CN103390857B - Generate method and the device of optical module lookup table - Google Patents
Generate method and the device of optical module lookup table Download PDFInfo
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Abstract
The invention discloses a kind of method and the device that generate optical module lookup table, the method comprises: electric refrigerator TEC locking temperature is preset value, determines the first environment temperature spot that the highest total current is corresponding; At first environment temperature spot, progressively raise TEC locking temperature, determine best electric refrigerator TEC locking temperature; TEC locking temperature is best TEC locking temperature, and extinction ratio is adjusted to desired value, obtains the first modulated current set point and a MCU temperature value; Under optical module being placed in low temperature environment temperature, TEC locking temperature is preset value, and extinction ratio is adjusted to desired value, obtains the second modulated current set point and the 2nd MCU temperature value; First, second MCU temperature value according to obtaining sets up TEC locking temperature question blank, and by TEC locking temperature question blank writing light module; First, second modulated current set point according to obtaining sets up modulated current question blank, and by modulated current question blank writing light module.Application the present invention, can promote EML stability.
Description
Technical field
The present invention relates to optical communication field, particularly relate to a kind of method and the device that generate optical module lookup table.
Background technology
Electroabsorption Modulated Laser (EML, Electro-absorptionModulatedLaser) extinction ratio is supplied to light emission secondary module (TOSA by electronics secondary module, TransmitterOpticalSubassembly) modulated current size determines, when average light power is fixed, modulated current is larger, and extinction ratio is larger; Because the performance of EML affects by working temperature, for fixing modulated current, when the operation temperature decreases, extinction ratio can reduce; When an operation temperature increases, extinction ratio can raise.
The change of EML working temperature can cause EML wave length shift, TOSA inside is needed to be provided with thermoelectric refrigerating unit (TEC, and control circuit ThermoElectricCooler), accurate monitoring is carried out to EML, TEC is by changing the sense of current and size control refrigeration or heating that flow through, and the temperature of refrigeration or heating, make the working temperature all-the-time stable of EML a fixed value.Because EML working temperature correspondingly changes with variation of ambient temperature, when ambient temperature is lower, EML working temperature reduces, TEC needs larger electric current to produce the working temperature of heat rising EML, when ambient temperature is higher, EML working temperature raises, and TEC needs larger electric current to absorb the working temperature of heat reduction EML, to ensure the stability of EML, but optical module power consumption can be caused significantly to increase.
In practical application, optical module needs the change according to working temperature, and adjustment modulated current is to ensure the stability of the performance of optical module, and adjustment TEC locking temperature value, to reduce power consumption.
The method of existing generation optical module lookup table, in optical module lookup table, by ambient temperature is divided into multiple interval, different TOSA core temperature is arranged in each interval, i.e. TEC locking temperature, in the lower interval of ambient temperature, TOSA core temperature is low, in the higher interval of ambient temperature, TOSA core temperature is high.In subsequent applications, environmentally temperature inquiry optical module lookup table, obtains the TOSA core temperature arranged, and TEC is worked under the TOSA core temperature of this setting.Like this, by reducing the difference of ambient temperature and TOSA core temperature, and then reduce electric current needed for TEC, thus arrive the object reducing optical module power consumption.
From above-mentioned, the method of existing generation optical module lookup table, by in advance ambient temperature being divided into multiple interval, be arranged to different TOSA core temperature in each interval, reduce the difference of ambient temperature and TOSA core temperature, and then reduce electric current needed for TEC, although optical module power consumption can be reduced, but correspondingly do not regulate modulated current, cause when the operation temperature decreases, extinction ratio reduces; When an operation temperature increases, extinction ratio raises, and makes the stability of EML poor.
Summary of the invention
Goal of the invention of the present invention there are provided a kind of method and the device that generate optical module lookup table, promotes the stability of EML.
An aspect according to an embodiment of the invention, provide a kind of method generating optical module lookup table, comprise: when electric refrigerator TEC locking temperature is preset value, obtain the optical module total current corresponding when low temperature, normal temperature, high temperature three ambient temperature points respectively, determine the first environment temperature spot that the highest total current is corresponding; At first environment temperature spot, progressively raise TEC locking temperature, obtain the numerical value of corresponding total current, bias current, MCU temperature, extinction ratio, according to the numerical value of the total current obtained, bias current, MCU temperature, extinction ratio, determine best electric refrigerator TEC locking temperature; Upgrading TEC locking temperature is best TEC locking temperature, and extinction ratio is adjusted to the extinction ratio desired value pre-set, and obtains the first modulated current set point and a MCU temperature value; Under optical module being placed in low temperature environment temperature, TEC locking temperature is set to preset value, and extinction ratio is adjusted to described extinction ratio desired value, obtains the second modulated current set point and the 2nd MCU temperature value; TEC locking temperature question blank is set up according to the MCU temperature value obtained and the 2nd MCU temperature value, and by TEC locking temperature question blank writing light module; Modulated current question blank is set up according to the first modulated current set point obtained and the second modulated current set point, and by modulated current question blank writing light module.
