CN104201140A - Washing device by wet process - Google Patents
Washing device by wet process Download PDFInfo
- Publication number
- CN104201140A CN104201140A CN201410443200.4A CN201410443200A CN104201140A CN 104201140 A CN104201140 A CN 104201140A CN 201410443200 A CN201410443200 A CN 201410443200A CN 104201140 A CN104201140 A CN 104201140A
- Authority
- CN
- China
- Prior art keywords
- cleaned
- wet
- nozzle
- wafer
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
Abstract
A washing device by wet process comprises a bearing platform, a nozzle, a support, and a fog absorbing device. The bearing platform is in a rotatable design and is used for bearing wafers to be washed. The nozzle is used for spraying cleaning solvent and is arranged face to face with the wafers to be washed. The support is fixedly arranged above one side of the bearing platform. The fog absorbing device is arranged on the support, is communicated with an air extractor through an air pipeline, and is used for absorbing and exhausting acid fog produced by the nozzle. In the washing device, the fog absorbing device is arranged above one side of the bearing platform arranged rotatably, and is communicated with the air extractor through the air pipeline, so the acid fog produced by volatilization of acid solution under a high-temperature condition is effectively absorbed and is discharged through the air pipeline and the air extractor, and therefore, the acid fog is prevented from condensing at the nozzle position to form crystals, particle stains are avoided, and yield of the wafers is improved.
Description
Technical field
The present invention relates to technical field of semiconductors, relate in particular to a kind of wet-cleaned device.
Background technology
Along with the development of integrated circuit fabrication process, on wafer, critical size continues to dwindle, and before accepting other technique, crystal column surface must be clean, so wet clean process is very important in whole integrated circuit fabrication process.
Wet-cleaned is generally series of process steps such as adopting chemical liquid and deionized water, removes staining on crystal column surface, includes but not limited to: particle, organic residue, metal pollutant, and natural oxidizing layer etc.Along with the requirement to crystal column surface cleanliness factor improves, wet-cleaned is cleaned to one chip and is cleaned and change by traditional slot type.
But, in wet-cleaned, usually adopt various acid solutions, in cleaning process, especially under the condition that temperature is higher, acid solution volatilization produces acid mist, and acid mist is easy to the formation crystallization of condensing at nozzle place, will certainly again drop on wafer, form particle contaminant, reduce the yield of wafer.
Therefore the problem existing for prior art, this case designer relies on the industry experience for many years of being engaged in, and active research improvement, so there has been a kind of wet-cleaned device of the present invention.
Summary of the invention
The present invention be directed in prior art, in traditional wet-cleaned, usually adopt various acid solutions, in cleaning process, especially under the condition that temperature is higher, acid solution volatilization produces acid mist, and acid mist is easy to the formation crystallization of condensing at nozzle place, will certainly again drop on wafer, form particle contaminant, the defects such as yield that reduce wafer provide a kind of wet-cleaned device.
In order to address the above problem, the invention provides a kind of wet-cleaned device, described wet-cleaned device, comprising: carrying platform, Rotation Design, and for carrying wafer to be cleaned; Nozzle, for jet cleaning solvent, and is towards setting with described wafer to be cleaned; Bracing frame, is fixedly installed on the top of one of described carrying platform side; Inhale mist device, be arranged on support frame as described above, and be communicated with air extractor by gas piping, for absorbing and discharge the acid mist of described nozzle generation.
Alternatively, described suction mist device is round platform design, and one end that described suction mist device is connected with described gas piping is little to the floor space of one end of described wafer to be cleaned compared with described suction mist device surface.
Alternatively, the angle of described suction mist device and position are set according to the cleaning liquid at described nozzle place and the size of flow.
Alternatively, support frame as described above is annular design, and described suction mist device can move along the bracing frame of described annular design, and carries out angle adjustment.
In sum, wet-cleaned device of the present invention is by arranging described suction mist device above one of the carrying platform in described rotary setting side, and described suction mist device is communicated with described air extractor by described gas piping, effectively absorb the acid mist producing because of acid solution volatilization under hot conditions, and discharge by described gas piping and air extractor, avoid the formation crystallization of condensing at nozzle place of described acid mist, stopped to form particle contaminant, promoted the yield of wafer.
Accompanying drawing explanation
Figure 1 shows that the structural representation of wet-cleaned device of the present invention.
Embodiment
By describe in detail the invention technology contents, structural feature, reached object and effect, below in conjunction with embodiment and coordinate accompanying drawing to be described in detail.
Refer to Fig. 1, Figure 1 shows that the structural representation of wet-cleaned device of the present invention.Described wet-cleaned device 1, comprising: carrying platform 11, and described carrying platform 11 Rotation Design, and for carrying wafer to be cleaned 2; Nozzle 12, described nozzle 12 is for jet cleaning solvent, and is towards setting with described wafer to be cleaned 2; Bracing frame 13, support frame as described above 13 is fixedly installed on the top of one of described carrying platform 11 side; Inhale mist device 14, described suction mist device 14 is arranged on support frame as described above 13, and is communicated with air extractor 16 by gas piping 15, for absorbing and discharge the acid mist of described nozzle 12 generations.
