CN103283313A - Metal base circuit board, and method for producing metal base circuit board - Google Patents

Metal base circuit board, and method for producing metal base circuit board Download PDF

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Publication number
CN103283313A
CN103283313A CN201180063612XA CN201180063612A CN103283313A CN 103283313 A CN103283313 A CN 103283313A CN 201180063612X A CN201180063612X A CN 201180063612XA CN 201180063612 A CN201180063612 A CN 201180063612A CN 103283313 A CN103283313 A CN 103283313A
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CN
China
Prior art keywords
metal
circuit board
aluminium
base
resin layer
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CN201180063612XA
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Chinese (zh)
Inventor
白土洋次
武谷光男
马场孝幸
飞泽晃彦
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication of CN103283313A publication Critical patent/CN103283313A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A metal base circuit board (10) is laminated with an aluminum substrate (12), an insulating resin layer (14), and a metal layer (16) in said order. The surface of the aluminum substrate (12) is brought into contact with water having a temperature of 50 to 80 DEG C for 0.5 to 3 minutes such that the surface roughness (Rz) of the surface of the aluminum substrate (12) is between 3 and 9 [mu]m and the water contact angle thereof is between 50 DEG and 95 DEG .

Description

The manufacture method of metal-base circuit board, metal-base circuit board
Technical field
The present invention relates to the manufacture method of a kind of metal-base circuit board and metal-base circuit board.
Background technology
From in the past, to discharge the heat that sends from installing component as purpose, use at the be situated between metal-base circuit board of by insulating resin layer laminated metal layer of aluminium base.
The metallic substrate surfaces that constitutes metal-base circuit board is formed with under the situation of oxide film thereon, makes the adaptation reduction with insulating resin layer.Therefore, as patent documentation 1 or 2 described, in order to remove the oxide film thereon on aluminium base surface, grind this surperficial mechanical lapping, as patent documentation 3～5 is described, carry out the roughening method that chemical etching should the surface.
In addition, in recent years, can carry the such light-emitting component of LED etc., and use (patent documentation 6) as the light source of liquid crystal indicator etc.
Patent documentation 1: Japanese kokai publication hei 07-197272 communique
Patent documentation 2: Japanese kokai publication hei 10-296908 communique
Patent documentation 3: TOHKEMY 2002-12653 communique
Patent documentation 4: TOHKEMY 2002-114836 communique
Patent documentation 5: TOHKEMY 2008-266535 communique
Patent documentation 6: TOHKEMY 2007-194155 communique
Summary of the invention
Yet, being accompanied by the slimming of electronic equipments such as liquid crystal indicator and the requirement of miniaturization, the area of loading position etc. is restricted, and has produced the necessity in little space mounting.When so little space mounting, produce the problem that metal-base circuit board is bent, peels off sometimes between aluminium base and insulating resin layer.
Handle according to the described mechanical lapping of above-mentioned patent documentation, chemical etching, form at the aluminium base concave-convex surface, because set effect and improving with the adaptation of resin bed.Yet, since aluminium base surface concavo-convex, the resin bed unevenness that this surface forms, and it is uneven that the circuit that forms on the resin bed also becomes.Therefore, the connection that is equipped on the parts of circuit sometimes becomes insufficient, uses the decrease in yield of the various devices of metal-base circuit board.On the other hand, handle if carry out these, the aluminium base surface is low with the adaptation of resin bed, has used the rate of finished products of the various devices of metal-base circuit board to reduce greatly.Therefore, surface treatment such as mechanical lapping, chemical etching becomes necessary operation.
And, because mechanical lapping produces a large amount of grinding slags, need in addition for the device that these are removed accurately, operation.On the other hand, device, the operation of the substrate surface after producing hydrogen etc. or further need to be used for neutralisation treatment in addition when handling handled in chemical etching.Like this, mechanical lapping, chemical etching are handled fail safe, manufacturing cost, operation numerous and diverse the point that improve.
Like this, the present inventor etc. have found to improve the adaptation of aluminium base and resin bed, and then improve the new problem of the rate of finished products of the various devices that used metal-base circuit board.
In addition, patent documentation 6 described led light source unit have the shape that metal-base circuit board is configured in the regulation in the framework, when still being processed into different shape, still have above-mentioned problem.
The present inventor etc. have carried out deep research in view of above-mentioned problem, even find under the situation of aluminium base surface smoothing, by with the contact angle of the water scope in regulation, improve with the adaptation of resin bed and used the rate of finished products of the various devices of metal-base circuit board to improve and all can satisfy, thereby finished the present invention.
In addition, the present inventor etc. have carried out deep research in view of above-mentioned problem, discovery is handled by the aluminium base surface being utilized excellent in safety and easy method, improve with the adaptation of resin bed and used the rate of finished products of the various devices of metal-base circuit board to improve and all can satisfy, thereby finished the present invention.
According to the present invention, a kind of metal-base circuit board is provided, be that aluminium base, insulating resin layer and metal level stack gradually the metal-base circuit board that forms,
Described aluminium base the surface with contact angle water be 50 °～95 °,
Surface roughness (R Z) be 3 μ m～9 μ m.
And, according to the present invention, providing the manufacture method of above-mentioned metal-base circuit board, the manufacture method of this metal-base circuit board comprises following operation:
Make described aluminium base contact 0.5 minute with 50 ℃～80 ℃ water～3 minutes operation and
Described aluminium base surface after processing forms described insulating resin layer, then forms the operation of described metal level at described insulating resin layer.
And, according to the present invention, provide the processing method of a kind of metal-base circuit board with aluminium base, be the processing method for the aluminium base of above-mentioned metal-base circuit board,
Make described aluminium base contact 0.5 minute with 50 ℃～80 ℃ water～3 minutes.
