt, aromatic sulfonium salts, fragrant salt compounded of iodine or ferrocene salt; The solvent material is following one or more mixtures: toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester; The stabilizer material is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine, anthraquinone; The levelling agent material is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester or organosilicon; The weight ratio of each component is: film-forming resin: 30-50 part; Emulsion: 1-10 part; Solvent: 10-40 part; Stabilizer: 0.1-5 part; Levelling agent: 0.1-5 part; Defoamer: 0.1-5 part; The above component sum is 100 parts.
60～120 ℃ of above-mentioned negative light resistance agent preliminary drying temperature, 10～60 minutes preliminary drying time; Exposure wavelength 200nm-400nm, exposure energy 50～1000mJ/cm
2, viscosity is 200cps-20000cps.
In the present embodiment, resin material in mixed ink under shading light part can become mono-crystalline structures after ultra violet lamp, meeting developing solution in development step 3 will dissolve, therefore the mixed ink under shading light part can be dissolved falls, the mixed ink stayed under light transmission part forms conductive pattern, during the elected mixed ink with above-mentioned composition, the light transmission part on the first mask plate and the second mask plate need to be designed to the shape of the conductive pattern on electrode.
Embodiment bis-
As shown in Figure 8, because it is light tight to form the conductor wire 101 of grid, in order to improve the light transmittance of electric conductor, thereby reduce the grid line spacing w of mesh width d and increase metal grill to increase glazed area, conductor wire 101 place intersected with each other forms node 102, and the distance between adjacent two nodes 102 is between 50 μ m～500 μ m; The width of conductor wire is between 0.2 μ m～5.0 μ m, preferably between 0.5 μ m～2.0 μ m; The thickness of conductor wire is between 0.5 μ m～10.0 μ m, preferably between 2.0 μ m～5.0 μ m.
Embodiment tri-
Because conductive layer in above-described embodiment one is the grid that lighttight electric conducting material forms, it is electric conducting material zone, cover part only on transparent base, when the refractive index difference of the reflectivity of electric conducting material and transparent base is larger, the optical effect that light is radiated at the light that electric conducting material surface and transparent base surface reflection return can produce larger difference, makes the people easily see the grid of conductive layer; Therefore, the present embodiment two by reaching region division one deck optical adjustment layer that the transparent base surface is not covered by the conductive mesh ruling on the grid line of conductive layer, to reduce the difference in reflectivity in the electric conductor zone covered by the conductive mesh ruling and the zone do not covered by the conductive mesh ruling, and then reduce the visibility of the grid of conductive layer.
On the basis of embodiment mono-or embodiment bis-, above-mentioned transparent conductive body is because conductive layer is conductive grid, the conductor wire that forms conductive grid zone, cover part (as shown in Figure 2) only on transparent substrates, when the difference in reflectivity of the reflectivity of conductor wire and transparent base is larger, the optical effect that light is radiated at the light that conductor wire surface and transparent substrates surface reflection return can produce larger difference, makes the user easily see conductor wire.Based on this, the present invention provides a kind of solution to the problems described above simultaneously, as shown in Figure 9, all be covered with the shadow layer 30 that disappears on the first conductive layer 10 and the second conductive layer 20, the shadow layer 30 that disappears covers the hollow region of the grid of conductor wire and conductor wire formation, shine the difference in reflectivity in zone that the transparent substrates surface covered by electric conducting material and not capped zone for reducing light, and then reduced the visibility of conductor wire.The material of shadow layer 30 of disappearing is high refractive index transparent insulation material, can be TiO
2, Nb
2o
5deng inorganic matter, can be also the organic materials such as 1,3,5-triazines-2,4,6-tri-aminated compounds; Refractive index as the shadow layer material that disappear is 1.6-2.8, and thickness is 20nm-2000nm.
Manufacture method is as follows:
Step 1S, the transparent substrates that above-mentioned two sides is all scribbled to mixed ink is carried out preliminary drying;
Step 3, carry out development treatment by the product after above-mentioned exposure, makes ink layer form the waffle-like pattern of hollow out;
Step 4, product after above-mentioned development is dried, bake out temperature is 130 ℃, drying time is 30min, cover in the ink layer of the waffle-like pattern of transparent substrates upper surface and form the first conductive layer, cover in the ink layer of the waffle-like pattern of transparent substrates lower surface and form the second conductive layer;
Step 5a covers respectively insulating resin on the first conductive layer and the second conductive layer, and the refractive index of this insulating resin, between 1.6～2.8, and is cured above-mentioned insulating resin, and the insulating resin after solidifying forms the shadow layer 40 that disappears.
