CN103309178A - Double-face alignment exposure device for semiconductor wafer - Google Patents
Double-face alignment exposure device for semiconductor wafer Download PDFInfo
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- CN103309178A CN103309178A CN2013102797381A CN201310279738A CN103309178A CN 103309178 A CN103309178 A CN 103309178A CN 2013102797381 A CN2013102797381 A CN 2013102797381A CN 201310279738 A CN201310279738 A CN 201310279738A CN 103309178 A CN103309178 A CN 103309178A
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Abstract
The invention discloses a double-face alignment exposure device for a semiconductor wafer. The double-face alignment exposure device is simple in structure and can realize double-face wafer alignment conveniently, quickly and accurately. A wafer is arranged between an upper mask plate and a lower mask plate; an upper chromium coating is arranged on the top, which is attached to the wafer, of the upper mask plate; a lower chromium coating is arranged at the bottom, which is attached to the wafer, of the lower mask plate. The double-face alignment exposure device comprises a base, a negative pressure source I, a negative pressure source II and an adjustment mechanism, wherein an air hole I and an air hole II are respectively formed in the side face of the base; an accommodating slot for accommodating the lower mask plate is formed in the center of the top of the base; a through slot communicated with the accommodating slot is formed in the center of the bottom of the base; an air path is arranged at the bottom of the accommodating slot. During working, the double-face alignment exposure device realizes precise alignment between the upper mask plate and the base, namely precise alignment between the upper mask plate and the lower mask plate, and is wide in application range. Square and crossed frame type coordinate marks are added to the upper mask plate and the lower mask plate, so that the precise alignment between the upper mask plate and the lower mask plate is further improved. The double-face alignment exposure device is easy and convenient to operate and high in reliability and reduces the production cost.
Description
Technical field
The present invention relates to the semiconductor devices technical field of lithography, relate in particular to for when the circular wafer upper and lower faces makes the full symmetric image by lithography, necessary a kind of to the line exposing device.
Background technology
Semiconductor devices at first, is coated on photoresist on the circular wafer surface for the treatment of photoetching in photoetching process is processed, its require coated photoresist adhere to good, evenly, free of pinholes, thickness be suitable.Then, utilize light source see through light shield version (same mask plate) adopt contact exposure with the patterned illumination on the mask plate on photoresist, realize the transfer of pattern.Generally, design transfer on the mask plate occurs over just the same face, but need to carry out line on the circular wafer two sides for two-way TVS product, SCR break-through diffusion etc., transferring to pattern on the wafer needs when identical and symmetrical, then need two-way exposure machine to have simultaneously preferably alignment device, upper and lower two mask plates can be moved flexibly, and mask plate can fully contact with wafer is gapless, so that upper and lower pattern fits like a glove.
The processing technology of tradition dual surface lithography is: adopt at film and draw the chromium layer pattern, align with figure on the collotype in advance, so that upper and lower figure is consistent, again with the fixing one side of film of adhesive tape, then will treat the line exposing wafer is placed between film and the collotype, by upper and lower two light sources it is exposed, thereby obtain expecting the effect of design transfer.
But because film is soft, in the photoetching process of above and below, easily produce the phenomenons such as crumple, projection, cause diplopia etc. unusual.Secondly, in advance film is alignd with the light shield of glass material, because there is certain thickness in wafer, in the time of in the middle of wafer being placed on film and collotype, minor shifts has occured, because film is soft and the one side is fixing, the final image that shifts has small deviation, and when causing etching, cutting, the upper and lower faces Cutting Road is inconsistent, produce the phenomenon of off normal, affect the crudy of product.
State Intellectual Property Office on November 9th, 1994 disclosed name be called " Two-fale register exposing ", its when work, first with upper and lower mask plate by sucker under microscopical effect, realize corresponding; Then put on mask plate on, silicon chip is sent between two editions, successively contact with upper mask plate, lower mask plate by sucker respectively, expose.At work, realize respectively the displacement of upper mask plate, silicon chip and lower mask plate is controlled by three groups of suckers, realize simultaneously the correspondence of position by microscope; The whole course of work, operation are complicated, and processing inconvenience and equipment cost are high.
Summary of the invention
The present invention is directed to above problem, provide a kind of simple in structure, can realize accurately easily and fast that wafer is two-sided line is used for the two-sided to the line exposing device of semiconductor wafer.