And, according to the present invention, providing a kind of manufacture method of metal-base circuit board, the manufacture method of this above-mentioned metal-base circuit board comprises following operation:
To the ultraviolet operation of described aluminium base surface irradiation and
Described aluminium base surface after the described ultraviolet ray of irradiation forms described insulating resin layer, then forms the operation of described metal level at described insulating resin layer.
And, according to the present invention, provide the processing method of a kind of metal-base circuit board with aluminium base,
Be the processing method for the aluminium base of above-mentioned metal-base circuit board,
The described ultraviolet accumulation light quantity that is radiated at described aluminium base surface is 0.1J/cm 2～1.0J/cm 2
The aluminium base of metal-base circuit board of the present invention and the adaptation of insulating resin layer, welding thermal endurance, resistance to bend(ing) excellence, and can improve the rate of finished products of the various devices that used it.
Description of drawings
According to the preferred implementation of the following stated and subsidiary the following drawings thereof, above-mentioned purpose and other purposes, feature and advantage are clearer and more definite.
Fig. 1 is the sectional drawing of an example that schematically shows the metal-base circuit board of present embodiment.
Fig. 2 is the skeleton diagram of the fitness test method among the expression embodiment.
Fig. 3 is the contact angle of expression among the embodiment and the chart of the relation of dhering strength.
Fig. 4 is the treatment conditions of expression among the embodiment and the chart of the relation of dhering strength.
Embodiment
Below, embodiments of the present invention are illustrated with accompanying drawing.Should illustrate that in all accompanying drawings, the identical identical symbol of inscape mark suitably omits explanation.
＜metal-base circuit board＞
As described in Figure 1, the metal-base circuit board 10 that relates to of present embodiment is that aluminium base 12, insulating resin layer 14 and metal level 16 stack gradually and form.Metal-base circuit board 10 uses as fin.
(aluminium base 12)
Surface roughness (the R on the surface of the aluminium base 12 that contacts with insulating resin layer 14 Z) in the scope of 3 μ m～9 μ m, further preferably in the scope of 3 μ m～5 μ m, and described surface is level and smooth.And the surface of aluminium base 12 and the contact angle of water are 50 °～95 °, are preferably 55 °～90 °.
By such contact angle, even aluminium base 12 surfaces are under the level and smooth situation, improve with the wettability of the resin combination that forms insulating resin layer 14 and the adaptation of aluminium base 12 and insulating resin layer 14 improves.
Carry out according to JIS R3257 with the contact angle of water, can be with on average calculating as contact angle more than 5 o'clock.Surface roughness is carried out according to JIS B0601, can be with 10 mean roughness (R Z) form calculate.
In the present embodiment, the surface of aluminium base 12 has the oxide layer that is caused by autoxidation because do not carry out mechanical lapping, chemical etching.The thickness of aluminium base 12 is 100 μ m～5000 μ m.If thickness is less than 100 μ m, then the thermal diffusivity as fin reduces.If thickness is greater than 5000 μ m, then processability such as bending reduces.
In the present embodiment, aluminium base 12 can carry out surface treatment without coupling agent.Even it is the aluminium base of present embodiment 12 carries out surface treatment without coupling agent, also excellent with the adaptation of insulating resin layer 14.Therefore, can omit the operation on the surface of using coupling agent treatment aluminium base 12.
(insulating resin layer 14)
The modulus of elasticity in static bending of insulating resin layer 14 is 5GPa～20GPa.Accordingly, even under the situation to the metal-base circuit board stress application, because the flexible excellence of insulating resin layer 14, the adaptation of aluminium base 12 and insulating resin layer 14 further improves.
The modulus of elasticity in static bending can followingly be measured.
In the mode that resin bed faces each other that 2 the Copper Foil that has resin is overlapping, carry out exerting pressure in 180 minutes at 220 ℃, must arrive the resin plate that the two sides has Copper Foil.This two sides is had the whole etchings of resin plate of Copper Foil, and it is thick to make 6mm * 25mm * 0.2mm() test piece.Then, use DMA device (the Measurement of Dynamic Viscoelasticity device DMA983 of TA INSTRUMENTS corporate system) with 5 ℃ of/minute intensifications, measure 25 ℃ the modulus of elasticity in static bending.
Insulating resin layer 14 can be individual layer, also can be made of multilayer.
Insulating resin layer 14 comprises as the thermosetting resin of principal component and inorganic filler.
As thermosetting resin, can enumerate epoxy resin, phenolic resins, melmac, unsaturated polyester resin etc., preferably use epoxy resin.
Epoxy resin is if there is the epoxy resin of the epoxy radicals more than 2 in 1 molecule, then there is no particular limitation, for example, glycidol ether systems such as bis-phenols such as bisphenol A-type and Bisphenol F type system, biphenyl system, novolaks system, multifunctional phenol system, naphthalene system, ester ring type system and alcohol system, glycidyl amine system and ethylene oxidic ester system etc. can be enumerated, a kind or will mix use more than 2 kinds can be used.
In the epoxy resin, preferably use the epoxy resin of Bisphenol F type or A type, the further preferred resin that uses these adding hydrogen into resin and obtain.Particularly preferably in Bisphenol F type liquid under the normal temperature or the epoxy resin of A type.By using these resins, the flexible excellence of insulating resin layer 14 is even under the metal-base circuit board 10 crooked situations about using, aluminium base 12 and peeling off also of insulating resin layer 14 are suppressed.
In insulating resin layer 14, thermosetting resin can contain the amount of 10 quality %～90 quality %.In addition, also can cooperate thermosetting resin resin in addition.Thus, can further improve adaptation with aluminium base 12.
As inorganic filler, there is no particular limitation, for example, can enumerate aluminium hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicates, calcium oxide, magnesium oxide, aluminium oxide, aluminium nitride, aluminium borate whisker, boron nitride, crystallinity silicon dioxide, amorphism silicon dioxide, carborundum etc.