Embodiment tetra-
As shown in figure 10, on the basis of embodiment mono-or embodiment bis-, in order to prevent conductive layer scratch in production and use procedure, to drop, a protective layer 40 can respectively be set on the surface of the first conductive layer 10 and the second conductive layer 20.
Manufacture method is as follows:
Step 1S, the transparent substrates that above-mentioned two sides is all scribbled to mixed ink is carried out preliminary drying;
Step 3, carry out development treatment by the product after above-mentioned exposure, makes ink layer form the waffle-like pattern of hollow out;
Step 4, product after above-mentioned development is dried, and bake out temperature is 130 ℃, and drying time is 30min, cover in the waffle-like pattern ink layer of transparent substrates upper surface and form the first conductive layer, cover in the waffle-like pattern ink layer of transparent substrates lower surface and form the second conductive layer;
Step 5b covers respectively heat reactive resin or ultraviolet resin on the first conductive layer and the second conductive layer, and irradiates heat reactive resin or ultraviolet resin are cured by heating or ultraviolet ray, and heat reactive resin or ultraviolet resin are cured rear formation protective layer 40.
On the shadow layer 30 that disappears of electrically conducting transparent surface that also can be in embodiment tri-, a protective layer 40 respectively is set; As shown in figure 11.
Manufacture method is as follows:
Step 1S, the transparent substrates that above-mentioned two sides is all scribbled to mixed ink is carried out preliminary drying;
Step 3, carry out development treatment by the product after above-mentioned exposure, above-mentioned ink layer is partly dissolved to the waffle-like pattern that obtains hollow out;
Step 4, product after above-mentioned development is dried, bake out temperature is 130 ℃, drying time is 30min, cover in the ink layer of the waffle-like pattern of transparent substrates upper surface and form the first conductive layer, cover in the ink layer of the waffle-like pattern of transparent substrates lower surface and form the second conductive layer;
Step 5a covers respectively insulating resin on the first conductive layer and the second conductive layer, and the refractive index of this insulating resin, between 1.6～2.8, and is cured above-mentioned insulating resin, and the insulating resin after solidifying forms the shadow layer 40 that disappears.
Step 6 covers respectively heat reactive resin or ultraviolet resin on the above-mentioned shadow layer that disappears, and irradiates heat reactive resin or ultraviolet resin are cured by heating or ultraviolet ray, and heat reactive resin or ultraviolet resin are cured rear formation protective layer 40.
Finally it should be noted that: above each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to aforementioned each embodiment, the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: its technical scheme that still can put down in writing aforementioned each embodiment is modified, or some or all of technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of various embodiments of the present invention technical scheme.
Claims (23)
1. a transparent conductive body, comprise by the transparent substrates made of insulation material, be located at the first conductive layer of this transparent substrates upper surface and be fixed on the second conductive layer of this transparent substrates lower surface, it is characterized in that, described the first conductive layer and the second conductive layer form by a plurality of spaced electrodes, insulated from each other between adjacent two described electrodes; The electrode that forms described the first conductive layer is spatially arranged in a crossed manner with the conductive unit electrode that forms the second conductive layer; Described electrode is latticed, and described grid is by intersected with each other being connected to form of conductor wire be positioned on the same face; The grid electrode that described conductor wire forms adopts the mixed ink that comprises electric conducting material and resin material, based on the exposure imaging technological forming.
2. transparent conductive body according to claim 1, is characterized in that, described conductor wire place intersected with each other forms node, and the distance between adjacent two described nodes is between 50 μ m～500 μ m.
3. transparent conductive body according to claim 1, is characterized in that, the width of described conductor wire is between 0.2 μ m～5.0 μ m, and the thickness of described conductor wire is between 0.5 μ m～10.0 μ m.
4. according to the arbitrary described transparent conductive body of claim 1-3, it is characterized in that, on described the first conductive layer and the second conductive layer, all be covered with the shadow layer that disappears, the described shadow layer that disappears covers the hollow region of the grid of described conductor wire and the formation of described conductor wire.
5. transparent conductive body according to claim 4, is characterized in that, on the described shadow layer that disappears, all is covered with protective layer.
6. transparent conductive body according to claim 1, is characterized in that, on described the first conductive layer and the second conductive layer, all is covered with protective layer.
7. transparent conductive body according to claim 1, is characterized in that, described electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust.
