CN103219258B - Wafer defect sampling Detection system and method thereof - Google Patents
Wafer defect sampling Detection system and method thereof Download PDFInfo
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- CN103219258B CN103219258B CN201310117090.8A CN201310117090A CN103219258B CN 103219258 B CN103219258 B CN 103219258B CN 201310117090 A CN201310117090 A CN 201310117090A CN 103219258 B CN103219258 B CN 103219258B
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Abstract
The invention discloses a kind of wafer defect sampling Detection system itself and method, it is characterized in that: comprise a control system, primarily of control unit, counting unit and memory cell are formed, its method is: arrange the board list needing monitoring in control system, preset alarm time and downtime, the board activity duration compares with time of fire alarming, time of fire alarming is greater than when the activity duration, and when not receiving the Defect Scanning data of scanning website transmission, capture product introduction scanning website, if this board does not reach in operation obtained Defect Scanning data downtime, it is then the activity duration clearing of this board, if this board activity duration arrived after downtime, not receiving Defect Scanning data yet, then shut down, until rerun after obtaining Defect Scanning data, and is activity duration clearing.The present invention can carry out real time and on line monitoring to key machine by control system, ensures the yields of product, reduces amount detection, alleviates the use amount of scanning website, reduces testing cost.
Description
Technical field
The present invention relates to a kind of electronic product sampling Detection system and method, particularly relate to a kind of wafer defect sampling Detection system and method thereof.
Background technology
Wafer refers to the silicon wafer that Si semiconductor production of integrated circuits is used, because its shape is circular, therefore is called wafer; Various circuit component structure can be manufactured on silicon, and become the IC product having certain electric sexual function.The original material of wafer is silicon, and silicon dioxide ore refines via arc furnace, chlorination of hydrochloric acid, and after distillation, has made highly purified polysilicon, its high purity 99.999999999%.Wafer fabrication melts polysilicon, plant into seed crystal melting in liquid, then it is slowly pulled out, to form columned monocrystalline silicon crystal bar, because silicon crystal bar is that the seed crystal determined by a high preferred orientation generates gradually in the silicon raw material of molten state, this process is called " long brilliant ".Silicon crystal bar is again through segment, and barreling, cuts into slices, chamfering, polishing, and laser incising, after packaging, namely becomes the base stock of integrated circuit factory---and silicon wafer, Here it is " wafer ".
Make in process at wafer, need to carry out defects detection (KAL test) to wafer.If all detect each product, so need N platform SCAN scanning machine, spend sizable cost, have influence on production efficiency equally, therefore, usually adopt sampling Detection.Current employing method is, according to the LOT tail number of wafer, the sampling rate according to 30% is carried out picking up product and entered scanning element (YESCANTOOL), and the LOT tail number selected is random.
As mentioned above, there is following problem in current detection mode:
(1) the sampling rate of 30%, needs consume a large amount of testing times and control wafer, and manufacturing department often can dispute because of measurement queuing problem;
(2) current sampling Detection mode, can not accomplish on line real-time monitoring, especially to the monitoring of key machine, this is randomly draw according to LOT tail number owing to sampling, and likely can occur, the product of a certain board is not all pumped to, once generation problem, will affect very large, so sometimes need the product introduction SCAN manually captured on some key machines, both add detection limit like this, also CT Cycle Time must be affected, consumption manpower, consuming time, consumption cost.
Summary of the invention
The object of the invention is to provide a kind of wafer defect sampling Detection system and method thereof, uses this system and method, realizes real-time online and detects, improve process efficiency, reduce production cost.
For achieving the above object; the technical solution used in the present invention is: a kind of wafer defect sampling Detection system; comprise a plurality of board, at least one scanning website and a control system; this control system is formed primarily of MCU control unit, counting unit and memory cell; described MCU control unit and each board run control end and are connected; and by described counting unit counts activity duration T; described in each, scanning movement point data end is connected with described MCU control unit, preset in described memory cell each board corresponding time of fire alarming T1 and downtime T2.