Among these, from the viewpoint of high-termal conductivity, preferred aluminium oxide, aluminium nitride, boron nitride, crystallinity silicon dioxide, amorphism silicon dioxide.Aluminium oxide more preferably.Except high-termal conductivity, on the viewpoint of thermal endurance, insulating properties, be preferred when using aluminium oxide.In addition, on the few viewpoint of ionic impurity, preferred crystallinity silicon dioxide or amorphism silicon dioxide.Can make the Metal Substrate substrate of insulating reliability excellence.
The few viewpoint of corrosion of insulating properties height and metal, aluminum steel, aluminium sheet etc. under the steam atmospheres such as pressure cooker testing, preferred crystallinity silicon dioxide or amorphism silicon dioxide.
On the other hand, from the viewpoint of anti-flammability, preferred aluminium hydroxide, magnesium hydroxide.
In addition, be purpose to dissolve the viscosity adjustment and to give thixotropy, preferred aluminium hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicates, magnesium silicate, calcium oxide, magnesium oxide, aluminium oxide, crystallinity silicon dioxide, amorphism silicon dioxide.
There is no particular limitation for the content of inorganic filler, preferably contains the amount of 10 quality %～90 quality % in insulating resin layer 14.Be more than the 10 quality % by the content that makes (B) inorganic filler, reduce thermal resistance, can obtain sufficient thermal diffusivity.Be below the 90 quality % by the content that makes inorganic filler, the flowability when exerting pressure worsens, and can suppress the generation in space etc.
(metal level 16)
Metal level 16 is made of copper, aluminium, nickel, iron, tin etc., can comprise more than 2 kinds.The bed thickness of metal level 16 is about 0.1～1500 μ m.In addition, between insulating resin layer 14 and the metal level 16, can there be other layer such as adhesive linkage.
The metal-base circuit board 10 that such formation is arranged, because the contact angle of aluminium base 12 surface and water is 50 °～95 ° scope, the adaptation of aluminium base 12 and insulating resin layer 14 improves.And then weld thermal endurance, resistance to bend(ing) excellence, used the rate of finished products of its various devices to improve.
Aluminium base 12 surface is more little with the contact angles of water, more improve with the wettability of water, but with the contact angle of water during less than 50 °, aluminium base 12 reduces with the adaptation of insulating resin layer 14.Though its reason is unclear, yet think by the aluminium base 12 surperficial scopes of stipulating with the contact angle of water, aluminium base 12 surface smoothings become the scope of appropriateness with the wettability of the resin combination that forms insulating resin layer 14, even also can improve with the adaptation of insulating resin layer 14.
In the metal-base circuit board 10 of present embodiment, aluminium base 12 can be 20kg/cm with the dhering strength of described insulating resin layer 14 2～50kg/cm 2, be preferably 30kg/cm 2～45kg/cm 2
Dhering strength can be measured in following condition.
Experimental rig: NXT-250P(Fushan Mountain industry society system)
To coat aluminium test film (discoid, bonding plane 2.0cm φ) be used to the lacquer type organic coating that obtains described insulating resin layer, coated face will be adhered to fixing aluminium breadboard.Solidify described lacquer type organic coating under 180 ℃ of conditions of 60 minutes, it is bonding by resin bed that described aluminium test film and described aluminium breadboard are situated between.
The speed of aluminium test film with 1.5mm/ minute is risen in the vertical direction, the moment that described aluminium test film or described aluminium breadboard and described resin bed are peeled off is measured as dhering strength.
The metal-base circuit board 10 of present embodiment by with metal level 16 with the regulation pattern carry out etching etc., thereby can form circuit.And by carry various heat generating components such as LED, semiconductor device or laser part at this circuit, metal-base circuit board 10 is as fin performance function.
The manufacture method of＜metal-base circuit board＞
Manufacture method as the metal-base circuit board 10 of present embodiment, can enumerate (1) and use the water treatment aluminium base, the UV treatment aluminium base is used in the method, (2) that form insulating resin layer, metal level then, forms the method for insulating resin layer, metal level then.
The manufacture method of＜metal-base circuit board (1)＞
Below, (1) is used the water treatment aluminium base, the method that forms insulating resin layer, metal level then describes.
The manufacture method of the metal-base circuit board 10 of present embodiment comprises following operation (a)～(b).
(a) make aluminium base 12 contact 0.5 fen with 50 ℃～80 ℃ water～3 minutes operation
(b) 12 surfaces of the aluminium base after processing form insulating resin layer 14, then form the operation of metal level 16 at insulating resin layer 14
(operation (a))
Aluminium base 12 contacted 0.5 minute with 50 ℃～80 ℃, the water that is preferably 50 ℃～70 ℃～3 minutes, be preferably 0.5 minute～2 minutes.Water as being used for this processing can use pure water.In addition, in not influencing the capillary scope of aluminium base 12, can comprise the alcohols of isopropyl alcohol, ethanol, the tert-butyl alcohol etc., Ca 2+, Mg 2+, Na +, K +, Cl -Etc. various ions.
As this processing method, water contact aluminium base 12 surfaces are got final product, can enumerate impregnation process, stream treatment, spraying processing etc.After contact is handled, remove moisture by the method for regulation.Surface roughness (the R of aluminium base 12 Z) before and after handling, almost do not change, be 3～9 μ m, be level and smooth.Surface roughness is carried out according to JIS B0601, can be with 10 mean roughness (R Z) form calculate.
Handle by such contact, can be adjusted into 50 °～95 ° with contact angle water with aluminium base is 12 surfaces, be preferably 55 °～85 °.
Even it is the aluminium base of present embodiment 12 carries out surface treatment without coupling agent, also excellent with the adaptation of insulating resin layer 14.Therefore, the operation with the surface of coupling agent treatment aluminium base 12 can be omitted, the simplification of operation can be realized.
(operation (b))
Then, aluminium base 12 surfaces after processing form insulating resin layer 14, then form metal level 16 at insulating resin layer 14.