8. transparent conductive body according to claim 1, it is characterized in that, described resin material comprises the film-forming resin that weight content is 30～50 parts, the emulsion of 1～10 part, the solvent of 10～40 parts, the stabilizer of 0.1～5 part, the levelling agent of 0.1～5 part and the defoamer of 0.1～5 part;
Described film-forming resin is at least one in polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ethers and M Cr;
Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, fragrant salt compounded of iodine and ferrocene salt;
Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1, at least one in 6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester;
Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine and anthraquinone;
Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
9. the manufacture method of a transparent conductive body, is characterized in that, comprises the following steps:
Step 1, respectively cover at upper surface and the lower surface of transparent substrates the mixed ink that one deck comprises electric conducting material and resin material, and described mixed ink forms ink layer;
Step 2, be placed on the ink layer on above-mentioned transparent substrates two sides under ultraviolet lamp and carry out exposure-processed;
Step 3, carry out development treatment by the product after above-mentioned exposure, makes described ink layer form the waffle-like pattern of hollow out; Cover in the ink layer of the waffle-like pattern of transparent substrates upper surface and form the first conductive layer, cover in the ink layer of the waffle-like pattern of transparent substrates lower surface and form the second conductive layer.
10. the manufacture method of transparent conductive body according to claim 9, is characterized in that, between step 1 and step 2, also comprises:
Step 1S, the transparent substrates that two sides in step 1 is all scribbled to mixed ink is carried out preliminary drying.
11. the manufacture method of transparent conductive body according to claim 9, is characterized in that, the dominant wavelength of the light that the described ultraviolet lamp in step 2 sends is 300～400nm, and exposure energy is at 50～500mJ/cm
2between.
12. the manufacture method of transparent conductive body according to claim 9, is characterized in that, also comprises after described step 3:
Step 4, the product after step 3 is developed is dried.
13. the manufacture method of transparent conductive body according to claim 12, is characterized in that, also comprises after step 4:
Step 5a covers respectively insulating resin on described the first conductive layer and the second conductive layer, and the refractive index of this insulating resin, between 1.6～2.8, and is cured above-mentioned insulating resin, and the insulating resin after solidifying forms the shadow layer that disappears.
14. the manufacture method of transparent conductive body according to claim 13, is characterized in that, also comprises after step 5a:
Step 6 covers respectively heat reactive resin or UV-cured resin on the above-mentioned shadow layer that disappears, and by heating or UV-irradiation, described heat reactive resin or UV-cured resin is cured and forms protective layer.
15. the manufacture method of transparent conductive body according to claim 12, is characterized in that, also comprises after step 4:
Step 5b covers respectively heat reactive resin or UV-cured resin on described the first conductive layer and the second conductive layer, and by heating or UV-irradiation, described heat reactive resin or UV-cured resin is cured and forms protective layer.
16. the manufacture method of transparent conductive body according to claim 10, is characterized in that, the preliminary drying temperature in described step 1S is 60～120 ℃, and the preliminary drying time is 10～60 minutes.
17. the manufacture method of transparent conductive body according to claim 12, is characterized in that, the bake out temperature in described step 4 is 100～150 ℃, and drying time is 10～60 minutes.
18. the manufacture method according to the arbitrary described transparent conductive body of claim 7-13, is characterized in that, the exposure-processed in described step 2 comprises:
Step 21, be placed on the first mask plate on the ink layer of transparent substrates upper surface, the second mask plate is placed on the ink layer of transparent substrates lower surface, and the first mask plate and the second mask plate form by shading light part and light transmission part;
Step 22, irradiated the first mask plate and the second mask plate by ultraviolet lamp;
Step 23, take off the first mask plate and the second mask plate respectively from ink layer.
19. the manufacture method according to the arbitrary described transparent conductive body of claim 9-17, it is characterized in that, development treatment in described step 3 is specially: above-mentioned ink layer is dipped in developer solution, ink layer and light transmission part or shading light part over against be partially dissolved in developer solution, the undissolved part of ink layer that is positioned at the transparent substrates upper surface forms the first conductive layer, and the undissolved part of ink layer that is positioned at the transparent substrates lower surface forms the second conductive layer.
20. the manufacture method according to the arbitrary described transparent conductive body of claim 9-17, it is characterized in that, the mixture that described mixed ink is electric conducting material and resin material, described electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust, and described resin material comprises the film-forming resin that weight content is 30～50 parts, the emulsion of 1～10 part, the solvent of 10～40 parts, the stabilizer of 0.1～5 part, the levelling agent of 0.1～5 part and the defoamer of 0.1～5 part.
21. the manufacture method of transparent conductive body according to claim 20, is characterized in that, described electric conducting material is nano particle, and the granularity of described nano particle is between 100nm～1000nm.
22. the manufacture method of transparent conductive body according to claim 20, is characterized in that, described electric conducting material is nano wire, and the diameter of described nano wire is between 20nm～200nm, and the length of described nano wire is between 100nm～10000nm.
23. the manufacture method of transparent conductive body according to claim 20, is characterized in that,
Described film-forming resin is at least one in polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ethers and M Cr;
Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, fragrant salt compounded of iodine and ferrocene salt;
Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1, at least one in 6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester;
Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine and anthraquinone;
Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
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Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210223 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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