CN112666311A - Automatic monitoring system and method for defect scanning machine - Google Patents
Automatic monitoring system and method for defect scanning machine Download PDFInfo
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- CN112666311A CN112666311A CN202011421066.XA CN202011421066A CN112666311A CN 112666311 A CN112666311 A CN 112666311A CN 202011421066 A CN202011421066 A CN 202011421066A CN 112666311 A CN112666311 A CN 112666311A
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- 230000007547 defect Effects 0.000 title claims abstract description 153
- 238000012544 monitoring process Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000012216 screening Methods 0.000 claims abstract description 7
- 238000013480 data collection Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 9
- 230000002159 abnormal effect Effects 0.000 claims description 7
- 238000004458 analytical method Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 230000005856 abnormality Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
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Abstract
The invention discloses an automatic monitoring method and system of a defect scanning machine, which are used for monitoring all defect scanning machines for online defect scanning, wherein: acquiring defect scanning information of all defect scanning machines; acquiring query conditions set by a user, and monitoring the defect scanning information according to the query conditions set by the user; screening out a defect scanning machine table corresponding to the defect scanning information meeting the query condition; counting and summarizing the screened defect scanning information, and determining the scanning rate information of the corresponding defect scanning machine; and judging the running state of the defect scanning machine according to the scanning rate information, and determining whether to trigger an alarm according to the running state of each defect scanning machine. The invention can realize the full-coverage monitoring of the defect scanning machine, automatically count the scanning rate of the machine, conveniently find the machine with potential risk problem in time according to different scanning conditions and carry out early warning on the scanning condition of the machine.
Description
Technical Field
The invention relates to a semiconductor integrated circuit detection technology, in particular to an automatic monitoring system and method of a defect scanning machine.
Background
In recent years, as semiconductor integrated circuits have been rapidly developed and the critical dimensions have been scaled down, the manufacturing processes thereof have become more and more complicated. Currently, advanced integrated circuit fabrication processes typically involve hundreds of process steps, wherein minor errors in any one step can cause problems and, in the worst case, can cause failure of the entire semiconductor integrated circuit chip. Particularly, as the critical dimension of the circuit is continuously reduced, the requirement for process control is more and more strict, so that in order to find and solve problems in time during the production process, the product generally needs to be subjected to online defect detection.
Currently, in the prior art, in online defect detection, a defect scanning machine is mainly used to scan a chip on a production line, collect the positions of defects on the chip and count the number of the defects, compare the number of the defects on the chip with a control standard value (for example, 10 defects) set for the chip, and if the number of the defects on the chip exceeds the set control standard value, the chip defect is considered to be abnormal, and if the number of the defects on the chip does not exceed the set control standard value, the chip defect is considered to be normal. However, in the existing online defect detection process, it is impossible to monitor whether the work of the defect scanning machine is normal, which cannot ensure the accuracy of the defect detection result.
Disclosure of Invention
The technical problem to be solved by the invention is to provide an automatic monitoring system and method for a defect scanning machine, which can solve the problem that the prior art cannot monitor the defect scanning machine.
In order to solve the above problems, the present invention provides an automatic monitoring system for a defect scanning machine, comprising:
the data collection module is in communication connection with all the defect scanning machines and is used for acquiring defect scanning information of each defect scanning machine;
the setting module is used for setting an inquiry condition for monitoring the defect scanning information collected by the data collection module;
the inquiry module inquires the defect scanning information collected by the data collection module according to the inquiry condition set by the setting module and screens out a defect scanning machine station meeting the inquiry condition;
the analysis module is used for processing the defect scanning information corresponding to the defect scanning machine platform screened by the query module;
and the judging module judges the running state of the defect scanning machine according to the processing result of the analyzing module and determines whether to trigger an alarm according to the running state of each defect scanning machine.
The query conditions comprise the scanning rate of the defect scanning machine, the products and the product types detected by the defect scanning machine, the product batches, the wafer number information and the time of continuous abnormity of the scanning rate.
The defect scanning information comprises scanning product batches, scanning product types, scanning corresponding time periods and upper limit and lower limit information of the over-shipment product batches.
Further, the system further comprises:
and the database is used for storing the defect scanning information acquired by the data collection module.
Further, the system further comprises:
and the data processing module is used for carrying out data cleaning, data classification and data screening pretreatment on the defect scanning information acquired by the data acquisition module and summarizing the scanning rate information corresponding to the defect scanning machine corresponding to a department.
The analysis module counts and summarizes the defect scanning information corresponding to the defect scanning machines screened by the query module, and determines the scanning rate information of each defect scanning machine.
Further, when the scanning rate of the defect scanning machine is lower than a standard threshold or the scanning rate is continuously lower than a set value within a set time, the judging module judges that the defect scanning machine is in an abnormal state and triggers an alarm.