Particularly, consider the thickness after the curing, resin combination is coated aluminium base 12 surfaces, and precuring and become B stage state.Then, the applying metal forming is carried out the back and is solidified, and is manufactured on the metal-base circuit board 10 of stacked have chance with extremely resin bed 14 and metal level 16 of aluminium base 12 surfaces.
Perhaps, resin combination is coated aluminium base 12 surfaces, and after making it be solidified to form insulating resin layer 14, can on insulating resin layer 14, form metal level 16 by metal evaporation.
In addition, operation (a) also can be formed at metal foil surface with insulating resin layer afterwards, fits with the aluminium base 12 after handling.Particularly, consider the thickness after the curing, resin combination is coated metal foil surface, and preparation is solidified and become B stage state.Fit with aluminium base 12 then, carry out the back and solidify, be manufactured on the metal-base circuit board 10 of stacked have chance with extremely resin bed 14 and metal level 16 of aluminium base 12 surfaces.
There is no particular limitation for metal forming, and for example can enumerating, copper and copper series alloy, aluminium and aluminum series alloy, silver and silver are that alloy, gold and gold are that alloy, zinc and Zn based alloy, nickel and nickel system alloy, tin and tin are metal formings such as alloy, iron and iron-based alloy.Among these, from the viewpoint that metal forming can be used as conductor circuit by etching, preferred Copper Foil.And, from the viewpoint of low-thermal-expansion, preferred Fe-Ni alloy.
In addition, the manufacture method of metal forming can be any in electrolysis or the rolling process.In addition, can carry out metal depositions such as Ni plating, Ni-Au plating, solder plating on the metal forming, yet, from the viewpoint of the cementability of insulating resin layer 14, the surface of a side of the connection insulating resin layer 14 of further preferred conductor circuit is by roughening processing in advance such as etching, plating.
There is no particular limitation for the thickness of metal forming, preferred 0.5 μ m～105 μ m, further preferred 1 μ m～70 μ m, preferred especially 9 μ m～35 μ m.Thickness by making metal forming is below lower limit, suppress the generation of pin hole, under metal forming etching and the situation as the conductor circuit use, the possibility that the infiltration of soups such as plating fluctuation, circuit broken string, etching solution and de-smear liquid in the time of can avoiding the circuit pattern moulding etc. take place.In addition, the thickness by making metal forming is below higher limit, and the thickness fluctuation of metal forming diminishes, and can suppress the surface roughness fluctuation of metal forming roughening face.
In addition, as metal forming, can use the metal forming as thin as a wafer that has foils.The metal forming as thin as a wafer that has foils is with strippable foils and the bonding metal forming of metal forming as thin as a wafer.The metal forming as thin as a wafer that has foils by use, can form metal foil layer as thin as a wafer on the two sides of insulating barrier, for example, under the situation with formation circuit such as semi-additive process, not carrying out electroless plating covers, but metal forming is directly carried out electrolytic coating as power supply layer and after forming circuit, ultrathin copper foil can be dodged erosion as thin as a wafer.Have the metal forming as thin as a wafer of foils by use, though the following metal forming as thin as a wafer of thickness 10 μ m, the breaking and rupture of the decline of the operability of metal forming as thin as a wafer in the operation that also can prevent from for example exerting pressure, ultrathin copper foil.
Below, the formation method of insulating resin layer 14 is specifically described.
At first, resin combination in organic solvents such as acetone, methyl ethyl ketone, methylisobutylketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane ring hexanone, oxolane, dimethyl formamide, dimethylacetylamide, dimethyl sulfoxide (DMSO), ethylene glycol, cellosolve system, carbitol system, methyl phenyl ethers anisole, is used ultrasonic wave dispersing mode, high pressure conflict formula dispersing mode, rotates various mixers such as dispersing mode, ball mill mode, high speed shear dispersing mode and rotation revolution formula dispersing mode at a high speed and dissolve, mix, stir and make lacquer type organic coating.
There is no particular limitation for the content of the resin combination in the lacquer type organic coating, preferred 45 quality %～85 quality %, more preferably 55 quality %～75 quality %.
Then, use various apparatus for coating, lacquer type organic coating is coated aluminium base 12 surfaces, and be dried.In addition, lacquer type organic coating is sprayed at aluminium base 12 surfaces with spray equipment after, be dried.
There is no particular limitation for apparatus for coating, for example, can use roll coater, rod to be coated with machine, cutter coating machine, intaglio plate coating machine, mould and be coated with machine, comma coating machine, curtain formula coating machine etc.Among these, preferably use mould to be coated with the method for machine, cutter coating machine and comma coating machine.Thus, can make the insulating resin layer 14 that does not have the space and have uniform thickness efficiently.
The thickness of insulating resin layer 14 is preferably the scope of 20 μ m～250 μ m.Be more than the 20 μ m by the thickness that makes insulating resin layer 14, can produce thermal stress by the thermal expansion rate variances that insulating resin layer 14 fully relaxes owing to aluminium base 12 and insulating resin layer 14.In addition, the insulating properties of metal-base circuit board 10 improves.
When surfaces such as semiconductor element, resistance component were installed on such metal-base circuit board 10, the distortion that can suppress between member increased, and can obtain sufficient thermal shock reliability.And the thickness by making insulating resin layer 14 is below 250 μ m, and the deflection in the surperficial mounting portion of metal-base circuit board 10 tails off, and when can obtain good thermal shock reliability, thermal resistance reduces, and can obtain sufficient thermal diffusivity.Therefore, if the thickness of insulating resin layer 14 in above-mentioned scope, the balance excellence of these characteristics.
The manufacture method of the metal-base circuit board 10 of present embodiment possesses the operation that the aluminium base surface is contacted with water, be excellent in safety and simple method, can obtain aluminium base and insulating resin layer adaptation, welding thermal endurance, resistance to bend(ing) is excellent and can improve the metal-base circuit board of the rate of finished products of the various devices that used it.
