CN103258765A - Silicon wafer loader transition frame - Google Patents
Silicon wafer loader transition frame Download PDFInfo
- Publication number
- CN103258765A CN103258765A CN201310167814XA CN201310167814A CN103258765A CN 103258765 A CN103258765 A CN 103258765A CN 201310167814X A CN201310167814X A CN 201310167814XA CN 201310167814 A CN201310167814 A CN 201310167814A CN 103258765 A CN103258765 A CN 103258765A
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- silicon wafer
- frame
- wafer carrier
- conversion frame
- described conversion
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- Packaging Frangible Articles (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a silicon wafer loader transition frame. The silicon wafer loader transition frame structurally comprises a top frame body, a bottom frame body, a baffle and a U-type frame body, wherein the top frame body comprises two opposite edges with steps, the bottom frame body comprises several pairs of inner fixing ridges and outer fixing ridges, and U-type ridges, the inner fixing ridges and the outer fixing ridges are arranged in parallel, openings of the U-type ridges are formed towards the left side of the silicon wafer loader transition frame, the ridges are separated from one another by a certain distance, the baffle is located on the left side of the silicon wafer loader transition frame, and the U-type frame body is located on the right side of the silicon wafer loader transition frame.
Description
Technical field
The present invention relates to a kind ofly for the silicon chip processing, will be used for the device of the silicon wafer carrier conversion of described production line with the unmatched silicon wafer carrier of production line.
Background technology
The manufacturing of integrated circuit relates to the multiple operation on the silicon chip of semiconductor substrate.Wherein some operation may comprise for example photoetching, etching, exposure, wherein related environment generally all belongs to severe corrosive environment such as strong acid and/or highly basic, thereby be used for that devices such as rack for cleaning that the carrying silicon chip carries out the carrier of corresponding operating and carrier load all need can anti-strong acid and alkali corrosion, or even the corrosion of strong acid and highly basic under the hot conditions, such material is selected fluoroplastics usually, for example polytetrafluoroethylene (PTFE), perfluoroalkyl vinyl ether copolymer (PFA), Kynoar (PVDF) etc.
Along with the development at full speed of semiconductor science technology, the extensive use of silicon chip relates to all trades and professions of modern society.Therefore, the production and processing amount of silicon chip is constantly soaring, forms extensive streamlined operation thereupon.In order to improve the utilization ratio of equipment in the large-scale production; usually need a production line can clean the silicon chip of different size specification; for example adopt a production line that cleans 6 inches silicon chips; some the time clean the silicon chip of 4 inches or 5 inches; thereby improve the utilance of production line; reduce production costs, enhance productivity.Such application has proposed corresponding requirement for the conversion frame of silicon wafer carrier.
Summary of the invention
The present invention is in order to adapt to above application request, designed a kind of silicon wafer carrier conversion frame, it can be written into the little silicon wafer carrier of die size than the actual cleaning of production line, thereby cleans this undersized silicon chip at described production line, and this goal of the invention is achieved in that
A kind of silicon wafer carrier conversion frame, it has following structure:
A top frame and a under(-)chassis, wherein top frame has opposed two edges that have step, under(-)chassis has some to the interior fixedly rib that is arranged in parallel and outer fixedly rib and towards the U-shaped rib of left side opening, is spaced from each other a segment distance between the described rib;
A baffle plate that is positioned at the left side;
A U-shaped framework that is positioned at the right side.
In the preferred embodiment of the present invention, described conversion frame bottom has the raised line that extends along described baffle plate near the left side baffle plate.
In the preferred embodiment of the present invention, described conversion frame bottom downside has some supports, and its shape and size match with the silicon wafer cleaner tool.
In the preferred embodiment of the present invention, the various piece of described conversion frame obtains by machining, is combined into described conversion frame then.
In the preferred embodiment of the present invention, the combination of described conversion frame relies on fusion weld to carry out.
In the preferred embodiment of the present invention, the material of described conversion frame various piece is polypropylene, Kynoar, polytetrafluoroethylene or perfluoroalkyl vinyl ether copolymer.
Description of drawings
Fig. 1 is the schematic diagram of putting into the small size silicon wafer carrier of silicon wafer carrier conversion frame of the present invention.
Fig. 2 is the stereogram of silicon wafer carrier conversion frame of the present invention.
Fig. 3 is the assembly drawing of silicon wafer carrier conversion frame of the present invention.
Embodiment
With reference to Fig. 1-3, represent silicon wafer carrier conversion frame of the present invention with mark 100, mark 200 expressions need be put into the silicon wafer carrier of described conversion frame.
Described silicon wafer carrier conversion frame 100 comprises that 130, one on baffle plate that a top frame 110 and 120, one of under(-)chassis are positioned at the left side is positioned at the U-shaped framework 140 on right side.
Described top frame 110 has opposed two edges that have step, and upper edge on the step 111 is used for cooperatively interacting with the production line machinery of cleaning silicon chip, in order to whole conversion frame mentioned or put into production line; Lower edge 112 under the step is used for blocking the last side carrying handle 201 of the silicon wafer carrier 200 in this conversion frame of packing into, to fix the position of this silicon wafer carrier 200 in the conversion frame.