Wherein, described extinction ratio desired value is 6.5dB.
Wherein, a described MCU temperature value according to acquisition and the 2nd MCU temperature value are set up TEC locking temperature question blank and are comprised: with MCU temperature for abscissa, TEC locking temperature is ordinate, calculates the temperature slope parameter of the straight line that described best TEC locking temperature corresponding to a described MCU temperature value and described preset value corresponding to described 2nd MCU temperature value are formed; Divide ambient temperature point, according to the described temperature slope parameter obtained, calculate the TEC locking temperature value under the ambient temperature point of each division, set up the described TEC locking temperature question blank of ambient temperature point and TEC locking temperature value mapping relations.
Wherein, described low temperature is 0 ° of C, and described high temperature is 70 ° of C, and described normal temperature is 25 ° of C, within the scope of 0 ° of C-70 ° of C, with 2 ° of C for interval, ambient temperature is divided into 35 temperature spots.
Wherein, the formula of described accounting temperature Slope Parameters is:
In formula,
K
1for temperature slope parameter;
A
2for best TEC locking temperature;
A
1for TEC locking temperature preset value;
T
2it is a MCU temperature value;
T
1it is the 2nd MCU temperature value.
Wherein, the formula of described calculating TEC locking temperature value is:
a=a
1-K
1(T
1-T)
In formula,
A is the TEC locking temperature under current environmental temperature;
T is the MCU temperature value under current environmental temperature.
Wherein, described the first modulated current set point according to acquisition and the second modulated current set point are set up modulated current question blank and are comprised: ambient temperature is set as normal temperature, inquire about described TEC locking temperature question blank, obtain the TEC locking temperature that this normal temperature is corresponding, TEC is adjusted to this locking temperature, and adjust extinction ratio to described desired value, obtain the 3rd modulated current set point; According to the described first modulated current set point obtained, described second modulated current set point and described 3rd modulated current preset value calculation modulated current normalization Slope Parameters; Divide ambient temperature point, according to the described modulated current normalization Slope Parameters obtained, calculate the modulated current set point under the ambient temperature point of each division, set up described modulated current question blank.
Wherein, the formula of described calculating modulated current normalization Slope Parameters is:
In formula,
K
2for modulated current normalization Slope Parameters;
I
2it is the first modulated current set point;
I
1it is the second modulated current set point;
I
3it is the 3rd modulated current set point.
Wherein, the formula of described calculating modulated current set point is:
i=i
2-K
2i
3(T
2-T)
In formula,
I is the modulated current set point under current environmental temperature.
Wherein, described temperature slope parameter is 1.279412; Described modulated current normalization Slope Parameters is-0.002804.
Wherein, described method comprises further: the ambient temperature obtaining optical module, inquire about described TEC locking temperature question blank and described modulated current question blank, obtain TEC locking temperature corresponding to the ambient temperature of described optical module and modulated current, drive optical module according to the TEC locking temperature obtained and modulated current work.
Another aspect according to an embodiment of the invention, additionally provide a kind of device generating optical module lookup table, comprising: power consumption processing module, locking temperature acquisition module, the first modulated current acquisition module, the second modulated current acquisition module and question blank generation module; Described power consumption processing module, for when TEC locking temperature is preset value, obtains the optical module total current corresponding when low temperature, normal temperature, high temperature three ambient temperature points respectively, determines the first environment temperature spot that the highest total current is corresponding; Described locking temperature acquisition module, for at described first environment temperature spot, progressively raise TEC locking temperature, obtain the numerical value of corresponding total current, bias current, MCU temperature, extinction ratio, according to the numerical value of the total current obtained, bias current, MCU temperature, extinction ratio, determine best electric refrigerator TEC locking temperature; Described first modulated current acquisition module, for at described first environment temperature spot, upgrading TEC locking temperature is described best TEC locking temperature, and extinction ratio is adjusted to the extinction ratio desired value pre-set, and obtains the first modulated current set point and a MCU temperature value; Described second modulated current acquisition module, under optical module is placed in low temperature environment temperature, TEC locking temperature is set to preset value, and extinction ratio is adjusted to described extinction ratio desired value, obtains the second modulated current set point and the 2nd MCU temperature value; Described question blank generation module, for setting up TEC locking temperature question blank according to the described MCU temperature value obtained and described 2nd MCU temperature value, modulated current question blank is set up according to the described first modulated current set point obtained and described second modulated current set point, and by described TEC locking temperature question blank and described modulated current question blank writing light module.