Except above-mentioned thermosetting resin, inorganic filler, can comprise curing agent, curing accelerator, coupling agent, flexible composition, antioxidant, the levelling agent etc. given for the preparation of the resin combination of insulating resin layer 14.
As curing agent, can enumerate diethylenetriamines (DETA), trien (TETA), m-xylene diamine (MXDA), IPD (IPD), 1,3-diaminourea hexahydrotoluene (1,3BAC), diaminodiphenyl-methane (DDM), m-phenylenediamine (MPDA), diamino-diphenyl sulfone (DDS), dicyandiamide (DICY), the organic acid hydrazides, dodecenylsuccinic anhydride (DDSA), poly-azelaic acid acid anhydride (PAPA), hexahydrophthalic anhydride (HHPA), methyl tetrahydrophthalic anhydride (MTHPA), methyl carbic anhydride (MNA), trimellitic anhydride (TMA), the equal tetracarboxylic acid anhydride of benzene (PMDA), benzophenone tetracarboxylic dianhydride (BTDA), tetrabromophthalic anhydride (TBPA), HET acid acid anhydride (HET) etc.
As curing accelerator, can enumerate 2-phenyl-4, various imidazoles such as 5-dihydroxy methylimidazole, 2 phenyl 4 methyl 5 hydroxy methylimidazole, various phosphorus compounds such as triphenylphosphine, triphenyl phosphite, triethylamine, benzyl dimethylamine, pyridine, DBU(diazabicyclo hendecene) etc. various tertiary amines and quaternary ammonium salt etc.
As coupling agent, can enumerate 2-(3, the 4-epoxycyclohexyl), 3-glycidoxy propyl group methyl dimethoxysilane, the 3-glycidoxypropyltrime,hoxysilane, 3-glycidoxy propyl group methyldiethoxysilane, 3-glycidoxy propyl-triethoxysilicane, vinyltrimethoxy silane, the 3-methacryloxypropyl trimethoxy silane, 3-acryloxy propyl trimethoxy silicane, the 3-TSL 8330,3-sulfydryl propyl group methyl dimethoxysilane, various silane couplers such as 3-NCO propyl-triethoxysilicane.
The content of preferred coupling agent satisfies following formula (1).
5×10 -2＜c-（b×1/100）＜11 （1）
Here, c(quality %) expression is with respect to the content of the coupling agent of the total amount 100 quality % of resin combination.B(quality %) expression is with respect to the content of the inorganic filler of the total amount 100 quality % of resin combination.
［ c-(b * 1/100) ］ expression is non-cohesive on the surface of inorganic filler in the above-mentioned formula (1), the content of the coupling agent that exists in resin combination (that is the free coupling agent in resin combination).
This point below is described.
At first, coupling agent has the functional group in conjunction with organic material and inorganic material simultaneously in molecule.Jie is by this coupling agent, inorganic material and organic material combination.
In the art, coupling agent is used for the bonding of inorganic filler and resin combination, and the surface of inorganic filler is handled.Therefore, the treating capacity of coupling agent (with respect to the overall content of the resin combination of coupling agent) is to determine according to the content of inorganic filler.
Usually, known total amount 100 quality % with respect to inorganic filler, the treating capacity of coupling agent is about 0.5～1 quality %.
Therefore, the expression of (b * 1/100) in the above-mentioned formula (1) is with respect to the common treating capacity of the coupling agent of inorganic filler.And, deduct the treating capacity (b * 1/100) of coupling agent by the total amount c from coupling agent, as mentioned above, can estimate the content ［ c-(b * 1/100) ］ of coupling agent free in the resin combination.
Free coupling agent in such resin combination non-cohesive in inorganic filler the surface and be present in the resin combination.Such action of coupling agents can improve the adaptation of insulating resin layer 14 and aluminium base 12 in the aluminium base 12 as inorganic material.
In the present embodiment, the content by making the free coupling agent in the resin combination can be realized the adaptation of insulating resin layer 14 and aluminium base 12 and the balance of thermal cycle characteristic in specific scope.That is, as the content of the free coupling agent in the resin combination, lower limit is preferably 5 * 10 -2More than the quality %, more preferably 1 * 10 -1More than the quality %, more preferably 5 * 10 -1More than the quality %, there is no particular limitation for upper limit amount, for example, is preferably below the 11 quality %, more preferably below the 10 quality %, more preferably below the 9 quality %.
Content by making the free coupling agent in the resin combination is more than lower limit, the adaptation of insulating resin layer 14 and aluminium base 12 improves when bringing into play the effect that obtains from inorganic filler fully, and the insulating properties characteristic that improves metal-base circuit board 10 becomes possibility.
In addition, the content by making the free coupling agent in the resin combination is below higher limit, and the coupling agent hydrolysis can suppress to weld thermal endurance and reduce.
In the past, for example, be to be that the treating capacity of expression coupling agent is situation about 1 quality % with respect to the total amount 100 quality % of inorganic filler below 0 when ［ c-(b * 1/100) ］, in other words, we can say that expression used the situation of the common treating capacity of coupling agent.The metal-base circuit board that has used this resin combination has suitable leeway aspect the improving of the adaptation of metallic plate and resin bed.
Relative therewith, in the present embodiment, c-(b * 1/100) ］＞0.05.Thus, the adaptation of insulating resin layer 14 and aluminium base 12 improves, and the insulating properties that improves metal-base circuit board 10 becomes possibility.
As the flexible composition of giving, can enumerate phenoxy resin and rubber constituent.Contain the flexible composition of giving in the insulating resin layer 14 by making, not only the adaptation of insulating resin layer 14 and aluminium base 12 improves, and when exerting pressure, flowability improves, and can not have space etc. and moulding.