In technique scheme, control system is connected with needing the key machine monitored, by counting unit counts, obtain the activity duration T of this board, the activity duration T of board is compared to the time of fire alarming T1 of the corresponding board defaulted in memory cell, reach time of fire alarming T1, and do not receive the Defect Scanning data M of this board, so control system drives board to capture product introduction scanning website: 1. control system does not arrive T2 downtime at activity duration T, just receive Defect Scanning data M's, counting unit will reset the activity duration, again the counting of next round, if 2. activity duration T is when arriving T2 downtime, obtain Defect Scanning data M not yet, so control system controls board shutdown, until obtain Defect Scanning data M, recover board operation, activity duration T resets by counting unit, again next round counting.Wherein, time of fire alarming T1 and downtime T2 according to the featured configuration of this board, to meet the board deadline of each batch products, ensure that each batch products all can be detected, really realize the object of on line real-time monitoring.According to need of production, listed in by key machine in control system watch-list, thus realize real-time monitoring to key machine, the defectiveness scan-data M that guarantees to be bound within a certain period of time occurs.
In technique scheme, in described control system, be provided with communication unit, be connected with operating personnel E-mail address or mobile phone by cable network or wireless network.When activity duration T arrives time of fire alarming T1, control system sends alarm signal to operating personnel, and when activity duration T arrives T2 downtime, control system sends stopping signal to operating personnel.
For achieving the above object, the method scheme that the present invention adopts is: a kind of wafer defect sampling Detection method, the steps include:
(1) arrange in control system need monitoring board list, for each board in list preset a time of fire alarming T1 and one downtime T2, board run after control system starts counting, obtain activity duration T;
(2) as the T1 recording board activity duration T and be greater than the setting of corresponding board, and when not receiving the Defect Scanning data M that scanning website sends, capture product introduction scanning website, and continue timing;
(3) when board obtains Defect Scanning data M, and when not reaching T2 downtime, then control system is that the activity duration T of this board resets; If this board, after activity duration T=T2 downtime, does not receive Defect Scanning data M yet, then this board is shut down, after Defect Scanning data M to be obtained, and the operation again of this board, and activity duration T is reset;
(4) again count, return step (2).
In technique scheme, described step (1) in, the wafer specifications that the time of fire alarming T1 that each board is preset and downtime, T2 processed according to this board and property settings, to obtain the Defect Scanning data M of each batch.
In technique scheme, described step (2) in, when crawl product introduction scanning website after, system sends alarm signal simultaneously and locates to operating personnel.
Further technical scheme is, described alarm signal sends mail in operating personnel's mailbox by cable network, or sends note on operating personnel's mobile phone by wireless network.
In technique scheme, described step (3) in, board shut down after; control system is lock-out state by arranging this board, sends stopping signal simultaneously and locates to operating personnel, after Defect Scanning data M to be obtained; by operating personnel be board set unlock, board resumes operation.
Further technical scheme is, described stopping signal sends mail in operating personnel's mailbox by cable network, or sends note on operating personnel's mobile phone by wireless network.
Because technique scheme is used, the present invention compared with prior art has following advantages:
1. the present invention is by arranging control system, key machine can be listed in control system monitoring range, arrange time of fire alarming T1 and downtime T2, pass through counting unit counts, obtain the activity duration T of board, T is compared with T1 and T2 respectively, guarantee that board is within the operation T2 time, be bound to the appearance of defectiveness scan-data, otherwise shut down and wait for, thus meet the effect to key machine on line real-time monitoring, avoid undetected, ensure the yields of product;
2. because key machine all obtains Defect Scanning data M by control system timing, this number of scans is included in the sampling rate of 30%, eliminate in the past to the operation that key machine scans separately, reduce the utilization rate of QC, reduce the utilization rate of use amount and the scanning website controlling wafer, alleviate the measurement pressure to QC part, enhance productivity;
3. by the communication unit in control system, in real time monitored board working condition can be sent to relevant operating personnel place, understand the job state of board in time, realize effective monitoring in real time;
4. time of fire alarming T1 and downtime T2 can according to board featured configuration, meet difference needs preparing board each series products corresponding, control flexibly, effective.
