CN103369451B - Production technology of ribbon-type high-pitch diaphragm - Google Patents

Production technology of ribbon-type high-pitch diaphragm Download PDF

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Publication number
CN103369451B
CN103369451B CN201310300212.7A CN201310300212A CN103369451B CN 103369451 B CN103369451 B CN 103369451B CN 201310300212 A CN201310300212 A CN 201310300212A CN 103369451 B CN103369451 B CN 103369451B
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China
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film
diaphragm
compound
sheet
pitch
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Expired - Fee Related
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CN201310300212.7A
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CN103369451A (en
Inventor
袁琳
裘功科
裘华见
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Shengzhou Dikai Electronic Co. Ltd.
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Zhejiang Industry Polytechnic College
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Abstract

The invention discloses a kind of production technology of ribbon-type high-pitch diaphragm.Comprise CAD to design compound high pitch diaphragm size, circuit, paint film egative film, the height of circuit, wide, length gone out according to the technique resistance of compound height sound diaphragm, areal calculation, and film egative film is expanded in layout; Take polyimide film as base material, aluminium foil for cover material high-temperature thermo-compression formation be compound high pitch film sheet, base material corner is pasted onto on backing plate; Cleaning showers cover material surface; Cover material surface-coated photoresists are also dried; Film egative film overlays on photoresists rete and exposes; Sheet material development, fixing, cleaning and dry; Have breakage to figure, incomplete place is repaired, and Pian Cai Erosion carves and rinses , Erosion and carves liquid employing iron ion Fe 3+content is the ferric trichloride of 46%; Sheet material demoulding also rinses; Sheet material dipping aluminum oxidation protection liquid is finally check compound high pitch membrane resistance value.This production technology obtains the ribbon-type high-pitch diaphragm that the one-shot forming of circuit resistance is not repaired, resistance accuracy is high, and utilization rate of raw materials is high.