As phenoxy resin, for example, can enumerate phenoxy resin, the phenoxy resin with naphthalene skeleton, the phenoxy resin with anthracene skeleton with bis-phenol skeleton, have the phenoxy resin of biphenyl backbone etc.In addition, can use and have multiple these the phenoxy resin of structure of skeleton.
Among these, preferably use the phenoxy resin of bisphenol A-type or Bisphenol F type.Thus, during the manufacturing of circuit substrate, can further improve wiring layer to the adaptation of plywood.
There is no particular limitation for the weight average molecular weight of phenoxy resin, and preferred 4.0 * 10 4～8.0 * 10 4
Be 4.0 * 10 by making molecular weight 4～8.0 * 10 4, can obtain following effect: the first, low elastic modulus changes into and is possible, and the stress retentivity is also excellent when being used for metal-base circuit board 10.For example, when making the semiconductor device that electronic unit etc. is installed, even under the environment of rapid heating/cooling, it is bad to suppress that also this semiconductor device takes place to rupture etc. near the solder bonds portion of bonding electronic unit and Metal Substrate base plate or its.
In addition, the weight average molecular weight by making phenoxy resin is 4.0 * 10 4More than, when can carry out low elastic modulusization fully, when being used for semiconductor device, under rapid heating/cooling, solder bonds portion or near the fracture it become and are difficult to take place.Can improve the thermal cycle characteristic of Metal Substrate base plate like this.In addition, the weight average molecular weight by making phenoxy resin is 4.9 * 10 4Below, can suppress to worsen, produce space etc. owing to the flowability that viscosity increases when exerting pressure, thereby can improve the insulating reliability of metal-base circuit board 10.Can improve the insulation characterisitic of metal-base circuit board 10 like this.In addition, the weight average molecular weight of phenoxy resin is the value with the polystyrene conversion of gel permeation chromatography (GPC) mensuration.
The content of preferred phenoxy resin is at 10 overall quality % of resin combination～40 quality %.Content by making phenoxy resin is more than 10 quality %, the effect of modulus of elasticity fully can be reduced, stress retentivity excellence when being used for metal-base circuit board 10 even be subjected to rapid heating/cooling, also can suppress to rupture near scolder or its.Content by making phenoxy resin is below 40 quality %, and the flowability when exerting pressure worsens, and can suppress generations such as space, can improve the insulating reliability of metal-base circuit board 10.
In addition, resin combination has totally referred to for example to use the solid of desolventizing under the situation of lacquer of solvent etc., and liquid parts such as liquid-state epoxy resin, coupling agent are included in the resin combination.
As rubber constituent, for example can use rubber particles.As the preference of rubber particles, can enumerate nucleocapsid type rubber particle, crosslink propylene nitrile butadiene rubber particle, cross-linked styrene butadiene rubber particle, acrylic rubber particle, organosilicon particle etc.
The nucleocapsid type rubber particle is the rubber particles with stratum nucleare and shell, for example can enumerate 2 layers of structure that outer field shell is made of glassy polymers and the stratum nucleare of internal layer is made of rubber-like polymer, perhaps outer field shell by glassy polymers constitute, the intermediate layer is made of rubber-like polymer and the rubber particles of the 3-tier architecture that stratum nucleare is made of glassy polymers etc.The glassy polymers layer for example is made of Polymerization of Methyl thing etc.The rubber-like polymer layer is for example by butyl acrylate polymer formations such as (butyl rubbers).As the concrete example of nucleocapsid type rubber particle, can enumerate STAPHYLOID AC3832, AC3816N(trade name, Ganz Chemical corporate system), METABLEN KW-4426(trade name, the beautiful positive corporate system of Mitsubishi).As the concrete example of crosslink propylene nitrile butadiene rubber (NBR) particle, can enumerate XER-91(average grain diameter 0.5 μ m, the JSR corporate system) etc.
As the concrete example of cross-linked styrene butadiene rubber (SBR) particle, can enumerate XSK-500(average grain diameter 0.5 μ m, the JSR corporate system) etc.As the concrete example of acrylic rubber particle, can enumerate METABLEN W300A(average grain diameter 0.1 μ m), W450A(average grain diameter 0.2 μ m) (the beautiful positive corporate system of Mitsubishi) etc.
If the organosilicon particle is the caoutchouc elasticity particulate that is formed by organopolysiloxane, then there is no particular limitation, for example, can enumerate the particulate that formed by silicon rubber (organopolysiloxane cross-linked elastomer) itself and the nucleocapsid structure particle of the nuclear portion that formed by the organosilicon of the crosslinked main body of two dimension by the organosilicon lining of three-dimensional cross-linked type main body etc.As the silicon rubber particulate, can use KMP-605, KMP-600, KMP-597, chemical company of KMP-594(SHIN-ETSU HANTOTAI system), TREFIL E-500, TREFIL E-600(Dong Li Dow Corning Corporation system) etc. commercially available product.
There is no particular limitation for the content of rubber particles, preferably lumps together with above-mentioned inorganic filler and account for 20 overall quality % of resin combination～80 quality %, preferred especially 30 quality %～75 quality %.If content in scope, especially can hang down suction.
The manufacture method of＜metal-base circuit board (2)＞
Next, (2) are used the UV treatment aluminium base, then, the method that forms insulating resin layer, metal level describes.
The manufacture method of the metal-base circuit board 10 of present embodiment comprises following operation (c), (d).
(c) to the ultraviolet operation of aluminium base 12 surface irradiations
(d) insulating resin layer 14 is formed at aluminium base 12 surfaces after the processing, then forms the operation of metal levels 16 at insulating resin layer 14
Should illustrate that operation (d) is the operation identical with above-mentioned operation (b), so omit explanation.
(operation (c))
In aluminium base 12 surface irradiation ultraviolet rays.As the ultraviolet ray that is used for this processing, can use wavelength to be the ultraviolet ray of 185nm or 254nm.