In order to solve the above problems, the present invention further provides an automatic monitoring method for a defect scanning machine, which is used for monitoring all defect scanning machines for online defect scanning, and the automatic monitoring method comprises:
acquiring defect scanning information of all defect scanning machines for online defect scanning;
acquiring query conditions set by a user, and monitoring the defect scanning information according to the query conditions set by the user;
screening out a defect scanning machine table corresponding to the defect scanning information meeting the query condition;
counting and summarizing the screened defect scanning information, and determining the scanning rate information of the corresponding defect scanning machine;
and judging the running state of the defect scanning machine according to the scanning rate information, and determining whether to trigger an alarm according to the running state of each defect scanning machine.
Further, when the scanning rate of the defect scanning machine is lower than a standard threshold or the scanning rate is continuously lower than a set value within a set time, it is determined that the defect scanning machine is in an abnormal state, and an alarm is triggered.
Compared with the prior art, the invention monitors the on-line running state of all the defect scanning machines, can realize the full-coverage monitoring of the defect scanning machines, improves the machine body data monitoring coverage rate, automatically counts the scanning rate of the machines, and warns the machines with unreasonable scanning rate, thereby being beneficial to improving the monitoring of the key information of the on-line delivered products, reducing the affected area of the products, improving the monitoring of the scanning condition of the key products on the on-line machines, being convenient for engineers to find the machines with potential risk problems in time according to different scanning conditions and warns the scanning condition of the machines.
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FIG. 1 is a flow chart of an automatic monitoring method for a defect scanning apparatus according to the present invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and technical effects of the present invention will be fully apparent to those skilled in the art from the disclosure in the specification. The invention is capable of other embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the general spirit of the invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. The following exemplary embodiments of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the technical solutions of these exemplary embodiments to those skilled in the art.
Other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. In the following description, specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced or applied in different embodiments, and the details may be based on different viewpoints and applications, and may be widely spread and replaced by those skilled in the art without departing from the spirit of the present invention.
In a preferred embodiment of the present invention, an automatic monitoring system for a defect scanning machine comprises:
the data collection module is in communication connection with all the defect scanning machines and is used for acquiring defect scanning information of each defect scanning machine;
the setting module is used for setting an inquiry condition for monitoring the defect scanning information collected by the data collection module;
the inquiry module inquires the defect scanning information collected by the data collection module according to the inquiry condition set by the setting module and screens out a defect scanning machine station meeting the inquiry condition;
the analysis module is used for processing the defect scanning information corresponding to the defect scanning machine platform screened by the query module;
and the judging module judges the running state of the defect scanning machine according to the processing result of the analyzing module and determines whether to trigger an alarm according to the running state of each defect scanning machine.
The query conditions comprise the scanning rate of the defect scanning machine, the products and the product types detected by the defect scanning machine, the product batches, the wafer number information and the time of continuous abnormity of the scanning rate.
The defect scanning information comprises scanning product batches, scanning product types, scanning corresponding time periods and upper limit and lower limit information of the over-shipment product batches.
The analysis module is used for counting and summarizing the defect scanning information corresponding to the defect scanning machine platform screened by the query module and determining the scanning rate information of the defect scanning machine platform corresponding to each department.
When the scanning rate of the defect scanning machine is lower than a standard threshold or the scanning rate is continuously lower than a set value within a set time, the judging module judges that the defect scanning machine is in an abnormal state and triggers an alarm.
In another preferred embodiment of the present invention, the automatic monitoring system further includes:
and the database is used for storing the defect scanning information acquired by the data acquisition module, so that the data storage of a defect scanner side can be omitted.
In addition, in another preferred embodiment of the present invention, the automatic monitoring system further includes:
and the data processing module is used for carrying out data cleaning, data classification and data screening pretreatment on the defect scanning information acquired by the data acquisition module and summarizing scanning rate information corresponding to each module.
Based on the above system, the automatic monitoring method of the defect scanning machine of the present invention is used for monitoring all defect scanning machines for online defect scanning, and as shown in fig. 1, the automatic monitoring method includes:
acquiring defect scanning information of all defect scanning machines for online defect scanning;
acquiring query conditions set by a user, and monitoring the defect scanning information according to the query conditions set by the user;
screening out a defect scanning machine table corresponding to the defect scanning information meeting the query condition;
counting and summarizing the screened defect scanning information, and determining the scanning rate information of the corresponding defect scanning machine;
and judging the running state of the defect scanning machine according to the scanning rate information, and determining whether to trigger an alarm according to the running state of each defect scanning machine.
Further, when the scanning rate of the defect scanning machine is lower than a standard threshold or the scanning rate is continuously lower than a set value within a set time, it is determined that the defect scanning machine is in an abnormal state, and an alarm is triggered.
