CN103309178B - A kind of double-face alignment exposure device for semiconductor wafer - Google Patents
A kind of double-face alignment exposure device for semiconductor wafer Download PDFInfo
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- CN103309178B CN103309178B CN201310279738.1A CN201310279738A CN103309178B CN 103309178 B CN103309178 B CN 103309178B CN 201310279738 A CN201310279738 A CN 201310279738A CN 103309178 B CN103309178 B CN 103309178B
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Abstract
A kind of double-face alignment exposure device for semiconductor wafer.Structure is simple, can accurately realize wafer easily and fast two-sided to line.Wafer is located between upper and lower mask plate, and the end face of upper mask plate bonded wafer is provided with chrome coating, and the bottom surface of lower mask plate bonded wafer is provided with lower chrome coating; Double-face alignment exposure device comprises pedestal, negative pressure source one, negative pressure source two and governor motion, the side of pedestal is respectively equipped with pore one and pore two, the end face center of pedestal is provided with the storage tank for placing lower mask plate, and the bottom center of pedestal is provided with the groove being communicated with storage tank; The bottom surface of storage tank is provided with gas circuit.At work, what namely realization realizes between upper and lower mask plate between mask plate and pedestal is accurate to line in the present invention, simultaneously applied widely.Upper and lower mask plate adds square and cross-type coordinates logo, further increases the exactitude position between upper and lower mask plate.The present invention is easy and simple to handle, reduce production cost, reliability is high.
Description
Technical field
The present invention relates to semiconductor devices technical field of lithography, particularly relate to for when circular wafer upper and lower faces makes full symmetric image by lithography, necessary one is to line exposing device.
Background technology
Semiconductor devices is in photoetching process process, and first, photoresist is coated on the circular wafer surface for the treatment of photoetching, it requires, and coated photoresist adheres to well, even, free of pinholes, thickness are suitable.Then, utilize light source to adopt contact exposure by the patterned illumination on mask plate on photoresist through light shield version (same to mask plate), realize the transfer of pattern.Under normal circumstances, design transfer on mask plate occurs over just the same face, but two-way TVS product, SCR break-through diffusion etc. are needed to carry out line on circular wafer two sides, when the pattern transferred on wafer needs identical and symmetrical, then need two-way exposure machine to have good alignment device simultaneously, can movement flexibly by upper and lower two pieces of mask plates, and mask plate fully can contact with wafer is gapless, and upper and lower pattern is fitted like a glove.
The processing technology of tradition dual surface lithography is: adopt and draw layers of chrome figure on film, align with the figure on collotype in advance, make upper and lower figure consistent, one side of film is fixed again with adhesive tape, then will treat to be placed between film and collotype to line exposing wafer, by upper and lower two light sources, it is exposed, thus obtain the effect of expection design transfer.
But because film is soft, in the photoetching process of above and below, easily produce the phenomenon such as crumple, projection, cause the exceptions such as diplopia.Secondly, in advance film is alignd with the light shield of glass material, because wafer exists certain thickness, when being placed on by wafer in the middle of film and collotype, there occurs minor shifts, because film is soft and one side is fixing, the final image shifted has small deviation, and when causing etching, cutting, upper and lower faces Cutting Road is inconsistent, produce the phenomenon of off normal, affect the crudy of product.
State Intellectual Property Office's name disclosed in the 9 days November in 1994 is called " Two-fale register exposing ", its operationally, first by upper and lower mask plate by sucker under microscopical effect, realize corresponding; Then put on mask plate on, silicon chip is sent between two editions, successively contact with upper mask plate, lower mask plate respectively by sucker, expose.At work, realize respectively, to the Bit andits control of upper mask plate, silicon chip and lower mask plate, being realized the correspondence of position by microscope by three groups of suckers simultaneously; The whole course of work, operates more complicated, and processing is inconvenient and equipment cost is high.
Summary of the invention
The present invention is directed to above problem, provide a kind of structure simple, accurately can realize the two-sided double-face alignment exposure device for semiconductor wafer to line of wafer easily and fast.