Preferably, described question blank generation module comprises: temperature slope parameter acquiring unit, TEC locking temperature question blank generation unit, the 3rd modulated current acquiring unit, modulated current normalization Slope Parameters acquiring unit, modulated current question blank generation unit; Described temperature slope parameter acquiring unit, for with MCU temperature for abscissa, TEC locking temperature is ordinate, calculates the temperature slope parameter of the straight line that described best TEC locking temperature corresponding to a described MCU temperature value and described preset value corresponding to described 2nd MCU temperature value are formed; Described TEC locking temperature question blank generation unit, for dividing ambient temperature point, according to the described temperature slope parameter obtained, calculate the TEC locking temperature value under the ambient temperature point of each division, set up the described TEC locking temperature question blank of ambient temperature point and TEC locking temperature value mapping relations; Described 3rd modulated current acquiring unit, for ambient temperature is set as normal temperature, inquires about described TEC locking temperature question blank, obtain the TEC locking temperature that this normal temperature is corresponding, TEC is adjusted to this locking temperature, and adjusts extinction ratio to described desired value, obtain the 3rd modulated current set point; Described modulated current normalization Slope Parameters computing unit, for modulated current normalization Slope Parameters according to the described first modulated current set point obtained, described second modulated current set point and described 3rd modulated current preset value calculation; Described modulated current question blank generation unit, for dividing ambient temperature point, according to the described modulated current normalization Slope Parameters obtained, calculating the modulated current set point under the ambient temperature point of each division, setting up described modulated current question blank.
Preferably, described device comprises further: TEC locking temperature and modulated current adjusting module, for obtaining the ambient temperature of optical module, inquire about described TEC locking temperature question blank and described modulated current question blank, obtain TEC locking temperature corresponding to the ambient temperature of described optical module and modulated current, drive optical module according to the TEC locking temperature obtained and modulated current work.
From above-mentioned, in embodiment of the present invention technical scheme, according to the optical module obtained at low temperature, normal temperature, high temperature three corresponding modulated current set points of ambient temperature point, MCU temperature value, divide ambient temperature point, calculate TEC locking temperature corresponding to each ambient temperature point and modulated current set point, generate TEC locking temperature question blank and modulated current question blank, in subsequent process, obtain ambient temperature, inquiry TEC locking temperature question blank and modulated current question blank, drive optical module according to the TEC locking temperature corresponding with ambient temperature obtained and modulated current work, correspondingly TEC locking temperature value and modulated current set point are set to corresponding Query Value, the power consumption of effective reduction optical module, ensure extinction ratio substantially constant, promote the stability of EML.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below.Apparently, the accompanying drawing in below describing is only some embodiments of the present invention, for those of ordinary skills, can also obtain other embodiment and accompanying drawing thereof according to these accompanying drawing illustrated embodiments.
Fig. 1 is the method flow schematic diagram that the embodiment of the present invention generates optical module lookup table;
Fig. 2 is the apparatus structure schematic diagram that the embodiment of the present invention generates optical module lookup table.
Embodiment
For making object of the present invention, technical scheme and advantage clearly understand, enumerate preferred embodiment referring to accompanying drawing, the present invention is described in more detail.But it should be noted that, the many details listed in specification are only used to make reader to have a thorough understanding, even if do not have these specific details also can realize these aspects of the present invention to one or more aspect of the present invention.
The method of existing generation optical module lookup table, by in advance ambient temperature being divided into multiple interval, different TOSA core temperature is arranged in each interval, reduce the difference of ambient temperature and TOSA core temperature, and then reduce electric current needed for TEC, although optical module power consumption can be reduced, correspondingly do not regulate modulated current, cause when the operation temperature decreases, extinction ratio reduces; When an operation temperature increases, extinction ratio raises, and makes the stability of EML poor.