Described under(-)chassis 120 has some to the interior fixedly rib that is arranged in parallel 121 and outer fixedly rib 122 and towards the U-shaped rib 123 of left side opening, the interior fixedly rib 121 that is arranged in parallel and the spacing of outer fixedly rib 122, U-shaped rib curved edges with outward fixedly the spacing of rib all match with the thickness of silicon wafer carrier 200 bottom supports 202 in this conversion frame of packing into, in order to block the bottom of described silicon wafer carrier 200.Be spaced from each other a segment distance between each described rib, constitute some breach 124, in order to the cleaning fluid in the silicon chip cleaning process is discharged smoothly.Described conversion frame under(-)chassis 120 has the raised line 125 that extends along described baffle plate 130 near the position of left side baffle plate 130, it is used for increasing bonding area, be convenient to being connected of under(-)chassis 120 and left side baffle plate 130, its downside also can have some supports 126 in addition, and its shape and size match with silicon wafer cleaner tool in the production line.
Horizontal level when the described baffle plate 130 that is positioned at the left side is packed into for fixing described silicon wafer carrier 200, it can be a monoblock solid slab, perhaps for the purpose of conservation, adopt frame structure, can block the blend stop 131 that silicon wafer carrier is fixed its horizontal level thereby only the adding of framework centre is some all around.
The described U-shaped framework that is positioned at the right side 140 constitutes an opening, and the silicon wafer carrier that will pack into when using this conversion frame passage that becomes along each prismatic on the under(-)chassis of direction thus pushes and changes frame inside.
In embodiment of the present invention, the various piece of described conversion frame obtains (each part as shown in Figure 3) by machining, be combined into described conversion frame then, this combination can rely on fusion weld to carry out, Fig. 3 has expressed to making the tightr some jacks that design of connection, latch, groove, bayonet socket etc., usual way when these modes are this area combination product can increase the tightness of combination product, and makes things convenient for the joint of fusion weld.
The material of each part of conversion frame of the present invention can be polypropylene, Kynoar, polytetrafluoroethylene or perfluoroalkyl vinyl ether copolymer.
The present invention can implement by other form under the situation that does not break away from its purport, and therefore, illustrated embodiment is explanation of the present invention rather than restriction, and relating to what show the scope of the invention is appending claims rather than above-mentioned explanation.
Claims (6)
1.. a silicon wafer carrier conversion frame, it has following structure:
A top frame and a under(-)chassis, wherein top frame has opposed two edges that have step, under(-)chassis has some to the interior fixedly rib that is arranged in parallel and outer fixedly rib and towards the U-shaped rib of left side opening, is spaced from each other a segment distance between the described rib;
A baffle plate that is positioned at the left side;
A U-shaped framework that is positioned at the right side.
2. silicon wafer carrier as claimed in claim 1 is changed frame, and described conversion frame bottom has the raised line that extends along described baffle plate near the left side baffle plate.
3. silicon wafer carrier as claimed in claim 1 is changed frame, and described conversion frame bottom downside has some supports, and its shape and size match with the silicon wafer cleaner tool.
4. silicon wafer carrier as claimed in claim 1 is changed frame, and the various piece of described conversion frame obtains by machining, is combined into described conversion frame then.
5. silicon wafer carrier as claimed in claim 1 is changed frame, and the combination of described conversion frame relies on fusion weld to carry out.
6. silicon wafer carrier as claimed in claim 1 is changed frame, and the material of described conversion frame various piece is polypropylene, Kynoar, polytetrafluoroethylene or perfluoroalkyl vinyl ether copolymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310167814.XA CN103258765B (en) | 2013-05-09 | 2013-05-09 | Silicon wafer loader transition frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310167814.XA CN103258765B (en) | 2013-05-09 | 2013-05-09 | Silicon wafer loader transition frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103258765A true CN103258765A (en) | 2013-08-21 |
| CN103258765B CN103258765B (en) | 2016-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310167814.XA Active CN103258765B (en) | 2013-05-09 | 2013-05-09 | Silicon wafer loader transition frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103258765B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379751A (en) * | 2019-07-25 | 2019-10-25 | 常州时创能源科技有限公司 | A kind of silicon chip flower basket equipped with carrying frame |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2833883Y (en) * | 2005-11-08 | 2006-11-01 | 深圳市捷佳创精密设备有限公司 | Silicon wafer basket |
| CN202103032U (en) * | 2011-06-17 | 2012-01-04 | 北京通美晶体技术有限公司 | Wafer washing and drying basket |
| CN202259213U (en) * | 2011-09-21 | 2012-05-30 | 有研半导体材料股份有限公司 | Corrosion carrier suitable for wafers of different sizes |
| CN202503019U (en) * | 2012-03-20 | 2012-10-24 | 湖州奥博石英科技有限公司 | Multifunction quartz boat |
-
2013
- 2013-05-09 CN CN201310167814.XA patent/CN103258765B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2833883Y (en) * | 2005-11-08 | 2006-11-01 | 深圳市捷佳创精密设备有限公司 | Silicon wafer basket |
| CN202103032U (en) * | 2011-06-17 | 2012-01-04 | 北京通美晶体技术有限公司 | Wafer washing and drying basket |
| CN202259213U (en) * | 2011-09-21 | 2012-05-30 | 有研半导体材料股份有限公司 | Corrosion carrier suitable for wafers of different sizes |
| CN202503019U (en) * | 2012-03-20 | 2012-10-24 | 湖州奥博石英科技有限公司 | Multifunction quartz boat |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379751A (en) * | 2019-07-25 | 2019-10-25 | 常州时创能源科技有限公司 | A kind of silicon chip flower basket equipped with carrying frame |
| CN110379751B (en) * | 2019-07-25 | 2024-02-13 | 常州时创能源股份有限公司 | Silicon wafer flower basket with bearing frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103258765B (en) | 2016-06-01 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100009, 47 Gulou Street, Beijing, Xicheng District Patentee after: Beijing Plastics Research Institute Co.,Ltd. Address before: 100009, 47 Gulou Street, Beijing, Xicheng District Patentee before: BEIJING PLASTICS Research Institute |