Technical scheme of the present invention is: described wafer is located between upper and lower mask plate, described upper mask plate is positioned at the top of described lower mask plate, the fit end face of described wafer of described upper mask plate is provided with chrome coating, and the fit bottom surface of described wafer of described lower mask plate is provided with lower chrome coating;
Described double-face alignment exposure device comprises pedestal, negative pressure source one, negative pressure source two and governor motion, and described pedestal is tabular, and the side of described pedestal is respectively equipped with pore one and pore two,
The end face center of described pedestal is provided with the storage tank for placing described lower mask plate, and the bottom center of described pedestal is provided with the groove being communicated with described storage tank, the area of the area >=described wafer of described groove;
The bottom surface of described storage tank is provided with gas circuit, and ringwise and be positioned at the surrounding of described groove, described gas circuit is communicated with described negative pressure source one by described pore one to described gas circuit;
Described upper mask plate is located on described pedestal, described governor motion comprises O-ring seal and is located at annular groove relative between described upper mask plate bottom surface and base top surface respectively, described annular groove is positioned at the surrounding of described storage tank, described O-ring seal is located in described annular groove, and described annular groove is communicated with described negative pressure source two by described pore two; Described upper mask plate and pedestal is made to be hermetically-sealed construction.
Described governor motion also comprises ball and is located at ball hole relative between described upper mask plate bottom surface and base top surface, and described ball is actively installed in described ball hole.
Described upper and lower mask plate is glass material.
Described upper and lower mask plate is respectively equipped with corresponding positioning mark.
The bottom surface of described upper mask plate is provided with the cross-type positioning mark protruded downwards, and the end face of described lower mask plate is provided with square opening positioning mark, and described cross-type positioning mark is located in described square opening positioning mark adaptedly.
Semiconductor wafer double-side exposure device in the present invention in a lithographic process, makes the upper and lower faces of circular wafer to overlap to carve the identical and image of symmetry, solves the abnormal conditions such as off normal, diplopia existed in traditional handicraft.
In work, lower mask plate is arranged in the storage tank on pedestal, realizes fixing lower mask plate by the negative pressure gas circuit of storage tank bottom surface; By governor motion and O-ring seal and ball, mask plate can be moved on the O-ring seal of quality of rubber materials, ball improves the dirigibility of movement, what namely realization realizes between upper and lower mask plate between mask plate and pedestal is accurate to line, simultaneously, soft O-ring seal can adapt to the wafer of different-thickness, applied widely, then realizes fixing by the negative pressure gas circuit of communication seals circle.Upper and lower mask plate adds square and cross-type coordinates logo, further increases the exactitude position between upper and lower mask plate.Invention increases the accuracy to line, easy and simple to handle, reduce production cost, reliability is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention,
Fig. 2 is the vertical view of Fig. 1,
Fig. 3 is the structural representation of upper mask plate in the present invention,
Fig. 4 is the structural representation of lower mask plate in the present invention,
Fig. 5 is working state structure schematic diagram of the present invention;
In figure, 1 is pedestal, and 11 is storage tanks, and 12 is gas circuits, and 13 is pores one, and 14 is pores two, and 15 is ball holes, and 16 is grooves,
2 is upper mask plates, and 21 is cross-type positioning marks, and 22 is upper chrome coatings,
3 is lower mask plates, and 31 is square opening positioning marks, and 32 is lower chrome coatings,
4 is O-ring seals, and 5 is balls, and 6 is annular grooves.
