CN103219258A - Wafer defect sampling inspection system and method thereof - Google Patents
Wafer defect sampling inspection system and method thereof Download PDFInfo
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- CN103219258A CN103219258A CN2013101170908A CN201310117090A CN103219258A CN 103219258 A CN103219258 A CN 103219258A CN 2013101170908 A CN2013101170908 A CN 2013101170908A CN 201310117090 A CN201310117090 A CN 201310117090A CN 103219258 A CN103219258 A CN 103219258A
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Abstract
The invention discloses a wafer defect sampling inspection system and a method thereof. The wafer defect sampling inspection system is characterized by comprising a control system, wherein the control system mainly comprises a control unit, a counting unit and a storage unit. The method comprises the steps that a list for machines required to be monitored is arranged in the control system; the alarm time and the shut-down time are prearranged; the machine operation time is compared with the alarm time; when the operation time is more than the alarm time and no defect scanning data sent by scanning stations are received, products are grabbed to enter the scanning stations; if the machines obtain the defect scanning data before the arrival of the shut-down time during running, the operation time of the machines is reset; if the operation time of the machines reaches the shut-down time and no defect scanning data are still received, the shut-down is performed; the rerunning is not implemented until the defect scanning data are obtained; and the operation time is reset. By the adoption of the wafer defect sampling inspection system and the method thereof, the crucial machines can be monitored on line and in real time by controlling the system; and therefore, the product yield is guaranteed, the detection amount is decreased, the usage amount of the scanning stations is relieved, and the detection cost is lowered.
Description
Technical field
The present invention relates to a kind of electronic product sampling Detection system and method, relate in particular to a kind of wafer defect sampling Detection system and method thereof.
Background technology
Wafer is meant the silicon wafer that the Si semiconductor production of integrated circuits is used, because it is shaped as circle, so be called wafer; On silicon wafer, can manufacture various circuit element structures, the IC of certain electric sexual function product be arranged and become.The original material of wafer is a silicon, and the silicon dioxide ore refines via arc furnace, chlorination of hydrochloric acid, and after distillation, made high-purity polycrystalline, its purity is up to 99.999999999%.Polysilicon is melted in wafer manufactory, plant seed crystal melting in the liquid, then it is slowly pulled out, to form columned monocrystalline silicon crystal bar, because silicon crystal bar is to be generated gradually in the silicon raw material of molten state by the seed crystal that a high preferred orientation is determined, this process is called " long brilliant ".Silicon crystal bar passes through segment again, barreling, and section, chamfering, polishing, laser is carved, and after the packing, promptly becomes the base stock of integrated circuit factory---silicon wafer, and Here it is " wafer ".
Make in the process at wafer, need carry out defects detection (KAL test) wafer.If each product is all detected, need N platform SCAN scanning machine so, spend sizable cost, have influence on production efficiency equally, therefore, adopt sampling Detection usually.The employing method is at present, according to the LOT tail number of wafer, selects product according to 30% sampling rate and enters scanning element (YE SCAN TOOL), and the LOT tail number of being selected is at random.
As mentioned above, there is following problem in present detection mode:
⑴ the sampling rate of 30% needs to consume a large amount of testing time and control wafer, and manufacturing department disputes because measure queuing problem through regular meeting;
⑵ the sampling Detection mode that present can not be accomplished online in real time monitoring, especially to the monitoring of key machine, this might take place owing to sampling is to randomly draw according to the LOT tail number, and the product of a certain board all is not pumped to, in case generation problem, will influence very greatly,, so both increase detection limit so the product that needs sometimes manually to grasp on some key machines enters SCAN, also must influence CT Cycle Time, the consumption manpower, consuming time, the consumption cost.
Summary of the invention
The object of the invention provides a kind of wafer defect sampling Detection system and method thereof, uses this system and method, realizes that real-time online detects, and improves processing procedure efficient, reduces production costs.
For achieving the above object; the technical solution used in the present invention is: a kind of wafer defect sampling Detection system; comprise a plurality of boards, at least one scanning website and a control system; this control system mainly is made of MCU control unit, counting unit and memory cell; described MCU control unit is connected with each board operation control end; and by described counting unit counting activity duration T; each described scanning movement point data end is connected with described MCU control unit, in the described memory cell time of fire alarming T1 of default corresponding each board and downtime T2.
In the technique scheme, control system is connected with the key machine that needs monitoring, count by counting unit, obtain the activity duration T of this board, the activity duration T of board is compared with the time of fire alarming T1 that defaults in the corresponding board in the memory cell, reach time of fire alarming T1, and do not receive the defective scan-data M of this board, control system drives board extracting product and enters the scanning website so: 1. control system is at activity duration T no show T2 downtime, just receive defective scan-data M's, counting unit is the activity duration zero clearing, again the counting of next round; 2. if activity duration T when arrival T2 downtime, does not obtain defective scan-data M yet, control system control board is shut down so, until obtaining defective scan-data M, recovers the board operation, and counting unit is with activity duration T zero clearing, and next round is counted again.Wherein, time of fire alarming T1 and downtime T2 according to the characteristic setting of this board, to meet the board deadline of each batch products, guarantee that each batch products all can be detected, really realize the purpose of online in real time monitoring.According to producing needs, key machine is listed in the control system watch-list, thereby realized real-time monitoring key machine, the defectiveness scan-data M that guarantees to be bound within a certain period of time occurs.