Description

Production technology of ribbon-type high-pitch diaphragm
[technical field]
The present invention relates to a kind of production technology of ribbon-type high-pitch diaphragm, the ribbon-type high-pitch diaphragm that this production technology processes is applied on high-grade loud speaker, belongs to Guangization Erosion carving technology technical field.
[background technology]
Sound diaphragm as loud speaker core component directly affects the performance of loud speaker.Along with the fast development of ultrathin electronic product, TV, mobile phone etc. the ultrathin of sounding electronic product can become market trend, thus cause acoustic design limitation increasing, the conventional two-piece sound basin voice coil loudspeaker voice coil taking up room large no longer adapts to, eliminate papery/plastics sound basin, copper wire line voice coil loudspeaker voice coil, substituting becomes developing direction by the ultra-thin integral type sound diaphragm of polyimide film clad aluminum foil, but corresponding production technology has no report.
[summary of the invention]
The object of this invention is to provide a kind of production technology of ribbon-type high-pitch diaphragm, with the aluminium foil layer of polyimide film compound on make electronic circuit, the one-shot forming of circuit resistance is not repaired, resistance accuracy is high, adopts this production technology utilization rate of raw materials high, meets the needs of batch production.
For reaching above-mentioned purpose, the invention provides following technical scheme:
1, a production technology of ribbon-type high-pitch diaphragm, its operation comprises:
A. design plate-making, adopt computer CAD system design compound height sound diaphragm overall dimension and electronic circuit, the Selective Laser Sintering designed is made a plate by optical plotter, to draw film egative film;
B. compound high pitch film sheet global formation, employing polyimide film is base material, aluminium foil be cover material in order to high-temperature thermo-compression formation, shaping rear sheet thickness is 0.0225 ~ 0.0425mm, and wherein, aluminum foil thickness is 0.01 ~ 0.03mm;
C. sheet material cleaning, cleaning machine cleaning showers, remove the oil stain on cover material surface, spot and oxide-film, cleans post-drying surface moisture:
D. silk-screen photoresists and oven dry, by screen printer toward cover material surface-coated photoresists, coating post-drying photoresists;
E. expose, and then film egative film is covered on the photoresists rete of sheet material, expose;
F. develop, exposed sheet material carry out developing successively, fixing, cleaning and drying and processing;
G. overhaul, have breakage to figure, incomplete place is repaired;
H. etch, sheet material Song Dao the Erosion overhauled carves the Hang Erosion of Jin Shang machine and carves, and San Lvization Tie Erosion is carved liquid and evenly sprays after Erosion sheet surface , Erosion at quarter carves with running water Chong Xi Erosion surface at quarter by Tong Guo Erosion machine at quarter;
I. striping cleaning , Erosion carve after sheet material be impregnated into the striping groove filling striping liquid and carry out demoulding, demoulding afterflush is clean;
J. flood aluminum oxidation protection liquid, the sheet material after demoulding protects liquid to contact by the method for dipping with aluminum oxidation, makes the aluminum steel bar surface of compound height sound diaphragm form one deck protection against oxidation film, waits oven dry;
K. check, check the resistance of compound height sound diaphragm,
The height of described operation a electronic circuit, width and length draw according to the technique resistance of compound height sound diaphragm, the areal calculation of compound height sound diaphragm, by keyline layout method expansion film egative film, to adapt with compound high pitch diaphragm area, the corner of its base material of compound high pitch film sheet that described operation b obtains is pasted onto on backing plate.
The epoxy resin bonded fiber of above-mentioned backing plate to be thickness be 0.6mm, epoxy resin bonded fiber acid and alkali resistance.
San Lvization Tie Erosion in above-mentioned operation h carves liquid, iron ion Fe 3+content is 46%.
Above-mentioned San Lvization Tie Erosion carves liquid temp and controls at 40 DEG C, and spray pressure is 3.4KG/CM 2.
Above-mentioned aluminum oxidation protection liquid volume concentrations is 10%, and under normal temperature, dip time is 8 minutes.
Tool of the present invention has the following advantages and beneficial effect:
1, its electronic circuit resistance one-shot forming of compound height sound diaphragm obtained by the present invention is not repaired, and resistance accuracy controls, within ± 10%, to meet technological requirement completely, and when producing in batches, resistance consistency is good;
2, keyline layout method solves the manufacture method of large area egative film, improves the raw-material utilance of compound height sound diaphragm to greatest extent, improves productivity effect;
3, adopt backing plate mode, solve fine sheet (0.0225 ~ 0.0425mm is thick) self and cannot operate and transmit difficult problem, workable;
4, iron ion Fe is adopted 3+content be 46% three chlorine iron Erosion carve liquid; Erosion carves that aluminium Line edge in the electronic circuit obtained is smooth, impulse-free robustness, and it is little that height sound diaphragm of the present invention is applied to noise phenomenon on high-grade loud speaker, and the practicable circular regeneration of this Erosion liquid at quarter, decreasing pollution, reduces costs;
5, compound height sound diaphragm is by dipping aluminum oxidation protection liquid, effectively improves electronic circuit non-oxidizability.
[accompanying drawing explanation]
Be described in further detail with regard to the present invention below in conjunction with accompanying drawing.
Fig. 1 is the production technological process of ribbon-type high-pitch diaphragm of the present invention.
[embodiment]
Be DK141 × 43-4 compound height sound diaphragm below with model be example, composition graphs 1 describes its manufacturing process in detail.
1, design plate-making:
Adopt the drawing of computer CAD system, design compound height sound diaphragm overall dimension and electronic circuit thereof; The Selective Laser Sintering designed is made a plate by 16000DPI high resolution optical plotter.
Electronic circuit is according to resistance, the compound high pitch diaphragm area needed for compound height sound diaphragm technique, calculates the height of electronic circuit, width and length, in order to be depicted as line pattern according to sheet resistance principle.For reach production good after resistance requirement, except with reference to except theoretical foundation, need the technical parameter of experimental summary, the design resistance of the present embodiment compound height sound diaphragm is 3.8 ~ 4.2 Ω by technological requirement.