The ultraviolet accumulation light quantity that is radiated at aluminium base 12 surfaces is preferably 0.1J/cm 2～1.0J/cm 2, 0.2J/cm more preferably 2～0.8J/cm 2This accumulation light quantity is ultraviolet activity (mW/cm 2) and the product of irradiation time (second), thereby the accumulation light quantity can be regulated by ultraviolet intensity and the irradiation time used.
In addition, there is no particular limitation to be radiated at the ultraviolet activity on aluminium base 12 surfaces, is preferably 1.0mW/cm 2～100mW/cm 2
By such UV treatment, aluminium base is 12 surfaces can be adjusted into 50 °～95 ° with contact angle water, is preferably 55 °～90 °.In addition, the surface roughness (R of aluminium base 12 Z) before and after handling, almost do not change, be 3～9 μ m, be level and smooth.
Moreover, be preferably below the 5cm with the distance of aluminium base 12, more preferably below the 3cm, be preferably below the 1cm especially.If with the distance of aluminium base 12 greater than 5cm, can't obtain the effect of shining sometimes fully.
The ultraviolet lamp that uses is so long as can illumination wavelength be the ultraviolet device of 185nm or 254nm, and then there is no particular limitation, for example can enumerate the ultraviolet lamp that has used low pressure mercury lamp.
The aluminium base 12 of present embodiment is even without carrying out surface treatment with coupling agent, and is also excellent with the adaptation of insulating resin layer 14.Therefore, the operation with the surface of coupling agent treatment aluminium base 12 can be omitted, the simplification of operation can be realized.
Embodiment
Below, based on embodiment and the detailed explanation the present invention of comparative example, but the invention is not restricted to these.
(embodiment 1)
Should illustrate, with " embodiment 1a " mark, use " embodiment 1b " mark when using lacquer type organic coating b when using lacquer type organic coating a among the following embodiment 1.For other embodiment, comparative example too.
(making of lacquer type organic coating a)
Phenoxy resin (Mitsubishi Chemical society system, 4275, the weight average molecular weight 6.0 * 10 that will have Bisphenol F skeleton and bisphenol-A skeleton 422.0 Quality Mgmt Dept of the ratio of Bisphenol F skeleton and bisphenol-A skeleton=75:25), bisphenol F epoxy resin (DIC corporate system, 830S, epoxide equivalent 170) 10.0 Quality Mgmt Dept, bisphenol A epoxide resin (Mitsubishi Chemical society system, 1001, epoxide equivalent 475) 15.0 Quality Mgmt Dept, 2-phenylimidazole (four countries change into the 2PZ processed of society) 1.0 Quality Mgmt Dept, γ-glycidoxy trimethyl silane (the organosilicon corporate system KBM-403 of SHIN-ETSU HANTOTAI) 2.0 Quality Mgmt Dept as silane coupler, aluminium hydroxide (clear and electrician's corporate system, HP-360, particle diameter 3.0 μ m) 50.0 Quality Mgmt Dept dissolving, be mixed in cyclohexanone, stir with high-speed stirring apparatus, obtaining resin combination is the lacquer that benchmark is counted 70 quality % with the solid constituent.
(making of lacquer type organic coating b)
Phenoxy resin (Mitsubishi Chemical people's commune system, 4275, the weight average molecular weight 6.0 * 10 that will have Bisphenol F skeleton and bisphenol-A skeleton 422.0 Quality Mgmt Dept of the ratio of Bisphenol F skeleton and bisphenol-A skeleton=75:25), biphenyl backbone epoxy resin (Mitsubishi Chemical people's commune system, YX4000, epoxide equivalent 185) 10.0 Quality Mgmt Dept, bisphenol A epoxide resin (Mitsubishi Chemical people's commune system, 1001, epoxide equivalent 475) 15.0 Quality Mgmt Dept, 2-phenylimidazole (four countries change into the 2PZ processed of society) 1.0 Quality Mgmt Dept, as silane coupler γ-glycidoxy oxypropyl trimethyl silane (the organosilicon corporate system KBM-403 of SHIN-ETSU HANTOTAI) 2.0 Quality Mgmt Dept, aluminium hydroxide (clear and electrician's corporate system, HP-360, particle diameter 3.0 μ m) 50.0 Quality Mgmt Dept dissolving, be mixed in cyclohexanone, stir with high-speed stirring apparatus, obtaining resin combination is the lacquer that benchmark is counted 70 quality % with the solid constituent.
(hot wash of aluminium base is handled)
With thickness 1mm, the aluminium sheet of each 10cm is as substrate anyhow.According to the treatment conditions of table 1, this substrate flooded the stipulated time in the pure water of set point of temperature after, with acetone washing, drying, obtain the aluminium breadboard.
(embodiment 2～5 and comparative example 1～8)
Treatment conditions according to table 1～3 are handled aluminium sheet, with acetone washing, drying, obtain the aluminium breadboard.
(reference example)
With thickness 1mm, the aluminium sheet of each 10cm is as substrate anyhow.After the surface of this substrate ground with sand paper (#1500), with acetone washing and dry and obtain the aluminium breadboard.
(embodiment 6～8)
With thickness 1mm, the aluminium sheet of each 10cm is as substrate anyhow.As ultraviolet lamp, use low pressure mercury lamp (OAK corporate system, wavelength: 185nm, activity 5.0mW/cm 2).According to the treatment conditions of the table 4 single face irradiation ultraviolet radiation at substrate, obtain the aluminium breadboard.
For the aluminium breadboard that is obtained by each embodiment, comparative example and reference example, carry out following each by following determination method and estimate.Evaluation result is shown in table 1～table 4.The relation of contact angle and dhering strength as shown in Figure 3.In addition, the relation for the treatment of conditions and dhering strength as shown in Figure 4.
A. with the contact angle of water
Carry out according to JIS R3257, with on average calculating as contact angle more than 5 o'clock.
