CN103391820B - 液体材料的涂布方法及涂布装置 - Google Patents

液体材料的涂布方法及涂布装置 Download PDF

Info

Publication number
CN103391820B
CN103391820B CN201280005931.XA CN201280005931A CN103391820B CN 103391820 B CN103391820 B CN 103391820B CN 201280005931 A CN201280005931 A CN 201280005931A CN 103391820 B CN103391820 B CN 103391820B
Authority
CN
China
Prior art keywords
discharge
coating
liquid material
pulse
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280005931.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN103391820A (zh
Inventor
生岛和正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of CN103391820A publication Critical patent/CN103391820A/zh
Application granted granted Critical
Publication of CN103391820B publication Critical patent/CN103391820B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201280005931.XA 2011-01-19 2012-01-18 液体材料的涂布方法及涂布装置 Active CN103391820B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-008648 2011-01-19
JP2011008648A JP5779353B2 (ja) 2011-01-19 2011-01-19 液体材料の塗布方法、塗布装置およびプログラム
PCT/JP2012/050912 WO2012099147A1 (ja) 2011-01-19 2012-01-18 液体材料の塗布方法、塗布装置およびプログラム

Publications (2)

Publication Number Publication Date
CN103391820A CN103391820A (zh) 2013-11-13
CN103391820B true CN103391820B (zh) 2016-04-13

Family

ID=46515770

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280005931.XA Active CN103391820B (zh) 2011-01-19 2012-01-18 液体材料的涂布方法及涂布装置

Country Status (7)

Country Link
US (1) US10086573B2 (enExample)
EP (1) EP2666545B1 (enExample)
JP (1) JP5779353B2 (enExample)
KR (1) KR101901217B1 (enExample)
CN (1) CN103391820B (enExample)
TW (1) TWI537061B (enExample)
WO (1) WO2012099147A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6078298B2 (ja) * 2012-11-01 2017-02-08 武蔵エンジニアリング株式会社 位置補正機能を有する作業装置および作業方法
US9057642B2 (en) * 2012-12-03 2015-06-16 Illinois Tool Works Inc. Method and apparatus for calibrating a dispenser
JP6183597B2 (ja) * 2013-08-05 2017-08-23 Tdk株式会社 液滴塗布装置
US10559864B2 (en) 2014-02-13 2020-02-11 Birmingham Technologies, Inc. Nanofluid contact potential difference battery
PL3117909T3 (pl) * 2014-03-10 2026-02-16 Musashi Engineering, Inc. Urządzenie aplikujące i sposób aplikacji
JP6541489B2 (ja) * 2015-07-24 2019-07-10 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6538465B2 (ja) * 2015-07-24 2019-07-03 武蔵エンジニアリング株式会社 固体粒子を含有する液体材料の吐出装置および塗布装置並びに塗布方法
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
CN108906508B (zh) * 2018-08-06 2020-11-27 Oppo（重庆）智能科技有限公司 胶量控制方法及胶量控制装置
KR102798490B1 (ko) 2019-10-17 2025-04-22 주식회사 엘지에너지솔루션 활물질 이중층을 형성하는 전극 슬러리 코팅 장치 및 방법
US10950706B2 (en) 2019-02-25 2021-03-16 Birmingham Technologies, Inc. Nano-scale energy conversion device
US11244816B2 (en) 2019-02-25 2022-02-08 Birmingham Technologies, Inc. Method of manufacturing and operating nano-scale energy conversion device
US11101421B2 (en) 2019-02-25 2021-08-24 Birmingham Technologies, Inc. Nano-scale energy conversion device
CN109847971A (zh) * 2019-03-02 2019-06-07 西华大学 一种具有低流速和高精度的自动化涂料装置及方法
US11124864B2 (en) 2019-05-20 2021-09-21 Birmingham Technologies, Inc. Method of fabricating nano-structures with engineered nano-scale electrospray depositions
US11046578B2 (en) * 2019-05-20 2021-06-29 Birmingham Technologies, Inc. Single-nozzle apparatus for engineered nano-scale electrospray depositions
JP7467176B2 (ja) 2020-03-16 2024-04-15 日本発條株式会社 接着剤の塗布方法および塗布装置
CN115335235B (zh) * 2020-03-31 2023-07-28 株式会社富士 印刷控制装置及印刷控制方法
US11649525B2 (en) 2020-05-01 2023-05-16 Birmingham Technologies, Inc. Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method
US11417506B1 (en) 2020-10-15 2022-08-16 Birmingham Technologies, Inc. Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods
US11616186B1 (en) 2021-06-28 2023-03-28 Birmingham Technologies, Inc. Thermal-transfer apparatus including thermionic devices, and related methods
TW202430278A (zh) * 2023-01-18 2024-08-01 萬潤科技股份有限公司 液材施作方法及液材施作設備

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1426853A (zh) * 2001-12-19 2003-07-02 松下电器产业株式会社 流体涂布方法及流体涂布装置
WO2010147052A1 (ja) * 2009-06-15 2010-12-23 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3877038B2 (ja) 1999-11-10 2007-02-07 武蔵エンジニアリング株式会社 液体の塗布方法および装置
JP2002303275A (ja) * 2001-04-09 2002-10-18 Iwashita Engineering Inc 定量吐出器の吐出量補正方法
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
KR101045754B1 (ko) 2004-04-09 2011-06-30 파나소닉 주식회사 점성 유체 도포 장치
JP4382595B2 (ja) * 2004-07-09 2009-12-16 パナソニック株式会社 粘性流体供給装置及びその固化防止方法
JP4889967B2 (ja) * 2005-07-01 2012-03-07 芝浦メカトロニクス株式会社 液状物質滴下装置及び液状物質滴下方法
JP4995488B2 (ja) * 2006-05-26 2012-08-08 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4871093B2 (ja) 2006-11-01 2012-02-08 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP5280702B2 (ja) * 2008-02-18 2013-09-04 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1426853A (zh) * 2001-12-19 2003-07-02 松下电器产业株式会社 流体涂布方法及流体涂布装置
WO2010147052A1 (ja) * 2009-06-15 2010-12-23 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム

Also Published As

Publication number Publication date
JP2012148235A (ja) 2012-08-09
WO2012099147A1 (ja) 2012-07-26
EP2666545B1 (en) 2019-05-15
CN103391820A (zh) 2013-11-13
US20130313745A1 (en) 2013-11-28
EP2666545A1 (en) 2013-11-27
TWI537061B (zh) 2016-06-11
US10086573B2 (en) 2018-10-02
KR20140003542A (ko) 2014-01-09
HK1189193A1 (zh) 2014-05-30
KR101901217B1 (ko) 2018-09-21
JP5779353B2 (ja) 2015-09-16
EP2666545A4 (en) 2016-03-02
TW201240739A (en) 2012-10-16

Similar Documents

Publication Publication Date Title
CN103391820B (zh) 液体材料的涂布方法及涂布装置
TWI497613B (zh) A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program
JP5280702B2 (ja) 液体材料の塗布方法、その装置およびそのプログラム
CN102802813B (zh) 液体材料的涂布方法
CN101573185B (zh) 液体材料的填充方法及装置
US20100075021A1 (en) Method, apparatus and program for filling liquid material
HK1189193B (en) Application method of liquid material and application device
HK1171573B (en) Method for applying liquid material and application device
HK1134799B (en) Method and apparatus for filling liquid material
HK1131363B (en) Method and apparatus for filling liquid material
HK1174304A (en) Method for applying liquid material
HK1174304B (en) Method for applying liquid material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1189193

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1189193

Country of ref document: HK