CN103252804B - 基板的沟槽加工工具及沟槽加工装置 - Google Patents

基板的沟槽加工工具及沟槽加工装置 Download PDF

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Publication number
CN103252804B
CN103252804B CN201310010371.3A CN201310010371A CN103252804B CN 103252804 B CN103252804 B CN 103252804B CN 201310010371 A CN201310010371 A CN 201310010371A CN 103252804 B CN103252804 B CN 103252804B
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China
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mentioned
blade
substrate
groove processing
instrument
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CN201310010371.3A
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Chinese (zh)
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CN103252804A (zh
Inventor
曾山正信
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Photovoltaic Devices (AREA)
CN201310010371.3A 2012-02-17 2013-01-10 基板的沟槽加工工具及沟槽加工装置 Active CN103252804B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012032895A JP5826665B2 (ja) 2012-02-17 2012-02-17 基板の溝加工ツール及び溝加工装置
JP2012-032895 2012-02-17

Publications (2)

Publication Number Publication Date
CN103252804A CN103252804A (zh) 2013-08-21
CN103252804B true CN103252804B (zh) 2016-10-05

Family

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Family Applications (1)

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CN201310010371.3A Active CN103252804B (zh) 2012-02-17 2013-01-10 基板的沟槽加工工具及沟槽加工装置

Country Status (4)

Country Link
JP (1) JP5826665B2 (ja)
KR (1) KR101510175B1 (ja)
CN (1) CN103252804B (ja)
TW (1) TWI498298B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513671B (zh) * 2013-12-06 2015-12-21 Ind Tech Res Inst 刀具及應用其之玻璃切割裝置
JP6331701B2 (ja) * 2014-05-29 2018-05-30 三星ダイヤモンド工業株式会社 ツールホルダ及び溝加工装置
KR102563577B1 (ko) * 2017-12-27 2023-08-03 현대자동차주식회사 막전극 접합체용 전극의 제조장치 및 이를 이용한 막전극 접합체용 전극의 제조방법
CN112091298A (zh) * 2020-09-16 2020-12-18 中国航发贵州黎阳航空动力有限公司 直槽加工刀具及加工方法
CN112466785B (zh) * 2020-11-23 2022-09-02 江西世星科技有限公司 一种集成电路v形槽开槽机
CN112620762A (zh) * 2020-12-18 2021-04-09 贵州华烽电器有限公司 一种壳体键槽切削加工装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2475577A (en) * 1943-11-05 1949-07-05 Berthiez Charles William Control device for tool carriers of reciprocating machines
CN2728681Y (zh) * 2004-03-14 2005-09-28 侯宝长 牛头刨龙门刨双刃切削平面夹具
CN102130217A (zh) * 2010-01-08 2011-07-20 三星钻石工业股份有限公司 薄膜太阳电池用槽加工工具

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH247283A (fr) * 1943-11-05 1947-02-28 Berthiez Charles William Dispositif de commande d'un porte-outils de machine à courses alternatives travaillant dans les deux sens.
US4524894A (en) * 1982-12-29 1985-06-25 Gerber Garment Technology, Inc. Method and apparatus for forming pattern pieces
JPS6295813U (ja) * 1985-12-09 1987-06-18
JPH09267291A (ja) * 1996-04-02 1997-10-14 Sony Corp 基板切断機
JP2000315809A (ja) * 1999-03-04 2000-11-14 Matsushita Electric Ind Co Ltd 集積型薄膜太陽電池の製造方法およびパターニング装置
JP2002033498A (ja) * 2000-07-17 2002-01-31 Matsushita Electric Ind Co Ltd 集積型薄膜太陽電池の製造方法およびパターニング装置
JP2002346803A (ja) * 2001-05-25 2002-12-04 Ricoh Co Ltd 溝加工法、溝加工品、及び、光学部品又は精密部品
JP2003145321A (ja) * 2001-11-12 2003-05-20 Allied Material Corp 単結晶ダイヤモンドバイト
JP2007203379A (ja) * 2006-01-30 2007-08-16 Kyocera Corp 切削工具並びに切削工具に用いられるチップおよびホルダ
US7614831B2 (en) * 2006-03-13 2009-11-10 Panasonic Corporation Machining tools having concave cutting surfaces for precision machining and methods of manufacturing such
JP5308892B2 (ja) * 2009-04-01 2013-10-09 三星ダイヤモンド工業株式会社 集積型薄膜太陽電池の製造装置
JP5436007B2 (ja) * 2009-04-06 2014-03-05 株式会社シライテック 太陽電池パネルの製膜スクライブ装置
JP2011155151A (ja) * 2010-01-27 2011-08-11 Mitsuboshi Diamond Industrial Co Ltd 薄膜太陽電池用スクライブ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2475577A (en) * 1943-11-05 1949-07-05 Berthiez Charles William Control device for tool carriers of reciprocating machines
CN2728681Y (zh) * 2004-03-14 2005-09-28 侯宝长 牛头刨龙门刨双刃切削平面夹具
CN102130217A (zh) * 2010-01-08 2011-07-20 三星钻石工业股份有限公司 薄膜太阳电池用槽加工工具

Also Published As

Publication number Publication date
JP2013169600A (ja) 2013-09-02
TW201335087A (zh) 2013-09-01
JP5826665B2 (ja) 2015-12-02
KR101510175B1 (ko) 2015-04-08
TWI498298B (zh) 2015-09-01
CN103252804A (zh) 2013-08-21
KR20130095201A (ko) 2013-08-27

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