In embodiments of the present invention, provide a kind of method and the device that generate optical module lookup table, by according to obtain optical module at low temperature, normal temperature, high temperature three corresponding modulated current set points of ambient temperature point, MCU temperature value, divide ambient temperature point, calculate TEC locking temperature corresponding to each ambient temperature point and modulated current set point, generate TEC locking temperature question blank and modulated current question blank, in subsequent process, obtain ambient temperature, inquiry TEC locking temperature question blank and modulated current question blank, drive optical module according to the TEC locking temperature corresponding with ambient temperature obtained and modulated current work, correspondingly TEC locking temperature value and modulated current set point are set to corresponding Query Value, the power consumption of effective reduction optical module, ensure extinction ratio substantially constant, promote the stability of EML.
Fig. 1 is the method flow schematic diagram that the embodiment of the present invention generates optical module lookup table.See Fig. 1, this flow process comprises:
Step 101, when electric refrigerator TEC locking temperature is preset value, obtains the optical module total current corresponding when low temperature, normal temperature, high temperature three ambient temperature points respectively, determines the first environment temperature spot that the highest total current is corresponding;
In this step, TEC locking temperature preset value is 48 ° of C, works under optical module being placed in respectively-5 ° of C low temperature environments, 25 ° of C normal temperature environments, 70 ° of C hot environments.
The numerical tabular of the optical module that table 1 obtains for the embodiment of the present invention total current corresponding when three ambient temperature points work, bias current, MCU temperature, extinction ratio.
Table 1
In table 1, the working temperature of MCU reacts the working temperature of whole optical module, as reference foundation.
With reference to table 1 data, in the 3rd group of data, the total current of optical module is 640mA, is the highest total current in three groups of data, determines that 70 ° of C corresponding to the highest total current are first environment temperature spot.
Step 102, at first environment temperature spot, progressively raise TEC locking temperature, obtain the numerical value of corresponding total current, bias current, MCU temperature, extinction ratio, according to the numerical value of the total current obtained, bias current, MCU temperature, extinction ratio, determine best TEC locking temperature;
In this step, optical module works under being placed in 70 ° of C hot environments, TEC locking temperature is from 48 ° of C, progressively rise to 53 ° of C, 58 ° of C, 60 ° of C, observe the change of eye diagram quality, will optical module total current be caused low and and the matter measured TEC locking temperature value of eye pattern as best TEC locking temperature value.
The numerical tabular of the optical module that table 2 obtains for the embodiment of the present invention total current corresponding when four TEC locking temperature points work, bias current, MCU temperature, extinction ratio.
Table 2
In table 2, the working temperature of MCU reacts the working temperature of whole optical module, as reference foundation.
With reference to table 2 data, when TEC locking temperature rises to 58 ° of C, the total current of optical module is 433mA, and extinction ratio is 7.96dB; When TEC locking temperature rises to 60 ° of C, optical module total current is 407mA, and extinction ratio is 8.45dB; The total current of optical module when this two TEC locking temperature points is low, simultaneously, owing to affecting factor mainly extinction ratio and the average light power of eye diagram quality, the size of bias current determines the size of average light power, in table, bias current substantially constant, also just say that average light power is constant, the target extinction ratio of business level EML is 6.5dB, as long as extinction ratio is more close to 6.5dB, eye diagram quality is better, can determine that 58 ° of C are best TEC locking temperature value.
Step 103, upgrading TEC locking temperature is best TEC locking temperature, and extinction ratio is adjusted to the extinction ratio desired value pre-set, and obtains the first modulated current set point and a MCU temperature value;
In this step, optical module works under 70 ° of C hot environments, and TEC locking temperature is 58 ° of C, by adjustment modulated current, make extinction ratio reach 6.5dB, record modulated current set point now and MCU temperature value, as the first modulated current set point and a MCU temperature value.
In actual applications, using the optical module of business level as reference standard, the extinction ratio of optical module is remained on 6.5dB as desired value.
Step 104, under optical module being placed in low temperature environment temperature, TEC locking temperature is set to preset value, and extinction ratio is adjusted to described extinction ratio desired value, obtains the second modulated current set point and the 2nd MCU temperature value;
In this step, optical module works under 0 ° of C low temperature environment, and TEC locking temperature is preset value 58 ° of C, by adjustment modulated current, make extinction ratio reach 6.5dB, record modulated current set point now and MCU temperature value, as the second modulated current set point and the 2nd MCU temperature value.
