CN103237411A - 用细导线排制作的led单面线路板和方法 - Google Patents
用细导线排制作的led单面线路板和方法 Download PDFInfo
- Publication number
- CN103237411A CN103237411A CN2013101655909A CN201310165590A CN103237411A CN 103237411 A CN103237411 A CN 103237411A CN 2013101655909 A CN2013101655909 A CN 2013101655909A CN 201310165590 A CN201310165590 A CN 201310165590A CN 103237411 A CN103237411 A CN 103237411A
- Authority
- CN
- China
- Prior art keywords
- thin wire
- wire row
- row
- wiring board
- single face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Led Device Packages (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013101655909A CN103237411A (zh) | 2013-05-06 | 2013-05-06 | 用细导线排制作的led单面线路板和方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013101655909A CN103237411A (zh) | 2013-05-06 | 2013-05-06 | 用细导线排制作的led单面线路板和方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103237411A true CN103237411A (zh) | 2013-08-07 |
Family
ID=48885413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2013101655909A Pending CN103237411A (zh) | 2013-05-06 | 2013-05-06 | 用细导线排制作的led单面线路板和方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103237411A (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040212085A1 (en) * | 2003-04-25 | 2004-10-28 | Denso Corporation | Thick film circuit board, method of producing the same and integrated circuit device |
CN201947530U (zh) * | 2010-07-29 | 2011-08-24 | 王定锋 | 单面电路板 |
CN102237481A (zh) * | 2010-05-07 | 2011-11-09 | 佛山市国星光电股份有限公司 | 一种表面贴装型功率led支架制造方法及其产品 |
CN102340928A (zh) * | 2010-07-20 | 2012-02-01 | 王定锋 | 用扁平导线并置排列制作的单面电路板及其制作方法 |
CN202455644U (zh) * | 2011-12-16 | 2012-09-26 | 田茂福 | 用单条导线制作的串联型led单面线路板 |
CN203435227U (zh) * | 2013-05-06 | 2014-02-12 | 田茂福 | 用细导线排制作的led单面线路板 |
-
2013
- 2013-05-06 CN CN2013101655909A patent/CN103237411A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040212085A1 (en) * | 2003-04-25 | 2004-10-28 | Denso Corporation | Thick film circuit board, method of producing the same and integrated circuit device |
CN102237481A (zh) * | 2010-05-07 | 2011-11-09 | 佛山市国星光电股份有限公司 | 一种表面贴装型功率led支架制造方法及其产品 |
CN102340928A (zh) * | 2010-07-20 | 2012-02-01 | 王定锋 | 用扁平导线并置排列制作的单面电路板及其制作方法 |
CN201947530U (zh) * | 2010-07-29 | 2011-08-24 | 王定锋 | 单面电路板 |
CN202455644U (zh) * | 2011-12-16 | 2012-09-26 | 田茂福 | 用单条导线制作的串联型led单面线路板 |
CN203435227U (zh) * | 2013-05-06 | 2014-02-12 | 田茂福 | 用细导线排制作的led单面线路板 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN203131524U (zh) | 一种可弯折的led光源模组 | |
CN102340928B (zh) | 用扁平导线并置排列制作的单面电路板及其制作方法 | |
CN202048540U (zh) | 用三条扁平导线制作的led灯电路板 | |
CN102340931B (zh) | 采用并置的导线制作单面电路板的方法 | |
US8974083B2 (en) | Low-cost multi functional heatsink for LED arrays | |
CN202652681U (zh) | Led三维电路板 | |
CN103915544A (zh) | 立体发光led芯片灯丝及led灯泡 | |
CN203151860U (zh) | 一种可弯折的金属基印刷电路板 | |
EP2730834B1 (en) | LED Illumination Device | |
CN109757039B (zh) | 一种复合金属电路的电路板及其制作方法 | |
CN203435227U (zh) | 用细导线排制作的led单面线路板 | |
TW200618345A (en) | Light emitting diode assembly | |
CN102748605A (zh) | 将led芯片封装在散热支撑载体电路上的led灯具模组和方法 | |
CN102340929B (zh) | 分别用绝缘层同时热压在扁平导线两面上制作单面电路板 | |
CN103237411A (zh) | 用细导线排制作的led单面线路板和方法 | |
CN102227156B (zh) | 高反射镜面盲杯槽印刷电路板及其制备方法 | |
CN102724810A (zh) | 能够灵活拆分电路的led电路板及led模组 | |
CN109757032A (zh) | 一种金属箔电路和导线电路复合制作电路板的方法 | |
CN103606545A (zh) | 一种led软板光源模组及其制造方法 | |
CN103486484A (zh) | 电路板及采用该电路板的发光二极管灯条 | |
CN203219609U (zh) | 一种新型金属基印刷电路板 | |
CN201919236U (zh) | 采用扁平绞合导线束制作的单面电路板 | |
CN103152976A (zh) | 用于led安装的陶瓷基印刷电路板 | |
TW201528563A (zh) | 用於線路電壓之具陶瓷電路板與驅動器模組的灌膠之led模組 | |
CN102769992A (zh) | Led三维电路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
DD01 | Delivery of document by public notice |
Addressee: Tian Maofu Document name: Notification of Publication of the Application for Invention |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
DD01 | Delivery of document by public notice |
Addressee: Hu Zhen Document name: Notification that Application Deemed not to be Proposed |
|
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Tian Maofu Document name: Notification of Patent Invention Entering into Substantive Examination Stage |
|
DD01 | Delivery of document by public notice |
Addressee: Tian Maofu Document name: the First Notification of an Office Action |
|
DD01 | Delivery of document by public notice |
Addressee: Tian Maofu Document name: Notification that Application Deemed to be Withdrawn |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130807 |