Technical scheme of the present invention is: described wafer is located between the upper and lower mask plate, described upper mask plate is positioned at the top of described lower mask plate, the fit end face of described wafer of described upper mask plate is provided with chrome coating, and the fit bottom surface of described wafer of described lower mask plate is provided with lower chrome coating;
Describedly two-sided the line exposing device is comprised pedestal, negative pressure source one, negative pressure source two and governor motion, described pedestal is tabular, and the side of described pedestal is respectively equipped with pore one and pore two,
The end face center of described pedestal is provided be used to the storage tank of placing described lower mask plate, and the bottom center of described pedestal is provided with the groove that is communicated with described storage tank, the area of the area of described groove 〉=described wafer;
The bottom surface of described storage tank is provided with gas circuit, described gas circuit ringwise and be positioned at described groove around, described gas circuit is communicated with described negative pressure source one by described pore one;
Described upper mask plate is located on the described pedestal, described governor motion comprises O-ring seal and is located at respectively relative annular groove between described upper mask plate bottom surface and the base top surface, described annular groove be positioned at described storage tank around, described O-ring seal is located in the described annular groove, and described annular groove is communicated with described negative pressure source two by described pore two; So that described upper mask plate and pedestal are hermetically-sealed construction.
Described governor motion also comprises ball and is located at relative ball hole between described upper mask plate bottom surface and the base top surface, and described ball is actively installed in the described ball hole.
Described upper and lower mask plate is glass material.
Be respectively equipped with corresponding positioning mark on the described upper and lower mask plate.
The bottom surface of described upper mask plate is provided with the cross-type positioning mark of downward protrusion, and the end face of described lower mask plate is provided with the square opening positioning mark, and described cross-type positioning mark is located in the described square opening positioning mark adaptedly.
Semiconductor wafer double-side exposure device among the present invention carves identical and symmetrical image so that the upper and lower faces of circular wafer can overlap in photoetching process, solved the abnormal conditions such as the off normal that exists in the traditional handicraft, diplopia.
In the work, lower mask plate is arranged in the storage tank on the pedestal, and the negative pressure gas circuit by the storage tank bottom surface realizes fixing to lower mask plate; Be O-ring seal and ball by governor motion, mask plate can be moved at the O-ring seal of quality of rubber materials, ball has improved mobile dirigibility, namely realize between mask plate and the pedestal in the realization between the upper and lower mask plate precisely to line, simultaneously, soft O-ring seal can adapt to the wafer of different-thickness, and is applied widely, and then the negative pressure gas circuit by the communication seals circle realizes fixing.Add square and cross-type coordinates logo at upper and lower mask plate, further improved the exactitude position between the upper and lower mask plate.The present invention has improved the accuracy to line, easy and simple to handle, reduced production cost, reliability is high.
Description of drawings
Fig. 1 is structural representation of the present invention,
Fig. 2 is the vertical view of Fig. 1,
Fig. 3 is the structural representation of upper mask plate among the present invention,
Fig. 4 is the structural representation of lower mask plate among the present invention,
Fig. 5 is working state structure schematic diagram of the present invention;
1 is pedestal among the figure, the 11st, and storage tank, the 12nd, gas circuit, the 13rd, pore one, 14th, pore two, 15th, ball hole, the 16th, groove,
The 2nd, upper mask plate, the 21st, the cross-type positioning mark, the 22nd, upper chrome coating,
The 3rd, lower mask plate, the 31st, the square opening positioning mark, the 32nd, lower chrome coating,
The 4th, O-ring seal, the 5th, ball, the 6th, annular groove.
Embodiment
The present invention is shown in Fig. 1-5,: described wafer is located between the upper and lower mask plate, described upper mask plate 2 is positioned at the top of described lower mask plate 3, the end face that described upper mask plate 2 is fitted described wafer is provided with the bottom surface that chrome coating 22(namely go up mask plate 2 and is provided with chrome coating 22), the bottom surface of the described wafer of described lower mask plate 3 applyings is provided with lower chrome coating 32(and namely descends the end face of mask plate 3 to be provided with lower chrome coating 32);
Describedly two-sided the line exposing device is comprised pedestal 1, negative pressure source one, negative pressure source two and governor motion, described pedestal 1 is tabular, and the side of described pedestal 1 is respectively equipped with pore 1 and pore 2 14,
The end face center of described pedestal 1 is provided be used to the storage tank 11 of placing described lower mask plate 3, the bottom center of described pedestal 1 is provided with the groove 16 that is communicated with described storage tank 11, the area of the area of described groove 16 〉=described wafer, realize lower light source by 16 pairs of lower mask plate 3 exposures of groove, thereby realize the exposure to wafer;
The bottom surface of described storage tank 11 is provided with gas circuit 12, described gas circuit 12 ringwise and be positioned at described groove 16 around (being the area of the area＞groove 16 of storage tank 11), described gas circuit 12 is communicated with described negative pressure source one by described pore 1;
Described upper mask plate 3 is located on the described pedestal 1, described governor motion comprise O-ring seal 4 and be located at respectively described upper mask plate 2 bottom surfaces and pedestal 1 end face between relative annular groove 6, described annular groove 6 be positioned at described storage tank 11 around, described O-ring seal 4 is located in the described annular groove 6, and described annular groove 6 is communicated with described negative pressure source two by described pore 2 14; So that described upper mask plate 3 is hermetically-sealed construction with pedestal 1, thus realize between upper mask plate, wafer and the lower mask plate to line and fixing.