Embodiment
The present invention as Figure 1-5,: described wafer is located between upper and lower mask plate, described upper mask plate 2 is positioned at the top of described lower mask plate 3, the fit end face of described wafer of described upper mask plate 2 is provided with the bottom surface that namely chrome coating 22(go up mask plate 2 and is provided with chrome coating 22), the fit bottom surface of described wafer of described lower mask plate 3 is provided with lower chrome coating 32(and namely descends the end face of mask plate 3 to be provided with lower chrome coating 32);
Described double-face alignment exposure device comprises pedestal 1, negative pressure source one, negative pressure source two and governor motion, and described pedestal 1 is in tabular, and the side of described pedestal 1 is respectively equipped with pore 1 and pore 2 14,
The end face center of described pedestal 1 is provided with the storage tank 11 for placing described lower mask plate 3, the bottom center of described pedestal 1 is provided with the groove 16 being communicated with described storage tank 11, the area of the area >=described wafer of described groove 16, realize lower light source to be exposed lower mask plate 3 by groove 16, thus realize the exposure to wafer;
The bottom surface of described storage tank 11 is provided with gas circuit 12, ringwise and be positioned at the surrounding (i.e. the area of the area > groove 16 of storage tank 11) of described groove 16, described gas circuit 12 is communicated with described negative pressure source one by described pore 1 to described gas circuit 12;
Described upper mask plate 3 is located on described pedestal 1, described governor motion comprises O-ring seal 4 and is located at annular groove 6 relative between described upper mask plate 2 bottom surface and pedestal 1 end face respectively, described annular groove 6 is positioned at the surrounding of described storage tank 11, described O-ring seal 4 is located in described annular groove 6, and described annular groove 6 is communicated with described negative pressure source two by described pore 2 14; Make described upper mask plate 3 and pedestal 1 in hermetically-sealed construction, thus realize upper mask plate, fixing to line between wafer and lower mask plate.
Described governor motion also comprises ball 5 and is located at ball hole 15 relative between described upper mask plate 2 bottom surface and pedestal 1 end face, and described ball 5 is actively installed in described ball hole 15.Upper mask plate 2 is mobile weak effect on the O-ring seal 4 of quality of rubber materials, increases the ball 5 that can roll in ball hole, can effectively move mask plate 2, plays the effect of accurately location.
Described upper and lower mask plate is glass material.
Described upper and lower mask plate is respectively equipped with corresponding positioning mark.
The bottom surface of described upper mask plate 2 is provided with the cross-type positioning mark 21 protruded downwards, and the end face of described lower mask plate 3 is provided with square opening positioning mark 31, and described cross-type positioning mark 21 is located in described square opening positioning mark 31 adaptedly.
For two-way two in the face of the wafer of line, upper and lower mask plate all adopts glass material; Because wafer itself is light tight, be clipped in the middle of upper and lower collotype, figure is all covered, and outside figure, newly-increased positioning mark and cross-type positioning mark and square opening positioning mark, further increase the exactitude position between upper and lower mask plate.
The effect of O-ring seal 4 in the present invention: one is regulate the thickness adapting to different chips, the product circular wafer variable thickness of different model, O-ring seal adopts quality of rubber materials, can be out of shape under the effect of the pressure, effectively can be regulated and adapt to the thickness of wafer to be exposed by this characteristic; Two is make mask plate 2 and pedestal 1 present sealing, and after air is siphoned away by negative pressure source two, upper mask plate 2 is inhaled effectively to be overlayed on wafer.
The course of work of the present invention is:
First, lower mask plate 3 is placed in the storage tank 11 on pedestal 1, realizes fixing lower mask plate 3 by the negative pressure gas circuit of storage tank 11 bottom surface;
Secondly, wafer is placed on the lower chrome coating 32 of lower mask plate 3;
Then, upper mask plate 2 is placed on pedestal 1 and (is namely positioned on wafer), by governor motion and O-ring seal 4 and ball 5, mask plate 2 can be moved on the O-ring seal of quality of rubber materials, ball improves the dirigibility of movement, realize upper and lower chrome coating between upper and lower mask plate precisely to line, taken away instantaneously by the air in O-ring seal by the negative pressure gas circuit of communication seals circle, in realization, mask plate 2 is fixing;
Finally, realize the double-sided exposure to wafer by upper and lower light source, upper light source directly exposes upper mask plate 2, and lower light source is exposed lower mask plate 3 by groove 16.
The present invention can realize under general work environment, by governor motion realize between wafer and upper and lower mask plate to line function, economically, microscope can be saved, save control device that is mobile or rotary mask version, save operating space, greatly reduce the production cost of enterprise; Say from work angle, operating personnel realize the flexible movement of mask plate by O-ring seal and ball, accurate to line, easy and simple to handle, feasibility is high.The present invention is convenient to promote the use of, practical.