The user can flexibly set inquiry monitoring, for example, the user can screen defect scanning machines with scanning rates lower than a set value for a continuously set number of days, or screen defect scanning machines with scanning rates lower than the set value for a non-continuous time and with times reaching the set value.
Compared with the prior art, the invention monitors the on-line running state of all defect scanning machines, can realize the full-coverage monitoring of the defect scanning machines (different defect scanning objects and different defect scanning machines), improves the machine body data monitoring coverage rate, automatically counts the scanning rate of the machines, and warns the machines with unreasonable scanning rate, is beneficial to improving the monitoring of the key information of the products which pass on the line, reduces the affected area of the products, improves the monitoring of the scanning condition of the key products of the on-line machines, is convenient for engineers to find the machines with potential risk problems in time according to different scanning conditions, and warns the scanning condition of the machines.
The present invention has been described in detail with reference to the specific embodiments, which are merely preferred embodiments of the present invention, and the present invention is not limited to the above embodiments. Equivalent alterations and modifications made by those skilled in the art without departing from the principle of the invention should be considered to be within the technical scope of the invention.
Claims (10)
1. An automatic monitoring system of a defect scanning machine, comprising:
the data collection module is in communication connection with all the defect scanning machines and is used for acquiring defect scanning information of each defect scanning machine;
the setting module is used for setting an inquiry condition for monitoring the defect scanning information collected by the data collection module;
the inquiry module inquires the defect scanning information collected by the data collection module according to the inquiry condition set by the setting module and screens out a defect scanning machine station meeting the inquiry condition;
the analysis module is used for processing the defect scanning information corresponding to the defect scanning machine platform screened by the query module;
and the judging module judges the running state of the defect scanning machine according to the processing result of the analyzing module and determines whether to trigger an alarm according to the running state of each defect scanning machine.
2. The system of claim 1, wherein the query condition includes a scan rate of the defect scanner, a product and a product type detected by the defect scanner, a product lot, a wafer number information, and a time when a consecutive abnormality occurs in the scan rate.
3. The system of claim 1, wherein the defect scan information comprises upper and lower limit information of a scanned product lot, a scanned product type, a time period corresponding to the scan, and a passing product lot.
4. The system of claim 1, further comprising:
and the database is used for storing the defect scanning information acquired by the data collection module.
5. The system of claim 1, further comprising:
and the data processing module is used for carrying out data cleaning, data classification and data screening pretreatment on the defect scanning information acquired by the data acquisition module and summarizing the scanning rate information of the defect scanning machine tables corresponding to all departments.
6. The system of claim 1, wherein the analysis module performs statistics and summary on the defect scan information corresponding to the defect scanners screened by the query module to determine scan rate information of each defect scanner.
7. The system of claim 6, wherein the determining module determines that the defect scanner is in an abnormal state and triggers an alarm when the scan rate of the defect scanner is lower than a standard threshold or continuously lower than a set value within a set time.
8. An automatic monitoring method for a defect scanning machine is used for monitoring all defect scanning machines for online defect scanning, and is characterized in that the automatic monitoring method comprises the following steps:
acquiring defect scanning information of all defect scanning machines for online defect scanning;
acquiring query conditions set by a user, and monitoring the defect scanning information according to the query conditions set by the user;
screening out a defect scanning machine table corresponding to the defect scanning information meeting the query condition;
counting and summarizing the screened defect scanning information, and determining the scanning rate information of the corresponding defect scanning machine;
and judging the running state of the defect scanning machine according to the scanning rate information, and determining whether to trigger an alarm according to the running state of each defect scanning machine.
9. The method as claimed in claim 8, wherein when the scan rate of the defect scanner is lower than a standard threshold or continuously lower than a set value within a set time, determining that the defect scanner is in an abnormal state and triggering an alarm.
10. The system of claim 8, wherein the defect scan information comprises upper and lower limit information of a scanned product lot, a scanned product type, a time period corresponding to the scan, and a passing product lot.