Accompanying drawing explanation
Fig. 1 is the control structure schematic diagram of the embodiment of the present invention one.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Embodiment one: shown in Figure 1, a kind of wafer defect sampling Detection system, comprise 4 boards, 2 scanning websites and a control system, this control system is primarily of MCU control unit, counting unit, communication unit and memory cell are formed, described MCU control unit and each board run control end and are connected, and by described counting unit counts activity duration T, described in each, scanning movement point data end is connected with described MCU control unit, preset in described memory cell each board corresponding time of fire alarming T1 and downtime T2, communication unit sends mail in operating personnel E-mail address by cable network.
Concrete method, the steps include:
(1) the board list needing monitoring is set in control system, for each board in list preset a time of fire alarming T1 and one downtime T2, the wafer specifications that the time of fire alarming T1 that each board is preset and downtime, T2 processed according to this board and property settings, to obtain the Defect Scanning data M of each batch, after board runs, control system starts counting: activity duration T;
When record board activity duration T be greater than corresponding board setting T1, and when not receiving the Defect Scanning data M of scanning website transmission, capture product introduction scanning website, and continue timing, control system sends the mail of alarm signal in operating personnel's mailbox simultaneously;
(3), if this board is not when operation reaches T2 downtime, obtain Defect Scanning data M, then the activity duration T of this board resets; If this board is after activity duration T=T2 downtime, do not receive Defect Scanning data M yet, then this board is shut down, control system is lock-out state by arranging this board, send stopping signal mail in operating personnel's mailbox, after Defect Scanning data M to be obtained, be that board sets unblock by operating personnel simultaneously, board resumes operation, and is reset by activity duration T;
(4) again count, return step (2).
As shown in Figure 1; key machine is selected 1., 3., 4., 6. to list control system monitoring range in; setting key machine time of fire alarming T1=10h 1., downtime, T2=20h, set key machine time of fire alarming T1=15h 3.; downtime T2=30h; setting key machine time of fire alarming T1=8h 4., downtime, T2=16h, set key machine time of fire alarming T1=20h 6.; downtime T2=40h, control system monitors board Defect Scanning data M situation 1., 3., 4., 6. in real time.
Below for board 1., illustrate: as board activity duration T=10h 1., but non-defectiveness scan-data M, control system sends alarm signal mail to operating personnel, control board simultaneously and capture product introduction scanning website 1, as T=12h, control system obtains board Defect Scanning data M 1. from scanning website, so the activity duration resets, and restarts counting.If as T=20h; obtain board Defect Scanning data M 1. not yet; so 1. board shuts down by control system; and send stopping signal mail to operating personnel, wait for that board Defect Scanning data M 1. arrives, after receiving; by board state 1. in operating personnel's change control system; unlock, 1. board resumes operation, and activity duration T resets simultaneously.
By the setting of control system, obtain the real-time monitoring 1., 3., 4., 6. to key machine, in setting-up time section, be bound to defectiveness scan-data M, to ensure the monitoring to each key machine product quality.
Embodiment two: a kind of wafer defect sampling Detection system and method thereof; the present embodiment and embodiment one basic simlarity; its difference is: the communication unit in control system sends alarm signal or stopping signal by wireless network (GPRS mobile telephone network); send on operating personnel's mobile phone in the mode of short message, notify the handling situations of key machine in operating personnel's control system watch-list in time.