Claims (4)
1. the double-face alignment exposure device for semiconductor wafer, described wafer is located between upper and lower mask plate, described upper mask plate is positioned at the top of described lower mask plate, the fit end face of described wafer of described upper mask plate is provided with chrome coating, and the fit bottom surface of described wafer of described lower mask plate is provided with lower chrome coating;
It is characterized in that, described double-face alignment exposure device comprises pedestal, negative pressure source one, negative pressure source two and governor motion, and described pedestal is tabular, and the side of described pedestal is respectively equipped with pore one and pore two,
The end face center of described pedestal is provided with the storage tank for placing described lower mask plate, and the bottom center of described pedestal is provided with the groove being communicated with described storage tank, the area of the area >=described wafer of described groove;
The bottom surface of described storage tank is provided with gas circuit, and ringwise and be positioned at the surrounding of described groove, described gas circuit is communicated with described negative pressure source one by described pore one to described gas circuit;
Described upper mask plate is located on described pedestal, described governor motion comprises O-ring seal and is located at annular groove relative between described upper mask plate bottom surface and base top surface respectively, described annular groove is positioned at the surrounding of described storage tank, described O-ring seal is located in described annular groove, and described annular groove is communicated with described negative pressure source two by described pore two; Described upper mask plate and pedestal is made to be hermetically-sealed construction;
Described governor motion also comprises ball and is located at ball hole relative between described upper mask plate bottom surface and base top surface, and described ball is actively installed in described ball hole.
2. a kind of double-face alignment exposure device for semiconductor wafer according to claim 1, is characterized in that, described upper and lower mask plate is glass material.
3. a kind of double-face alignment exposure device for semiconductor wafer according to claim 2, is characterized in that, described upper and lower mask plate is respectively equipped with corresponding positioning mark.
4. a kind of double-face alignment exposure device for semiconductor wafer according to claim 3, it is characterized in that, the bottom surface of described upper mask plate is provided with the cross-type positioning mark protruded downwards, the end face of described lower mask plate is provided with square opening positioning mark, and described cross-type positioning mark is located in described square opening positioning mark adaptedly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310279738.1A CN103309178B (en) | 2013-07-04 | 2013-07-04 | A kind of double-face alignment exposure device for semiconductor wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310279738.1A CN103309178B (en) | 2013-07-04 | 2013-07-04 | A kind of double-face alignment exposure device for semiconductor wafer |
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| CN103309178A CN103309178A (en) | 2013-09-18 |
| CN103309178B true CN103309178B (en) | 2015-08-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104932208B (en) * | 2015-07-07 | 2017-01-18 | 仓和精密制造(苏州)有限公司 | Exposure jig and work process thereof |
| CN105045047B (en) * | 2015-09-07 | 2018-04-10 | 深圳市路维光电股份有限公司 | Circular ring plate chromium plate exposes tool and exposure method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458365A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Mask aligner |
| CN1094827A (en) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | Two-sided to the version exposure machine |
| JPH0943861A (en) * | 1995-08-02 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | Aligning method and aligning device for opposite plate |
| CN202257025U (en) * | 2011-08-26 | 2012-05-30 | 华中科技大学 | Ultra-violet nanoimprinting soft template fixing and aligning assembly |
| CN203324648U (en) * | 2013-07-04 | 2013-12-04 | 扬州杰利半导体有限公司 | Two-side alignment exposure device for semiconductor chip |
-
2013
- 2013-07-04 CN CN201310279738.1A patent/CN103309178B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458365A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Mask aligner |
| CN1094827A (en) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | Two-sided to the version exposure machine |
| JPH0943861A (en) * | 1995-08-02 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | Aligning method and aligning device for opposite plate |
| CN202257025U (en) * | 2011-08-26 | 2012-05-30 | 华中科技大学 | Ultra-violet nanoimprinting soft template fixing and aligning assembly |
| CN203324648U (en) * | 2013-07-04 | 2013-12-04 | 扬州杰利半导体有限公司 | Two-side alignment exposure device for semiconductor chip |
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| CN103309178A (en) | 2013-09-18 |
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