In the technique scheme, be provided with communication unit in the described control system, be connected with operating personnel E-mail address or mobile phone by cable network or wireless network.When the operation time T arrived time of fire alarming T1, control system sent alarm signal to operating personnel, and when operation time T arrival T2 downtime, control system sends stopping signal to operating personnel.
For achieving the above object, the method scheme that the present invention adopts is: a kind of wafer defect sampling Detection method the steps include:
⑴ the board tabulation that needs monitoring is set in the control system, for the default time of fire alarming T1 of each board in the tabulation and one downtime T2, board operation back control system begins counting, obtains activity duration T;
⑵ when recording the T1 that board activity duration T sets greater than corresponding board, and when not receiving the defective scan-data M that the scanning website sends, grasp product and enter the scanning website, and continue timing;
⑶ obtain defective scan-data M when board, and do not reach downtime during T2, and then control system is the activity duration T zero clearing of this board; If this board is behind activity duration T=T2 downtime, do not receive defective scan-data M yet, then this board is shut down, wait to obtain defective scan-data M after, this board operation again, and with activity duration T zero clearing;
⑷ count again, returns step ⑵.
In the technique scheme, among the described step ⑴, the time of fire alarming T1 that each board is default and wafer specification and property settings that downtime, T2 processed according to this board are to obtain the defective scan-data M of each batch.
In the technique scheme, among the described step ⑵, after grasping product and entering the scanning website, system sends alarm signal simultaneously and locates to operating personnel.
Further technical scheme is, described alarm signal sends mail to operating personnel's mailbox by cable network, or sends note to operating personnel's mobile phone by wireless network.
In the technique scheme, among the described step ⑶, after board is shut down; it is lock-out state that control system will be provided with this board, sends stopping signal simultaneously and locates to operating personnel, wait to obtain defective scan-data M after; by operating personnel is that board is set release, and board resumes operation.
Further technical scheme is, described stopping signal sends mail to operating personnel's mailbox by cable network, or sends note to operating personnel's mobile phone by wireless network.
Because the technique scheme utilization, the present invention compared with prior art has following advantage:
1. the present invention can list key machine in the control system monitoring range in by control system is set, be provided with time of fire alarming T1 and downtime T2, count by counting unit, obtain the activity duration T of board, T is compared with T1 and T2 respectively, guarantee that board is moving T2 in the time, the appearance of defectiveness scan-data is bound to, wait for otherwise shut down, thereby satisfy the effect that the key machine online in real time is monitored, avoid omission, guarantee yield of products;
2. because key machine all regularly obtains defective scan-data M by control system, this number of scans is included in 30% the sampling rate, removed the operation that in the past key machine was scanned separately from, reduce the utilization rate of QC, reduce the use amount of control wafer and the utilization rate of scanning website, alleviate measurement pressure, enhance productivity the QC part;
3. by the communication unit in the control system, can in real time monitored board working condition be sent to relevant operating personnel place, in time understand the job state of board, realize the real-time and effective monitoring;
Time of fire alarming T1 and downtime T2 can be provided with according to the board characteristic, meet the different needs of corresponding each series products of preparation board, control flexibly, effectively.
Description of drawings
Fig. 1 is the control structure schematic diagram of the embodiment of the invention one.
Embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment one: referring to shown in Figure 1; a kind of wafer defect sampling Detection system; comprise 4 boards; 2 scan a website and a control system; this control system is mainly by the MCU control unit; counting unit; communication unit and memory cell constitute; described MCU control unit is connected with each board operation control end; and by described counting unit counting activity duration T; each described scanning movement point data end is connected with described MCU control unit; in the described memory cell time of fire alarming T1 of default corresponding each board and downtime T2, communication unit sends mail to the operating personnel E-mail address by cable network.
Concrete method the steps include:
⑴ the board tabulation that needs monitoring is set in the control system, for the default time of fire alarming T1 of each board in the tabulation and one downtime T2, the time of fire alarming T1 that each board is default and wafer specification and property settings that downtime, T2 processed according to this board, to obtain the defective scan-data M of each batch, board operation back control system begins counting: activity duration T;
⑵ when recording the T1 that board activity duration T sets greater than corresponding board, and when not receiving the defective scan-data M of scanning website transmission, grasp product and enter the scanning website, and continue timing, control system sends the mail of alarm signal simultaneously to operating personnel's mailbox;
⑶ obtain defective scan-data M, the then activity duration T zero clearing of this board if this board does not reach downtime during T2 in operation; If this board is behind activity duration T=T2 downtime, do not receive defective scan-data M yet, then this board is shut down, it is lock-out state that control system will be provided with this board, send the stopping signal mail simultaneously to operating personnel's mailbox, wait to obtain defective scan-data M after, be that board is set release by operating personnel, board resumes operation, and with activity duration T zero clearing;
⑷ count again, returns step ⑵.