Step 105, sets up TEC locking temperature question blank according to the MCU temperature value obtained and the 2nd MCU temperature value, and by TEC locking temperature question blank writing light module;
In this step, set up TEC locking temperature question blank according to the MCU temperature value obtained and the 2nd MCU temperature value and comprise:
A11, with MCU temperature for abscissa, TEC locking temperature is ordinate, calculates the temperature slope parameter of the straight line that best TEC locking temperature corresponding to a MCU temperature value and preset value corresponding to the 2nd MCU temperature value are formed;
The formula of accounting temperature Slope Parameters is:
In formula,
K
1for temperature slope parameter;
A
2for TEC locking temperature best under first environment temperature spot;
A
1for TEC locking temperature preset value under low temperature environment temperature spot;
T
2it is a MCU temperature value;
T
1it is the 2nd MCU temperature value;
In this step, slope K
1be 1.279412.
A12, divides ambient temperature point, according to the Slope Parameters obtained, calculates the TEC locking temperature value under the ambient temperature point of each division, sets up the TEC locking temperature question blank of ambient temperature point and TEC locking temperature value mapping relations.
In this step, the ambient temperature residing for optical module is when 0 ° of C-70 ° of C range, and corresponding TEC locking temperature computing formula is:
a=a
1-K
1(T
1-T)
In formula,
A
1for under low temperature environment temperature spot, TEC locking temperature presets;
T
1it is the 2nd MCU temperature value;
T is MCU temperature value under current environmental temperature;
K
1for temperature slope parameter;
Within the scope of 0 ° of C-70 ° of C, with 2 ° of C for interval, ambient temperature is marked off 35 temperature spots, according to TEC locking temperature computing formula, and correspondingly MCU temperature value, calculate one group divide varying environment temperature spot under TEC locking temperature numerical value, set up the TEC locking temperature question blank of ambient temperature point and TEC locking temperature value mapping relations.
In practical application, the optical module applied environment temperature range of business level is 0 ° of C-70 ° of C.
Step 106, sets up modulated current question blank according to the first modulated current set point obtained and the second modulated current set point, and by modulated current question blank writing light module;
In this step, set up modulated current question blank according to the first modulated current set point obtained and the second modulated current set point to comprise:
A21, is set as normal temperature by ambient temperature, and inquiry TEC locking temperature question blank, obtains the TEC locking temperature that this normal temperature is corresponding, TEC is adjusted to this locking temperature, and adjust extinction ratio to desired value, obtain the 3rd modulated current set point;
In this step, work under optical module being placed in 25 ° of C normal temperature environment temperature, inquiry TEC locking temperature question blank, obtain the TEC locking temperature value that 25 ° of C temperature spots are corresponding, TEC is adjusted to this locking temperature and adjusts extinction ratio to 6.5dB simultaneously, obtain modulated current set point now, as the 3rd modulated current set point.
A22, according to the first modulated current set point obtained, the second modulated current set point and the 3rd modulated current preset value calculation modulated current normalization Slope Parameters;
In this step, the formula calculating modulated current normalization slope is
In formula,
I
2it is the first modulated current set point;
I
1it is the second modulated current set point;
I
3it is the 3rd modulated current set point;
T
2it is a MCU temperature value;
T
1it is the 2nd MCU temperature value.
Preferably, modulated current normalization slope K
2for-0.002804.
In this step, because the consistency of the modulated current set point of each optical module exists certain otherness, 3 temperature spots are adopted to correct, namely the difference of ceiling temperature point and lower limit temperature point modulated current set point and the difference of ceiling temperature point and lower limit temperature point MCU temperature value are divided by, obtain modulated current normalization Slope Parameters with the reciprocal multiplication of normal temperature modulated current setting value again, this parameter has more accuracy.
A23, divides ambient temperature point, according to the modulated current normalization Slope Parameters obtained, calculates the modulated current set point under the ambient temperature point of each division, sets up modulated current question blank;
In this step, the ambient temperature residing for optical module is when 0 ° of C-70 ° of C range, and corresponding modulated current computing formula is:
i=i
2-K
2i
3(T
2-T)
In formula,
I
3it is the 3rd modulated current set point;
I
2it is the first modulated current set point;
T
2it is a MCU temperature value;
T is MCU temperature value under current environmental temperature;
K
2for modulated current normalization slope;
Within the scope of 0 ° of C-70 ° of C, with 2 ° of C for interval, ambient temperature is marked off 35 temperature spots, according to modulated current computing formula, and correspondingly MCU temperature value, calculate the modulated current set point under one group of varying environment temperature spot divided, set up the modulated current question blank of ambient temperature point and modulated current set point mapping relations.