As those skilled in the art, hold intelligibly, while carrying out wet-cleaned under hot conditions, acid solution volatilization produces acid mist, acid mist certainly will absorb by described suction mist device 14, and discharges by described gas piping 15 and air extractor 16, has avoided the formation crystallization of condensing at nozzle place of described acid mist, stop to form particle contaminant, promote the yield of wafer.
In order to disclose more intuitively the present invention's technical scheme, highlight the present invention's beneficial effect, now in conjunction with concrete execution mode, set forth.In order better to implement the present invention's technical scheme, as execution mode particularly, preferably, described suction mist device 14 is round platform design, and one end that described suction mist device 14 is connected with described gas piping 15 is little towards the floor space of one end of described wafer 2 to be cleaned compared with described suction mist device 14.The angle of described suction mist device 14 and position are set according to the cleaning liquid at described nozzle 12 places and the size of flow.More specifically, support frame as described above 13 is annular design, and described suction mist device 14 can move along the bracing frame 13 of described annular design, and carries out angle adjustment.
Significantly, wet-cleaned device 1 of the present invention is by arranging described suction mist device 14 above one of the carrying platform 11 in described rotary setting side, and described suction mist device 14 is communicated with described air extractor 16 by described gas piping 15, effectively absorb the acid mist producing because of acid solution volatilization under hot conditions, and discharge by described gas piping 15 and air extractor 16, avoid the formation crystallization of condensing at nozzle place of described acid mist, stopped to form particle contaminant, promoted the yield of wafer.
In sum, wet-cleaned device of the present invention is by arranging described suction mist device above one of the carrying platform in described rotary setting side, and described suction mist device is communicated with described air extractor by described gas piping, effectively absorb the acid mist producing because of acid solution volatilization under hot conditions, and discharge by described gas piping and air extractor, avoid the formation crystallization of condensing at nozzle place of described acid mist, stopped to form particle contaminant, promoted the yield of wafer.
Those skilled in the art all should be appreciated that, in the situation that not departing from the spirit or scope of the present invention, can carry out various modifications and variations to the present invention.Thereby, if when any modification or modification fall in the protection range of appended claims and equivalent, think that the present invention contains these modifications and modification.
Claims (4)
1. a wet-cleaned device, is characterized in that, described wet-cleaned device, comprising:
Carrying platform, Rotation Design, and for carrying wafer to be cleaned;
Nozzle, for jet cleaning solvent, and is towards setting with described wafer to be cleaned;
Bracing frame, is fixedly installed on the top of one of described carrying platform side;
Inhale mist device, be arranged on support frame as described above, and be communicated with air extractor by gas piping, for absorbing and discharge the acid mist of described nozzle generation.
2. wet-cleaned device as claimed in claim 1, is characterized in that, described suction mist device is round platform design, and one end that described suction mist device is connected with described gas piping is little to the floor space of one end of described wafer to be cleaned compared with described suction mist device surface.
3. wet-cleaned device as claimed in claim 1, is characterized in that, the angle of described suction mist device and position are set according to the cleaning liquid at described nozzle place and the size of flow.
4. wet-cleaned device as claimed in claim 1, is characterized in that, support frame as described above is annular design, and described suction mist device can move along the bracing frame of described annular design, and carries out angle adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410443200.4A CN104201140A (en) | 2014-09-02 | 2014-09-02 | Washing device by wet process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410443200.4A CN104201140A (en) | 2014-09-02 | 2014-09-02 | Washing device by wet process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104201140A true CN104201140A (en) | 2014-12-10 |
Family
ID=52086412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410443200.4A Pending CN104201140A (en) | 2014-09-02 | 2014-09-02 | Washing device by wet process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104201140A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125128A (en) * | 2019-06-19 | 2019-08-16 | 德淮半导体有限公司 | Waste gas collection device and wet-cleaning device |
| US11699678B2 (en) | 2016-02-26 | 2023-07-11 | Semtech Corporation | Semiconductor device and method of forming insulating layers around semiconductor die |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020036004A1 (en) * | 2000-09-28 | 2002-03-28 | Applied Materials, Inc. | Substrate cleaning apparatus and method |
| KR101274824B1 (en) * | 2008-08-06 | 2013-06-13 | 도쿄엘렉트론가부시키가이샤 | Liquid treatment apparatus |
-
2014
- 2014-09-02 CN CN201410443200.4A patent/CN104201140A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020036004A1 (en) * | 2000-09-28 | 2002-03-28 | Applied Materials, Inc. | Substrate cleaning apparatus and method |
| KR101274824B1 (en) * | 2008-08-06 | 2013-06-13 | 도쿄엘렉트론가부시키가이샤 | Liquid treatment apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11699678B2 (en) | 2016-02-26 | 2023-07-11 | Semtech Corporation | Semiconductor device and method of forming insulating layers around semiconductor die |
| CN110125128A (en) * | 2019-06-19 | 2019-08-16 | 德淮半导体有限公司 | Waste gas collection device and wet-cleaning device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141210 |
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| RJ01 | Rejection of invention patent application after publication |