Film egative film area needs to adapt with compound high pitch diaphragm area, layout sheet number (the present embodiment layout quantity is 18) is determined according to compound height sound diaphragm size, in order to utilize compound height sound diaphragm raw material to greatest extent, adopt keyline layout method, film egative film is maximum extends to 500 × 300mm.
The MYLAR type film that initial film egative film adopts du pont company to produce.
2, compound high pitch film sheet global formation:
Compound height sound diaphragm raw material by after coating adhesive on base material with cover material through high-temperature thermo-compression formation, the thickness after shaping is 0.0225 ~ 0.0425mm, intercepts the compound high pitch film sheet of area 500 × 300mm.
Wherein, base material adopts polyimide film, and thickness is 0.0125mm, and cover material adopts aluminium foil, and thickness is 0.01 ~ 0.03mm (0.02mm is thick in the present embodiment employing).
3, lining pastes backing plate:
The corner of its base material of compound high pitch film sheet is pasted onto on backing plate.
Backing plate adopts thickness to be the epoxy resin bonded fiber of 0.6mm, and area is 500 × 400mm, slightly larger than compound high pitch diaphragm area.
Because compound high pitch film sheet thickness is too thin, only have 0.0325mm, self cannot operate and transmit in process of production, therefore adopts backing plate as carrier, handled easily and transmission.
4, sheet material cleaning:
By cleaning machine, cleaning showers process is carried out to sheet surface, to remove surperficial oil stain, spot and oxide-film, make sheet surface have good ink-receptive, be beneficial to rear road in sheet material aluminium foil layer surface attachment photosensitive-ink, after cleaning, dry surface moisture through drying tunnel.
The YB-5-A type normal temperature washing agent that cleaning agent adopts Shanghai Zheng Yi Industrial Co., Ltd. to produce, cleaning fluid proportioning: YB-5-A type normal temperature washing agent 500 grams, 2000 milliliters, water, rinse liquid temperature is 30 DEG C; Spray operating pressure is 2KG/CM 2, scavenging period is 2 minutes; Drying tunnel temperature 45 DEG C, 1.5 minutes time.
5, silk-screen photoresists and oven dry
On the aluminium foil layer of compound high pitch film sheet, apply photoresists by screen printer, enter drying tunnel afterwards and dry, the dried THICKNESS CONTROL of dry-film resist is 0.015 ~ 0.02mm (the present embodiment thickness 0.018mm, uses micron miking).
The TLK-1501 type photoresists that photoresists adopt upper tableland Li Tong ink Co., Ltd to produce; Silk-screen coating photoresists operating environment carries out under the darkroom, gold-tinted (can not see white light) condition of sealing purification, and ambient temperature and humidity controls at 23 ~ 25 DEG C, 50 ~ 60%RH respectively; Drying tunnel length is 12 meters, and in temperature 85 DEG C, drying tunnel, the time of staying is 5min.
6, expose:
Above photoresists rete film egative film being covered sheet material, expose in power 9 kilowatts of exposure machines, the time is 6 ~ 8 seconds (the present embodiment is 8 seconds).Exposure operation environment carries out under darkroom, gold-tinted condition.
7, develop:
Sheet material after exposure is carried out developing, fixing, cleaning and drying and processing.
Developer solution proportioning: 3400 grams, sodium carbonate, 1000 kilograms, water, developer temperatur controls at 30 DEG C.
Fixing solution is filled a prescription: 100 kilograms, sulfuric acid 30ml, water.
By developing machine, developer solution is evenly sprayed sheet surface (photosensitive rete), developing machine spray pressure 2KG/CM 2, developing time 1.5 ~ 2 minutes (the present embodiment is 1.5 minutes).Carry out fixing at normal temperatures with sulfuric acid 30ml, 100 kilograms, water after development, afterwards cleaning, hot-air seasoning, drying time 30 seconds, temperature 50 ~ 60 degree.
After development, Selective Laser Sintering is complete.
Development, fixingly all to carry out under dark room conditions, gold-tinted.
8, overhaul:
For ensuring the quality of products and qualification rate, once checking, repairing, every have that figure is damaged, incomplete place repair liquid is repaired, to ensure the qualification rate that Hou Dao Erosion carves.
9, Erosion carves:
Shang sheet material Song Dao Erosion machine at quarter after maintenance, the Hang Erosion of Jin carves, and San Lvization Tie Erosion liquid at quarter is evenly sprayed Dai Erosion sheet surface , Erosion at quarter liquid temp at quarter and controls at 40 DEG C by Tong Guo Erosion machine at quarter, spray pressure 3.4KG/CM 2electronic circuit resistance measured after , Erosion etching speed Yi Erosion is carved into type is as the criterion on aluminium foil layer that , Erosion carves complete visible compound voice diaphragm sheet material and forms the electronic circuit be made up of lines, carves surface with running water Chong Xi Erosion.
San Lvization Tie Erosion carves liquid, iron ion Fe 3+content is 46%.
10, striping clean:
Compound high pitch film sheet after Erosion carves is impregnated into the striping groove filling striping liquid and carries out demoulding process (removing the light-sensitive surface of figure protection), and dip time 25 seconds, demoulding totally adopts tap water afterwards.
Striping liquid: NaOH 28g, water 10Kg, striping liquid temp 80 DEG C.
11, flood aluminum oxidation protection liquid: the compound height sound diaphragm after demoulding protects liquid to contact by the method for dipping with aluminum oxidation, floods 8 minutes at normal temperatures, make the aluminum steel bar surface of compound height sound diaphragm form one deck protection against oxidation film, then dry.
Aluminum oxidation protection liquid proportioning: aluminum antioxidant agent 1000ml, water 10Kg.
Aluminum antioxidant formulation number is OY-67, is produced by Wenzhou Aoyang Metal Surface Treatment Co., Ltd..
12, check: check the outward appearance of compound height sound diaphragm, size and circuit resistance, the resistance measuring aluminum steel bar electronic circuit through universal instrument is 4.0 Ω, meets production engineering specifications 3.8 ~ 4.2 Ω scope, carries out package handling.
Application prospect: the ribbon-type high-pitch diaphragm product obtained by the production technology of ribbon-type high-pitch diaphragm provided by the invention is particularly applicable on high-grade loud speaker, as in ultra-thin television, ultra thin handset, with alternative traditional large volume split type sound basin voice coil loudspeaker voice coil.