Step 107, obtain the ambient temperature of optical module, inquiry TEC locking temperature question blank and modulated current question blank, obtains TEC locking temperature corresponding to the ambient temperature of optical module and modulated current, drives optical module according to the TEC locking temperature obtained and modulated current work;
Optical module is placed in varying environment temperature for the embodiment of the present invention by table 3, after TEC locking temperature question blank and modulated current question blank adjustment TEC locking temperature and modulated current, and the numerical tabular of the total current of acquisition, MCU temperature, extinction ratio.
Table 3
| Ambient temperature (° C) | Module total current (mA) | MCU temperature (° C) | Extinction ratio (dB) |
| -5 | 391 | 16.5 | 6.59 |
| 25 | 310 | 41.3 | 6.51 |
| 70 | 412 | 90.3 | 6.62 |
Above-mentioned experimental result shows, under optical module is placed in low temperature, normal temperature and high ambient temperatures respectively, after TEC locking temperature question blank and modulated current question blank adjustment TEC locking temperature value and modulated current set point, the extinction ratio of optical module is floated up and down among a small circle at 6.5dB, substantially constant, meet the desired value of business level application, and the value of total current obviously reduces in extreme temperature conditions.
Fig. 2 is the structural representation that the embodiment of the present invention generates the device of optical module lookup table.See Fig. 2, this device comprises: power consumption processing module 201, locking temperature acquisition module 202, first modulated current acquisition module 203, second modulated current acquisition module 204, question blank generation module 205; Wherein,
Power consumption processing module 201, for when TEC locking temperature is preset value, obtains the optical module total current corresponding when low temperature, normal temperature, high temperature three ambient temperature points respectively, determines the first environment temperature spot that the highest total current is corresponding;
Locking temperature acquisition module 202, for at first environment temperature spot, progressively raise TEC locking temperature, obtain the numerical value of corresponding total current, bias current, MCU temperature, extinction ratio, according to the numerical value of the total current obtained, bias current, MCU temperature, extinction ratio, determine best electric refrigerator TEC locking temperature;
First modulated current acquisition module 203, at first environment temperature spot, upgrading TEC locking temperature is best TEC locking temperature, and extinction ratio is adjusted to the extinction ratio desired value pre-set, and obtains the first modulated current set point and a MCU temperature value;
Second modulated current acquisition module 204, under optical module is placed in low temperature environment temperature, TEC locking temperature is set to preset value, and extinction ratio is adjusted to described extinction ratio desired value, obtains the second modulated current set point and the 2nd MCU temperature value;
Question blank generation module 205, for setting up TEC locking temperature question blank according to the MCU temperature value obtained and the 2nd MCU temperature value, modulated current question blank is set up according to the first modulated current set point obtained and the second modulated current set point, and by TEC locking temperature question blank and modulated current question blank writing light module.
Question blank generation module 205 comprises: temperature slope parameter acquiring unit, TEC locking temperature question blank generation unit, the 3rd modulated current acquiring unit, modulated current normalization Slope Parameters acquiring unit, modulated current question blank generation unit;
Temperature slope parameter acquiring unit, for MCU temperature for abscissa, TEC locking temperature is ordinate, calculates the temperature slope parameter of the straight line that best TEC locking temperature corresponding to a MCU temperature value and preset value corresponding to the 2nd MCU temperature value are formed;
TEC locking temperature question blank generation unit, for dividing ambient temperature point, according to the temperature slope parameter obtained, calculate the TEC locking temperature value under the ambient temperature point of each division, set up the TEC locking temperature question blank of ambient temperature point and TEC locking temperature value mapping relations;
3rd modulated current acquiring unit, for ambient temperature is set as normal temperature, inquiry TEC locking temperature question blank, obtain the TEC locking temperature that this normal temperature is corresponding, TEC is adjusted to this locking temperature, and adjusts extinction ratio to desired value, obtain the 3rd modulated current set point;
Modulated current normalization Slope Parameters acquiring unit, for the first modulated current set point according to acquisition, the second modulated current set point and the 3rd modulated current preset value calculation modulated current normalization Slope Parameters;
Modulated current question blank generation unit, for dividing ambient temperature point, according to the modulated current normalization Slope Parameters obtained, calculating the modulated current set point under the ambient temperature point of each division, setting up modulated current question blank.
Further, the device that the embodiment of the present invention generates optical module lookup table also comprises TEC locking temperature and modulated current adjusting module 206, TEC locking temperature and modulated current adjusting module 206 are for inquiring about TEC locking temperature question blank and modulated current question blank, obtain TEC locking temperature corresponding to the ambient temperature of optical module and modulated current, drive optical module according to the TEC locking temperature obtained and modulated current work.