Described governor motion also comprise ball 5 and be located at described upper mask plate 2 bottom surfaces and pedestal 1 end face between relative ball hole 15, described ball 5 is actively installed in the described ball hole 15.Upper mask plate 2 is mobile weak effect on the O-ring seal 4 of quality of rubber materials, and the ball 5 that increase can be rolled in ball hole can effectively move mask plate 2, plays the effect of accurate location.
Described upper and lower mask plate is glass material.
Be respectively equipped with corresponding positioning mark on the described upper and lower mask plate.
The bottom surface of described upper mask plate 2 is provided with the cross-type positioning mark 21 of downward protrusion, and the end face of described lower mask plate 3 is provided with square opening positioning mark 31, and described cross-type positioning mark 21 is located in the described square opening positioning mark 31 adaptedly.
For two-way two in the face of the wafers of line, upper and lower mask plate all adopts glass material; Because wafer itself is light tight, is clipped in the middle of the upper and lower collotype, figure is all covered, and newly-increased positioning mark is cross-type positioning mark and square opening positioning mark outside figure, has further improved the exactitude position between the upper and lower mask plate.
The effect of O-ring seal 4 among the present invention: the one, regulate the thickness that adapts to different chips, the product circular wafer variable thickness of different model, O-ring seal adopts quality of rubber materials, can be out of shape under the effect of pressure, can effectively regulate and adapt to the thickness of wafer to be exposed by this specific character; The 2nd, make mask plate 2 and pedestal 1 present sealing, after air was siphoned away by negative pressure source two, upper mask plate 2 is inhaled effectively to be overlayed on the wafer.
The course of work of the present invention is:
At first, lower mask plate 3 is placed in the storage tank 11 on the pedestal 1, the negative pressure gas circuit by storage tank 11 bottom surfaces realizes fixing to lower mask plate 3;
Secondly, wafer is placed on the lower chrome coating 32 of lower mask plate 3;
Then, upper mask plate 2 is placed on the pedestal 1 (namely is positioned on the wafer), be O-ring seal 4 and ball 5 by governor motion, mask plate 2 can be moved at the O-ring seal of quality of rubber materials, ball has improved mobile dirigibility, realize upper and lower chrome coating between the upper and lower mask plate precisely to line, the negative pressure gas circuit by the communication seals circle is taken the air moment in the O-ring seal away, and mask plate 2 is fixing in the realization;
At last, by the double-sided exposure of upper and lower light source realization to wafer, upper light source is directly to upper mask plate 2 exposures, and lower light source is by 16 pairs of lower mask plates 3 exposures of groove.
The present invention can realize under the general work environment, by governor motion realize between wafer and the upper and lower mask plate to the line function, say from economic angle, can save microscope, save the control device of mobile or rotary mask version, save the operating space, greatly reduced the production cost of enterprise; Say from work angle, operating personnel realize the flexible movement of mask plate by O-ring seal and ball, and are accurate to line, easy and simple to handle, feasibility is high.The present invention is convenient to promote the use of, and is practical.