Claims (8)
1. a wafer defect sampling Detection system, comprise a plurality of board and at least one scanning website, it is characterized in that: also comprise a control system, this control system is formed primarily of MCU control unit, counting unit and memory cell, described MCU control unit and each board run control end and are connected, and by described counting unit counts activity duration T, described in each, scanning movement point data end is connected with described MCU control unit, preset in described memory cell each board corresponding time of fire alarming T1 and downtime T2; Control system is connected with needing the key machine monitored, by counting unit counts, obtain the activity duration T of this board, the activity duration T of board is compared to the time of fire alarming T1 of the corresponding board defaulted in memory cell, reach time of fire alarming T1, and do not receive the Defect Scanning data M of this board, so control system drives board to capture product introduction scanning website: 1. control system does not arrive T2 downtime at activity duration T, just receive Defect Scanning data M's, counting unit will reset the activity duration, again the counting of next round; If 2. activity duration T is when arriving T2 downtime, obtain Defect Scanning data M not yet, so control system controls board shutdown, until obtain Defect Scanning data M, recover board operation, activity duration T resets by counting unit, again next round counting; Wherein, time of fire alarming T1 and downtime T2 according to the featured configuration of this board.
2. wafer defect sampling Detection system according to claim 1, is characterized in that: be provided with communication unit in described control system, is connected with operating personnel E-mail address or mobile phone by cable network or wireless network.
3. a wafer defect sampling Detection method, the steps include:
(1) arrange in control system need monitoring board list, for each board in list preset a time of fire alarming T1 and one downtime T2, board run after control system starts counting, obtain activity duration T;
(2) as the T1 recording board activity duration T and be greater than the setting of corresponding board, and when not receiving the Defect Scanning data M that scanning website sends, capture product introduction scanning website, and continue timing;
(3) when board obtains Defect Scanning data M, and when not reaching T2 downtime, then control system is that the activity duration T of this board resets; If this board, after activity duration T=T2 downtime, does not receive Defect Scanning data M yet, then this board is shut down, after Defect Scanning data M to be obtained, and the operation again of this board, and activity duration T is reset;
(4) again count, return step (2).
4. wafer defect sampling Detection method according to claim 3; it is characterized in that: in described step (1); the wafer specifications that the time of fire alarming T1 that each board is preset and downtime, T2 processed according to this board and property settings, to obtain the Defect Scanning data M of each batch.
5. wafer defect sampling Detection method according to claim 3, is characterized in that: in described step (2), and when after crawl product introduction scanning website, system sends alarm signal simultaneously and locates to operating personnel.
6. wafer defect sampling Detection method according to claim 5, is characterized in that: described alarm signal sends mail in operating personnel's mailbox by cable network, or sends note on operating personnel's mobile phone by wireless network.
7. wafer defect sampling Detection method according to claim 3; it is characterized in that: in described step (3); after board is shut down; control system is lock-out state by arranging this board; send stopping signal to locate to operating personnel simultaneously; after Defect Scanning data M to be obtained, be that board sets unblock by operating personnel, board resumes operation.
8. wafer defect sampling Detection method according to claim 7, is characterized in that: described stopping signal sends mail in operating personnel's mailbox by cable network, or sends note on operating personnel's mobile phone by wireless network.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103559566B (en) * | 2013-06-04 | 2017-07-07 | 上海华力微电子有限公司 | A kind of work dispatching method of Defect Scanning output control process work bench |
| CN103681402B (en) * | 2013-11-29 | 2016-04-27 | 上海华力微电子有限公司 | A kind of Cargo Inspection of jumping automatically examining system |
| CN104485298A (en) * | 2014-11-28 | 2015-04-01 | 上海华力微电子有限公司 | Detecting and sampling system and detecting and sampling method |
| CN112666311A (en) * | 2020-12-08 | 2021-04-16 | 上海华力集成电路制造有限公司 | Automatic monitoring system and method for defect scanning machine |
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| JP4032036B2 (en) * | 2004-03-23 | 2008-01-16 | 株式会社東芝 | Defect inspection equipment |
| JP5390215B2 (en) * | 2009-02-25 | 2014-01-15 | 株式会社日立ハイテクノロジーズ | Defect observation method and defect observation apparatus |
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| CN1666329A (en) * | 2002-07-03 | 2005-09-07 | 东京电子株式会社 | Method and device for dynamic sensor configuration and runtime execution |
| CN1851593A (en) * | 2005-12-05 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Equipment alarm and interlocking treatment method |
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