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| CN202011421066.XA CN112666311A (en) | 2020-12-08 | 2020-12-08 | Automatic monitoring system and method for defect scanning machine |
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000050282A (en) * | 1999-01-02 | 2000-08-05 | 윤종용 | System for inspecting wafer stage |
| JP2003262594A (en) * | 2002-03-08 | 2003-09-19 | Fuji Photo Film Co Ltd | Defect inspection machine |
| TWI229915B (en) * | 2004-02-13 | 2005-03-21 | Taiwan Semiconductor Mfg | Method and system for analyzing wafer yield against uses of a semiconductor tool |
| CN1920863A (en) * | 2005-08-22 | 2007-02-28 | 力晶半导体股份有限公司 | Real time management system for production management and yield analytical integration and processing method thereof |
| JP2009085892A (en) * | 2007-10-02 | 2009-04-23 | Sharp Corp | Defect-inspecting apparatus, defect inspection method, image processing apparatus, program, and computer-readable recording medium with the program stored |
| CN102412168A (en) * | 2011-11-30 | 2012-04-11 | 上海华力微电子有限公司 | Wafer defect defection method and system |
| JP2012118038A (en) * | 2010-11-30 | 2012-06-21 | Shin King Pay | Statistical system and method thereof in detection of defect signal in semiconductor manufacturing |
| CN103219258A (en) * | 2013-04-03 | 2013-07-24 | 无锡华润上华科技有限公司 | Wafer defect sampling inspection system and method thereof |
| CN103559566A (en) * | 2013-06-04 | 2014-02-05 | 上海华力微电子有限公司 | Dispatching method for controlling process machine through defect scan result |
| CN103646059A (en) * | 2013-11-29 | 2014-03-19 | 上海华力微电子有限公司 | Scanning machine program control method |
| CN103871921A (en) * | 2014-02-21 | 2014-06-18 | 上海华力微电子有限公司 | Wafer defect monitoring analysis method based on server |
| CN106206356A (en) * | 2016-08-31 | 2016-12-07 | 上海华力微电子有限公司 | The method improving Yield lmproved defect inspection efficiency |
| CN108133900A (en) * | 2017-12-21 | 2018-06-08 | 上海华力微电子有限公司 | A kind of Defect Scanning board and its automatic defect classification method |
| CN109065468A (en) * | 2018-09-12 | 2018-12-21 | 上海华力微电子有限公司 | Defect filtration system and filter method and computer storage medium |
| CN109698139A (en) * | 2018-12-27 | 2019-04-30 | 上海华力微电子有限公司 | The real-time acquisition system of wafer defect optical photograph and acquisition method |
-
2020
- 2020-12-08 CN CN202011421066.XA patent/CN112666311A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000050282A (en) * | 1999-01-02 | 2000-08-05 | 윤종용 | System for inspecting wafer stage |
| JP2003262594A (en) * | 2002-03-08 | 2003-09-19 | Fuji Photo Film Co Ltd | Defect inspection machine |
| TWI229915B (en) * | 2004-02-13 | 2005-03-21 | Taiwan Semiconductor Mfg | Method and system for analyzing wafer yield against uses of a semiconductor tool |
| CN1920863A (en) * | 2005-08-22 | 2007-02-28 | 力晶半导体股份有限公司 | Real time management system for production management and yield analytical integration and processing method thereof |
| JP2009085892A (en) * | 2007-10-02 | 2009-04-23 | Sharp Corp | Defect-inspecting apparatus, defect inspection method, image processing apparatus, program, and computer-readable recording medium with the program stored |
| JP2012118038A (en) * | 2010-11-30 | 2012-06-21 | Shin King Pay | Statistical system and method thereof in detection of defect signal in semiconductor manufacturing |
| CN102412168A (en) * | 2011-11-30 | 2012-04-11 | 上海华力微电子有限公司 | Wafer defect defection method and system |
| CN103219258A (en) * | 2013-04-03 | 2013-07-24 | 无锡华润上华科技有限公司 | Wafer defect sampling inspection system and method thereof |
| CN103559566A (en) * | 2013-06-04 | 2014-02-05 | 上海华力微电子有限公司 | Dispatching method for controlling process machine through defect scan result |
| CN103646059A (en) * | 2013-11-29 | 2014-03-19 | 上海华力微电子有限公司 | Scanning machine program control method |
| CN103871921A (en) * | 2014-02-21 | 2014-06-18 | 上海华力微电子有限公司 | Wafer defect monitoring analysis method based on server |
| CN106206356A (en) * | 2016-08-31 | 2016-12-07 | 上海华力微电子有限公司 | The method improving Yield lmproved defect inspection efficiency |
| CN108133900A (en) * | 2017-12-21 | 2018-06-08 | 上海华力微电子有限公司 | A kind of Defect Scanning board and its automatic defect classification method |
| CN109065468A (en) * | 2018-09-12 | 2018-12-21 | 上海华力微电子有限公司 | Defect filtration system and filter method and computer storage medium |
| CN109698139A (en) * | 2018-12-27 | 2019-04-30 | 上海华力微电子有限公司 | The real-time acquisition system of wafer defect optical photograph and acquisition method |
Non-Patent Citations (2)
| Title |
|---|
| JAN MULKENS等: "改进缺陷,套刻和聚焦性能的第五世代浸没式曝光系统(英文)", 《电子工业专用设备》 * |
| 范荣伟等: "28 nm技术节点微小多晶硅桥连缺陷检测与改进方法的研究", 《集成电路应用》 * |
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Application publication date: 20210416 |