The foregoing is only preferred embodiment of the present invention, not for limiting the scope of the invention.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement and improvement etc., all should be included in protection scope of the present invention.
Claims (14)
1. generate a method for optical module lookup table, it is characterized in that, comprising:
When electric refrigerator TEC locking temperature is preset value, obtains optical module corresponding total current when low temperature, normal temperature, high temperature three ambient temperature points respectively, determine the first environment temperature spot that the highest total current is corresponding;
At first environment temperature spot, progressively raise TEC locking temperature, obtain the numerical value of corresponding total current, bias current, MCU temperature, extinction ratio, according to the numerical value of the total current obtained, bias current, MCU temperature, extinction ratio, determine best electric refrigerator TEC locking temperature;
Upgrading TEC locking temperature is best TEC locking temperature, and extinction ratio is adjusted to the extinction ratio desired value pre-set, and obtains the first modulated current set point and a MCU temperature value;
Under optical module being placed in low temperature environment temperature, TEC locking temperature is set to preset value, and extinction ratio is adjusted to described extinction ratio desired value, obtains the second modulated current set point and the 2nd MCU temperature value;
TEC locking temperature question blank is set up according to the MCU temperature value obtained and the 2nd MCU temperature value, and by TEC locking temperature question blank writing light module;
Modulated current question blank is set up according to the first modulated current set point obtained and the second modulated current set point, and by modulated current question blank writing light module.
2. method according to claim 1, wherein, described extinction ratio desired value is 6.5dB.
3. method according to claim 1, wherein, a described MCU temperature value according to acquisition and the 2nd MCU temperature value are set up TEC locking temperature question blank and are comprised:
With MCU temperature for abscissa, TEC locking temperature is ordinate, calculates the temperature slope parameter of the straight line that best TEC locking temperature corresponding to a MCU temperature value and preset value corresponding to the 2nd MCU temperature value are formed;
Divide ambient temperature point, according to the Slope Parameters obtained, calculate the TEC locking temperature value under the ambient temperature point of each division, set up the TEC locking temperature question blank of ambient temperature point and TEC locking temperature value mapping relations.
4. method according to claim 3, wherein, described low temperature is 0 DEG C, and described high temperature is 70 DEG C, and described normal temperature is 25 DEG C, within the scope of 0 DEG C-70 DEG C, with 2 DEG C for interval, ambient temperature is divided into 35 temperature spots.
5. method according to claim 3, wherein, the formula calculating described temperature slope parameter is:
In formula,
K
1for temperature slope parameter;
A
2for best TEC locking temperature;
A
1for TEC locking temperature preset value;
T
2it is a MCU temperature value;
T
1it is the 2nd MCU temperature value.
6. method according to claim 5, wherein, the formula calculating described TEC locking temperature value is:
a＝a
1-K
1(T
1-T)
In formula,
A is the TEC locking temperature under current environmental temperature;
T is the MCU temperature value under current environmental temperature.
7. method according to claim 6, wherein, described the first modulated current set point according to acquisition and the second modulated current set point are set up modulated current question blank and are comprised:
Ambient temperature is set as normal temperature, and inquiry TEC locking temperature question blank, obtains the TEC locking temperature that this normal temperature is corresponding, TEC is adjusted to this locking temperature, and adjust extinction ratio to desired value, obtain the 3rd modulated current set point;
According to the first modulated current set point obtained, the second modulated current set point and the 3rd modulated current preset value calculation modulated current normalization Slope Parameters;
Divide ambient temperature point, according to the modulated current normalization Slope Parameters obtained, calculate the modulated current set point under the ambient temperature point of each division, set up modulated current question blank.
8. method according to claim 7, wherein, the formula calculating described modulated current normalization Slope Parameters is:
In formula,
K
2for modulated current normalization Slope Parameters;
I
2it is the first modulated current set point;
I
1it is the second modulated current set point;
I
3it is the 3rd modulated current set point.
9. method according to claim 8, wherein, the formula calculating described modulated current set point is:
i＝i
2-K
2i
3(T
2-T)
In formula,
I is the modulated current set point under current environmental temperature.
10. method according to claim 9, wherein,
Described temperature slope parameter is 1.279412; Described modulated current normalization Slope Parameters is-0.002804.
11. methods according to any one of claim 1 to 10, wherein, described method comprises further:
Obtain the ambient temperature of optical module, inquire about described TEC locking temperature question blank and modulated current question blank, obtain TEC locking temperature corresponding to the ambient temperature of described optical module and modulated current, drive optical module according to the TEC locking temperature obtained and modulated current work.