Claims (1)

1. a production technology of ribbon-type high-pitch diaphragm, its operation comprises:
A. design plate-making, adopt computer CAD system design compound height sound diaphragm overall dimension and electronic circuit, the Selective Laser Sintering designed is made a plate by the optical plotter of 16000DPI high resolution, to draw film egative film;
B. compound high pitch film sheet global formation, employing polyimide film is base material, aluminium foil be cover material in order to high-temperature thermo-compression formation, shaping rear sheet thickness is 0.0225 ~ 0.0425mm, and wherein, aluminum foil thickness is 0.01 ~ 0.03mm;
C. sheet material cleaning, cleaning machine cleaning showers, remove the oil stain on cover material surface, spot and oxide-film, cleans post-drying surface moisture;
D. silk-screen photoresists and oven dry, by screen printer toward cover material surface-coated photoresists, coating post-drying photoresists;
E. expose, and then film egative film is covered on the photoresists rete of sheet material, expose;
F. develop, exposed sheet material carry out developing successively, fixing, cleaning and drying and processing;
G. overhaul, have breakage to figure, incomplete place repairs;
H. etch, the sheet material overhauled is delivered on etching machine and is etched, and by etching machine, ferric trichloride etching solution is evenly sprayed sheet surface to be etched, uses tap water etched surfaces after etching;
I. striping cleaning, the sheet material after etching is impregnated into the striping groove filling striping liquid and carries out demoulding, and demoulding afterflush is clean;
J. flood aluminum oxidation protection liquid, the sheet material after demoulding protects liquid to contact by the method for dipping with aluminum oxidation, makes the aluminum steel bar surface of compound height sound diaphragm form one deck protection against oxidation film, waits oven dry;
K. check, check the resistance of compound height sound diaphragm,
It is characterized in that: the height of described operation a electronic circuit, width and length are resistance 3.8 ~ 4.2 Ω according to compound height sound diaphragm, area 500 × the 300mm of compound height sound diaphragm is through calculating, by keyline layout method expansion film egative film, to adapt with compound high pitch diaphragm area, the corner of its base material of compound high pitch film sheet that described operation b obtains is pasted onto on backing plate, the epoxy resin bonded fiber of described backing plate to be thickness be 0.6mm, described operation d dries photoresists in drying tunnel, the length of this drying tunnel and temperature are respectively 12 meters, 85 DEG C, in drying tunnel, the time of staying is 5min, the dried THICKNESS CONTROL of dry-film resist is at 0.015 ~ 0.02mm, in described operation e, exposure machine power is 9 kilowatts, time for exposure is 6 ~ 8 seconds, in described operation f, develop with sodium carbonate, developer temperatur controls at 30 DEG C, developing machine spray pressure 2Kg/cm 2, developing time 1.5 ~ 2 minutes, carries out fixing with sulfuric acid after development, the ferric trichloride etching solution in described operation h, iron ion Fe 3+content is 46%, and ferric trichloride etching solution temperature controls at 40 DEG C, and spray pressure is 3.4Kg/cm 2, the striping liquid in described operation i is sodium hydroxid striping liquid, the lower dipping of liquid temperature 80 degree 25 seconds.
CN201310300212.7A 2013-07-08 2013-07-08 Production technology of ribbon-type high-pitch diaphragm Expired - Fee Related CN103369451B (en)