Claims (5)
1. one kind is used for the two-sided to the line exposing device of semiconductor wafer, described wafer is located between the upper and lower mask plate, described upper mask plate is positioned at the top of described lower mask plate, the fit end face of described wafer of described upper mask plate is provided with chrome coating, and the fit bottom surface of described wafer of described lower mask plate is provided with lower chrome coating;
It is characterized in that, describedly two-sided the line exposing device is comprised pedestal, negative pressure source one, negative pressure source two and governor motion, described pedestal is tabular, and the side of described pedestal is respectively equipped with pore one and pore two,
The end face center of described pedestal is provided be used to the storage tank of placing described lower mask plate, and the bottom center of described pedestal is provided with the groove that is communicated with described storage tank, the area of the area of described groove 〉=described wafer;
The bottom surface of described storage tank is provided with gas circuit, described gas circuit ringwise and be positioned at described groove around, described gas circuit is communicated with described negative pressure source one by described pore one;
Described upper mask plate is located on the described pedestal, described governor motion comprises O-ring seal and is located at respectively relative annular groove between described upper mask plate bottom surface and the base top surface, described annular groove be positioned at described storage tank around, described O-ring seal is located in the described annular groove, and described annular groove is communicated with described negative pressure source two by described pore two; So that described upper mask plate and pedestal are hermetically-sealed construction.
2. a kind of two-sided to the line exposing device for semiconductor wafer according to claim 1, it is characterized in that, described governor motion also comprises ball and is located at relative ball hole between described upper mask plate bottom surface and the base top surface, and described ball is actively installed in the described ball hole.
3. according to claim 1 a kind ofly for the two-sided of semiconductor wafer the line exposing device be is characterized in that, described upper and lower mask plate is glass material.
4. according to claim 3 a kind ofly for the two-sided of semiconductor wafer the line exposing device be is characterized in that, be respectively equipped with corresponding positioning mark on the described upper and lower mask plate.
5. a kind of two-sided to the line exposing device for semiconductor wafer according to claim 4, it is characterized in that, the bottom surface of described upper mask plate is provided with the cross-type positioning mark of downward protrusion, the end face of described lower mask plate is provided with the square opening positioning mark, and described cross-type positioning mark is located in the described square opening positioning mark adaptedly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310279738.1A CN103309178B (en) | 2013-07-04 | 2013-07-04 | A kind of double-face alignment exposure device for semiconductor wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310279738.1A CN103309178B (en) | 2013-07-04 | 2013-07-04 | A kind of double-face alignment exposure device for semiconductor wafer |
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| CN103309178A true CN103309178A (en) | 2013-09-18 |
| CN103309178B CN103309178B (en) | 2015-08-26 |
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| CN201310279738.1A Active CN103309178B (en) | 2013-07-04 | 2013-07-04 | A kind of double-face alignment exposure device for semiconductor wafer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932208A (en) * | 2015-07-07 | 2015-09-23 | 仓和精密制造(苏州)有限公司 | Exposure jig and work process thereof |
| CN105045047A (en) * | 2015-09-07 | 2015-11-11 | 深圳市路维光电股份有限公司 | Circular-ring-piece-shaped chromium plate exposure fixture and exposure method |
Citations (5)
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| JPS5458365A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Mask aligner |
| CN1094827A (en) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | Two-sided to the version exposure machine |
| JPH0943861A (en) * | 1995-08-02 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | Aligning method and aligning device for opposite plate |
| CN202257025U (en) * | 2011-08-26 | 2012-05-30 | 华中科技大学 | Ultra-violet nanoimprinting soft template fixing and aligning assembly |
| CN203324648U (en) * | 2013-07-04 | 2013-12-04 | 扬州杰利半导体有限公司 | Two-side alignment exposure device for semiconductor chip |
-
2013
- 2013-07-04 CN CN201310279738.1A patent/CN103309178B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458365A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Mask aligner |
| CN1094827A (en) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | Two-sided to the version exposure machine |
| JPH0943861A (en) * | 1995-08-02 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | Aligning method and aligning device for opposite plate |
| CN202257025U (en) * | 2011-08-26 | 2012-05-30 | 华中科技大学 | Ultra-violet nanoimprinting soft template fixing and aligning assembly |
| CN203324648U (en) * | 2013-07-04 | 2013-12-04 | 扬州杰利半导体有限公司 | Two-side alignment exposure device for semiconductor chip |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932208A (en) * | 2015-07-07 | 2015-09-23 | 仓和精密制造(苏州)有限公司 | Exposure jig and work process thereof |
| CN105045047A (en) * | 2015-09-07 | 2015-11-11 | 深圳市路维光电股份有限公司 | Circular-ring-piece-shaped chromium plate exposure fixture and exposure method |
| CN105045047B (en) * | 2015-09-07 | 2018-04-10 | 深圳市路维光电股份有限公司 | Circular ring plate chromium plate exposes tool and exposure method |
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| CN103309178B (en) | 2015-08-26 |
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