B. surface roughness (R Z)
Carry out according to JIS B0601, with 10 mean roughness (R Z) form calculate.
C. dhering strength
Use fitness test device (model: NXT-250P, Fushan Mountain Industry Co., Ltd system), as shown in Figure 2, lacquer type organic coating a or b are coated the aluminium test film (bonding plane 2.0cm φ) of fitness test device, coated face is adhered to fixing aluminium breadboard, under 180 ℃ of conditions of cure of 60 minutes, solidifies.Then, as shown in Figure 2, the speed of aluminium test film with 1.5mm/ minute is risen in the vertical direction, the moment that described aluminium test film or described aluminium breadboard and described resin bed are peeled off is measured as dhering strength, evaluation result is shown in table 1～4.
[table 1]
Table-1
Figure BDA00003433056500181
[table 2]
Table-2
Figure BDA00003433056500182
[table 3]
Table-3
Figure BDA00003433056500191
[table 4]
Table-4
Figure BDA00003433056500192
In addition, significantly low by the results presumption dhering strength of the bend test of carrying out in addition in comparative example 7a, the 7b of table 3,8a, 8b, thereby do not carry out the mensuration of dhering strength.
As above-mentioned, even the surface smoothing of aluminium base (surface roughness (R Z): 3～9 μ m), because the aluminium base surface and contact angle water are 50 °～95 °, thus the dhering strength excellence of aluminium base and insulating resin layer, and then can infer also excellence of welding thermal endurance, resistance to bend(ing).Therefore, the clear and definite rate of finished products of its various devices of having used improves.
This application with the Japanese publication that proposed on December 28th, 2010 special be willing to 2010-291893 number and Japanese publication that on December 28th, 2010 proposed special be willing to 2010-291895 number serve as basis opinion priority, include here that they are disclosed whole in.

Claims (16)

1. a metal-base circuit board is that aluminium base, insulating resin layer and metal level stack gradually the metal-base circuit board that forms,
Described aluminium base the surface with contact angle water be 50 °～95 °,
Surface roughness R ZBe 3 μ m～9 μ m.
2. metal-base circuit board as claimed in claim 1, wherein,
The described aluminium base of measuring with following condition and the dhering strength of described insulating resin layer are 20kg/cm 2～50kg/cm 2
To coat discoid and bonding plane is the aluminium test film of 2.0cm φ be used to the lacquer type organic coating that obtains described insulating resin layer, coated face is adhered to fixing aluminium breadboard, solidify described lacquer type organic coating under 180 ℃ of conditions of 60 minutes, it is bonding by resin bed that described aluminium test film and described aluminium breadboard are situated between;
The speed of aluminium test film with 1.5mm/ minute is risen in the vertical direction, the moment that described aluminium test film or described aluminium breadboard and described resin bed are peeled off is measured as dhering strength.
3. metal-base circuit board as claimed in claim 1 or 2, wherein,
Described insulating resin layer contains the solidfied material of the epoxy resin of liquid Bisphenol F type or A type at normal temperatures.
4. as each described metal-base circuit board in the claim 1～3, wherein,
Described insulating resin layer comprises the flexible composition of giving more than a kind that is selected from phenoxy resin and the rubber constituent.
5. metal-base circuit board as claimed in claim 4, wherein,
With respect to described insulating resin layer 100 quality %, the described flexible content of giving composition is 10 quality %～40 quality %.
6. as each described metal-base circuit board in the claim 1～5, wherein,
Described aluminium base does not carry out surface treatment with coupling agent.
7. as each described metal-base circuit board in the claim 1～6, wherein,
Described insulating resin layer comprises inorganic filler and silane coupler,
With respect to the total amount 100 quality % of described insulating resin layer, the content of described silane coupler is made as c quality %,
With respect to the total amount 100 quality % of described insulating resin layer, when the content of described inorganic filler is made as b quality %, satisfy
5×10 -2＜c-（b×1/100）＜11。
8. metal-base circuit board as claimed in claim 7, wherein,
Described inorganic filler is aluminium hydroxide, magnesium hydroxide or aluminium oxide.
9. as the manufacture method of each described metal-base circuit board in the claim 1～8, wherein, comprise following operation:
Make described aluminium base contact 0.5 minute with 50 ℃～80 ℃ water～3 minutes operation and
Described aluminium base surface after processing forms described insulating resin layer, then forms the operation of described metal level at described insulating resin layer.
10. the manufacture method of metal-base circuit board as claimed in claim 9, wherein,
Described aluminium base does not carry out surface treatment with coupling agent.
11. as the manufacture method of each described metal-base circuit board in the claim 1～8, wherein, comprise following operation:
To the ultraviolet operation of described aluminium base surface irradiation and
Described aluminium base surface after the described ultraviolet ray of irradiation forms described insulating resin layer, then forms the operation of described metal level at described insulating resin layer.
12. the manufacture method of metal-base circuit board as claimed in claim 11, wherein,
Described ultraviolet wavelength is 185nm or 254nm.
13. as the manufacture method of claim 11 or 12 described metal-base circuit boards, wherein,
The described ultraviolet accumulation light quantity that is radiated at described aluminium base surface is 0.1J/cm 2～1.0J/cm 2
14. as the manufacture method of each described metal-base circuit board in the claim 11～13, wherein,
Described aluminium base does not carry out surface treatment with coupling agent.
15. the metal-base circuit board processing method of aluminium base is the processing method for the aluminium base of each described metal-base circuit board of claim 1～8,
Make described aluminium base contact 0.5 minute with 50 ℃～80 ℃ water～3 minutes.
16. the metal-base circuit board processing method of aluminium base is the processing method for the aluminium base of each described metal-base circuit board of claim 1～8,
The described ultraviolet accumulation light quantity that is radiated at described aluminium base surface is 0.1J/cm 2～1.0J/cm 2
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