As shown in Figure 1; select key machine 1., 3., 4., 6. to list the control system monitoring range in; set key machine time of fire alarming T1=10h 1., downtime, T2=20h set key machine time of fire alarming T1=15h 3.; downtime T2=30h; set key machine time of fire alarming T1=8h 4., downtime, T2=16h set key machine time of fire alarming T1=20h 6.; downtime T2=40h, control system monitor in real time board 1., 3., 4., defective scan-data M situation 6..
Below 1. be example with board, specify: when 1. activity duration T=10h of board, but defectiveness scan-data M not, control system sends the alarm signal mail to operating personnel, control board extracting product simultaneously and enter scanning website 1, when T=12h, control system obtains board defective scan-data M 1. from the scanning website, activity duration zero clearing so restarts counting.If when T=20h; do not obtain board defective scan-data M 1. yet; 1. control system shuts down board so; and send the stopping signal mail to operating personnel, wait for that board defective scan-data M 1. arrives, after receiving; revise board state 1. in the control system by operating personnel; unlock, 1. board resumes operation, simultaneously activity duration T zero clearing.
By the setting of control system, obtain to key machine 1., 3., 4., 6. real-time monitoring, in the setting-up time section, the defectiveness scan-data M that is bound to is to guarantee the monitoring to each key machine product quality.
Embodiment two: a kind of wafer defect sampling Detection system and method thereof; present embodiment is similar substantially to embodiment one; its difference is: the communication unit in the control system sends alarm signal or stopping signal by wireless network (GPRS mobile telephone network); send on operating personnel's mobile phone in the mode of short message, in time the operation situation of key machine in the notifying operation personnel control system watch-list.
Claims (8)
1. wafer defect sampling Detection system; comprise a plurality of boards and at least one scanning website; it is characterized in that: also comprise a control system; this control system mainly is made of MCU control unit, counting unit and memory cell; described MCU control unit is connected with each board operation control end; and by described counting unit counting activity duration T; each described scanning movement point data end is connected with described MCU control unit, in the described memory cell time of fire alarming T1 of default corresponding each board and downtime T2.
2. wafer defect sampling Detection according to claim 1 system is characterized in that: be provided with communication unit in the described control system, be connected with operating personnel E-mail address or mobile phone by cable network or wireless network.
3. a wafer defect sampling Detection method the steps include:
⑴ the board tabulation that needs monitoring is set in the control system, for the default time of fire alarming T1 of each board in the tabulation and one downtime T2, board operation back control system begins counting, obtains activity duration T;
⑵ when recording the T1 that board activity duration T sets greater than corresponding board, and when not receiving the defective scan-data M that the scanning website sends, grasp product and enter the scanning website, and continue timing;
⑶ obtain defective scan-data M when board, and do not reach downtime during T2, and then control system is the activity duration T zero clearing of this board; If this board is behind activity duration T=T2 downtime, do not receive defective scan-data M yet, then this board is shut down, wait to obtain defective scan-data M after, this board operation again, and with activity duration T zero clearing;
⑷ count again, returns step ⑵.
4. wafer defect sampling Detection method according to claim 3; it is characterized in that: among the described step ⑴; the time of fire alarming T1 that each board is default and wafer specification and property settings that downtime, T2 processed according to this board are to obtain the defective scan-data M of each batch.
5. round defective sampling Detection method according to claim 3 is characterized in that: among the described step ⑵, after grasping product and entering the scanning website, system sends alarm signal simultaneously and locates to operating personnel.
6. round defective sampling Detection method according to claim 5 is characterized in that: described alarm signal sends mail to operating personnel's mailbox by cable network, or sends note to operating personnel's mobile phone by wireless network.
7. round defective sampling Detection method according to claim 3; it is characterized in that: among the described step ⑶; after board is shut down; it is lock-out state that control system will be provided with this board; sending stopping signal simultaneously locates to operating personnel; after waiting to obtain defective scan-data M, be that board is set release by operating personnel, board resumes operation.
8. round defective sampling Detection method according to claim 7 is characterized in that: described stopping signal sends mail to operating personnel's mailbox by cable network, or sends note to operating personnel's mobile phone by wireless network.
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| CN201310117090.8A CN103219258B (en) | 2013-04-03 | 2013-04-03 | Wafer defect sampling Detection system and method thereof |
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| CN201310117090.8A CN103219258B (en) | 2013-04-03 | 2013-04-03 | Wafer defect sampling Detection system and method thereof |
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| CN103559566A (en) * | 2013-06-04 | 2014-02-05 | 上海华力微电子有限公司 | Dispatching method for controlling process machine through defect scan result |
| CN103681402A (en) * | 2013-11-29 | 2014-03-26 | 上海华力微电子有限公司 | Automatic skip-stop detection system |
| CN104485298A (en) * | 2014-11-28 | 2015-04-01 | 上海华力微电子有限公司 | Detecting and sampling system and detecting and sampling method |
| CN112666311A (en) * | 2020-12-08 | 2021-04-16 | 上海华力集成电路制造有限公司 | Automatic monitoring system and method for defect scanning machine |
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