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CN104105352B (en) * 2014-06-24 2017-07-18 上海英内物联网科技股份有限公司 A kind of aluminium etches the manufacture method of FPC
CN104333980B (en) * 2014-12-02 2019-01-22 深圳市博敏电子有限公司 A kind of overlength wiring board graph transfer method
CN105530763B (en) * 2015-12-30 2019-03-12 江西芯创光电有限公司 The production method of pcb board face protection
CN106303893A (en) * 2016-10-09 2017-01-04 苏州倍声声学技术有限公司 The automatic hot apparatus former of moving-iron type receiver vibrating film
CN116460016B (en) * 2023-03-15 2024-05-28 上汽通用五菱汽车股份有限公司 Surface texture simulation manufacturing method, substrate with surface texture pattern and application of substrate

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CN1640187A (en) * 2002-02-28 2005-07-13 古河电气工业株式会社 Planar speaker
TWI255148B (en) * 2004-08-06 2006-05-11 Beston Technology Corp A diaphragm for ribbon type planar speaker and its manufacturing method
CN1925724A (en) * 2005-09-02 2007-03-07 三星电机株式会社 Method of forming circuit pattern on printed circuit board
CN200947671Y (en) * 2006-01-20 2007-09-12 丁轶 Belt speaker
CN101227121A (en) * 2007-12-26 2008-07-23 彩虹集团电子股份有限公司 Production technology of oscillation ring
CN201234341Y (en) * 2008-06-30 2009-05-06 胡一平 Belt type high frequency loudspeaker
US8031901B2 (en) * 2006-09-14 2011-10-04 Bohlender Graebener Corporation Planar speaker driver

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1640187A (en) * 2002-02-28 2005-07-13 古河电气工业株式会社 Planar speaker
TWI255148B (en) * 2004-08-06 2006-05-11 Beston Technology Corp A diaphragm for ribbon type planar speaker and its manufacturing method
CN1925724A (en) * 2005-09-02 2007-03-07 三星电机株式会社 Method of forming circuit pattern on printed circuit board
CN200947671Y (en) * 2006-01-20 2007-09-12 丁轶 Belt speaker
US8031901B2 (en) * 2006-09-14 2011-10-04 Bohlender Graebener Corporation Planar speaker driver
CN101227121A (en) * 2007-12-26 2008-07-23 彩虹集团电子股份有限公司 Production technology of oscillation ring
CN201234341Y (en) * 2008-06-30 2009-05-06 胡一平 Belt type high frequency loudspeaker

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Effective date of registration: 20160224

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