12. 1 kinds of devices generating optical module lookup table, is characterized in that, comprising: power consumption processing module, locking temperature acquisition module, the first modulated current acquisition module, the second modulated current acquisition module and question blank generation module; Wherein,
Power consumption processing module, for when TEC locking temperature is preset value, obtains optical module corresponding total current when low temperature, normal temperature, high temperature three ambient temperature points respectively, determines the first environment temperature spot that the highest total current is corresponding;
Locking temperature acquisition module, for at first environment temperature spot, progressively raise TEC locking temperature, obtain the numerical value of corresponding total current, bias current, MCU temperature, extinction ratio, according to the numerical value of the total current obtained, bias current, MCU temperature, extinction ratio, determine best electric refrigerator TEC locking temperature;
First modulated current acquisition module, at first environment temperature spot, upgrading TEC locking temperature is best TEC locking temperature, and extinction ratio is adjusted to the extinction ratio desired value pre-set, and obtains the first modulated current set point and a MCU temperature value;
Second modulated current acquisition module, under optical module is placed in low temperature environment temperature, TEC locking temperature is set to preset value, and extinction ratio is adjusted to described extinction ratio desired value, obtains the second modulated current set point and the 2nd MCU temperature value;
Question blank generation module, for setting up TEC locking temperature question blank according to the MCU temperature value obtained and the 2nd MCU temperature value, modulated current question blank is set up according to the first modulated current set point obtained and the second modulated current set point, and by TEC locking temperature question blank and modulated current question blank writing light module.
13. devices according to claim 12, it is characterized in that, described question blank generation module comprises: temperature slope parameter acquiring unit, TEC locking temperature question blank generation unit, the 3rd modulated current acquiring unit, modulated current normalization Slope Parameters acquiring unit, modulated current question blank generation unit; Wherein,
Temperature slope parameter acquiring unit, for with MCU temperature for abscissa, TEC locking temperature is ordinate, calculates the temperature slope parameter of the straight line that described best TEC locking temperature corresponding to a described MCU temperature value and described preset value corresponding to described 2nd MCU temperature value are formed;
TEC locking temperature question blank generation unit, for dividing ambient temperature point, according to the described temperature slope parameter obtained, calculate the TEC locking temperature value under the ambient temperature point of each division, set up the described TEC locking temperature question blank of ambient temperature point and TEC locking temperature value mapping relations;
3rd modulated current acquiring unit, for ambient temperature is set as normal temperature, inquires about described TEC locking temperature question blank, obtain the TEC locking temperature that this normal temperature is corresponding, TEC is adjusted to this locking temperature, and adjusts extinction ratio to described desired value, obtain the 3rd modulated current set point;
Modulated current normalization Slope Parameters computing unit, for modulated current normalization Slope Parameters according to the described first modulated current set point obtained, described second modulated current set point and described 3rd modulated current preset value calculation;
Modulated current question blank generation unit, for dividing ambient temperature point, according to the described modulated current normalization Slope Parameters obtained, calculating the modulated current set point under the ambient temperature point of each division, setting up described modulated current question blank.
14. devices according to claim 12 or 13, is characterized in that, comprise further:
TEC locking temperature and modulated current adjusting module, for obtaining the ambient temperature of optical module, inquire about described TEC locking temperature question blank and described modulated current question blank, obtain TEC locking temperature corresponding to the ambient temperature of described optical module and modulated current, drive optical module according to the TEC locking temperature obtained and modulated current work.
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| CN106027157B (en) * | 2016-05-16 | 2018-09-07 | 青岛海信宽带多媒体技术有限公司 | The current compensation method and optical module of optical module |
| CN105977782B (en) * | 2016-06-28 | 2019-04-23 | 武汉华工正源光子技术有限公司 | A kind of temperature-compensation method of optical module extinction ratio |
| CN106155688A (en) * | 2016-07-05 | 2016-11-23 | 江苏奥雷光电有限公司 | A kind of linear deflection algorithm with lower limit being applicable to optical module production |
| CN110289550B (en) * | 2019-06-25 | 2020-08-18 | 深圳市亚派光电器件有限公司 | Current correction method and device for optical module and computer readable storage medium |
| CN113113842B (en) * | 2021-03-22 | 2022-07-12 | 武汉光迅科技股份有限公司 | Optical module wavelength control method, device and storage medium |
| CN116899914B (en) * | 2023-09-14 | 2024-01-23 | 厦门优迅高速芯片有限公司 | EML laser screening method |
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